TWM546655U - Liquid-cooled heat-dissipation structure - Google Patents

Description

Liquid cooled heat dissipation structure

This creation is related to a heat sink, especially a liquid cooled heat sink structure.

According to the electronic product, a large amount of heat is generated during the operation of the electronic device, and when the temperature of the device is too high, the performance of the device is affected, resulting in poor operation or even damage. Therefore, the heat generated by the device must be derived by the heat sink to Maintain its normal operation.

There are three modes of heat transfer, conduction, convection, and radiation. The conduction system brings two objects into contact with each other, and heat is transferred from the high temperature object toward the low temperature object. Convection refers to the transfer of heat by the flow of a fluid such as a liquid or a gas, including natural convection due to changes in density or pressure due to differences in temperature inside the fluid, and forced convection forced by external forces applied to the system. Radiation is the effect of emitting energy in the form of electromagnetic waves from the temperature of the object itself, the intensity of which depends on the temperature.

Using the above heat transfer principle, the industry has developed an air-cooled heat sink that contacts a heat source with a heat-conducting seat and projects a plurality of fins from the heat-conducting seat. The heat-conducting seat directs heat generated by the heat source to the fins when the air flows through the air. When the fins are removed, the heat can be removed by the above-mentioned heat conduction mode to reduce the temperature of the heat source. However, the efficiency of heat dissipation depends on the thermal conductivity of the material, and the thermal conductivity of air is very small, so the heat dissipation efficiency of the air-cooled heat sink is not good.

In view of this, how to improve the above problems is the primary issue that the creative office wants to solve.

The main purpose of this creation is to provide a liquid-cooled heat dissipation structure, which is combined with a heat source. Contact can be used to derive heat and use the circulating flow of liquid such as water to remove heat, thereby achieving the effect of heat dissipation.

For the purpose of the foregoing, the present invention provides a liquid-cooled heat dissipation structure, comprising: a body having a base body and a top cover body, wherein the base body and the top cover body are respectively provided with a concave side a hole, and after the base body is combined with the top cover body, the recesses of the two form a chamber located inside the body, and the base body and the top cover body are waterproofly combined, wherein the base body is a metal material having a high thermal conductivity is used for contacting the heat source; the base body and one side of the top cover body are respectively provided with a channel, and the channel of the base body is corresponding to the cavity, and the top cover body is disposed The channel is disposed corresponding to the cavity, and the channel combination of the two forms a flow path for fluid flow, wherein the flow channel is provided with a water inlet and a water outlet in the top cover body for connecting to a fluid circulation system.

In an embodiment, the flow path extends to form a spiral.

In an embodiment, the top cover body is made of a permeable acrylic material. A light-emitting element is disposed in the chamber, and the flow path extends to form a spiral around the circumference of the chamber.

In an embodiment, a waterproof gasket is disposed between the base body and the top cover body.

In an embodiment, the base body protrudes from a heat conducting portion.

The above objects and advantages of the present invention are not to be understood in detail from the detailed description and the accompanying drawings.

1‧‧‧ Ontology

11‧‧‧Base body

12‧‧‧Top cover

111, 121‧‧ ‧ pocket

112, 122‧‧‧ channel

13‧‧‧Transfer Department

14‧‧‧ screws

15‧‧‧Waterproof gasket

16‧‧ ‧ room

2‧‧‧Lighting elements

3‧‧‧ flow path

31‧‧‧ water inlet

32‧‧‧Water outlet

Figure 1 is a perspective view of the creation; Figures 2 and 3 are schematic exploded views of the creation; Figure 4 is a schematic plan view of the creation; Figure 5 is a schematic view of the A-A direction of Figure 4

Fig. 6 is a schematic cross-sectional view taken along the line B-B in Fig. 5.

Referring to Figures 1 and 2, there is shown a liquid-cooled heat dissipation structure provided by the present invention, which has a body 1 including a base body 11 and a top cover body 12, wherein the base body 11 is A metal material having a high thermal conductivity, such as copper or aluminum, protrudes from a heat conducting portion 13, and when the base portion 11 contacts the heat source 13 with a heat source, the heat energy of the heat source can be quickly transmitted to the base. The top cover 12 is made of a permeable acrylic material, such as acrylic. The base body 11 and the top cover body 12 are locked together by screws 14 to form the body 1. In the embodiment, a waterproof gasket 15 is disposed between the base body 11 and the top cover body 12, thereby The body 1 is made waterproof.

The base body 11 and the top cover body 12 are respectively provided with a recess 111, 121 on one side of the cover body 12, and after the base body 11 is combined with the top cover body 12, the recesses 111 and 121 of the two are as follows. Connected to the ground shown in Fig. 5 to form a chamber 16 located inside the body 1. The light-emitting element 2 is disposed in the chamber 16 . In the embodiment, the light-emitting element 2 is an LED lamp body, and the shape thereof is matched with the two pockets 111 and 121 as shown in FIG. 3 to fill the space. The chamber and the light emitted by the chamber can pass through the top cover 12 to pass out of the body 1 to achieve the decoration and display effect.

