TWM548598U - Flow-guiding structure - Google Patents

Abstract

An air deflector of the present invention comprises an upper cover with a vent, a deflector with a deflector hole, and a back cover with an inlet; wherein the deflector connects with the upper cover and the back cover separately; and an axis line of the vent and an axis line of the deflector hole are parallel with each other; the axis line of the deflector hole connects to an axis line of the inlet, thus, the lines to form a straight line with each other.

Description

Diversion structure

The present invention relates to a gas inlet and outlet device for a wafer cassette, and more particularly to a gas guiding device disposed between an inflator of a wafer cassette and a gas diffusion device.

The wafer cassette is used for transporting and storing wafers between semiconductor processes. To prevent contamination of the wafer during the process, an inflated hole is placed at the bottom of the wafer cassette, and the inside of the wafer cassette is filled with dry clean gas. The way to maintain the humidity and cleanliness inside the wafer cassette.

In order to keep the inside of the wafer cassette clean, one to four inflating holes are usually opened at the bottom of the wafer cassette. However, the gas filling method of the inflating hole in the inflating hole often causes uneven distribution of airflow in the wafer cassette, and generates a dead angle of airflow. It still causes problems of uneven humidity or partial cleanliness.

In view of the foregoing problems, the industry has installed a gas diffusion device in the wafer cassette so that the gas entering from the gas-filled hole can be uniformly distributed in the gas diffusion device, and then uniformly diffused into the inside of the wafer cassette, thereby reducing the dead angle of the air flow. problem.

However, in order to prevent the gas diffusion device from colliding with the wafer in the wafer cassette, the wafer is damaged, and the gas diffusion device is not disposed too close to the wafer, so not all the wafer cassettes can be equipped with the gas diffusion device. .

According to most existing wafer cassette structures, the inflation holes are permanently placed at the edge of the wafer. As a result, the gas diffusion device cannot be installed, or both the gas-filled holes or the gas diffusion device are structurally incompatible, and the gas diffusion device cannot be mounted on the gas-filled holes.

Accordingly, there is a need for a structural device that is mounted inside the wafer cassette so that the gas diffusion device can be smoothly connected to the inflation hole without coming into contact with the wafer.

In order to solve the problems of the prior art, the present invention proposes a flow guiding structure, which is conveniently installed inside the wafer cassette, and one end of which can be connected with the gas diffusion device, and the other end can be connected with the inflation hole on the wafer cassette for airflow. The role of conduction.

The flow guiding structure of the present invention comprises: an upper cover having an air outlet; a deflector having a flow guiding hole; and a lower cover having an air inlet, wherein the deflector is respectively connected to the upper cover and the lower cover, And the axial line of the air outlet and the axial line of the air guiding hole are parallel to each other, and the axial line of the air guiding hole and the axial line of the air inlet hole are connected to each other as a straight line.

Since the axial line of the air outlet and the axial line of the air guiding hole are parallel to each other, the distance between the air outlet and the air guiding hole is shifted, and the axial center shift occurs. At this time, the gas diffusion device is installed. In the air outlet of the upper cover, the air inlet of the lower cover is connected with the inflation hole of the wafer cassette, so that the gas diffusion device does not need to be directly disposed above the inflation hole, avoiding the position of wafer storage in the wafer cassette, and still It communicates with the inflation hole to achieve a uniform airflow and maintain the internal cleanliness of the wafer cassette.

By designing the diversion structure of the axis of the creation, it is not necessary to change the structure of the original gas diffusion device or the inflation hole, and it is not necessary to change the position of the inflation hole in the wafer cassette, and the existing wafer cassette and the inflation hole are utilized. The structure allows the gas diffusion device to be smoothly installed on the wafer cassette, which is low in cost and simple and convenient.

10‧‧‧Upper cover

12‧‧‧ Vents

20‧‧‧Baffle

22‧‧‧Inlet

24‧‧‧Upper connector

26‧‧‧ Lower connector

28‧‧‧First locking hole

30‧‧‧Under the cover

32‧‧‧Air intake

34‧‧‧Second locking hole

40‧‧‧shims

42‧‧‧ holes

50‧‧‧Bottom of the wafer cassette

52‧‧‧Inflatable holes

60‧‧‧ gas diffusion device

A1‧‧‧ Venting axis

A2‧‧‧Drain shaft axis

A3‧‧‧Intake shaft axis

C‧‧‧ hatching

The first picture is the schematic diagram of the disassembly of the creative diversion structure (1); the second picture is the schematic diagram of the disassembly of the creative diversion structure (2); the third picture is the schematic diagram of the installation of the creative diversion structure; A schematic diagram of the use of the creative diversion structure.

