TWM538949U - Continuous electroplating structure - Google Patents

Description

Continuous plating structure

The present invention relates to a continuous electroplating structure, and more particularly to a continuous electroplating structure that allows the plated parts to be simultaneously moved and plated in a plating bath.

The conventional electroplating structure generally has a conveying assembly and a plurality of electroplating tanks, and the conveying assembly can sequentially place a plurality of objects to be plated into the plurality of plating tanks, so that the plurality of plated parts can be according to the plurality of plating tanks. The plating solution is plated with a metal layer such as gold, silver or nickel.

In general, a plurality of plating tanks of a conventional electroplating structure can also accommodate the same electroplating bath, so that the transporting assembly can simultaneously place a plurality of plated parts into the plurality of electroplating tanks to plate the plurality of plating tanks. The parts are plated with the same material to improve the overall plating efficiency.

However, since the plating effect is highly positively correlated with the concentration of the plating solution, if the plurality of plated members are respectively placed in different plating tanks, if the concentration of the plating solution in the plurality of plating tanks is different, the number may be caused. The thickness of the plated layer to be plated is different, and therefore, the conventional plating structure has a problem of uneven plating thickness.

In view of this, 遂 provides a continuous plating structure to solve the problem of uneven plating thickness of the conventional plating structure.

The purpose of the present invention is to provide a continuous electroplating structure that allows a plurality of plated parts to be simultaneously moved and plated in a plating bath to enhance plating uniformity.

In order to achieve the above creative purpose, the continuous plating structure of the creation includes: one loss a transport assembly having a guide rail, a transport table and a carrier member extending in a substantially horizontal direction and having a propulsion section movably coupled to the guide rail, the carrier member The transport platform is movably coupled in a substantially vertical direction; a push-type plating tank having a pusher slot, the pusher slot being oriented toward the rail and substantially vertical In the projection of the direction, the propulsion section of the guide rail is located within the range covered by the push slot; and a controller electrically connected to the transport platform, the controller is controlling the transport When the table moves in the advancing section, the relative position of the carrier and the transport table is further fixed. Thereby, it can be ensured that the plated member suspended by the object can be moved and plated in the horizontal direction in the push-type plating tank, and the number is ensured when the workpiece is suspended simultaneously. The plated parts can be plated in the same plating solution to maintain the uniformity of plating.

Wherein, the push plating bath has a nickel ion plating solution. Thereby, there is an effect of maintaining the plating uniformity of nickel.

In addition, there is a separate electroplating bath having a free-standing slot facing the rail, and in the substantially vertical projection of the direction, the propulsion area of the rail The segment is outside the range covered by the freestanding slot. Thereby, the plated member can be plated with metal layers of different materials in order, which has the effect of improving the convenience of use.

Wherein, the freestanding plating bath has a gold ion plating solution or a silver ion plating solution. Thereby, the plated member can be plated with metal layers of different materials in order, which has the effect of improving the convenience of use.

The auxiliary plating bath and the freestanding plating tank are respectively located at opposite ends of the push-type plating tank, and the auxiliary plating tank has an auxiliary slot, the auxiliary auxiliary slot The port is oriented toward the rail and the projection of the rail is outside the range covered by the auxiliary slot in a substantially vertical projection in the direction. Thereby, the plated member can be plated with metal layers of different materials in order, which has the effect of improving the convenience of use.

Wherein, the auxiliary plating bath has a gold ion plating solution or a silver ion plating solution. Thereby, the plated member can be plated with metal layers of different materials in order, which has the effect of improving the convenience of use.

[this creation]

1‧‧‧Transport components

11‧‧‧ Guide rail

111‧‧‧Progress section

12‧‧‧Conveyor

13‧‧‧Loading objects

2‧‧‧Promoted plating bath

21‧‧‧Promoted notches

22‧‧‧ plating solution

3‧‧‧ Controller

4‧‧‧Separate plating bath

41‧‧‧Separate slot

42‧‧‧ plating solution

5‧‧‧Auxiliary plating bath

51‧‧‧Auxiliary notch

52‧‧‧ plating solution

H‧‧‧ horizontal direction

P‧‧‧Ironed parts

V‧‧‧Vertical direction

Figure 1: Schematic diagram of the continuous electroplating structure of the present creation.

Figure 2: Operational reference drawing of the continuous plating structure of the present creation.

Figure 3: Operational reference drawing of the continuous plating structure of the present creation.

Figure 4: Operational reference drawing of the continuous plating structure of the present creation.

Figure 5: Operational reference drawing of the continuous plating structure of the present creation.

