TWM556849U - Three-dimensional optical detection device - Google Patents

Three-dimensional optical detection device Download PDF

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TWM556849U
TWM556849U TW106215201U TW106215201U TWM556849U TW M556849 U TWM556849 U TW M556849U TW 106215201 U TW106215201 U TW 106215201U TW 106215201 U TW106215201 U TW 106215201U TW M556849 U TWM556849 U TW M556849U
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focusing lens
optical detecting
tested
lens
splitting element
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TW106215201U
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楊伯溫
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明新科技大學
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Abstract

本創作係揭露一種三維光學檢測裝置,包含至少一光學檢測模組與至少一顯示控制模組。光學檢測模組包含一入射光源、一分光元件、一第一聚焦透鏡、一第一致動器、一平面鏡、一第二聚焦透鏡、一第二致動器與一影像感測器。第一致動器與第二致動器分別移動第一聚焦透鏡與第二聚焦透鏡。入射光源配合分光元件與待測物產生參考光束與樣本光束。在第一聚焦透鏡與第二聚焦透鏡移動時,參考光束與樣本光束具有同調性,並相互干涉供影像感測器感測,產生待測物之斷層影像訊號。顯示控制模組疊加斷層影像訊為一三維影像,以更清晰地檢測待測物之內部。The present invention discloses a three-dimensional optical detecting device comprising at least one optical detecting module and at least one display control module. The optical detecting module comprises an incident light source, a beam splitting component, a first focusing lens, a first actuator, a plane mirror, a second focusing lens, a second actuator and an image sensor. The first actuator and the second actuator respectively move the first focus lens and the second focus lens. The incident light source cooperates with the beam splitting element and the object to be tested to generate a reference beam and a sample beam. When the first focusing lens and the second focusing lens move, the reference beam is coherent with the sample beam and interferes with each other for sensing by the image sensor to generate a tomographic image signal of the object to be tested. The display control module superimposes the tomographic image as a three-dimensional image to more clearly detect the inside of the object to be tested.

Description

三維光學檢測裝置Three-dimensional optical detection device

本創作係有關於一種檢測裝置,尤指一種三維光學檢測裝置。The present invention relates to a detecting device, and more particularly to a three-dimensional optical detecting device.

「工業4.0」,或稱第四次工業革命、生產力4.0,是一個德國政府提出的高科技計劃。在人類歷史上,第一次工業革命是指利用水力及蒸汽的力量作為動力源,突破了以往人力與獸力的限制;第二次工業革命使用了電力為大量生產提供動力與支援,也讓機器生產機器的目標實現;第三次工業革命則是使用電子裝置及資訊技術來消除人為影響,以增進工業製造的精準化、自動化。至於工業4.0,其核心詞彙是智慧整合感控系統,而且是高度自動化,可以主動排除生產障礙,其概念在中國製造2025和美國製造業振興計劃中也都提到了。"Industry 4.0", or the fourth industrial revolution, productivity 4.0, is a high-tech plan proposed by the German government. In the history of mankind, the first industrial revolution refers to the use of the power of water and steam as a source of power, breaking through the limitations of manpower and animal power in the past; the second industrial revolution used electricity to provide power and support for mass production, and also The goal of the machine production machine; the third industrial revolution is the use of electronic devices and information technology to eliminate human influence, to improve the precision and automation of industrial manufacturing. As for Industry 4.0, its core vocabulary is a smart integrated sensory control system, which is highly automated and can actively eliminate production barriers. The concept is also mentioned in China Manufacturing 2025 and the US Manufacturing Revitalization Plan.

