TWM542802U - Liquid cooling system - Google Patents
Liquid cooling system Download PDFInfo
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- TWM542802U TWM542802U TW106203122U TW106203122U TWM542802U TW M542802 U TWM542802 U TW M542802U TW 106203122 U TW106203122 U TW 106203122U TW 106203122 U TW106203122 U TW 106203122U TW M542802 U TWM542802 U TW M542802U
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Abstract
Description
本創作關於一種液冷系統,尤指一種可使散熱器相對液冷頭於至少二相異位置間轉動之液冷系統。The present invention relates to a liquid cooling system, and more particularly to a liquid cooling system that allows the radiator to rotate relative to the liquid cooling head between at least two different positions.
散熱裝置與電子裝置的發展息息相關。由於電子裝置在運作時,電路中的電流會因阻抗的影響而產生不必要的熱能,如果這些熱能不能有效地排除而累積在電子裝置內部的電子元件上,電子元件便有可能因為不斷升高的溫度而損壞。因此,散熱裝置的優劣影響電子裝置的運作甚鉅。The heat sink is closely related to the development of electronic devices. Since the current in the circuit generates unnecessary thermal energy due to the influence of the impedance when the electronic device is in operation, if the thermal energy cannot be effectively eliminated and accumulated on the electronic components inside the electronic device, the electronic component may be continuously raised. The temperature is damaged. Therefore, the advantages and disadvantages of the heat sink affect the operation of the electronic device.
目前,電子裝置最常用的散熱裝置是透過將熱管的一端接觸會產生熱的電子元件,另一端連接散熱片,並以散熱風扇對散熱片進行散熱。然而,散熱風扇在高轉速之下所產生的擾人噪音及高耗電量,常常是製造業者所難以克服之問題。因此,液冷系統便因應而生。At present, the most commonly used heat sink for an electronic device is to heat the electronic component by contacting one end of the heat pipe, and to connect the heat sink to the other end, and to dissipate heat from the heat sink. However, the disturbing noise and high power consumption of the cooling fan at high speeds are often difficult for manufacturers to overcome. Therefore, the liquid cooling system is born.
一般而言,液冷系統主要係由複數個管路連接液冷頭、散熱器以及泵浦所構成。液冷系統在對電子元件進行散熱時,係由泵浦將冷卻液打入液冷頭,冷卻液吸收電子元件所產生的熱量,再由散熱器對冷卻液進行冷卻。於液冷系統中,液冷頭、散熱器與泵浦之相對位置係為固定且不可調整。此外,由於電子裝置內部之電子元件的配置不盡相同,電子裝置內部可用來裝設液冷系統的空間也受到限制。因此,便需針對不同的電子裝置設計專屬的液冷系統,使得液冷系統在使用上較無彈性,且會增加製造成本。In general, the liquid cooling system is mainly composed of a plurality of pipe connection liquid cooling heads, a radiator and a pump. When the liquid cooling system heats the electronic components, the cooling liquid is pumped into the liquid cooling head by the pump, the cooling liquid absorbs the heat generated by the electronic components, and then the cooling liquid is cooled by the radiator. In the liquid cooling system, the relative positions of the liquid cooling head, the radiator and the pump are fixed and non-adjustable. In addition, since the arrangement of the electronic components inside the electronic device is not the same, the space inside the electronic device for mounting the liquid cooling system is also limited. Therefore, it is necessary to design a dedicated liquid cooling system for different electronic devices, so that the liquid cooling system is less flexible in use and increases manufacturing costs.
本創作提供一種可使散熱器相對液冷頭於至少二相異位置間轉動之液冷系統,以解決上述之問題。The present invention provides a liquid cooling system that allows the radiator to rotate relative to the liquid cooling head between at least two different positions to solve the above problems.
