TWM535456U - Evaporator - Google Patents

Abstract

An evaporator is suitable for a thermal dissipation module. The thermal dissipation module includes a tube and fluid. The evaporator includes a casing and a first thermal dissipation structure. The casing has a chamber configured to communicate with the tube and the fluid is configured to flow in the tube and the chamber. The first thermal dissipation structure is disposed in the chamber, wherein the first thermal dissipation structure has a plurality of first fluid channels and the fluid flows through the first fluid channels when the fluid flows in the chamber.

Description

Evaporator

The present invention relates to an evaporator, and more particularly to an evaporator suitable for use in a heat dissipation module.

In recent years, with the development of the technology industry, electronic devices such as notebook computers, tablet computers, and smart phones have frequently appeared in daily life. Some of the electronic components mounted inside these electronic devices usually generate thermal energy during operation. Once the thermal energy accumulates inside the electronic device and cannot be immediately released to the outside world, the performance of the electronic device may be affected. Therefore, a heat dissipating module or a heat dissipating component is usually disposed inside the electronic device, such as a cooling fan, a heat dissipating material, a heat pipe, or a two-phase thermosyphon cooling system to assist in operating the electronic components. The generated heat energy escapes to the outside world.

In the above-mentioned heat dissipation module or heat dissipation component, the heat dissipation effect of the heat dissipation material and the heat dissipation tube is limited, and thus the heat dissipation fan is most widely used. However, the operation of the cooling fan depends on the power provided by the battery of the electronic device, which is bound to accelerate the consumption of electricity. At present, some electronic devices use a two-phase flow siphon cooling system to achieve the purpose of heat dissipation by transmitting the latent heat required by the fluid during phase change. However, the two-phase flow siphon heat dissipation system needs to be used as the power of the fluid to circulate in the pipeline by the difference of the potential energy and the attraction between the fluid molecules. Once the relative state between the electronic device and the gravity direction changes, the fluid may be The effect of the loop is affected.

The novel creation provides an evaporator that can improve the circulation of fluid in the heat dissipation module.

The novel created evaporator is suitable for a heat dissipation module, wherein the heat dissipation module includes a pipe member and a fluid. The evaporator includes a housing and a first heat dissipation structure. The housing has a chamber for communicating with the tubular member and the fluid is configured to flow within the tubular member and the chamber. The first heat dissipation structure is disposed in the chamber, wherein the first heat dissipation structure has a plurality of first flow channels and is flowable through the first flow channels when the fluid flows in the chamber.

Based on the above, the evaporator of the present invention is provided with a first heat dissipation structure in the chamber of the housing, and the first heat dissipation structure has a plurality of first flow passages for the passage of fluid. With this arrangement, it is helpful to increase the contact area between the fluid and the casing to increase the vaporization rate of the fluid after receiving heat from the electronic component or the heat pipe to the casing and the fluid in the loop formed by the pipe and the chamber. Loop effect. On the other hand, the first heat dissipation structure is assembled into the housing after the fabrication is completed, and is processed by etching or computer numerical control tools to form the evaporator, for example, compared to the existing evaporator. The heat dissipation structure, the manufacturing method of the evaporator created by the novel can not only improve the product yield but also reduce the production cost.

The above described features and advantages of the present invention will become more apparent and understood from the following description.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic exploded view of an evaporator of an embodiment of the present invention. 2 is a schematic structural view of the evaporator and the heat dissipation module of FIG. 1. 3 is a top plan view of the evaporator and heat dissipation module of FIG. 2. Figure 4 is a cross-sectional view of Figure 3 taken along line I-I. For clarity and ease of illustration, the cover 140 of Figures 2 and 3 is shown in dashed lines. Referring to FIG. 1 to FIG. 4 , in the embodiment, the evaporator 100 can be integrated into the heat dissipation module 10 and disposed in an electronic device (not shown). The electronic device (not shown) may be a smart phone, a tablet, a notebook computer, a docking station or other electronic products, and is internally provided with electronic components (not shown) such as a central processing unit or a display chip. The heat dissipation module 10 is thermally coupled to the electronic component (not shown) through the evaporator 100. For example, the evaporator 100 directly contacts the electronic component (not shown) to absorb heat generated by the electronic component (not shown), or The evaporator 100 is caused to absorb heat generated by an electronic component (not shown) through the heat pipe 20. Thereby, the heat generated by the operation of the electronic component (not shown) can be dissipated to the outside through the evaporator 100 and the heat dissipation module 10.