工業4.0將如先前之網路環境,將徹底改變人類生活的各種面向。綜觀工業歷史的演進,工業1.0以蒸汽動力為代表;工業2.0以電氣動力為代表;工業3.0以數位控制為代表;工業4.0則以智慧製造為代表。隨著市場走向「款多量少」,不少大型生產商已開始在其供應鏈引入「工業4.0」概念,充份利用資訊科技、互聯網、物聯網及流動智能裝置,打造智能工廠。未來廠商決戰市場的焦點,將在於機器人的手眼力、精密度的高穩定性等。此外,機器如果具備深度學習技術,便可判別事務知識的屬性,帶來更精彩的應用。整體而言,隨著勞動成本提高、彈性製造訴求等需求湧現,數位化生產已成為國際製造業的關注課題,如何把目前智慧型手機或是個人電腦的製造技術,轉向應用在機器人之上,是重塑產業競爭力的契機,值得臺灣深入探詢與著墨,此外,智慧機器人商機的持續湧現,也是已經投入市場的臺灣業者,開創新商機的良好契機。Industry 4.0 will, as in the previous online environment, revolutionize the various aspects of human life. Looking at the evolution of industrial history, Industry 1.0 is represented by steam power; Industry 2.0 is represented by electric power; Industry 3.0 is represented by digital control; and Industry 4.0 is represented by Smart Manufacturing. As the market moves toward "more money," many large manufacturers have begun to introduce the "Industry 4.0" concept in their supply chain, making full use of information technology, the Internet, the Internet of Things and mobile smart devices to create smart factories. The focus of the future manufacturers' decisive battle market will be the robot's hand and eyesight, high precision and so on. In addition, if the machine has deep learning technology, it can discriminate the attributes of transaction knowledge and bring more exciting applications. On the whole, with the emergence of labor costs and flexible manufacturing demands, digital production has become a topic of concern for international manufacturing. How to apply the current manufacturing technology of smart phones or personal computers to robots. It is an opportunity to reshape the competitiveness of the industry. It is worthy of Taiwan's in-depth inquiry and inspiration. In addition, the continuous emergence of smart robot business opportunities is also a good opportunity for Taiwanese companies that have already entered the market to open up new business opportunities.

手機觸控面板與太陽能板是目前最重要的光電產業,市場之巨大舉世皆知,其產品的高速檢測對於整體良率的提升具有重大貢獻,故手機面板或太陽能板的線上與即時高速與高通量檢測,其巨大的市場價值不言可喻。目前市面上一般的光學檢測機台或光學顯微鏡一台都是上百萬,缺點是很大、很重、很貴、需人為操作、而且一次只能一片,其缺點是檢測錯誤率高、人工貴、檢測錯誤率又會隨時間上升,不但效率極低、而且整體生產成本增高。目前雖然有使用具有深度掃描、高解析度、非侵入檢測、非破壞性檢測的優點之光學同調斷層掃瞄系統 (OCT)對產品進行檢測,但市面上使用的檢測儀皆屬於平面二維 影像,無法快速自動得知手機觸控面板或太陽能板表面以下之深層導線成像與資訊。Mobile phone touch panels and solar panels are currently the most important optoelectronic industry. The market is hugely known. The high-speed detection of its products has made a significant contribution to the overall improvement of the yield. Therefore, the line and instant high speed and high speed of mobile phone panels or solar panels Flux testing, its huge market value is self-evident. At present, there are millions of optical inspection machines or optical microscopes on the market. The disadvantages are that they are large, heavy, expensive, require human operation, and can only be one piece at a time. The disadvantage is that the detection error rate is high and artificial. Expensive and detection error rates will rise with time, not only inefficient, but also overall production costs. At present, although the optical coherence tomography system (OCT) with the advantages of deep scanning, high resolution, non-intrusive detection and non-destructive detection is used to detect the products, the detectors used in the market belong to the planar two-dimensional image. It is not possible to quickly and automatically learn the imaging and information of deep wires below the surface of the touch panel or solar panel of the mobile phone.

因此,本創作係在針對上述的困擾,提出一種三維光學檢測裝置,以解決習知所產生的問題。Therefore, the present invention has proposed a three-dimensional optical detecting device to solve the problems caused by the above-mentioned problems.

本創作的主要目的,在於提供一種三維光學檢測裝置,其係利用程式輔助,將斷層影像疊加成三維影像,能夠更清晰的觀測與檢測待測物之內部結構,例如手機觸控面板與太陽能板的內部結構。此外,使用只有兩公分大小的致動器取代干涉臂,因為光學檢測模組微小化後做得夠小夠便宜,所以不但可以同調得到穿透式斷層影像,而且可以將整個模組縮小,所以可望組合成微小化三維自動光學檢測矩陣,以高速、高通量的效率同時拍攝多組面板的不同深度多層影像,在未來工業4.0當中可用以取代傳統的人工檢測面板,供製造業進行非侵入式線上即時三維檢測,並回饋於生產線參數,以建立全自動化工廠環境,此部分未來在工業檢測上的商機非常大。 The main purpose of this creation is to provide a three-dimensional optical detection device, which uses program assistance to superimpose tomographic images into three-dimensional images, which can more clearly observe and detect the internal structure of the object to be tested, such as mobile phone touch panels and solar panels. Internal structure. In addition, an actuator with a size of only two centimeters is used instead of the interference arm. Since the optical detection module is small enough to be small enough to be cheap, it is possible to obtain a transmissive tomographic image and to reduce the entire module. It is expected to be combined into a miniaturized three-dimensional automatic optical inspection matrix to simultaneously capture multiple depths of multi-layer panels with high-speed, high-throughput efficiency. In the future, Industry 4.0 can be used to replace traditional manual inspection panels for manufacturing. Intrusive online real-time 3D inspection and feedback on production line parameters to establish a fully automated factory environment, this part of the future business opportunities in industrial testing is very large.