根據一實施例,本創作之液冷系統包含一液冷頭、一固定件、一散熱器、一泵浦、二第一水嘴以及至少一風扇。固定件設置於液冷頭上。散熱器藉由固定件安裝於液冷頭,並藉由固定件使散熱器相對液冷頭於至少二相異位置間轉動。散熱器具有一儲液箱。泵浦選擇性地設置液冷頭或儲液箱上。二第一水嘴沿一第一軸向可轉動地設置於儲液箱之相對二側,且風扇沿一第二軸向設置於散熱器上,其中第一軸向與第二軸向相異。According to an embodiment, the liquid cooling system of the present invention comprises a liquid cooling head, a fixing member, a radiator, a pump, two first nozzles and at least one fan. The fixing member is disposed on the liquid cooling head. The heat sink is mounted to the liquid cooling head by a fixing member, and the heat sink is rotated relative to the liquid cooling head at at least two different positions by the fixing member. The radiator has a reservoir. The pump is selectively placed on the liquid cooling head or the reservoir. The first water nozzle is rotatably disposed on opposite sides of the liquid storage tank along a first axial direction, and the fan is disposed on the heat sink along a second axial direction, wherein the first axial direction is different from the second axial direction .
綜上所述,由於散熱器可相對液冷頭於至少二相異位置間轉動,使用者或製造商即可根據電子裝置內部之電子元件的配置,調整散熱器相對液冷頭之位置,以避免液冷系統與電子裝置內部之電子元件產生干涉而無法裝設之問題。此外,本創作可將泵浦選擇性地設置於液冷頭或散熱器之儲液箱上,以增加製造上的彈性。再者,由於水嘴與風扇係沿相異軸向設置於散熱器上,且水嘴可轉動,因此,在散熱器相對液冷頭轉動的過程中,連接水嘴的管路不會與風扇產生干涉,使得散熱器可相對液冷頭順暢地轉動,亦可避免管路被風扇拉扯而脫離水嘴。In summary, since the heat sink can rotate relative to the liquid cooling head at at least two different positions, the user or the manufacturer can adjust the position of the heat sink relative to the liquid cooling head according to the configuration of the electronic components inside the electronic device. Avoid the problem that the liquid cooling system interferes with the electronic components inside the electronic device and cannot be installed. In addition, the present invention can selectively place the pump on the liquid cooling head or the reservoir of the radiator to increase manufacturing flexibility. Furthermore, since the faucet and the fan are disposed on the heat sink in different axial directions, and the faucet is rotatable, the pipe connecting the faucet does not interact with the fan during the rotation of the heat sink relative to the liquid cooling head. Interference is generated so that the radiator can be smoothly rotated relative to the liquid cooling head, and the pipeline can be prevented from being pulled by the fan and released from the nozzle.
關於本創作之優點與精神可以藉由以下的創作詳述及所附圖式得到進一步的瞭解。The advantages and spirit of this creation can be further understood by the following detailed description of the creation and the drawings.
請參閱第1圖至第4圖,第1圖為根據本創作一實施例之液冷系統1的示意圖,第2圖為第1圖中的液冷系統1於另一視角的示意圖,第3圖為第1圖中的液冷系統1的爆炸圖,第4圖為第1圖中的散熱器14轉動後的示意圖。Please refer to FIG. 1 to FIG. 4 , FIG. 1 is a schematic diagram of a liquid cooling system 1 according to an embodiment of the present invention, and FIG. 2 is a schematic view of the liquid cooling system 1 in FIG. The figure is an exploded view of the liquid cooling system 1 in Fig. 1, and Fig. 4 is a schematic view showing the heat sink 14 in Fig. 1 rotated.