In addition, one side of the base body 11 and the top cover body 12 are respectively provided with a channel 112, 122, and the channels 112 and 122 of the two are divided into a plurality of arc segments to be spaced apart. In this embodiment, the channel 112 of the base body 11 is disposed corresponding to the recess 111, and the depth of the channel 112 is greater than the depth of the recess 111; the channel 122 of the top cover 12 is disposed corresponding to the recess 121 thereof. And the depth of the channel 122 is greater than the depth of the cavity 121. Accordingly, after the base body 11 is combined with the top cover body 12, as shown in FIGS. 4 to 6, the two channels 112, 122 are connected to form a spiral extending and surrounding the chamber. 16 a peripheral flow channel 3, the flow channel 3 is available for fluid flow, and a water inlet port 31 and a water outlet port 32 are provided on one side surface of the top cover body 12, and the connection pipe is connected to a pipe There is a tank and pump fluid circulation system (not shown).

The present invention constitutes a liquid-cooled heat dissipation structure by the above structure, and the heat conduction portion 13 of the base body 11 is in contact with a heat source such as a semiconductor (MOS), and the heat energy generated when the semiconductor is activated is quickly introduced. The base body 11, thereby lowering the temperature of the semiconductor to maintain its normal operation. On the other hand, the coolant that is driven by the fluid circulation system will flow from the water. The port 31 is injected into the flow channel 3, and the water outlet 32 at the other end of the flow channel 3 flows out. As shown in Figs. 4 to 6, the coolant is injected from the water inlet port 31 at a temperature lower than the temperature. The state of the base body 11 passes through the base body 11 when it flows in the flow path 3, and is in contact with the base body 11, so that thermal energy can be introduced into the coolant from the base body 11 through the heat exchange principle, thereby reducing the The temperature of the base body 11 is such that the base body 11 can continuously conduct heat energy emitted by the semiconductor. The spiral extending of the flow path 3 increases the area in contact with the base body 11, whereby the heat exchange efficiency between the coolant and the base body 11 can be improved.

When the cooling liquid is discharged from the water outlet 32 through the flow path 3, it absorbs the heat energy of the base body 11 to be heated, and then the temperature can be lowered by the fluid circulation system by various conventional techniques, and recycled to the inlet. The nozzle 31 exchanges heat with the base body 11 again.

However, the above description of the embodiments is merely illustrative of the present invention and is not intended to limit the present invention. Therefore, the replacement of equivalent elements should still be within the scope of the present invention.

In summary, it can be made clear to the skilled person that the creation can achieve the aforementioned objectives, and it has already met the requirements of the Patent Law and submitted an application according to law.

1‧‧‧ Ontology

11‧‧‧Base body

12‧‧‧Top cover

111, 121‧‧ ‧ pocket

112, 122‧‧‧ channel

13‧‧‧Transfer Department

14‧‧‧ screws

15‧‧‧Waterproof gasket

2‧‧‧Lighting elements

31‧‧‧ water inlet

32‧‧‧Water outlet

Claims (8)

A liquid-cooled heat dissipation structure includes: a body having a base body and a top cover body, wherein the base body and the top cover body are respectively provided with a recess on one side thereof, and the base body and the base body After the top cover body is combined, the recesses of the two form a chamber located inside the body, and the base body and the top cover body are waterproofly combined, wherein the base body is made of a metal material with high thermal conductivity. The channel body and the one side of the top cover body are respectively provided with a channel, and the channel of the base body is disposed corresponding to the cavity, and the channel of the top cover body is corresponding to the cavity. And the combination of the two channels constitutes a flow path for fluid flow, wherein the flow channel is provided with a water inlet and a water outlet in the top cover body for connecting to a fluid circulation system. The liquid-cooled heat dissipation structure according to claim 1, wherein the flow path extends to form a spiral shape. The liquid-cooled heat dissipation structure according to claim 1, wherein the top cover body is made of a permeable acrylic material. The liquid-cooled heat dissipation structure according to claim 3, wherein a light-emitting element is disposed in the chamber. The liquid-cooled heat dissipation structure of claim 4, wherein the flow path extends to form a spiral around the circumference of the chamber. The liquid-cooled heat dissipation structure of claim 1, wherein a waterproof gasket is disposed between the base body and the top cover body. The liquid-cooled heat dissipation structure according to claim 1, wherein the base body protrudes from a heat conducting portion. The liquid cooling heat dissipation structure of claim 1, the fluid circulation system comprising a water tank and a pump.