為達上述目的,本創作提供一種三維光學檢測裝置,其係包含至少一光學檢測模組與至少一顯示控制模組。光學檢測模組包含一入射光源、一分光元件、一第一聚焦透鏡、一第一致動器、一平面鏡、一第二聚焦透鏡、一第二致動器與一影像感測器。入射光源產生一入射光束,分光元件接收入射光束,並將其分為參考光束與檢測光束。第一聚焦透鏡設於分光元件與至少一待測物之間,且分光元件、第一聚焦透鏡與待測物位於一第一直線軸上,第一聚焦透鏡聚焦檢測光束於待測物上,以反向反射與散射樣本光束,並將此反向反射與散射之樣本光束透過第一聚焦透鏡傳遞至分光元件中。第一致動器承載第一聚焦透鏡,並控制第一聚焦透鏡在第一直線軸上移動。第二聚焦透鏡設於分光元件與平面鏡之間,且分光元件、第二聚焦透鏡與平面鏡位於一第二直線軸上。第二聚焦透鏡聚焦參考光束於平面鏡上,平面鏡透過第二聚焦透鏡反射參考光束回分光元件。第二致動器承載第二聚焦透鏡,並控制第二聚焦透鏡在第二直線軸上移動。在第一聚焦透鏡與第二聚焦透鏡移動時,樣本光束與參考光束配合第一聚焦透鏡與第二聚焦透鏡而具有同調性,並經分光元件重合後而相互干涉,以產生複數之平面式光學干涉訊號。影像感測器感測複數之平面式光學干涉訊號,以產生待測物之不同深度之複數斷層影像訊號。顯示控制模組連接影像感測器,並接收斷層影像訊號,將其疊加成一三維影像。 To achieve the above object, the present invention provides a three-dimensional optical detecting device comprising at least one optical detecting module and at least one display control module. The optical detecting module comprises an incident light source, a beam splitting component, a first focusing lens, a first actuator, a plane mirror, a second focusing lens, a second actuator and an image sensor. The incident light source generates an incident beam, and the spectroscopic element receives the incident beam and divides it into a reference beam and a detection beam. The first focusing lens is disposed between the beam splitting element and the at least one object to be tested, and the beam splitting element, the first focusing lens and the object to be tested are located on a first linear axis, and the first focusing lens focuses the detecting beam on the object to be tested, The sample beam is retroreflected and scattered, and the reflected and scattered sample beam is transmitted through the first focusing lens to the beam splitting element. The first actuator carries the first focus lens and controls the first focus lens to move on the first linear axis. The second focusing lens is disposed between the beam splitting element and the plane mirror, and the beam splitting element, the second focusing lens and the plane mirror are located on a second linear axis. The second focus lens focuses the reference beam on the plane mirror, and the plane mirror reflects the reference beam back to the beam splitting element through the second focus lens. The second actuator carries the second focus lens and controls the second focus lens to move on the second linear axis. When the first focusing lens and the second focusing lens move, the sample beam and the reference beam cooperate with the first focusing lens and the second focusing lens to have coherence, and after the beam splitting elements overlap, interfere with each other to generate a plurality of planar optics. Interference signal. The image sensor senses a plurality of planar optical interference signals to generate complex tomographic signals at different depths of the object to be tested. The display control module is connected to the image sensor and receives the tomographic image signal, and superimposes it into a three-dimensional image.

在本創作之一實施例中,入射光源為發光二極體或高強度雷射二極體。 In one embodiment of the present invention, the incident light source is a light emitting diode or a high intensity laser diode.

在本創作之一實施例中,入射光束為白光、紅光或紅外光。 In one embodiment of the present invention, the incident beam is white, red or infrared.

在本創作之一實施例中,影像感測器為電荷耦合元件(CCD)或互補金屬氧化物半導體(CMOS)。 In one embodiment of the present invention, the image sensor is a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS).

在本創作之一實施例中,待測物為手機觸控面板或太陽能板等。 In an embodiment of the present invention, the object to be tested is a mobile phone touch panel or a solar panel.

在本創作之一實施例中,光學檢測模組之數量為複數個。 In one embodiment of the present invention, the number of optical detection modules is plural.