The present invention proposes a flow guiding structure for conducting airflow between the gas diffusion device and the inflating hole of the wafer cassette, please refer to FIG. 1 , which is a schematic diagram of disassembling the creative guiding structure (1), and the guiding structure comprises: An upper cover 10 having an air outlet 12; a deflector 20 having a flow guiding hole 22; and a lower cover 30 having an air inlet 32.

The baffles 20 are respectively connected to the upper cover 10 and the lower cover 30, and the axial line a1 of the air outlet 12 and the axial line a2 of the flow guiding hole 22 are parallel to each other, and the axial line a2 of the guiding hole 22 is The axis lines a3 of the intake holes 32 are connected to each other in a straight line.

By the parallel offset between the axial line a1 of the air outlet 12 and the axial line a2 of the air guiding hole 22, the gas diffusing device 60 (shown in FIG. 4) and the mounting of the air outlet 12 will be installed. A distance is translated between the inflation holes 52 of the air inlet hole 32 (as shown in FIG. 4), and the axial line a2 of the air guiding hole 22 and the axial line a3 of the air inlet hole 32 are connected to each other as a straight line. The clean gas entering from the inflating hole 52 of the wafer cassette (as shown in FIG. 4) enters the upper cover 10 from the axial line a3 of the air inlet 32 and along the axial line a2 of the air guiding hole 22, The upper cover 10 moves in parallel and enters the gas diffusion device 60 along the axis line a1 of the air outlet 12 (as shown in Fig. 4).

In this way, the gas diffusion device 60 (as shown in FIG. 4) can be omitted. Above the inflating hole 52 (shown in FIG. 4), the position of the wafer in the wafer cassette is avoided, and the air hole can still be communicated with the inflating hole to achieve uniform airflow and maintain the interior of the wafer cassette.

Specifically, the baffle 20 can also have an upper connecting member 24, and the upper connecting member 24 is connected to the upper cover 10, and the connecting manner can select complementary threads or simple snaps, and thus the upper connecting member 24 and the upper cover. A gas accommodating space is formed between 10, which can achieve a uniform airflow and achieve the effect of airflow translation.

The baffle 20 can also have a lower connecting member 26, and the lower connecting member 26 is connected to the lower cover 30, and the connecting manner can also be a complementary thread or a simple snap; and the deflector 20 and the lower cover 30 A gasket 40 may be provided to avoid leakage of the forced gas and the joint gap. Therefore, the gasket 40 may have at least one hole 42 correspondingly corresponding to the flow guiding hole 22 for the flow guiding hole 22 to pass therethrough.

Please refer to Fig. 2 and Fig. 4, respectively, which are schematic diagrams of the disassembly of the creative diversion structure (2) and the use of the creative diversion structure, and further make the structural relationship between the baffle 20 and the lower cover 30. Description.

According to the structure of many existing inflator holes of the wafer cassette, the inflating holes 52 are often composed of four quarter-circle holes, and therefore, the shape of the lower connecting member 26 of the deflector 20 may be a quarter cylinder. Thereby, the hole in the inflation hole 52 is engaged.

The lower connecting member 26 can have a first locking hole 28, and the lower cover 30 has at least one second locking hole 34 correspondingly engaged with the first locking hole 28, so that the lower cover 30 can be locked in the diversion. On the lower connector 26 of the plate 20.

Accordingly, the structure of the at least one hole 42 in the spacer 40 can be correspondingly matched with the lower connecting member 26, for example, the hole portion of the at least one hole 42 is formed into a shape of a quarter circle. The shape of the lower connector 26 or the inflation hole 52 is matched.

Next, please refer to Fig. 3 and Fig. 4, respectively, which are schematic diagrams of the installation of the creative flow guiding structure and the schematic diagram of the use of the creative flow guiding structure, wherein the third figure is along the direction of the section line C of Fig. 1, The cross-sectional view is formed to further explain the manner in which the flow guiding structure is mounted on the wafer cassette.

