TWI646210B - Method for adjusting flatness of sheet parts of chemical vapor deposition machine - Google Patents

Method for adjusting flatness of sheet parts of chemical vapor deposition machine Download PDF

Info

Publication number
TWI646210B
TWI646210B TW107104381A TW107104381A TWI646210B TW I646210 B TWI646210 B TW I646210B TW 107104381 A TW107104381 A TW 107104381A TW 107104381 A TW107104381 A TW 107104381A TW I646210 B TWI646210 B TW I646210B
Authority
TW
Taiwan
Prior art keywords
flatness
cvd
plate member
coordinate point
predetermined
Prior art date
Application number
TW107104381A
Other languages
Chinese (zh)
Other versions
TW201934791A (en
Inventor
金東熙
朴淵珏
洪啓方
崔勝龍
Original Assignee
世界中心科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 世界中心科技股份有限公司 filed Critical 世界中心科技股份有限公司
Priority to TW107104381A priority Critical patent/TWI646210B/en
Priority to KR1020180079887A priority patent/KR20190095856A/en
Application granted granted Critical
Publication of TWI646210B publication Critical patent/TWI646210B/en
Publication of TW201934791A publication Critical patent/TW201934791A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52Controlling or regulating the coating process
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45559Diffusion of reactive gas to substrate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/30Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/306Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness

Abstract

本揭示提供一種化學氣相沉積機台之板狀構件的平坦度處理方法,其包含:(a)繪製對應於一CVD板狀構件的一座標系,該座標系上包含複數個座標點;(b)量測每個座標點的平坦度;(c)判斷各個座標點的平坦度是否符合一預定平坦度;以及(d)若該各個座標點的平坦度不符合該預定平坦度,則在常溫下以一壓頭向需要進行平坦度調整的座標點施予壓力,並回到步驟(b)和(c)。本揭示能夠減少CVD板狀構件的平坦度調整時間。 The present disclosure provides a flatness processing method for a plate-shaped member of a chemical vapor deposition machine, comprising: (a) drawing a calibration system corresponding to a CVD plate-like member, the coordinate system including a plurality of coordinate points; b) measuring the flatness of each coordinate point; (c) determining whether the flatness of each coordinate point conforms to a predetermined flatness; and (d) if the flatness of the respective coordinate point does not conform to the predetermined flatness, then At a normal temperature, a pressure is applied to the coordinate point where the flatness adjustment is required, and the steps are returned to steps (b) and (c). The present disclosure can reduce the flatness adjustment time of the CVD plate member.

Description

化學氣相沉積機台之板狀構件的平坦度處理方 法 Flatness processing method of plate member of chemical vapor deposition machine law

本發明係關於一種化學氣相沉積機台之部件的處理方法,特別有關一種化學氣相沉積機台之板狀構件的平坦度處理方法。 The present invention relates to a method for processing a component of a chemical vapor deposition machine, and more particularly to a method for treating flatness of a plate member of a chemical vapor deposition machine.

化學氣相沉積(chemical vapor deposition,CVD)機台是光電半導體製程中常用的機台,廣泛應用於顯示面板的製造上。CVD機台各個部件在使用一段時間後,容易出現劣化情形。為維持CVD機台各個部件的使用年限,對CVD部件進行保養、修整是必要的,而如何縮短CVD部件的再生時間,控制時間成本是本領域重要的課題。此外,對於CVD新品部件,如何縮短其製造時間,也是本領域關注的問題。 Chemical vapor deposition (CVD) machines are commonly used in optoelectronic semiconductor processes and are widely used in the manufacture of display panels. The various parts of the CVD machine are prone to deterioration after a period of use. In order to maintain the service life of the various components of the CVD machine, it is necessary to maintain and trim the CVD components. How to shorten the regeneration time of the CVD components and control the time cost is an important issue in the field. In addition, how to shorten the manufacturing time for new CVD parts is also a concern in the field.