如第1圖至第4圖所示,液冷系統1包含一液冷頭10、一固定件12、一散熱器14、一泵浦16、二第一水嘴18、二風扇20、二第二水嘴22以及二管路24。固定件12設置於液冷頭10上。於此實施例中,泵浦16設置於液冷頭10上,且固定件12設置於泵浦16上,使得固定件12設置於液冷頭10上。於實際應用中,液冷頭10與泵浦16可整合成單一元件,但不以此為限。As shown in FIG. 1 to FIG. 4, the liquid cooling system 1 includes a liquid cooling head 10, a fixing member 12, a radiator 14, a pump 16, two first nozzles 18, two fans 20, and two. The dither 22 and the two tubes 24 are provided. The fixing member 12 is disposed on the liquid cooling head 10. In this embodiment, the pump 16 is disposed on the liquid cooling head 10, and the fixing member 12 is disposed on the pump 16, so that the fixing member 12 is disposed on the liquid cooling head 10. In practical applications, the liquid cooling head 10 and the pump 16 can be integrated into a single component, but not limited thereto.
固定件12具有二側板120,其中二側板120彼此相對。散熱器14設置於二側板120之間且藉由樞軸140與二側板120樞接。換言之,散熱器14係藉由固定件12安裝於液冷頭10與泵浦16。每一個側板120具有一第一彈性懸臂122以及一第二彈性懸臂124,且散熱器14之二側分別具有一固定孔142,如第3圖所示。需說明的是,受限於視角,第3圖僅顯示散熱器14一側之固定孔142。於此實施例中,第一彈性懸臂122與第二彈性懸臂124係用以與固定孔142卡合。此外,每一個側板120另具有一限位軌道126,且散熱器14之二側分別具有一限位件144,如第1圖與第2圖所示。限位件144係設置於限位軌道126中,使得限位件144可與限位軌道126配合,以限制散熱器14之轉動角度。The fixture 12 has two side panels 120 with the two side panels 120 facing each other. The heat sink 14 is disposed between the two side plates 120 and pivotally connected to the two side plates 120 by the pivot 140. In other words, the heat sink 14 is attached to the liquid cooling head 10 and the pump 16 by the fixing member 12. Each of the side plates 120 has a first elastic cantilever 122 and a second elastic cantilever 124, and the two sides of the heat sink 14 respectively have a fixing hole 142, as shown in FIG. It should be noted that, limited to the viewing angle, FIG. 3 only shows the fixing holes 142 on the side of the heat sink 14. In this embodiment, the first elastic cantilever 122 and the second elastic cantilever 124 are configured to engage with the fixing holes 142. In addition, each of the side plates 120 further has a limiting rail 126, and the two sides of the heat sink 14 respectively have a limiting member 144, as shown in FIGS. 1 and 2. The limiting member 144 is disposed in the limiting rail 126 such that the limiting member 144 can cooperate with the limiting rail 126 to limit the rotation angle of the heat sink 14 .
散熱器14具有一儲液箱146。於此實施例中,儲液箱146可用以儲存冷卻液,且用以調節泵浦運作時產生的液壓。二第一水嘴18沿一第一軸向A1可轉動地設置於儲液箱146之相對二側,且二風扇20沿一第二軸向A2設置於散熱器14上,其中第一軸向A1與第二軸向A2相異,如第1圖與第2圖所示。於此實施例中,第一軸向A1與第二軸向A2垂直,但不以此為限。此外,二第二水嘴22沿第二軸向A2可轉動地設置於泵浦16上。二管路24係用以連接二第一水嘴18與二第二水嘴22,進而形成冷卻液之循環通路。The radiator 14 has a reservoir 146. In this embodiment, the reservoir 146 can be used to store coolant and to regulate the hydraulic pressure generated during pump operation. The first water nozzles 18 are rotatably disposed on opposite sides of the liquid storage tank 146 along a first axial direction A1, and the two fans 20 are disposed on the heat sink 14 along a second axial direction A2, wherein the first axial direction A1 is different from the second axial direction A2 as shown in Figs. 1 and 2. In this embodiment, the first axial direction A1 is perpendicular to the second axial direction A2, but is not limited thereto. Further, the second second nozzles 22 are rotatably disposed on the pump 16 along the second axial direction A2. The two conduits 24 are used to connect the two first nozzles 18 and the second nozzles 22 to form a circulation passage for the coolant.
