TWM542240U - Leveling equipment for electronic products - Google Patents

Description

Leveling equipment for electronic products

This creation relates to a leveling device; more specifically, to a leveling device for electronic products.

In recent years, with the advancement of technology, semiconductor components are gradually becoming lighter and shorter, and the warpage problem generated in the packaging process is also receiving more and more attention. The packaging process of electronic products usually includes two or more different types. The combination of materials, and different materials will have different degrees of thermal expansion and contraction, so there is a very large problem in the process that may cause warpage, deformation and other problems in wafers or electronic products, and the warpage is higher. The electronic products will also affect the characteristics of the products that they should have. Therefore, reducing the degree of warpage or deformation of electronic products has become one of the urgent problems to be solved in the current packaging process.

However, if it is known that the flattening of an electronic product that has been deformed or warped is often caused by the destruction of electronic components on the surface of the electronic product, the product characteristics of the electronic product are impaired and become unusable. The electronic products need to be improved.

In view of this, I have been engaged in research and development in related fields for many years, and have conducted in-depth discussions on the above-mentioned shortcomings, and actively sought solutions based on the above-mentioned needs. After a long period of hard work and many tests, I finally completed this creation.

The main advantage of this creation is that it can provide users with different ways to level the action according to the joint state of electronic products and electronic components, so as to avoid damage to electronic components on the surface of electronic products. Leveling equipment that is level and protects the original electronic characteristics of electronic products.

For the above purposes, the flattening apparatus for electronic products is a heating plate on which an electronic product can be placed, and is placed above the heating plate, and the electronic product can be placed between the two. a leveling device, wherein the bottom surface of the aforementioned leveling device is movable to be in contact with the electronic product; wherein the leveling device comprises a cooling unit capable of manufacturing cold air, and a plurality of cooling units connected to the cooling unit and disposed on the leveling device The output unit can transport the cold air manufactured by the cooling unit to the electronic product; at the same time, the heating plate has a flat plate, a heater connected to the flat plate, and a plurality of electronic products disposed on the flat plate A fixed unit that is attached to the plate.

In the foregoing, when the electronic product is placed on the heating plate, it can be softened by the heating plate below to soften to form a shapeable shape, and the fixing unit can also provide a pull-down force, and the electronic product is more flat on the heating plate. In this case, the leveling effect can be improved. At this time, the leveling device above the electronic product provides downward contact or non-contact pressure with the electronic product, and the bottom surface of the aforementioned leveling device is specially designed to avoid the electrons on the surface of the electronic product. The component is designed so that when the surface of the electronic product is leveled, the electronic components on the surface of the electronic product are not destroyed, and the electronic characteristics of the electronic product are simultaneously protected, and at the same time, the effect of warping and deformation of the electronic product can be leveled. Then, through the cooling unit, the flattened electronic product is rapidly cooled and solidified, and a flat electronic product can be obtained.

A more detailed understanding of the objects, functions, features and structures of the present invention will be apparent.

Please refer to FIG. 1 and FIG. 2 together. FIG. 1 is a perspective view of a preferred embodiment of the present invention, and FIG. 2 is a side view of the preferred embodiment of the present invention.

As shown in the figure, the preferred embodiment of the present invention is for a leveling device 1 for an electronic product, comprising a heating plate 11 on which an electronic product 2 can be placed, and a heating plate 11 above, and which can be combined with the heating plate 11 The electronic product 2 is placed between the leveling device 12 therebetween, and the bottom surface of the aforementioned leveling device 12 is movable to be in contact with the electronic product 2, and when the electronic product 2 is placed on the heating plate 11, it can be softened to be plastic The shape is so smooth that the leveling device 12 is subsequently leveled and operated more smoothly.

The leveling device 12 includes a cooling unit 121 capable of manufacturing cold air, and a plurality of output units 122 connected to the cooling unit 121 and disposed on the leveling device 12, and the foregoing output unit 122 can be manufactured by the cooling unit 121. The cold air is sent to the electronic product 2, and the heating plate 11 has a flat plate 111, a heater (not shown) connected to the flat plate 111, and a plurality of devices disposed on the flat plate 111 and capable of fixing the electronic product 2 to A fixing unit (not shown) on the flat plate 111, so that when the electronic product 2 is placed on the flat plate 111, it can be softened by the lower heating plate 11 to be softened into a shapeable shape, and above the electronic product 2 The leveling device 12 can also provide pressure to the electronic product 2 so that the surface of the electronic product 2 is leveled, and then the cooled electronic product 2 is rapidly cooled and solidified through the cooling unit 121 to obtain a flat surface. Electronic products 2.