請參閱第1圖,其顯示現有的CVD機台1的結構示意圖。在CVD機台1中,擴散板(diffuser)12作為上電極,加熱器(susceptor)14作為下電極。背板(backing plate)16固定在腔壁上,並為擴散板12的安裝提供支撐。進行化學氣相沉積時,氣體由入口11導入,在擴散板12與背板16間的間隙擴散,自擴散板12 上的複數孔洞進入腔體。擴散板12與加熱器14間的電壓差使得帶電氣體分子向加熱器14移動,因在玻璃基板10上沉積以利於製造顯示元件,而多餘的氣體則從出口19排出。 Please refer to FIG. 1, which shows a schematic structural view of a conventional CVD machine 1. In the CVD machine 1, a diffuser 12 is used as an upper electrode, and a susceptor 14 is used as a lower electrode. A backing plate 16 is secured to the wall of the chamber and provides support for the installation of the diffuser panel 12. When chemical vapor deposition is performed, gas is introduced from the inlet 11 and diffused in the gap between the diffusion plate 12 and the backing plate 16, and the diffusion plate 12 is diffused. The plurality of holes in the cavity enter the cavity. The voltage difference between the diffuser plate 12 and the heater 14 causes the charged gas molecules to move toward the heater 14, as deposited on the glass substrate 10 to facilitate the manufacture of the display element, and the excess gas is discharged from the outlet 19.

CVD機台1中的板狀構件(例如擴散板12、加熱器14及背板16)往往因各種因素影響而產生形變,使得平坦度無法滿足原始要求。因此,業界需定期或不定期地對CVD板狀構件的平坦度進行修整。對於CVD板狀構件,不管是新品還是再生品,其平坦度的處理流程一般是,將板狀構件置於烤爐(oven)中的平台上,並按照想要的成形形狀,在板狀構件上施予一定的配重,在烤爐中進行升溫降溫,使其形狀慢慢達到預定的形狀。 The plate-like members (for example, the diffusion plate 12, the heater 14, and the back plate 16) in the CVD machine 1 are often deformed by various factors, so that the flatness cannot satisfy the original requirements. Therefore, the industry needs to regularly or irregularly adjust the flatness of the CVD plate member. For a CVD plate-like member, whether it is a new product or a recycled product, the process of flatness is generally performed by placing the plate-like member on a platform in an oven and in accordance with a desired formed shape in the plate-like member. A certain counterweight is applied thereto, and the temperature is raised and lowered in the oven to gradually shape the shape to a predetermined shape.

然而,為避免CVD板狀構件在日後使用上產生回彈現象,烤爐中進行的升溫降溫程序需要緩慢進行,此程序通常需耗時2~3天。而且,在烤爐中塑形後,若CVD板狀構件的平坦度或構形沒有達到預定的要求,則需重新置入烤爐中,重新塑形。這種CVD板狀構件之平坦度的處理方式,不僅耗費相當多的時間成本,塑形成效也是相當不穩定的。 However, in order to avoid the rebound phenomenon of the CVD plate member in the future use, the temperature rising and cooling process in the oven needs to be performed slowly, and the process usually takes 2 to 3 days. Moreover, after shaping in the oven, if the flatness or configuration of the CVD plate member does not meet the predetermined requirements, it needs to be reinserted into the oven and reshaped. The flatness treatment of such a CVD plate-like member not only consumes a considerable amount of time, but also the plastic forming effect is quite unstable.

本揭示提供一種化學氣相沉積機台之板狀構件的平坦度處理方法,以減少板狀構件之平坦度處理的時間成本。 The present disclosure provides a method of flatness processing of a plate member of a chemical vapor deposition machine to reduce the time cost of the flatness processing of the plate member.

為達成上述目的,本揭示提供一種化學氣相沉積機台之板狀構件的平坦度處理方法,包含:(a)繪製對應於一CVD板狀構件的一座標系,該座標系上包含複數個座標點;(b)量測每 個座標點的平坦度;(c)判斷各個座標點的平坦度是否符合一預定平坦度;以及(d)若該各個座標點的平坦度不符合該預定平坦度,則在常溫下以一壓頭向需要進行平坦度調整的座標點施予壓力,並回到步驟(b)和(c)。 In order to achieve the above object, the present disclosure provides a flatness processing method for a plate-shaped member of a chemical vapor deposition machine, comprising: (a) drawing a calibration system corresponding to a CVD plate-like member, the coordinate system including a plurality of Coordinate point; (b) measure each Flatness of the coordinate points; (c) determining whether the flatness of each coordinate point conforms to a predetermined flatness; and (d) if the flatness of the respective coordinate points does not conform to the predetermined flatness, then pressing at a normal temperature The head applies pressure to the coordinate points where the flatness adjustment is required, and returns to steps (b) and (c).