在本創作之一實施例中,顯示控制模組之數量為複數個。In one embodiment of the present invention, the number of display control modules is plural.

本創作之實施例將藉由下文配合相關圖式進一步加以解說。盡可能的,於圖式與說明書中,相同標號係代表相同或相似構件。於圖式中,基於簡化與方便標示,形狀與厚度可能經過誇大表示。可以理解的是,未特別顯示於圖式中或描述於說明書中之元件,為所屬技術領域中具有通常技術者所知之形態。本領域之通常技術者可依據本創作之內容而進行多種之改變與修改。 The embodiments of the present application will be further explained below in conjunction with the related drawings. Wherever possible, the same reference numerals in the drawings In the drawings, shapes and thicknesses may be exaggerated based on simplification and convenient labeling. It is to be understood that the elements not specifically shown in the drawings or described in the specification are those of ordinary skill in the art. A variety of changes and modifications can be made by those of ordinary skill in the art in light of the present disclosure.

本創作使用全景光學同調斷層攝影術(Full-Field Optical Coherence Tomography,FF-OCT)拍攝不同深度多層影像,將其應用於工業檢測系統,建構出一套可執行自動掃描、並可快速對物件深層執行斷層與三維造影的系統,在未來工業4.0的應用中,可用以取代傳統的人工檢測作業模式。由於非侵入性的特點,要實現商品化的自動化工業檢測儀指日可待。本創作可應用於手機觸控面板檢測等相關領域,具備極大的市場潛力。 This creation uses Full-Field Optical Coherence Tomography (FF-OCT) to capture multi-layer images of different depths, which are applied to industrial inspection systems, constructing a set of executable automatic scanning, and can quickly penetrate objects deep. A system for performing tomography and three-dimensional imaging can be used in the future application of Industry 4.0 to replace the traditional manual detection mode. Due to the non-invasive nature, automated industrial testers for commercialization are just around the corner. This creation can be applied to related fields such as mobile phone touch panel detection and has great market potential.

以下請參閱第1圖,並介紹本創作之第一實施例。本創作之三維光學檢測裝置係包含至少一光學檢測模組10與至少一顯示控制模組12,顯示控制模組12例如由電腦主機與螢幕之組合。光學檢測模組10包含一入射光源14、一分光元件16、一第一聚焦透鏡18、一第一致動器20、一平面鏡22、一第二聚焦透鏡24、一第二致動器26與一影像感測器28,其中入射光源14為發光二極體或高強度雷射二極體,影像感測器28例如為電荷耦合元件(CCD)或互補金屬氧化物半導體(CMOS)。Referring to Figure 1 below, a first embodiment of the present invention will be described. The three-dimensional optical detecting device of the present invention comprises at least one optical detecting module 10 and at least one display control module 12, and the display control module 12 is, for example, a combination of a computer host and a screen. The optical detecting module 10 includes an incident light source 14, a beam splitting component 16, a first focusing lens 18, a first actuator 20, a plane mirror 22, a second focusing lens 24, and a second actuator 26. An image sensor 28, wherein the incident light source 14 is a light emitting diode or a high intensity laser diode, and the image sensor 28 is, for example, a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS).