The evaporator 100 and the heat dissipation module 10 can constitute a siphon type heat dissipation assembly, wherein the heat dissipation module 10 includes a first tube member 11, a second tube member 12 and a fluid 13 (in the figure, the flow direction is represented by an arrow), and the first tube member 11 The second tube 12 is in communication with the evaporator 100, respectively, and the fluid 13 is configured to flow in the first tube 11, the second tube 12, and the evaporator 100. The evaporator 100 may include a housing 110, a first heat dissipation structure 120, a second heat dissipation structure 130, and a cover 140, wherein the housing 110 has a chamber 111, a first opening 112, and a second opening 113 relative to the first opening 112. And the first opening 112 and the second opening 113 are respectively communicated with the chamber 111. On the other hand, the first pipe member 11 is bored in the first opening 112 and communicates with the chamber 111. The second tube member 12 is disposed through the second opening 113 and communicates with the chamber 111. In detail, the fluid 13 can flow into the chamber 111 via the first tube 11 and out of the chamber 111 via the second tube 12. The end of the second tubular member 12 can be directly connected to the first tubular member 11, that is, the second tubular member 12 and the first tubular member 11 are both end portions of the same tubular member, or the end of the second tubular member 12 can be indirectly transmitted through a condenser (not shown). The first pipe member 11 is grounded so that the fluid can continue to flow from the second pipe member 12 to the first pipe member 11 after flowing out of the chamber 111, and further flows into the chamber 111. That is, the first tubular member 11, the second tubular member 12, and the chamber 111 may constitute a circuit for circulating the fluid 13.

In the present embodiment, the chamber 111 can be roughly divided into a first evaporation zone 111a and a second evaporation zone 111b, which are viewed from the first opening 112 to the second opening 113, and the first evaporation zone 111a and the second evaporation zone 111b are substantially The upper and lower sides of the chamber are arranged on the left and right sides of the chamber, and electronic components (not shown) are thermally coupled to the housing 110 through the heat pipe 20, and the heat pipe 20 is located directly below the first evaporation zone 111a. The heat of the heat pipe 20 can be conducted into the chamber 111 via the casing 110. After the fluid 13 flows into the chamber 111 via the first pipe member 11, it flows through the first evaporation zone 111a and the second evaporation zone 111b, respectively, and absorbs heat. The phase change is generated, for example, by converting the liquid fluid 13 into a gaseous fluid 13 and causing the heat to be carried away as the gaseous fluid 13 flows out of the chamber 111 via the second tubular member 12. The gaseous fluid 13 can again undergo phase change condensation (from a gaseous state back to a liquid state) as the second tubular member 12 and the first tubular member 11 pass through other lower temperature portions of the electronic device (not shown), dissipating the aforementioned heat. To the outside world. Thereafter, the fluid 13 converted from the gaseous state back to the liquid state can be returned to the chamber 111 via the first tubular member 11.

The first heat dissipation structure 120 and the second heat dissipation structure 130 are juxtaposed in the chamber 111 , and are viewed from the first opening 112 toward the second opening 113 , and the second heat dissipation structure 130 is arranged behind the first heat dissipation structure 120 . The first heat dissipation structure 120 and the second heat dissipation structure 130 are fixed to the housing 110 by soldering. For example, solder paste or other solder may be disposed between the first and second heat dissipation structures 120, 130 and the housing 110. After the first and second heat dissipation structures 120 and 130 are disposed on the housing 110, the first heat dissipation structure 120 and the second heat dissipation structure 130 are respectively soldered to the housing 110, thereby improving the first and second heat dissipation structures 120 and 130. Heat transfer efficiency with the housing 110. However, in other embodiments, a heat conductive medium such as a thermal paste may be used between the first and second heat dissipating structures and the housing, or the first and second heat dissipating structures may be simply brought into contact with the housing without being soldered. For alternatives. The cover body 140 is disposed on the housing 110 and covers the chamber 111 and the first heat dissipation structure 120 and the second heat dissipation structure 130 located in the chamber 111 such that the chamber 111 is sealed to the outside. To be precise, after the cover 140 covers the chamber 111, the chamber 111 forms a closed space with the first tube member 11 and the second tube member 12.