在本揭示之CVD機台之板狀構件的平坦度處理方法中,在常溫下利用壓頭進行板狀構件的平坦度處理,相較於習知技術採用加溫配重的方式,本揭示可縮短CVD部件的再生時間,節省時間成本,也減少了CVD新品部件的製造時間,且能夠有效解決塑形成效不穩定的技術問題。 In the flatness processing method of the plate-like member of the CVD machine of the present disclosure, the flatness processing of the plate-shaped member is performed by the indenter at normal temperature, and the present disclosure can be adopted by a method of heating the weight compared with the prior art. The regenerative time of the CVD component is shortened, the time cost is saved, the manufacturing time of the new CVD component is also reduced, and the technical problem of the plastic formation instability is effectively solved.

1‧‧‧CVD機台 1‧‧‧CVD machine

10‧‧‧玻璃基板 10‧‧‧ glass substrate

11‧‧‧入口 11‧‧‧ Entrance

12‧‧‧擴散板 12‧‧‧Diffuser

14‧‧‧加熱器 14‧‧‧heater

16‧‧‧背板 16‧‧‧ Backboard

19‧‧‧出口 19‧‧‧Export

30‧‧‧擴散板 30‧‧‧Diffuser

40‧‧‧壓頭 40‧‧‧Indenter

S10~S16‧‧‧步驟 S10~S16‧‧‧Steps

第1圖顯示現有的CVD機台的結構示意圖。 Fig. 1 is a view showing the structure of a conventional CVD machine.

第2圖顯示根據本揭示的一種CVD機台之板狀構件的平坦度處理方法的流程圖。 2 is a flow chart showing a method of processing flatness of a plate member of a CVD machine according to the present disclosure.

第3圖顯示根據本揭示的擴散板的示意圖。 Figure 3 shows a schematic of a diffuser panel in accordance with the present disclosure.

第4圖顯示根據本揭示的壓頭擠壓板狀構件的示意圖。 Fig. 4 is a schematic view showing the indenter pressing plate member according to the present disclosure.

第5圖顯示根據本揭示的平坦度處理方式的一個例子的示意圖。 Fig. 5 is a view showing an example of a flatness processing method according to the present disclosure.

為使本揭示的目的、技術方案及效果更加清楚、明確,以下參照圖式並舉實施例對本揭示進一步詳細說明。應當理解,此處所描述的具體實施例僅用以解釋本揭示,本揭示說明書 所使用的詞語“實施例”意指用作實例、示例或例證,並不用於限定本揭示。此外,本揭示說明書和所附申請專利範圍中所使用的冠詞「一」一般地可以被解釋為意指「一個或多個」,除非另外指定或從上下文可以清楚確定單數形式。 The present disclosure will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the disclosure, the disclosure The word "embodiment" is used to mean serving as an example, example or illustration and is not intended to limit the disclosure. In addition, the articles "a" or "an" or "an"

本揭示提供一種化學氣相沉積(chemical vapor deposition,CVD)機台之板狀構件的平坦度處理方法,其能夠有效縮短CVD板狀構件之平坦度的處理時間。 The present disclosure provides a flatness processing method for a plate member of a chemical vapor deposition (CVD) machine, which can effectively shorten the processing time of the flatness of the CVD plate member.

該CVD板狀構件可以是CVD機台中的擴散板(diffuser)或稱上電極、加熱器(susceptor)或稱下電極、以及背板(backing plate),如第1圖所示,本揭示不作具體之限定,只要是CVD機台中的板狀構件即可。該CVD板狀構件的材料為金屬,特別是鋁材。 The CVD plate member may be a diffuser or upper electrode, a susceptor or a lower electrode, and a backing plate in a CVD machine. As shown in FIG. 1, the disclosure is not specific. The limitation is as long as it is a plate member in the CVD machine. The material of the CVD plate member is a metal, in particular an aluminum material.

該CVD板狀構件可以是新品或再生品,新品意指剛製造完成尚未使用過之產品,而再生品意指已用於CVD機台進行化學沉積製程而需進行再生使用之部件。 The CVD plate member may be a new product or a recycled product, the new product means a product that has just been manufactured and not yet used, and the recycled product means a component that has been used in a chemical deposition process of a CVD machine and needs to be recycled.

請參閱第2圖,以下對本揭示之平坦度處理方法的具體步驟說明如下: Please refer to FIG. 2, and the specific steps of the flatness processing method of the present disclosure are as follows:

步驟S10:繪製對應於一CVD板狀構件的一座標系,該座標系上包含複數個座標點。 Step S10: drawing a calibration system corresponding to a CVD plate-like member, the coordinate system including a plurality of coordinate points.