入射光源14產生一入射光束LI。分光元件16接收入射光束LI,並將其分為參考光束LR與檢測光束LD。第一聚焦透鏡18設於分光元件16與至少一待測物30之間,待測物30例如為手機觸控面板或太陽能板。在第一實施例中,光學檢測模組10、顯示控制模組12與待測物30之數量皆以一為例。分光元件16、第一聚焦透鏡18與待測物30位於一第一直線軸上,第一聚焦透鏡18聚焦檢測光束LD於待測物30上,以反向反射與散射產生樣本光束LS,並將此樣本光束透過第一聚焦透鏡18傳遞至分光元件16中。第一致動器20承載第一聚焦透鏡18,並控制第一聚焦透鏡18在第一直線軸上移動。第二聚焦透鏡24設於分光元件16與平面鏡22之間,且分光元件16、第二聚焦透鏡24與平面鏡22位於一第二直線軸上。第二聚焦透鏡24聚焦參考光束LR於平面鏡22上,平面鏡22透過第二聚焦透鏡24反射參考光束LR回分光元件16。第二致動器26承載第二聚焦透鏡24,並控制第二聚焦透鏡24在第二直線軸上移動。在第一聚焦透鏡18與第二聚焦透鏡24移動時,樣本光束LS與參考光束LR配合第一聚焦透鏡18與第二聚焦透鏡24而具有同調性,並經分光元件16相互干涉,以產生複數平面式光學干涉訊號SP。影像感測器28感測平面式光學干涉訊號SP,以產生待測物30之不同深度之複數斷層影像訊號SI。顯示控制模組12連接影像感測器28,並接收斷層影像訊號SI,將其搭配程式輔助疊加成一三維影像。入射光束LI例如為白光、紅光或紅外光,較佳為紅光或紅外光,因為波長較長,穿透深度較深,可以拍攝到較深層之斷層影像訊號SI與三維影像。The incident source 14 produces an incident beam LI. The beam splitting element 16 receives the incident light beam LI and divides it into a reference beam LR and a detecting beam LD. The first focusing lens 18 is disposed between the beam splitting element 16 and the at least one object to be tested 30. The object to be tested 30 is, for example, a mobile phone touch panel or a solar panel. In the first embodiment, the number of the optical detection module 10, the display control module 12, and the object to be tested 30 is taken as an example. The beam splitting element 16, the first focusing lens 18 and the object to be tested 30 are located on a first linear axis, and the first focusing lens 18 focuses the detecting beam LD on the object to be tested 30 to generate reflection and scattering to generate a sample beam LS, and This sample beam is transmitted through the first focusing lens 18 to the beam splitting element 16. The first actuator 20 carries the first focus lens 18 and controls the first focus lens 18 to move on the first linear axis. The second focusing lens 24 is disposed between the beam splitting element 16 and the plane mirror 22, and the beam splitting element 16, the second focusing lens 24 and the plane mirror 22 are located on a second linear axis. The second focusing lens 24 focuses the reference beam LR on the plane mirror 22, and the plane mirror 22 reflects the reference beam LR back to the beam splitting element 16 through the second focusing lens 24. The second actuator 26 carries the second focus lens 24 and controls the second focus lens 24 to move on the second linear axis. When the first focusing lens 18 and the second focusing lens 24 move, the sample beam LS and the reference beam LR cooperate with the first focusing lens 18 and the second focusing lens 24 to have coherence, and interfere with each other via the beam splitting element 16 to generate a plurality of Planar optical interference signal SP. The image sensor 28 senses the planar optical interference signal SP to generate a plurality of tomographic image signals SI of different depths of the object 30 to be tested. The display control module 12 is connected to the image sensor 28, and receives the tomographic image signal SI, and superimposes it with a program to superimpose it into a three-dimensional image. The incident light beam LI is, for example, white light, red light or infrared light, preferably red light or infrared light. Because of the long wavelength and deep penetration depth, it is possible to capture deeper tomographic image signals SI and three-dimensional images.

以下介紹本創作之三維光學檢測裝置之第一實施例之運作過程。首先,第一致動器20控制第一聚焦透鏡18在第一直線軸上移動,同時,第二致動器26控制第二聚焦透鏡24在第二直線軸上移動。接著,入射光源14產生一入射光束LI,分光元件16接收入射光束LI,並將其分為參考光束LR與檢測光束LD。第一聚焦透鏡18聚焦檢測光束LD於待測物30上,以反向反射與散射產生樣本光束LS,並將此樣本光束透過第一聚焦透鏡18傳遞至分光元件16中。同時,第二聚焦透鏡24聚焦參考光束LR於平面鏡22上,平面鏡22透過第二聚焦透鏡24反射參考光束LR回分光元件16。在第一聚焦透鏡18與第二聚焦透鏡24移動時,參考光束LR與樣本光束LS配合第一聚焦透鏡18與第二聚焦透鏡24之移動而具有同調性,並經分光元件16相互干涉,以產生複數平面式光學干涉訊號SP。影像感測器28感測平面式光學干涉訊號SP,以產生待測物30之不同深度之複數斷層影像訊號SI。顯示控制模組12連接影像感測器28,並接收斷層影像訊號SI,將其搭配程式輔助疊加成一三維影像。本創作可從任何角度、任何切面穿透觀察待測物30,利用影像識別技術,可以線上即時檢測待測物30的瑕疵,以最有效率的方式決定待測物30的良劣。舉例來說,當待測物30為手機面板周邊排線區時,本創作能即時檢測排線區是否有不正常的短路、交叉或斷路現象。當待測物30為太陽能板之沉積導線區時,本創作能線上即時檢測導線區是否有不良的三維沉積輪廓,例如常見的局部凹陷、中間斷裂或兩端磨損之情形,因而導致的光電流不穩定之現象。The operation of the first embodiment of the three-dimensional optical detecting device of the present invention will be described below. First, the first actuator 20 controls the first focus lens 18 to move on the first linear axis while the second actuator 26 controls the second focus lens 24 to move on the second linear axis. Next, the incident light source 14 generates an incident light beam LI, and the light splitting element 16 receives the incident light beam LI and divides it into a reference light beam LR and a detection light beam LD. The first focusing lens 18 focuses the detection beam LD on the object to be tested 30 to generate a sample beam LS by retroreflection and scattering, and transmits the sample beam to the beam splitting element 16 through the first focusing lens 18. At the same time, the second focusing lens 24 focuses the reference beam LR on the plane mirror 22, and the plane mirror 22 reflects the reference beam LR back to the beam splitting element 16 through the second focusing lens 24. When the first focusing lens 18 and the second focusing lens 24 move, the reference beam LR and the sample beam LS cooperate with the movement of the first focusing lens 18 and the second focusing lens 24 to have coherence, and interfere with each other via the beam splitting element 16 to A complex planar optical interference signal SP is generated. The image sensor 28 senses the planar optical interference signal SP to generate a plurality of tomographic image signals SI of different depths of the object 30 to be tested. The display control module 12 is connected to the image sensor 28, and receives the tomographic image signal SI, and superimposes it with a program to superimpose it into a three-dimensional image. The creation can observe the object to be tested 30 from any angle and any aspect. Using the image recognition technology, the flaw of the object to be tested 30 can be detected on the line in real time, and the defect of the object to be tested 30 can be determined in the most efficient manner. For example, when the object to be tested 30 is the peripheral cable area of the mobile phone panel, the creation can immediately detect whether the cable area has abnormal short circuit, cross or open circuit. When the object to be tested 30 is a deposition wire region of the solar panel, the creation line can immediately detect whether the wire region has a bad three-dimensional deposition profile, such as a common partial depression, an intermediate fracture or a wear at both ends, thereby causing photocurrent. The phenomenon of instability.