當散熱器14相對液冷頭10處於第1圖所示之垂直位置時,側板120之第一彈性懸臂122係與散熱器14之固定孔142卡合固定。若使用者欲將散熱器14相對液冷頭10自第1圖所示之垂直位置轉動至第4圖所示之水平位置,使用者可直接轉動散熱器14。此時,側板120之第一彈性懸臂122便會脫離散熱器14之固定孔142。當散熱器14轉動至第4圖所示之水平位置時,側板120之第二彈性懸臂124即會與散熱器14之固定孔142卡合固定。於此實施例中,限位件144與限位軌道126可限制散熱器14之轉動角度為九十度(但不以此為限),以避免散熱器14轉動過頭。When the heat sink 14 is in the vertical position shown in FIG. 1 with respect to the liquid cooling head 10, the first elastic cantilever 122 of the side plate 120 is engaged with the fixing hole 142 of the heat sink 14. If the user wants to rotate the heat sink 14 relative to the liquid cooling head 10 from the vertical position shown in FIG. 1 to the horizontal position shown in FIG. 4, the user can directly rotate the heat sink 14. At this time, the first elastic cantilever 122 of the side plate 120 is disengaged from the fixing hole 142 of the heat sink 14. When the heat sink 14 is rotated to the horizontal position shown in FIG. 4, the second elastic cantilever 124 of the side plate 120 is engaged with the fixing hole 142 of the heat sink 14. In this embodiment, the limiting member 144 and the limiting rail 126 can limit the rotation angle of the heat sink 14 to ninety degrees (but not limited thereto) to prevent the heat sink 14 from rotating too far.
若使用者欲將散熱器14相對液冷頭10自第4圖所示之水平位置移動至第1圖所示之垂直位置,只要按照上述方式反向操作即可,在此不再贅述。藉此,即可藉由固定件12使散熱器14相對液冷頭10於至少二相異位置間轉動。由於第一水嘴18與風扇20係沿相異軸向A1、A2設置於散熱器14上,且第一水嘴18與第二水嘴22可轉動,因此,在散熱器14相對液冷頭10轉動的過程中,連接第一水嘴18與第二水嘴22的管路24不會與風扇20產生干涉,使得散熱器14可相對液冷頭10順暢地轉動,亦可避免管路24被風扇20拉扯而脫離第一水嘴18及/或第二水嘴22。If the user wants to move the heat sink 14 relative to the liquid cooling head 10 from the horizontal position shown in FIG. 4 to the vertical position shown in FIG. 1, it is only necessary to reverse the operation in the above manner, and details are not described herein again. Thereby, the heat sink 14 can be rotated relative to the liquid cooling head 10 at at least two different positions by the fixing member 12. Since the first water nozzle 18 and the fan 20 are disposed on the heat sink 14 along the different axial directions A1 and A2, and the first water nozzle 18 and the second water nozzle 22 are rotatable, the heat sink 14 is opposite to the liquid cooling head. During the rotation of the 10, the pipe 24 connecting the first nozzle 18 and the second nozzle 22 does not interfere with the fan 20, so that the radiator 14 can smoothly rotate relative to the liquid cooling head 10, and the pipeline 24 can be avoided. The fan 20 is pulled away from the first nozzle 18 and/or the second nozzle 22.