在此步驟中,可以在板狀構件上繪製座標系。在一個例子中,如第3圖所示,在擴散板30上繪製複數個彼此間隔相同 隔線,如縱向隔線和橫向隔線,這些隔線構成複數個面積相同的區域,每個區域可以作為一個座標點。 In this step, a coordinate system can be drawn on the plate member. In one example, as shown in FIG. 3, a plurality of identical intervals are drawn on the diffusion plate 30. Partition lines, such as longitudinal and lateral dividers, form a plurality of areas of the same area, each of which can serve as a coordinate point.

進一步地,也可以在電腦上利用圖形繪圖軟體繪製相應於第3圖上的座標系,這樣可以在後續平坦度量測後,建立每個座標點之平坦度的圖形。 Further, the coordinate system corresponding to the coordinate system on FIG. 3 can also be drawn on the computer by using the graphic drawing software, so that the flatness of each coordinate point can be established after the subsequent flat measurement.

步驟S12:量測每個座標點的平坦度。 Step S12: Measure the flatness of each coordinate point.

在此步驟中,可以採用紅外線水平儀量測每個座標點的平坦度,以建立板狀構件的平坦度分佈。具體來說,利用紅外線水平儀在板狀構件上一一測量出每個座標點的平坦度,而後將其輸入安裝於電腦中的圖形繪製軟體,從而建立板狀構件整體的平坦度分佈。圖形繪製軟體可以採用內插算法,以得出模擬的平坦度分佈。 In this step, the flatness of each coordinate point can be measured using an infrared level to establish a flatness distribution of the plate member. Specifically, the flatness of each coordinate point is measured one by one on the plate member by using an infrared level, and then input into a graphic drawing software installed in the computer, thereby establishing the flatness distribution of the entire plate member. The graphics rendering software can use an interpolation algorithm to derive the simulated flatness distribution.

步驟S14:判斷各個座標點的平坦度是否符合一預定平坦度。 Step S14: It is judged whether the flatness of each coordinate point conforms to a predetermined flatness.

在一個例子中,操作人員可以檢查CVD板狀構件上的每一個座標點的平坦度,判斷其是否符合預定平坦度,將不符合預定平坦度的座標點列為待調整的座標點。在某些情況下,操作人員也可以只檢查某一些座標點的平坦度,再查看周圍區域是否平滑,來決定是否進行平坦度處理,而不需對所有的座標點進行檢查。 In one example, the operator can check the flatness of each of the coordinate points on the CVD plate member to determine whether it meets the predetermined flatness, and to list the coordinate points that do not conform to the predetermined flatness as the coordinate points to be adjusted. In some cases, the operator can also check the flatness of some of the coordinate points and then check whether the surrounding area is smooth to determine whether to perform flatness processing without checking all coordinate points.

在另一個例子中,可以利用軟體建立一個符合該預定平坦度下的各個座標點的預定平坦值,將步驟S12量測出的各個 座標點的量測值與預定平坦值進行比較,從而判斷出每一座標點平坦度是否符合要求。 In another example, a predetermined flat value corresponding to each coordinate point of the predetermined flatness may be established by the software, and each of the measured values in step S12 is measured. The measured value of the coordinate point is compared with a predetermined flat value to determine whether the flatness of each of the punctuation points meets the requirements.

若各個座標點的平坦度已符合該預定平坦度,表示CVD板狀構件的平坦度已符合成形要求,可以結束流程。而若各個座標點的平坦度不符合該預定平坦度,表示需對CVD板狀構件的平坦度進行調整,流程進入步驟S16。 If the flatness of each coordinate point has conformed to the predetermined flatness, it indicates that the flatness of the CVD plate member has met the forming requirements, and the flow can be ended. On the other hand, if the flatness of each coordinate point does not conform to the predetermined flatness, it means that the flatness of the CVD plate member needs to be adjusted, and the flow proceeds to step S16.

作為例示的,可以將各個座標點的量測值與預定平坦值之差的平均進行加總後再取其根號值,若得出的結果小於一閾值,則判定符合平坦度要求,而若得出的結果大於該閾值,則判定不符合平坦度要求。 As an example, the average of the difference between the measured value of each coordinate point and the predetermined flat value may be added and then the root value is taken. If the result is less than a threshold, the determination meets the flatness requirement, and if If the result is greater than the threshold, it is determined that the flatness requirement is not met.

