TWM565943U - Heat transfer device - Google Patents

Abstract

A heat transfer device includes a first temperature equalizing plate, a first connector, a first heat sink fin, a second temperature equalizing plate, a second connector, and a second heat sink fin, wherein the first heat sink a uniform temperature plate and a second hollow plate have a hollow space therein, and the first connector and the second connector respectively have a vapor passage and a liquid passage communicating with the respective hollow spaces, so when the first After the average temperature plate absorbs heat, the cooling fluid in the hollow space inside the first temperature equalizing plate can be evaporated into a vapor, and then transported through a vapor line to the hollow space inside the second temperature equalizing plate. When the temperature is lowered, the vaporous cooling fluid in the hollow space inside the second temperature equalizing plate is converted into a liquid, wherein the liquid can enter the first liquid channel through the liquid pipeline, and thus cooled. The cycle will be able to achieve effective heat dissipation.

Description

Heat transfer device

The present invention relates to a heat transfer device, and more particularly to a heat transfer device capable of circulating steam and liquid in a pipeline for heat dissipation purposes.

In recent years, the heat generation of electronic components has been increasing rapidly with the precision of semiconductor processes; how to improve the heat dissipation capability of electronic components and maintain the normal operation of components has become a very important engineering issue. The direct air cooling technology currently in large use has been unable to meet the needs of many heat dissipation components with high heat flux, and other solutions must be sought.

The creation provides two sets of heat spreaders and two sets of connected tubes, one set of heat spreaders for evaporation to remove the absorbed heat, and the other set of heat spreaders for condensation to return to the output cooling fluid for heat dissipation cycle The circuit, because of the different pressures in the two sets of heat spreaders, can automatically carry out round-trip transport after the fluid phase changes, in order to achieve the purpose of natural circulation heat dissipation, so this creation should be an optimal solution.

A heat transfer device comprising: a first temperature equalizing plate having a hollow space therein, and the first temperature equalizing plate surface has at least a first vapor opening, a first liquid opening and a plurality of locking holes The first vapor opening and the first liquid opening are all connected to the hollow space inside the first temperature equalizing plate; a first connector is combined with the surface of the first temperature equalizing plate, and the first a connector corresponding to the first vapor opening and the first liquid opening is provided with a first vapor channel and a first liquid channel, wherein the first vapor channel and the bottom of the first liquid channel are respectively associated with the first The vapor opening is in communication with the first liquid opening; a first heat sink fin has a recess that can be coupled to the first connector, and the other surface of the first heat sink fin is coupled to the first The surface of the warming plate is combined; a second temperature equalizing plate has a hollow space therein, and the bottom surface of the second temperature equalizing plate has at least a second vapor opening and a second liquid opening, wherein the second vapor opening and The second liquid opening system a hollow space inside the second temperature equalizing plate is connected; a second connector is coupled to the bottom surface of the second temperature equalizing plate, and the second connector corresponds to the second vapor opening and the second liquid a second vapor channel and a second liquid channel are disposed in the opening, wherein the second vapor channel and the second liquid channel are respectively connected to the second vapor opening and the second liquid opening; and a second heat sink fin , the recess has a recess that can be coupled to the second connector, and the other portion of the second fin is coupled to the surface of the second temperature equalizing plate; a cooling fluid input tube is coupled to the first a vapor passage is connected to input a cooling fluid into the first vapor passage through the cooling fluid input pipe, and the cooling fluid enters a hollow space of the first temperature equalizing plate; Connected between the first vapor channel and the second vapor channel, and the first temperature equalizing plate absorbs heat to evaporate the liquid cooling fluid of the first liquid channel into a vapor, wherein the vapor can be One The gas passage enters the hollow space of the second vapor passage and the second temperature equalizing plate through the vapor line; and a liquid line is respectively connected between the first liquid passage and the second liquid passage, and Cooling the second heat dissipating fin to convert the vaporous cooling fluid in the hollow space inside the second temperature equalizing plate into a liquid, wherein the liquid can enter the first through the liquid line through the second liquid channel Inside the liquid channel.

More specifically, the diameter of the vapor line is greater than the diameter of the liquid line.

More specifically, the cooling stream system is a refrigerant.

More specifically, the vapor line and the liquid line have at least one curved portion, so that the first uniform temperature plate and the second uniform temperature plate are at a fixed distance, and the bending portion can be extended by the setting of the curved portion. The length of the vapor line and the liquid line.

More specifically, the vapor line and the liquid line are connected to the second uniform temperature plate in different directions, and the vapor line and the liquid line have at least one bent portion to make the steam line and the liquid The pipelines are respectively connected to the two sides of the second temperature equalizing plate.

Other technical contents, features, and effects of the present invention will be apparent from the following detailed description of the preferred embodiments.