請參閱第5圖至第8圖,第5圖為根據本創作另一實施例之液冷系統1'的示意圖,第6圖為第5圖中的液冷系統1'於另一視角的示意圖,第7圖為第5圖中的液冷系統1'的爆炸圖,第8圖為第5圖中的散熱器14轉動後的示意圖。液冷系統1'與上述的液冷系統1的主要不同之處在於,液冷系統1'之泵浦16係設置於散熱器14上,如第5圖至第8圖所示。由於泵浦16設置於散熱器14上,因此,二第二水嘴22係沿第二軸向A2可轉動地設置於液冷頭10上,再藉由二管路24連接二第一水嘴18與二第二水嘴22,即可形成冷卻液之循環通路。需說明的是,第5-8圖中與第1-4圖中所示相同標號的元件,其作用原理大致相同,在此不再贅述。Please refer to FIG. 5 to FIG. 8 , FIG. 5 is a schematic diagram of a liquid cooling system 1 ′ according to another embodiment of the present creation, and FIG. 6 is a schematic view of the liquid cooling system 1 ′ in FIG. 5 from another perspective. Fig. 7 is an exploded view of the liquid cooling system 1' in Fig. 5, and Fig. 8 is a schematic view showing the heat sink 14 in Fig. 5 rotated. The main difference between the liquid cooling system 1' and the liquid cooling system 1 described above is that the pump 16 of the liquid cooling system 1' is disposed on the heat sink 14, as shown in Figs. 5 to 8. Since the pump 16 is disposed on the radiator 14, the second nozzles 22 are rotatably disposed on the liquid cooling head 10 along the second axial direction A2, and the second nozzles are connected by the two conduits 24. The 18 and the second nozzles 22 form a circulation passage for the coolant. It should be noted that the components of the same reference numerals as those shown in FIGS. 1-4 in FIG. 5-8 have substantially the same principle of operation, and are not described herein again.
根據第1-4圖與第5-8圖所繪示之實施例,本創作係可將泵浦16選擇性地設置液冷頭10於或散熱器14之儲液箱146上,視實際應用而定。According to the embodiments illustrated in Figures 1-4 and 5-8, the present invention can selectively provide the pump 16 with the liquid cooling head 10 on the reservoir 146 of the radiator 14 depending on the actual application. And set.
綜上所述,由於散熱器可相對液冷頭於至少二相異位置間轉動,使用者或製造商即可根據電子裝置內部之電子元件的配置,調整散熱器相對液冷頭之位置,以避免液冷系統與電子裝置內部之電子元件產生干涉而無法裝設之問題。此外,本創作可將泵浦選擇性地設置於液冷頭或散熱器之儲液箱上,以增加製造上的彈性。再者,由於水嘴與風扇係沿相異軸向設置於散熱器上,且水嘴可轉動,因此,在散熱器相對液冷頭轉動的過程中,連接水嘴的管路不會與風扇產生干涉,使得散熱器可相對液冷頭順暢地轉動,亦可避免管路被風扇拉扯而脫離水嘴。In summary, since the heat sink can rotate relative to the liquid cooling head at at least two different positions, the user or the manufacturer can adjust the position of the heat sink relative to the liquid cooling head according to the configuration of the electronic components inside the electronic device. Avoid the problem that the liquid cooling system interferes with the electronic components inside the electronic device and cannot be installed. In addition, the present invention can selectively place the pump on the liquid cooling head or the reservoir of the radiator to increase manufacturing flexibility. Furthermore, since the faucet and the fan are disposed on the heat sink in different axial directions, and the faucet is rotatable, the pipe connecting the faucet does not interact with the fan during the rotation of the heat sink relative to the liquid cooling head. Interference is generated so that the radiator can be smoothly rotated relative to the liquid cooling head, and the pipeline can be prevented from being pulled by the fan and released from the nozzle.
以上所述僅為本創作之較佳實施例,凡依本創作申請專利範圍所做之均等變化與修飾,皆應屬本創作之涵蓋範圍。The above descriptions are only preferred embodiments of the present invention, and all changes and modifications made by the scope of the patent application of the present invention should be covered by the present invention.