Further, the fixing unit (not shown) may include a venting hole 112 and an adsorption unit (not shown) that is in contact with the venting opening 112, and the adsorption unit is vacuum permeable through the venting opening 112. The electronic product 2 placed on the lithographic plate 111 can also generate a downward pulling force of the electronic product 2, so that the electronic product 2 can be not only fixed on the flat plate 111, but also pulled downward by the pulling force to flatten the flatness of the surface. It can enhance the leveling effect and also make the electronic product 2 have a fixed effect in the leveling process.

Further, the output unit 122 of the leveling device 12 may include a blowing unit 1221, and a blowing hole 1222 disposed on the blowing unit 1221 and capable of circulating cold air with the cooling unit 121, so that when the electronic product is 2 After being heated and softened by the heating plate 11, the blowing wind can be reinforced by the blowing unit 1221 to the electronic product 2, the surface of the electronic product 2 can be flattened by the wind pressure, or the bottom surface of the leveling device 12 can be moved downward to The electronic product 2 is in contact with the electronic product 2, and the surface of the electronic product 2 is flattened by the downward pressure, while the cold air is produced by the cooling unit 121, and the cold air is passed through the air blowing hole 1222 through the air blowing unit 1221. After being transported to the electronic product 2, the electronic product 2 is subjected to pressure and leveling, and can be rapidly cooled to become a flat surface.

Furthermore, the electronic product 2 can be a wafer or a sheet with electronic component bonding. In this embodiment, the electronic product 2 is used as a wafer for illustration.

Further, the bottom surface of the leveling device 12 is designed corresponding to the electronic components bonded on the wafer. In other words, the bottom surface of the leveling device 12 can be designed to avoid electronic components on the surface of the wafer, so as to avoid When the flat device 12 is applied to the surface of the wafer, there is a possibility of damaging the electronic components on the surface of the wafer, thereby protecting the electronic characteristics of the wafer.

In the foregoing, the operation mode of the embodiment may be based on whether the electronic components on the surface of the wafer are affected by the contact of the bottom surface of the leveling device 12, and the two types of contact and non-contact operations may be used to perform the leveling operation. The details of the contact and non-contact actuation modes are described as an example.

Please refer to FIG. 3, which is a schematic diagram (1) of the operation of the preferred embodiment of the present invention; as shown in FIG. 3, the electronic component applied to the surface of the wafer in the present embodiment is not subjected to the leveling device. The bottom surface contact of 12 affects the leveling action performed, and the action is as follows:

First, the deformed wafer is placed on the flat plate 111. At this time, the adsorption unit (not shown) can vacuum-adsorb the wafer downward through the vent hole 112 and flatten it on the flat plate 111, so that the wafer can be fixed on the wafer. On the flat plate 111, a downward pulling force of the wafer (as indicated by the direction of the black arrow below the wafer in the figure) can be generated, so that the wafer can be not only fixed on the flat plate 111, but also pulled downward by the pulling force to flatten the same. The flatness of the surface enhances the leveling effect, and at the same time, the surface of the flat plate 111 is heated by the heater (not shown), and the surface temperature of the flat plate 111 is increased, and the wafer is softened to become a shapeable shape, and then The leveling device 12 moves downward until the bottom surface of the leveling device 12 is in contact with the surface of the wafer, and simultaneously applies pressure to the surface of the wafer (the direction indicated by the black arrow above the leveling device 12 in the figure is the direction of pressure), in particular The bottom surface of the leveling device 12 can be designed to avoid the appearance of electronic components on the surface of the wafer. Therefore, when the bottom surface is in contact with the surface of the wafer, the electronic components on the surface of the wafer are not damaged, and the crystal can also be crystallized. Round surface deformation, flattening For the flat surface, finally, cold air is produced through the cooling unit 121, and the cold air is sent from the air blowing hole 1222 to the flattened wafer through the air blowing unit 1221, and the wafer is rapidly cooled and solidified to form the wafer. A wafer aspect with a flat surface.