以下請參閱第1圖與第2圖,並介紹本創作之三維光學檢測裝置之第二實施例,第二實施例與第一實施例差別在於光學檢測模組10與待測物30之數量,在第二實施例中,光學檢測模組10與待測物30之數量皆為複數個,且第二實施例與第一實施例之運作方式相同,於此不再贅述。本創作利用程式輔助,將斷層影像疊加成三維影像,能夠更清晰的觀測與檢測手機觸控面板與太陽能板的內部結構。此外,在傳統技術中,分光鏡到平面鏡之間的光束稱參考臂,分光鏡到待測物之間的光束稱樣本臂,參考臂與樣本臂通常等長,並皆稱為干涉臂。本創作使用只有兩公分大小的致動器取代干涉臂,因為光學檢測模組10微小化後做得夠小,所以可以將整個模組縮小,可望組合成微小化三維自動光學檢測矩陣,如第二實施例所示,以高速、高通量的效率同時拍攝多組面板的不同深度多層影像,在未來工業4.0當中可用以取代傳統的人工方式檢測物件,供製造業進行非侵入式線上即時三維檢測,並回饋於生產線參數,以建立全自動化工廠環境,此部分未來在工業檢測上的商機非常大。因工業4.0的蓬勃發展,使得自動化的高速檢測更有價值。手機面板或太陽能板經本創作之三維光學檢測裝置檢測出缺陷後,可直接丟棄省卻後續的加工成本,並可向前回饋於生產線參數直接修復缺陷,線上檢測人員進化為品質監控人員或軟體程式設計師,可以在檢測到缺陷後即時修復省下大量成本、大量人力與大量時間。Please refer to FIG. 1 and FIG. 2 below, and a second embodiment of the three-dimensional optical detecting device of the present invention is introduced. The difference between the second embodiment and the first embodiment lies in the number of the optical detecting module 10 and the object to be tested 30. In the second embodiment, the number of the optical detection module 10 and the object to be tested 30 are plural, and the second embodiment operates in the same manner as the first embodiment, and details are not described herein. This creation uses program-assisted, superimposed tomographic images into 3D images, which enables clearer observation and detection of the internal structure of mobile touch panels and solar panels. In addition, in the conventional technology, the beam between the beam splitter and the plane mirror is called the reference arm, and the beam between the beam splitter and the object to be tested is called the sample arm, and the reference arm is usually the same length as the sample arm, and is called an interference arm. This creation uses an actuator of only two centimeters in size to replace the interference arm. Since the optical detection module 10 is made small enough to be small, the entire module can be reduced, and it is expected to be combined into a miniaturized three-dimensional automatic optical detection matrix, such as As shown in the second embodiment, high-speed, high-throughput efficiencies are simultaneously captured for different depths of multiple sets of panels. In the future, Industry 4.0 can be used to replace traditional manual detection of objects for non-intrusive online instant manufacturing. Three-dimensional inspection, and feedback on the production line parameters to establish a fully automated factory environment, this part of the future business opportunities in industrial testing is very large. Due to the booming industry 4.0, automated high-speed inspection is more valuable. After the mobile phone panel or solar panel detects defects through the created three-dimensional optical inspection device, it can directly discard the subsequent processing costs, and can directly feed back the defects in the production line parameters, and the online inspection personnel evolve into quality control personnel or software programming. The division can save a lot of cost, a lot of manpower and a lot of time when the defect is detected.