The air outlet 12 of the flow guiding structure passing through the upper cover 10 is connected to the gas diffusing device 60. The structure of the air outlet 12 can be matched with the bottom structure of the gas diffusing device 60, for example, a circular shape that is sized and shaped to be engaged. The deflector 20 having the flow guiding holes 22 can be connected to the upper cover 10 through the upper connecting member 24, and a gas receiving space is formed between the upper connecting member 24 and the upper cover 10.

Fig. 4 is a view showing the structure of the inflation hole 52 of the bottom 50 of the wafer cassette. The inflation hole 52 is usually disposed at the bottom corner of the wafer cassette. The shape of the inflation hole 52 is usually composed of four quarter circle holes. Therefore, the lower connecting member 26 of the baffle 20 may be a quarter cylindrical shape for engaging a quarter-circle of the hole in the inflating hole 52. At the same time, the shape of the flow guiding hole 22 may also be a quarter circle to match the shape of the inflation hole 52.

The upper cover 10 and the upper connecting member 24 of the deflector 20 are disposed inside the wafer cassette, the lower connecting member 26 of the deflector 20 is in contact with the lower cover 30, and the lower cover 30 is disposed outside the wafer cassette. The lower connecting member 26 of the deflector 20 engages the hole in the inflating hole 52, and the lower cover 30 is locked from the outside of the wafer cassette to the first locking hole 28 of the lower connecting member 26 by the second locking hole 34 thereof. Thus, the lower cover 30 is mounted on the lower connecting member 26 of the deflector 20.

The second locking hole 34 can be formed into a convex-shaped hole for facilitating the use of a screw or the like for the fixed object, extending from the second locking hole 34 into the first locking hole 28, and locking in the first locking hole. hole 28 and a convex top end of the second locking hole 34.

The gasket 40 is disposed between the lower joint member 26 and the lower cover 30 to prevent leakage of the forced gas and the joint gap.

In summary, due to the phenomenon of axial misalignment between the air outlet and the air guiding hole, at this time, the gas diffusion device is installed on the air outlet hole of the upper cover, and the air inlet hole of the lower cover is inflated with the inflating hole of the wafer cassette. The connection allows the gas diffusion device to be disposed directly above the inflation hole, avoiding the location of the wafer storage in the wafer cassette, but still communicating with the inflation hole to achieve uniform airflow and maintain the interior of the wafer cassette.

With the flow guiding structure of the present invention, it is not necessary to change the structure of the original gas diffusion device or the inflation hole, and it is not necessary to change the position of the inflation hole in the wafer cassette, and the structure of the existing wafer cassette and the inflation hole can be used. The gas diffusion device is smoothly installed on the wafer cassette, which is low in cost and simple and convenient.

10‧‧‧Upper cover

12‧‧‧ Vents

20‧‧‧Baffle

22‧‧‧Inlet

24‧‧‧Upper connector

26‧‧‧ Lower connector

30‧‧‧Under the cover

32‧‧‧Air intake

34‧‧‧Second locking hole

40‧‧‧shims

42‧‧‧ holes

A1‧‧‧ Venting axis

A2‧‧‧Drain shaft axis

A3‧‧‧Intake shaft axis

C‧‧‧ hatching

Claims (9)

A flow guiding structure comprising: an upper cover having an air outlet; a deflector having a flow guiding hole; and a lower cover having an air inlet, wherein the deflector and the upper cover and the lower cover respectively Connected, and the axial line of the air outlet and the axial line of the air guiding hole are parallel to each other, and the axial line of the guiding hole and the axial line of the air inlet are connected to each other in a straight line. The flow guiding structure according to claim 1, wherein the deflector further has an upper connecting member connected to the upper cover and forming a gas receiving space. The flow guiding structure according to claim 1, wherein the deflector further has a lower connecting member and is connected to the lower cover by the lower connecting member. The flow guiding structure of claim 3, wherein a spacer is disposed between the deflector and the lower cover. The flow guiding structure of claim 4, wherein the spacer has at least one hole corresponding to the guiding hole. The flow guiding structure of claim 4, wherein the lower connecting member has a shape of a quarter of a cylinder. The flow guiding structure of claim 6, wherein the lower connecting member has a first locking hole. The flow guiding structure of claim 7, wherein the spacer has at least one hole corresponding to the lower connecting member. The flow guiding structure of claim 8, wherein the lower cover further has at least one second locking hole correspondingly engaged with the first locking hole.