In order to make the above and other objects, features and advantages of the present invention more comprehensible, the preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings: FIG. The continuous plating structure of the present invention comprises: a conveying component 1, a propelling plating tank 2 and a controller 3, the conveying assembly 1 is disposed on one side of the propelling plating tank 2, and the controller 3 is electrically connected Delivery assembly 1.

The conveying assembly 1 has a guide rail 11, a conveying table 12 and an object 13 extending in a horizontal direction H (substantially horizontal direction) and having a pushing section 111, the conveying table 12 The guide rail 11 is movably coupled, and the carrier 13 is movably coupled to the transport table 12 in a vertical direction V (substantially perpendicular to one direction). The object 13 is used to suspend or fix a plated member P, and the plated member P can be a printed circuit board or any object, which is not limited herein.

The push-on plating tank 2 has a push-type notch 21 facing the guide rail 11, and in the projection of the vertical direction V, the advancing section 111 of the guide rail 11 is located in the push type Within the range covered by the notch 21. Wherein, the push plating tank 2 It may have basic components (such as electrodes, etc.) required for the plating operation, and may be used to accommodate a plating solution 22, which in the present embodiment has a nickel ion plating solution when the plated member P is When placed in the push-type plating tank 2, the surface of the member P to be plated can be subjected to nickel plating.

The controller 3 is electrically connected to the transport table 12, and the controller 3 further fixes the relative positions of the carrier 13 and the transport table 12 when the transport table 12 is controlled to move in the propulsion section 111. In the present embodiment, the controller 3 is disposed in the transport table 12. By means of the setting of the controller 3, when the conveying table 12 is moved in the advancing section 111, the loading member 13 is not moved relative to the conveying table 12 to ensure that the carrying member 13 is suspended. The plated member P can be moved and plated in the horizontal direction H in the push-type plating tank 2, and when the workpieces 13 are simultaneously suspended by the plurality of objects to be plated P, the plurality of objects to be plated P can be ensured. Electroplating in the same plating solution has the effect of maintaining plating uniformity.

The continuous plating structure of the present invention may further have a free-standing plating tank 4 having a free-standing slot 41 facing the rail 11 and in the vertical direction V. In projection, the advancement section 111 of the guide rail 11 is outside the range covered by the freestanding notch 41. The free-standing plating tank 4 can have the basic components (such as electrodes) required for the plating operation, and the plating solution 42 accommodated in the free-standing plating tank 4 is preferably accommodated in the push-type plating tank 2. In the present embodiment, the free-standing plating tank 4 has a gold ion plating solution or a silver ion plating solution. When the plated member P is placed in the free-standing plating tank 4, The surface of the plated member P can be subjected to gold or silver plating. Therefore, when the continuous plating structure of the present invention further has the free-standing plating tank 4, the plated member P can be sequentially plated with metal layers of different materials, which has the effect of improving the convenience of use.

The continuous plating structure of the present invention may further have an auxiliary plating tank 5, and the auxiliary plating tank 5 and the free-standing plating tank 4 are respectively located at opposite ends of the push-type plating tank 2, and the auxiliary plating tank 5 has An auxiliary notch 51, the auxiliary notch 51 is oriented toward the guide rail 11, and in the projection of the vertical direction V, the advancing section 111 of the guide rail 11 is tied It is outside the range covered by the auxiliary slot 51. The auxiliary plating tank 5 may have a basic member (such as an electrode) required for the plating operation, and the plating solution 52 of the auxiliary plating tank 5 is preferably accommodated by the push plating tank 2. In the present embodiment, the auxiliary plating bath 5 has a gold ion plating solution or a silver ion plating solution. When the plated member P is placed in the auxiliary plating bath 5, The surface of the plated member P can be subjected to gold or silver plating. Therefore, when the continuous plating structure of the present invention further has the auxiliary plating tank 5, the plated member P can be sequentially plated with metal layers of different materials, which has the effect of improving the convenience of use.

The detailed operation of the continuous plating structure of the present invention is illustrated below by way of illustration.

Referring to FIG. 2, the object 13 can suspend the plated member P, and the conveying table 12 can move along the horizontal direction H along the guide rail 11 when the conveying table 12 is in the vertical direction V. When the free-standing plating tank 4 is aligned, the workpiece 13 can protrude toward the free-standing slot 41 along the vertical direction V, so that the plated member P is placed into the free-standing plating from the free-standing slot 41. The tank 4 is used for the first plating operation.