「工業4.0」最關鍵的概念就是串連,利用資訊及通訊科技,組成物聯網 (IoT) 及服務聯網 (IoS),將生產流程所有的機器設備、人員、流程與資料連結起來,每個設備更能互相溝通,具備獨立監察、分析和判斷能力,可以隨時找到問題及解決,令生產流程更靈活、有彈性,能快速回應市場需求的變化,這就是「智能工廠」的構想。本創作使用全面掃描技術之全景光學同調攝影術發展高解析度的自動化光學系統,除可對待測物產生立體三維深層影像外,掃描速度亦可獲得極大改善。The most critical concept of "Industry 4.0" is the use of information and communication technology to form the Internet of Things (IoT) and Service Networking (IoS), linking all the machines, people, processes and materials in the production process. They are more able to communicate with each other and have the ability to independently monitor, analyze and judge. They can find problems and solve problems at any time, make the production process more flexible and flexible, and respond quickly to changes in market demand. This is the concept of "smart factory". This creation uses a comprehensive scanning technology for panoramic optical coherence photography to develop a high-resolution automated optical system. In addition to stereoscopic three-dimensional deep images that can be measured, the scanning speed can be greatly improved.

以下請參閱第1圖、第2圖與第3圖,並介紹本創作之三維光學檢測裝置之第三實施例,第二實施例與第三實施例差別在於光學檢測模組10之數量,在第三實施例中,顯示控制模組12之數量為複數個,所有顯示控制模組12分別連接所有光學檢測模組10之影像感測器28,並分別接收其所產生之斷層影像訊號SI,將其搭配程式輔助疊加成一三維影像,其餘運作方式與第二實施例之運作方式相同,於此不再贅述。Referring to FIG. 1 , FIG. 2 and FIG. 3 , a third embodiment of the three-dimensional optical detecting device of the present invention will be described. The difference between the second embodiment and the third embodiment lies in the number of optical detecting modules 10 . In the third embodiment, the number of the display control modules 12 is plural, and all the display control modules 12 are respectively connected to the image sensors 28 of all the optical detecting modules 10, and respectively receive the tomographic image signals SI generated by them. The collocation program is superimposed into a three-dimensional image, and the rest of the operation mode is the same as that of the second embodiment, and details are not described herein again.

綜上所述,本創作利用致動器使樣本光束與參考光束同調,以產生待測物之不同深度之複數斷層影像訊號,進而達到快速清晰檢測內部結構之目的。In summary, the present invention utilizes an actuator to align the sample beam with the reference beam to generate complex tomographic signals at different depths of the object to be tested, thereby achieving the purpose of quickly and clearly detecting the internal structure.

10‧‧‧光學檢測模組10‧‧‧Optical Inspection Module

12‧‧‧顯示控制模組12‧‧‧Display Control Module

14‧‧‧入射光源14‧‧‧ incident light source

16‧‧‧分光元件16‧‧‧Splitting components

18‧‧‧第一聚焦透鏡18‧‧‧First focusing lens

20‧‧‧第一致動器20‧‧‧First actuator

22‧‧‧平面鏡22‧‧‧Flat mirror

24‧‧‧第二聚焦透鏡24‧‧‧second focusing lens

26‧‧‧第二致動器26‧‧‧Second actuator

28‧‧‧影像感測器28‧‧‧Image sensor

30‧‧‧待測物30‧‧‧Test object

第1圖為本創作之第一實施例之三維光學檢測裝置之示意圖。 Fig. 1 is a schematic view showing a three-dimensional optical detecting device of a first embodiment of the present invention.

第2圖為本創作之第二實施例之三維光學檢測裝置之示意圖。 Fig. 2 is a schematic view showing the three-dimensional optical detecting device of the second embodiment of the present invention.