步驟S16:在常溫下以一壓頭向需要進行平坦度調整的座標點施予壓力。 Step S16: Apply pressure to the coordinate point where the flatness adjustment is required with an indenter at normal temperature.

在此步驟中,如第4圖所示,利用由一油壓機(未圖示)驅動的壓頭40對板狀構件的某個座標點進行施力、擠壓,以調整其平坦度。具體來說,在一個例子中,操作人員可以針對步驟S14中判斷出的平坦度不符合預定平坦度的座標點進行平坦度調整。操作人員將該壓頭40移動至該座標點上方,接著將該壓頭40向下移動,以對某一座標點施予一定壓力,來改變該座標點的平坦度。在另一個例子中,操作人員在步驟S16得知每個座標點的量測值與預定平坦值的差,若這個差大於一預定值時,即對該座標點進行平坦度調整。 In this step, as shown in Fig. 4, a certain coordinate point of the plate-like member is biased and pressed by the ram 40 driven by a hydraulic press (not shown) to adjust the flatness thereof. Specifically, in one example, the operator can perform the flatness adjustment for the coordinate point whose flatness determined in step S14 does not satisfy the predetermined flatness. The operator moves the indenter 40 above the coordinate point and then moves the indenter 40 downward to apply a certain pressure to a coordinate point to change the flatness of the coordinate point. In another example, the operator knows the difference between the measured value of each coordinate point and the predetermined flat value in step S16, and if the difference is greater than a predetermined value, the flatness adjustment is performed on the coordinate point.

該壓頭需要的施力大小可透過一施力模型得出,可利用數學建模或統計學上的方法來建立此施力模型。根據施力模型提供的需要施加的力的大小,工作人員可以藉由設定壓頭與板狀構件的接觸時間來達到預定的施力大小。 The amount of force required for the indenter can be derived from a force application model that can be modeled using mathematical modeling or statistical methods. According to the magnitude of the force to be applied provided by the force application model, the worker can achieve the predetermined force application by setting the contact time of the pressure head with the plate member.

步驟S16後,進入步驟S12,再一次量測平坦度調整後各個座標點的平坦度,並進入步驟S14,判斷平坦度是否符合要求,若是則結束流程,若否則再利用壓頭進行一次平坦度調整。 After step S16, the process proceeds to step S12, and the flatness of each coordinate point after the flatness adjustment is measured again, and the process proceeds to step S14 to determine whether the flatness meets the requirements. If yes, the process ends, and if otherwise, the flat head is used for flatness. Adjustment.

於一實施例中,請參閱第5圖,假定CVD板狀構件預定的成形形狀為弧形。不管是新品或再生品,可以以下列步驟來調整其平坦度:(1)先對板狀構件中心區域的平坦度進行調整;(2)而後對板狀構件中心區域及周圍區域進行平坦度調整,從而達到預定的弧度要求。在平坦度調整過程中,可以採用多個壓頭同時施壓,也可以採用單一個壓頭對不同區域輪流施壓。 In one embodiment, referring to Fig. 5, it is assumed that the predetermined shape of the CVD plate member is curved. Whether it is a new product or a recycled product, the flatness can be adjusted by the following steps: (1) adjusting the flatness of the central portion of the plate member; (2) then adjusting the flatness of the central region and the surrounding region of the plate member. To achieve the predetermined arc requirement. In the flatness adjustment process, multiple indenters may be used for simultaneous pressure application, or a single indenter may be used to apply pressure to different regions in turn.

在步驟S10之前,本揭示之方法還可包含對該CVD板狀構件進行熱處理以解除其應力的步驟。以新品來說,在其加工過程中容易殘存加工應力而成為平坦度處理上的一個不穩定因素,因此需對其進行熱處理。在一個例子中,可對CVD板狀構件以溫度420℃、升溫4小時、降溫6小時的方式進行熱處理。再生品應力積聚的情形通常不顯著,可以省略熱處理的步驟,以提升平坦度處理效率。 Prior to step S10, the method of the present disclosure may further comprise the step of heat treating the CVD plate member to relieve its stress. In the case of new products, processing stress tends to remain in the process of processing, which becomes an unstable factor in the flatness treatment, and therefore heat treatment is required. In one example, the CVD plate-like member may be heat-treated at a temperature of 420 ° C for 4 hours and a temperature drop of 6 hours. The case where the stress accumulation of the recycled product is usually not significant, the step of heat treatment can be omitted to improve the flatness processing efficiency.