Referring to FIG. 3, after the plated member P has completed the plating operation of the free-standing plating tank 4, the workpiece 13 is movable along the vertical direction V and away from the free-standing slot 41, so that the The plated member P can be pulled away from the freestanding plating tank 4 by the free-standing notch 41. Then, the conveying table 12 can be moved along the guide rail 11 in the horizontal direction H when the conveying table 12 is in the vertical direction V. When the push-on plating tank 2 is aligned and adjacent to the propulsion section 111, the workpiece 13 can protrude toward the propulsion slot 21 along the vertical direction V, so that the plated member P is driven by the propulsion slot The port 21 is placed in the push-type plating bath 2 for the second plating operation.

Referring to FIG. 4, during the plating operation of the plated member P in the push-type plating tank 2, the controller 3 can control the conveying table 12 to move in the horizontal direction H, and at the conveying table. When moving in the propulsion section 111, the controller 3 can limit the relative positions of the carrier 13 and the conveying table 12 to each other, so that the plated member P can be in the propelling plating tank 2 The inner portion is moved and plated in the horizontal direction H. At this time, if another conveying table 12 is mounted on the other plated member P, the other plated member P is moved while the other plated member P is moved. The push-type plating tank 2 can be successively inserted to perform the plating operation. When the plating operation is performed in the above manner, not only the effect of plating the plurality of plated parts P at the same time but also each of the plated parts P can be ensured. Electroplating in the same plating solution has the effect of maintaining plating uniformity.

Referring to FIG. 5, when the transport table 12 is moved outside the advancement section 111 and the plating operation of the push-type plating tank 2 is completed, the workpiece 13 can move along the vertical direction V and away from the push type. The slot 21 allows the plated member P to be pulled away from the push-on plating tank 2 by the pusher slot 21, and then the transport table 12 can be moved along the guide rail 11 in the horizontal direction H when the transport When the table 12 is aligned with the auxiliary plating tank 5 in the vertical direction V, the workpiece 13 can protrude toward the auxiliary slot 51 along the vertical direction V, so that the plated member P is supported by the auxiliary slot. The port 51 is placed in the auxiliary plating bath 5 for the third plating operation.

In summary, the continuous plating structure of the present invention has the push-type plating tank 2, and the controller 3 can control the workpiece P to be moved and plated in the horizontal direction H in the push-type plating tank 2, It is ensured that each of the plated parts P can be continuously plated in the same push-type plating tank 2, and has the effect of improving plating uniformity.

Although the present invention has been disclosed by the above-described preferred embodiments, it is not intended to limit the present invention, and it is still within the spirit and scope of the present invention to make various changes and modifications to the above embodiments. The technical scope of the protection is created, so the scope of protection of this creation is subject to the definition of the patent application scope attached.

1‧‧‧Transport components

11‧‧‧ Guide rail

111‧‧‧Progress section

12‧‧‧Conveyor

13‧‧‧Loading objects

2‧‧‧Promoted plating bath

21‧‧‧Promoted notches

22‧‧‧ plating solution

3‧‧‧ Controller

4‧‧‧Separate plating bath

41‧‧‧Separate slot

42‧‧‧ plating solution

5‧‧‧Auxiliary plating bath

51‧‧‧Auxiliary notch

52‧‧‧ plating solution

H‧‧‧ horizontal direction

P‧‧‧Ironed parts

V‧‧‧Vertical direction

Claims (6)

A continuous electroplating structure comprising: a conveying assembly having a guide rail, a conveying table and an object, the rail extending in a substantially horizontal direction and having a pushing section, the conveying platform being The guide rail is movably coupled to the transport table in a substantially vertical direction; a push-type plating tank having a pusher slot, the pusher slot Facing the guide rail, and in a substantially vertical projection in the direction, the propulsion section of the guide rail is located within a range covered by the propulsion slot; and a controller electrically connecting the conveyor base The controller further fixes the relative positions of the carrier and the transport table when controlling the transport table to move in the propulsion section. The continuous plating structure of claim 1, wherein the push plating bath has a nickel ion plating solution. The continuous electroplating structure according to claim 1, wherein the independent electroplating bath has a freestanding slot, the freestanding slot is oriented toward the rail, and is substantially In the vertical projection of the direction, the advancement section of the guide rail is outside the range covered by the freestanding notch. The continuous plating structure of claim 3, wherein the freestanding plating bath has a gold ion plating solution or a silver ion plating solution. The continuous plating structure according to claim 3, further comprising an auxiliary plating tank, wherein the auxiliary plating tank and the independent plating tank are respectively located at opposite ends of the push plating tank, the auxiliary type The electroplating bath has an auxiliary slot facing the rail, and in a substantially vertical projection in the direction, the propulsion section of the rail is located in the range covered by the auxiliary slot outer. The continuous plating structure according to claim 5, wherein the auxiliary plating bath has a gold ion plating solution or a silver ion plating solution.