1、1'‧‧‧液冷系統
10‧‧‧液冷頭
12‧‧‧固定件
14‧‧‧散熱器
16‧‧‧泵浦
18‧‧‧第一水嘴
20‧‧‧風扇
22‧‧‧第二水嘴
24‧‧‧管路
120‧‧‧側板
122‧‧‧第一彈性懸臂
124‧‧‧第二彈性懸臂
126‧‧‧限位軌道
140‧‧‧樞軸
142‧‧‧固定孔
144‧‧‧限位件
146‧‧‧儲液箱
A1‧‧‧第一軸向
A2‧‧‧第二軸向1, 1 '‧‧‧ liquid cooling system
10‧‧‧ liquid cold head
12‧‧‧Fixed parts
14‧‧‧ radiator
16‧‧‧ pump
18‧‧‧First faucet
20‧‧‧Fan
22‧‧‧second faucet
24‧‧‧pipe
120‧‧‧ side panels
122‧‧‧First elastic cantilever
124‧‧‧Second elastic cantilever
126‧‧‧Limited orbit
140‧‧‧ pivot
142‧‧‧Fixed holes
144‧‧‧Limited parts
146‧‧‧Liquid tank
A1‧‧‧first axial direction
A2‧‧‧second axial
第1圖為根據本創作一實施例之液冷系統的示意圖。 第2圖為第1圖中的液冷系統於另一視角的示意圖。 第3圖為第1圖中的液冷系統的爆炸圖。 第4圖為第1圖中的散熱器轉動後的示意圖。 第5圖為根據本創作另一實施例之液冷系統的示意圖。 第6圖為第5圖中的液冷系統於另一視角的示意圖。 第7圖為第5圖中的液冷系統的爆炸圖。 第8圖為第5圖中的散熱器轉動後的示意圖。Fig. 1 is a schematic view of a liquid cooling system according to an embodiment of the present invention. Figure 2 is a schematic view of the liquid cooling system of Figure 1 from another perspective. Figure 3 is an exploded view of the liquid cooling system in Figure 1. Fig. 4 is a schematic view showing the heat sink in Fig. 1 after being rotated. Fig. 5 is a schematic view of a liquid cooling system according to another embodiment of the present creation. Figure 6 is a schematic view of the liquid cooling system of Figure 5 from another perspective. Figure 7 is an exploded view of the liquid cooling system in Figure 5. Figure 8 is a schematic view of the heat sink in Figure 5 after rotation.
1‧‧‧液冷系統 1‧‧‧Liquid cooling system
10‧‧‧液冷頭 10‧‧‧ liquid cold head
12‧‧‧固定件 12‧‧‧Fixed parts
14‧‧‧散熱器 14‧‧‧ radiator
16‧‧‧泵浦 16‧‧‧ pump
18‧‧‧第一水嘴 18‧‧‧First faucet
20‧‧‧風扇 20‧‧‧Fan
22‧‧‧第二水嘴 22‧‧‧second faucet
24‧‧‧管路 24‧‧‧pipe
120‧‧‧側板 120‧‧‧ side panels
122‧‧‧第一彈性懸臂 122‧‧‧First elastic cantilever
124‧‧‧第二彈性懸臂 124‧‧‧Second elastic cantilever
126‧‧‧限位軌道 126‧‧‧Limited orbit
140‧‧‧樞軸 140‧‧‧ pivot
144‧‧‧限位件 144‧‧‧Limited parts
146‧‧‧儲液箱 146‧‧‧Liquid tank
A1‧‧‧第一軸向 A1‧‧‧first axial direction
A2‧‧‧第二軸向 A2‧‧‧second axial
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610288691.9A CN106973545B (en) | 2016-01-14 | 2016-05-04 | Liquid cooling system |
CN201621198414.0U CN206212531U (en) | 2016-11-07 | 2016-11-07 | Liquid cooling system |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM542802U true TWM542802U (en) | 2017-06-01 |
Family
ID=58752880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106203122U TWM542802U (en) | 2016-05-04 | 2017-03-07 | Liquid cooling system |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN206212531U (en) |
TW (1) | TWM542802U (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112802318B (en) * | 2020-12-30 | 2021-12-21 | 贵州电网有限责任公司 | Electric energy meter communication module based on LoRa technique |
-
2016
- 2016-11-07 CN CN201621198414.0U patent/CN206212531U/en active Active
-
2017
- 2017-03-07 TW TW106203122U patent/TWM542802U/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN206212531U (en) | 2017-05-31 |
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