在進行熱處理的步驟之前,本揭示之方法還可包含形成一保護層於該CVD板狀構件上的步驟。以CVD板狀構件為鋁 材來說,可對鋁板進行氧化還原反應,以在其上形成一氧化鋁層,以提升抗蝕能力。 Prior to the step of performing the heat treatment, the method of the present disclosure may further comprise the step of forming a protective layer on the CVD plate member. CVD plate-like member is aluminum In the case of the material, the aluminum plate may be subjected to a redox reaction to form an aluminum oxide layer thereon to enhance the corrosion resistance.

在進行平坦度調整之前,可先對CVD板狀構件進行清洗,如化學清洗(chemical wash),以清除其上的殘留雜物,避免影響平坦度處理。 Prior to the flatness adjustment, the CVD plate member may be cleaned, such as a chemical wash, to remove residual debris thereon to avoid affecting the flatness treatment.

具體來說,於一實施例中,新品的處理步驟如下:先將板材加工成與預定成形要求(例如弧形)相近的形狀,對其進行化學清洗,在板材上形成保護層,而後進行熱處理的步驟以解除應力,再採用步驟S10~S16進行精細的平坦度調整,再進行一次清洗後即可出貨。於一實施例中,再生品的處理步驟如下:對板狀構件進行化學清洗,而後進行步驟S10~S16的平坦度調整,再進行一次清洗,即完成板狀構件的再生。 Specifically, in one embodiment, the processing steps of the new product are as follows: the sheet is first processed into a shape similar to a predetermined forming requirement (for example, a curved shape), chemically cleaned, a protective layer is formed on the sheet, and then heat treated. The steps are to relieve the stress, and then the fine flatness adjustment is performed by using steps S10 to S16, and then washed once and then shipped. In one embodiment, the processing steps of the recycled product are as follows: the plate-shaped member is chemically cleaned, and then the flatness adjustment of steps S10 to S16 is performed, and then the cleaning is performed once, that is, the regeneration of the plate-shaped member is completed.

採用習知的加溫配重將一塊CVD板狀構件塑形,需要2~3天的時間。在本技術的成效方面,對於第8.5代的擴散板來說,僅需花費現有技術1/3的時間即能完成平坦度處理,而對第6代的擴散板來說,也僅需約1/6的時間。本技術能夠有效節省時間成本,也減少了習知技術中不穩定因素的影響。 It takes 2 to 3 days to shape a CVD plate member using a conventional warming weight. In terms of the effectiveness of the present technology, for the 8.5th generation diffusion plate, the flatness processing can be completed in only 1/3 of the time of the prior art, and only about 1 for the 6th generation diffusion plate. /6 time. The technology can effectively save time cost and reduce the influence of unstable factors in the prior art.

在本揭示之CVD機台之板狀構件的平坦度處理方法中,在常溫下利用壓頭進行板狀構件的平坦度處理,相較於習知技術採用加溫配重的方式,本揭示可縮短CVD部件的再生時間,節省時間成本,也減少了CVD新品部件的製造時間,且能夠有效解決塑形成效不穩定的技術問題。 In the flatness processing method of the plate-like member of the CVD machine of the present disclosure, the flatness processing of the plate-shaped member is performed by the indenter at normal temperature, and the present disclosure can be adopted by a method of heating the weight compared with the prior art. The regenerative time of the CVD component is shortened, the time cost is saved, the manufacturing time of the new CVD component is also reduced, and the technical problem of the plastic formation instability is effectively solved.

本揭示已用較佳實施例揭露如上,然其並非用以限定本揭示,本揭示所屬技術領域中具有通常知識者,在不脫離本揭示之精神和範圍內,當可作各種之更動與潤飾,因此本揭示之保護範圍當視後附之申請專利範圍所界定者為準。 The present disclosure has been disclosed in the above preferred embodiments. However, it is not intended to limit the scope of the disclosure, and various modifications and changes can be made without departing from the spirit and scope of the disclosure. Therefore, the scope of protection of this disclosure is subject to the definition of the scope of the patent application.