Please refer to FIG. 1 to FIG. 3 , which are schematic diagrams of an exploded structure, a combined structure diagram and a partial sectional structure of the heat transfer device. The heat transfer device includes a first temperature equalizing plate 11 and a first connector 12 . A first heat dissipation fin 13 , a second temperature equalization plate 21 , a second connector 22 , a second heat dissipation fin 23 , a vapor line 4 , a liquid line 5 , and a cooling fluid input tube 6 .

The first temperature equalizing plate 11 has a hollow space 111 therein, and the surface of the first temperature equalizing plate 11 has at least a first vapor opening 112, a first liquid opening 113 and a plurality of locking holes 114, wherein The first vapor opening 112 and the first liquid opening 113 are all connected to the hollow space 111 inside the first temperature equalizing plate 11;

The first connector 12 is coupled to the surface of the first temperature equalizing plate 11, and the first connector 12 is provided with a first vapor channel 121 corresponding to the first vapor opening 112 and the first liquid opening 113. And a first liquid channel 122, wherein the first vapor channel 112 and the bottom of the first liquid channel 113 are respectively in communication with the first vapor opening 112 and the first liquid opening 113;

The first heat dissipation fin 13 has a notch that can be coupled to the first connector 12, and the other surface of the first heat dissipation fin 13 is combined with the surface of the first temperature equalization plate 11.

The second temperature equalizing plate 21 has a hollow space 211 therein, and the bottom surface of the second temperature equalizing plate 21 has at least a second vapor opening 212 and a second liquid opening 213, wherein the second vapor opening 212 and The second liquid opening 213 is connected to the hollow space 211 inside the second temperature equalizing plate 21;

The second connector 22 is coupled to the bottom surface of the second temperature equalizing plate 21, and the second connector 22 is provided with a second vapor channel 221 corresponding to the second vapor opening 212 and the second liquid opening 213. a second liquid channel 222, wherein the tops of the second vapor channel 221 and the second liquid channel 222 are respectively in communication with the second vapor opening 212 and the second liquid opening 213;

The second heat dissipating fins 23 have a notch that can be coupled to the second connector 22, and other portions of the second heat dissipating fins 23 are combined with the surface of the second temperature equalizing plate 21.

The cooling fluid input pipe 6 is connected to the first vapor passage 121 for inputting a cooling fluid into the first vapor passage 121 through the cooling fluid input pipe 6, and allowing the cooling fluid to enter the first The hollow space 111 of the warm plate 11 is inside.

The vapor line 4 is connected between the first vapor channel 121 and the second vapor channel 221, and the liquid line 5 is connected to the first liquid channel 122 and the second liquid channel 222, respectively. As shown in FIG. 4, the first temperature equalizing plate 11 can be locked on an electronic device. When the electronic device generates heat, the first temperature equalizing plate 11 can absorb heat to evaporate the liquid cooling fluid into After a vapor 81, the vapor 81 can rise into the first vapor passage 121, and further, due to the pressure difference, the vapor 81 will enter the second vapor passage 221 along the vapor line 4 and the second The hollow space 211 of the temperature equalizing plate 21;

Thereafter, when the second heat dissipation fin 23 is cooled, the vapor 81 of the hollow space 211 will become the liquid 82 and fall into the second liquid passage 222, and the liquid 82 will be further due to the pressure difference. Entering the first liquid passage 122 through the liquid line 5 by the second liquid passage 222;

Thereafter, the first temperature equalizing plate 11 absorbs heat to evaporate the liquid cooling fluid in the inner hollow space 111 into a vapor 81, and the vapor 81 rises to the first vapor channel 121 and is again transported to the steam. The second vapor passage 221 is provided for the purpose of circulating heat dissipation.

In addition, as shown in FIG. 5, the vapor line 4 and the liquid line 5 have at least one curved portion 41, 51, so that the first uniform temperature plate 11 and the second uniform temperature plate 21 are fixed. The distance between the vapor line 4 and the liquid line 5 can be extended by the arrangement of the curved portions 41, 51, and the other structures are the same as those of Figs. 1 to 4, and will not be described herein.

In addition, please refer to FIG. 6 , wherein the vapor line 4 and the liquid line 5 are connected to the second uniform temperature plate 21 in different directions, and the vapor line 4 and the liquid line 5 have at least one In the above-mentioned curved portion, the vapor line 4 and the liquid line 5 are respectively connected to the two sides of the second floor plate 21, and other structures are the same as those of FIGS. 1 to 5, and details are not described herein.

The advantages of the heat transfer device provided by this creation are compared with other conventional techniques: 1. The creation provides two sets of heat spreaders and two sets of connected pipes, and a set of heat spreaders for evaporation to take away The heat absorbed, another set of heat spreaders is used to condense to cool down to return the circuit that outputs the cooling fluid for heat dissipation. 2. Due to the different pressures in the two sets of homogenizers, this creation can automatically carry out round-trip transportation after the fluid phase changes, in order to achieve the purpose of natural circulation heat dissipation.