第3圖為本創作之第三實施例之三維光學檢測裝置之示意圖。 Fig. 3 is a schematic view showing the three-dimensional optical detecting device of the third embodiment of the present invention.

Claims (6)

一種三維光學檢測裝置,包含:至少一光學檢測模組,包含:一入射光源,產生一入射光束;一分光元件,接收該入射光束,並將其分為參考光束與檢測光束;一第一聚焦透鏡,設於該分光元件與至少一待測物之間,且該分光元件、該第一聚焦透鏡與該待測物位於一第一直線軸上,該第一聚焦透鏡聚焦該檢測光束於該待測物上,以反向反射或散射產生樣本光束,並將此樣本光束透過該第一聚焦透鏡傳遞至該分光元件中;一第一致動器,承載該第一聚焦透鏡,並控制該第一聚焦透鏡在該第一直線軸上移動;一平面鏡與一第二聚焦透鏡,該第二聚焦透鏡設於該分光元件與該平面鏡之間,且該分光元件、該第二聚焦透鏡與該平面鏡位於一第二直線軸上,該第二聚焦透鏡聚焦該參考光束於該平面鏡上,該平面鏡透過該第二聚焦透鏡反射該參考光束回該分光元件;一第二致動器,承載該第二聚焦透鏡,並控制該第二聚焦透鏡在該第二直線軸上移動,在該第一聚焦透鏡與該第二聚焦透鏡移動時,該樣本光束與該參考光束配合該第一聚焦透鏡與該第二聚焦透鏡而具有同調性,並經該分光元件相互干涉,以產生複數平面式光學干涉訊號;以及一影像感測器,感測該些平面式光學干涉訊號,以產生該至少一 待測物之不同深度之複數斷層影像訊號;以及至少一顯示控制模組,連接該影像感測器,並接收該些斷層影像訊號,將其疊加成一三維影像。 A three-dimensional optical detecting device comprising: at least one optical detecting module, comprising: an incident light source to generate an incident light beam; a light splitting component, receiving the incident light beam, and dividing the light beam into a reference beam and a detecting beam; a lens disposed between the beam splitting element and the at least one object to be tested, wherein the beam splitting element, the first focusing lens and the object to be tested are located on a first linear axis, and the first focusing lens focuses the detecting beam on the a sample beam is generated by back reflection or scattering, and the sample beam is transmitted to the beam splitting element through the first focus lens; a first actuator carries the first focus lens and controls the first a focusing lens is moved on the first linear axis; a plane mirror and a second focusing lens, the second focusing lens is disposed between the beam splitting element and the plane mirror, and the beam splitting element, the second focusing lens is located with the plane mirror On a second linear axis, the second focusing lens focuses the reference beam on the plane mirror, and the plane mirror reflects the reference beam back to the beam splitting through the second focusing lens a second actuator that carries the second focus lens and controls the second focus lens to move on the second linear axis. When the first focus lens and the second focus lens move, the sample beam Cooperating with the reference beam, the first focusing lens and the second focusing lens are coherent, and interfere with each other through the beam splitting element to generate a plurality of planar optical interference signals; and an image sensor for sensing the planes Optical interferometric signal to generate the at least one a plurality of tomographic image signals of different depths of the object to be tested; and at least one display control module connected to the image sensor and receiving the tomographic image signals to be superimposed into a three-dimensional image. 如請求項1所述之三維光學檢測裝置,其中該入射光源為發光二極體或高強度雷射二極體。 The three-dimensional optical detecting device of claim 1, wherein the incident light source is a light emitting diode or a high intensity laser diode. 如請求項1所述之三維光學檢測裝置,其中該入射光束為白光、紅光或紅外光。 The three-dimensional optical detecting device of claim 1, wherein the incident light beam is white light, red light or infrared light. 如請求項1所述之三維光學檢測裝置,其中該影像感測器為電荷耦合元件(CCD)或互補金屬氧化物半導體(CMOS)。 The three-dimensional optical detecting device of claim 1, wherein the image sensor is a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS). 如請求項1所述之三維光學檢測裝置,其中該光學檢測模組之數量為複數個。 The three-dimensional optical detecting device of claim 1, wherein the number of the optical detecting modules is plural. 如請求項1所述之三維光學檢測裝置,其中該顯示控制模組之數量為複數個。The three-dimensional optical detecting device of claim 1, wherein the number of the display control modules is plural.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110378171A (en) * 2018-04-13 2019-10-25 致伸科技股份有限公司 The detection system of fingerprint identification module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110378171A (en) * 2018-04-13 2019-10-25 致伸科技股份有限公司 The detection system of fingerprint identification module

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