Claims (13)

一種化學氣相沉積(chemical vapor deposition,CVD)機台之板狀構件的平坦度處理方法,包含:(a)繪製對應於一CVD板狀構件的一座標系,該座標系上包含複數個座標點;(b)量測每個座標點的平坦度;(c)判斷各個座標點的平坦度是否符合一預定平坦度;以及(d)若該各個座標點的平坦度不符合該預定平坦度,則在常溫下以一壓頭向需要進行平坦度調整的座標點施予壓力,並回到步驟(b)和(c)。 A flatness processing method for a plate-shaped member of a chemical vapor deposition (CVD) machine, comprising: (a) drawing a calibration system corresponding to a CVD plate-like member, the coordinate system including a plurality of coordinates (b) measuring the flatness of each coordinate point; (c) determining whether the flatness of each coordinate point conforms to a predetermined flatness; and (d) if the flatness of the respective coordinate point does not conform to the predetermined flatness Then, at a normal temperature, a pressure is applied to the coordinate point where the flatness adjustment is required, and the steps are returned to steps (b) and (c). 根據申請專利範圍第1項所述之方法,還包含:(e)若該各個座標點的平坦度符合該預定平坦度,則結束流程。 The method of claim 1, further comprising: (e) if the flatness of the respective coordinate points conforms to the predetermined flatness, the process ends. 根據申請專利範圍第1項所述之方法,其中該CVD板狀構件係選自由一擴散板(diffuser)、一加熱器(susceptor)和一背板(backing plate)所組成的群組。 The method of claim 1, wherein the CVD plate member is selected from the group consisting of a diffuser, a susceptor, and a backing plate. 根據申請專利範圍第1項所述之方法,其中在步驟(a)之前,所述方法還包含:對該CVD板狀構件進行熱處理以解除其應力。 The method of claim 1, wherein prior to the step (a), the method further comprises: heat treating the CVD plate member to relieve stress thereof. 根據申請專利範圍第4項所述之方法,其中在該熱處理的步驟之前,所述方法還包含:形成一保護層於該CVD板狀構件上。 The method of claim 4, wherein prior to the step of heat treating, the method further comprises: forming a protective layer on the CVD plate member. 根據申請專利範圍第5項所述之方法,其中於形成該保護層的步驟中,該保護層係利用氧化還原反應而形成。 The method of claim 5, wherein in the step of forming the protective layer, the protective layer is formed by a redox reaction. 根據申請專利範圍第1項所述之方法,其中在步驟(a)之前,所述方法還包含:對該CVD板狀構件進行化學清洗(chemical wash)。 The method of claim 1, wherein prior to the step (a), the method further comprises: chemically washing the CVD plate member. 根據申請專利範圍第1項所述之方法,其中步驟(a)包含:以一圖形繪圖軟體建立對應該CVD板狀構件的座標系。 The method of claim 1, wherein the step (a) comprises: establishing a coordinate system corresponding to the CVD plate member by a graphic drawing software. 根據申請專利範圍第8項所述之方法,其中步驟(b)包含:以該圖形繪圖軟體建立該CVD板狀構件的平坦度分佈。 The method of claim 8, wherein the step (b) comprises: establishing a flatness distribution of the CVD plate member by the graphic drawing software. 根據申請專利範圍第1項所述之方法,其中步驟(b)包含:利用一紅外線水平儀量測每個座標點的平坦度。 The method of claim 1, wherein the step (b) comprises: measuring the flatness of each coordinate point using an infrared level. 根據申請專利範圍第1項所述之方法,其中步驟(c)包含:將步驟(b)量測出的各個座標點的平坦度量測值與該預定平坦度進行比較,從而判斷出是否符合該預定平坦度。 The method of claim 1, wherein the step (c) comprises: comparing the flatness measurement values of the respective coordinate points measured in the step (b) with the predetermined flatness, thereby determining whether the compliance is met. The predetermined flatness. 根據申請專利範圍第1項所述之方法,其中步驟(d)包含:(d1)對該CVD板狀構件之中心區域的平坦度進行調整;以及(d2)在步驟(d1)之後,對該CVD板狀構件的中心區域及周圍區域進行平坦度調整。 The method of claim 1, wherein the step (d) comprises: (d1) adjusting a flatness of a central region of the CVD plate member; and (d2) after the step (d1), The flatness adjustment is performed in the central region and the surrounding region of the CVD plate member. 根據申請專利範圍第1項所述之方法,其中該壓頭係利用一油壓機驅動。 The method of claim 1, wherein the indenter is driven by a hydraulic press.
TW107104381A 2018-02-07 2018-02-07 Method for adjusting flatness of sheet parts of chemical vapor deposition machine TWI646210B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW107104381A TWI646210B (en) 2018-02-07 2018-02-07 Method for adjusting flatness of sheet parts of chemical vapor deposition machine
KR1020180079887A KR20190095856A (en) 2018-02-07 2018-07-10 Method for adjusting flatness of sheet part of chemical vapor deposition machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW107104381A TWI646210B (en) 2018-02-07 2018-02-07 Method for adjusting flatness of sheet parts of chemical vapor deposition machine