The present invention has been disclosed above in the above embodiments, but it is not intended to limit the present invention. Anyone skilled in the art having ordinary knowledge will understand the foregoing technical features and embodiments of the present invention without departing from the present invention. In the spirit and scope, the scope of patent protection of this creation shall be subject to the definition of the requirements attached to this manual.

11‧‧‧First average temperature plate
111‧‧‧ hollow space
112‧‧‧First vapor opening
113‧‧‧First liquid opening
114‧‧‧Lock hole
12‧‧‧First connector
121‧‧‧First Vapor Channel
122‧‧‧First liquid passage
13‧‧‧First heat sink fin
21‧‧‧Second average temperature plate
211‧‧‧ hollow space
212‧‧‧Second steam opening
213‧‧‧Second liquid opening
22‧‧‧Second connector
221‧‧‧Second vapor channel
222‧‧‧Second liquid channel
23‧‧‧Second heat sink fins
4‧‧‧Vapor line
41‧‧‧Bend
5‧‧‧Liquid line
51‧‧‧Bend
6‧‧‧Cooling fluid input tube
81‧‧‧Vapor
82‧‧‧Liquid

[Fig. 1] A schematic diagram of the exploded structure of the present heat transfer device. [Fig. 2] A schematic diagram of the combined structure of the present heat transfer device. [Fig. 3] A schematic diagram of a partial cross-sectional structure of the present heat-generating device. [Fig. 4] A schematic diagram of the flow of vapor and liquid in the present heat transfer device. [Fig. 5] A schematic diagram of another embodiment of the present heat generating device. [Fig. 6] A schematic diagram of another embodiment of the present heat generating device.

Claims (4)

A heat transfer device comprises: a first temperature equalizing plate having a hollow space therein, and the first temperature equalizing plate surface has at least a first vapor opening, a first liquid opening and a plurality of locking a hole, wherein the first vapor opening and the first liquid opening are all in communication with a hollow space inside the first temperature equalizing plate; a first connector is coupled to the surface of the first temperature equalizing plate, and the The first connector is provided with a first vapor channel and a first liquid channel corresponding to the first vapor opening and the first liquid opening, wherein the first vapor channel and the bottom of the first liquid channel are respectively associated with the first a vapor opening is in communication with the first liquid opening; a first heat dissipation fin has a notch that can be coupled to the first connector, and the other portion of the first heat dissipation fin is coupled to the first surface The surface of the temperature equalizing plate is combined; a second temperature equalizing plate having a hollow space therein, and the bottom surface of the second temperature equalizing plate has at least a second vapor opening and a second liquid opening, wherein the second vapor opening And the second liquid is opened The mouthpiece is connected to the hollow space inside the second temperature equalizing plate; a second connector is coupled to the bottom surface of the second temperature equalizing plate, and the second connector corresponds to the second vapor opening and The second liquid opening is provided with a second vapor passage and a second liquid passage, wherein the second vapor passage and the second liquid passage are respectively connected to the second vapor opening and the second liquid opening; The second heat dissipating fin has a notch that can be coupled to the second connector, and the other surface of the second heat dissipating fin is combined with the surface of the second temperature equalizing plate; a cooling fluid input tube, Connected to the first vapor passage for inputting a cooling fluid into the first vapor passage through the cooling fluid input pipe, and allowing the cooling fluid to enter the hollow space of the first temperature equalizing plate; And connecting the first vapor channel to the second vapor channel, and the first temperature equalizing plate absorbs heat to evaporate the liquid cooling fluid of the first liquid channel into a vapor, wherein the vapor were able Passing the first vapor passage through the vapor line into the hollow space of the second vapor passage and the second temperature equalizing plate; and a liquid line connected to the first liquid passage and the second liquid passage respectively And cooling the second cooling fin to convert the vaporous cooling fluid in the hollow space inside the second temperature equalizing plate into a liquid, wherein the liquid can pass through the liquid pipeline through the second liquid passage Entering the first liquid passage. The heat transfer device of claim 1, wherein the cooling flow system is a refrigerant. The heat transfer device of claim 1, wherein the vapor line and the liquid line have at least one bent portion, so that the first uniform temperature plate and the second uniform temperature plate are at a fixed distance, by the bent portion The length of the vapor line and the liquid line can be extended. The heat transfer device of claim 1, wherein the vapor line and the liquid line are connected to the second uniform temperature plate in different directions, and the vapor line and the liquid line have at least one bend, so that The vapor line and the liquid line are respectively connected to the two sides of the second temperature equalizing plate.