Please refer to FIG. 4 , which is a schematic diagram of the operation of the preferred embodiment of the present invention. FIG. 4 shows another operation mode of the embodiment for the wafer unsuitable and the leveling device 12 . In the case of contact with the bottom surface, the mode of action is:

First, the deformed wafer is placed on the flat plate 111. At this time, the adsorption unit (not shown) can vacuum-adsorb the wafer through the vent hole 112 and flatten it on the flat plate 111 (the black arrow below the wafer in the figure). As shown, the wafer can be fixed, and at the same time, the heater 111 (not shown) is heated to the flat plate 111 to increase the surface temperature of the flat plate 111, and the wafer is softened by heat to form a shapeable shape. The blowing unit 1221 reinforced the blowing wind force to the wafer, so that the surface deformation of the wafer is flattened by the wind pressure (in the figure, the black arrow direction from the leveling device 12 to the wafer direction is the wind direction), in other words, The difference from the operation mode of FIG. 3 is that the leveling device 12 is completely out of contact with the wafer, and only the reinforced wind of the air blowing unit 1221 is used to blow the surface of the wafer, and finally, the cooling unit 121 is used to manufacture cold air. The cold air is sent from the air blowing hole 1222 to the flattened wafer by the air blowing unit 1221, and the flattened wafer is rapidly cooled to complete the wafer surface of the flat surface.

In summary, the leveling equipment for electronic products described in this case is incapable of the prior art technology of the same technical field, that is, the case has the following advantages:

1. The bottom of the screed device can avoid the electronic components on the surface of the electronic product to design the contact surface. Therefore, when the creation is leveled, the internal structure of the electronic product itself is not destroyed, and the electronic product can be protected. The effect of its own electronic characteristics.

2. This creation can be applied to different electronic products with different characteristics according to whether the electronic product is suitable for contact with the leveling device, so it can be applied to more diverse conveniences. .

Therefore, this creation has excellent progress and practicality in similar products. At the same time, after checking the technical literature on such structures at home and abroad, it has not been found that the same or similar structure exists before the application of this case, so this case It should meet the patent requirements of "creative", "combined with industrial use" and "progressive", and apply in accordance with the law.

It is to be understood that the above-mentioned preferred embodiments of the present invention are intended to be included in the scope of the present invention.

1‧‧‧Leveling equipment for electronic products
11‧‧‧heating plate
111‧‧‧ tablet
112‧‧‧Ventinel
12‧‧‧Leveling device
121‧‧‧Cooling unit
122‧‧‧Output unit
1221‧‧‧Blowing unit
1222‧‧‧Blowing holes
2‧‧‧Electronic products

1 is a perspective view of a preferred embodiment of the present invention; FIG. 2 is a side elevational view of a preferred embodiment of the present invention; FIG. 3 is a schematic view of the preferred embodiment of the present invention (1); 4 is a schematic diagram of the operation of the preferred embodiment of the present invention (2).

1‧‧‧Leveling equipment for electronic products

11‧‧‧heating plate

111‧‧‧ tablet

112‧‧‧Ventinel

12‧‧‧Leveling device

121‧‧‧Cooling unit

122‧‧‧Output unit

1221‧‧‧Blowing unit

1222‧‧‧Blowing holes

2‧‧‧Electronic products

Claims (6)

A leveling device for an electronic product, comprising: a heating plate on which an electronic product can be placed, and a leveling device located above the heating plate and capable of placing the electronic product between the heating plate and the heating plate The bottom surface of the leveling device is movable to be in contact with the electronic product; wherein the leveling device comprises a cooling unit capable of manufacturing cold air, and a plurality of output units connected to the cooling unit and disposed on the leveling device, and the foregoing output The unit can transport the cold air manufactured by the cooling unit to the electronic product, and the heating plate has a flat plate, a heater connected to the flat plate, and a plurality of fixing units disposed on the flat plate and fixing the electronic product on the flat plate. . The leveling device for an electronic product according to claim 1, wherein the fixing unit comprises a vent hole and an adsorption unit connected to the vent hole, and the adsorption unit is vacuum-adsorbed through the vent hole and placed on the lithographic plate. On the electronic products. The leveling device for an electronic product according to claim 1, wherein the output unit of the leveling device may include a blowing unit, and a blowing hole provided on the blowing unit and capable of circulating cold air with the cooling unit. A leveling device for an electronic product according to claim 1, wherein the electronic product is a wafer having an electronic component bonded to a surface. A leveling device for an electronic product according to claim 4, wherein the electronic product has a sheet in which electronic components are joined. A leveling apparatus for an electronic product according to claim 4, wherein the bottom surface of the leveling device is designed to avoid electronic components bonded on the surface of the wafer.