Publications (2)

Publication Number Publication Date
TWI646210B true TWI646210B (en) 2019-01-01
TW201934791A TW201934791A (en) 2019-09-01

Family

ID=65803990

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107104381A TWI646210B (en) 2018-02-07 2018-02-07 Method for adjusting flatness of sheet parts of chemical vapor deposition machine

Country Status (2)

Country Link
KR (1) KR20190095856A (en)
TW (1) TWI646210B (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006016265A (en) * 2004-07-02 2006-01-19 Fujitsu Hitachi Plasma Display Ltd Method for relieving deformation of glass platen
US20110222039A1 (en) * 2010-03-11 2011-09-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2014183253A (en) * 2013-03-21 2014-09-29 Nikon Corp Substrate holding device, substrate holder, and exposure method and device
US20140335624A1 (en) * 2013-05-09 2014-11-13 Kinik Company Detection method and apparatus for the tip of a chemical mechanical polishing conditioner
TW201703188A (en) * 2015-06-22 2017-01-16 Asml荷蘭公司 Substrate support, method of compensating unflatness of an upper surface of a substrate, lithographic apparatus and device manufacturing method
TWM542240U (en) * 2017-02-14 2017-05-21 Chih Cheng Detailed Industrial Co Ltd Leveling equipment for electronic products

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006016265A (en) * 2004-07-02 2006-01-19 Fujitsu Hitachi Plasma Display Ltd Method for relieving deformation of glass platen
US20110222039A1 (en) * 2010-03-11 2011-09-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2014183253A (en) * 2013-03-21 2014-09-29 Nikon Corp Substrate holding device, substrate holder, and exposure method and device
US20140335624A1 (en) * 2013-05-09 2014-11-13 Kinik Company Detection method and apparatus for the tip of a chemical mechanical polishing conditioner
TW201703188A (en) * 2015-06-22 2017-01-16 Asml荷蘭公司 Substrate support, method of compensating unflatness of an upper surface of a substrate, lithographic apparatus and device manufacturing method
TWM542240U (en) * 2017-02-14 2017-05-21 Chih Cheng Detailed Industrial Co Ltd Leveling equipment for electronic products

Also Published As

Publication number Publication date
KR20190095856A (en) 2019-08-16
TW201934791A (en) 2019-09-01

Similar Documents

Publication Publication Date Title
TWI633586B (en) Contoured showerhead for improved plasma shaping and control
US8627683B2 (en) Methods for controlling glass sheet thickness
JP2006315063A (en) Pressing die design support program, and its method
JP2008522873A (en) Manufacture of honeycomb extrusion dies
TWI646210B (en) Method for adjusting flatness of sheet parts of chemical vapor deposition machine
JP3302914B2 (en) Method and apparatus for manufacturing hot-rolled steel sheet
CN106444365A (en) Wafer etching control method and wafer manufacturing method
JP5168170B2 (en) Method for estimating the material constant and straightening state of the material to be straightened in roller straightening, and roller roller leveling method
JP6849319B2 (en) Calibration method for heat treatment unit
US6780795B2 (en) Heat treatment apparatus for preventing an initial temperature drop when consecutively processing a plurality of objects
CN108491361B (en) Heterogeneous reservoir permeability distribution inversion method and device
Kartik et al. Effect of punch radius and sheet thickness on spring-back in V-die bending
Li et al. Application of six sigma robust optimization in sheet metal forming
CN110116149A (en) The flatness processing method of the tabular component of chemical vapor deposition machine station
CN108971355B (en) method for eliminating wrinkling of large-curved-surface skin based on gradual-change gap mold
CN111400904B (en) Prediction method for crack density of ceramic matrix composite substrate
CN112038233B (en) Method for reducing load effect of different products in furnace tube
Huang et al. An elasto-plastic finite-element analysis of sheet metal camber process
CN113964061A (en) Method for monitoring uneven baking of hot plate
JP4525037B2 (en) Roller straightening method for steel sheet
JP5915402B2 (en) Roll shape determination apparatus and roll shape determination method
WO2022270576A1 (en) Method for manufacturing fused quartz jig and fused quartz jig
KR20160046357A (en) Method of chamfering of glass
CN101355008A (en) Method for forming film
TWI530334B (en) System and method for determining rolling force distribution