For example, the joint between the cover body 140 and the housing 110 may be provided with a leakage preventing structure to prevent the fluid 13 from leaking from the interface between the cover body 140 and the housing 110 to the inside of the electronic device (not shown), thereby causing The electronic component (not shown) is faulty or damaged. Preferably, the cover 140 is welded to the housing 110 to seal the chamber 111. In particular, the housing 110 further has a bearing surface 114, wherein the chamber 111 is formed on the bearing surface 114, and the bearing surface 114 is substantially associated with the first upper surface 123 of the first heat dissipation structure 120 and the second heat dissipation structure 130. The two upper surfaces 133 are flush with each other, and the cover 140 abuts the bearing surface 114, the first upper surface 123 and the second upper surface 133, so that the first heat dissipation structure 120 and the second heat dissipation structure 130 can be used to support the cover 140, thereby reducing Or avoiding the situation in which the cover 140 is softened by heat when the cover body 140 is welded to the housing 110 and collapses into the chamber 111.

On the other hand, the first heat dissipation structure 120 is located between the first opening 112 and the second heat dissipation structure 130 , and the second heat dissipation structure 130 is located between the first heat dissipation structure 120 and the second opening 113 . The first heat dissipation structure 120 spans the first evaporation zone 111a and the second evaporation zone 111b and has a plurality of first flow channels 121 and 122. Similarly, the second heat dissipation structure 130 spans the first evaporation zone 111a and the second evaporation zone. 111b and having a plurality of second flow paths 131 and 132. Therefore, the fluid 13 flowing into the chamber 111 from the first opening 112 first passes through the first flow paths 121 and 122, passes through the second flow paths 131 and 132, and finally flows out of the chamber 111 from the second opening 113.

In detail, the first heat dissipation structure 120 may be composed of a plurality of first structural members 120a and 120b, and the first flow path 121 and the first structure that are engaged with each other are defined by the first structural members 120a that are engaged with each other. The member 120b defines a first flow path 122. In this embodiment, the depth D1 of the first evaporation zone 111a is smaller than the depth D2 of the second evaporation zone 111b, wherein the first structural member 120a is disposed in the first evaporation zone 111a, and the height of the first structural member 120a is substantially equal to Depth D1. The first structural member 120b is disposed within the second evaporation zone 111b, and the height of the first structural member 120b is substantially equal to the depth D2. On the other hand, the number of the first structural members 120b is, for example, greater than the number of the first structural members 120a, and thus the first structural members 120a and 120b respectively have two different sizes, wherein the first flow path 121 located in the first evaporation region 111a The cross-sectional shape (or cross-sectional area) is different from the cross-sectional shape (or cross-sectional area) of the first flow path 122 located in the second evaporation zone 111b, and the number of the first flow paths 121 is smaller than the number of the first flow paths 122.

The second heat dissipation structure 130 may be composed of a plurality of second structural members 130a and 130b, and the second flow path 131 is defined by the mutually engaged second structural members 130a and defined by the mutually engaged second structural members 130b. The second flow path 132 is exited. In the present embodiment, the second structural member 130a is disposed in the first evaporation zone 111a, and the height of the second structural member 130a is substantially equal to the depth D1. The second structural member 130b is disposed within the second evaporation zone 111b, and the height of the second structural member 130b is substantially equal to the depth D2. On the other hand, the number of the second structural members 130b is, for example, greater than the number of the second structural members 130a, so that the second structural members 130a and 130b respectively have two different sizes, wherein the second flow path 131 located in the first evaporation region 111a The cross-sectional shape (or cross-sectional area) is different from the cross-sectional shape (or cross-sectional area) of the second flow path 132 located in the second evaporation zone 111b, and the number of the second flow channels 131 is smaller than the number of the second flow paths 132.

In this embodiment, the first structural members 120a, 120b and the second structural members 130a, 130b are long strips having a C-shaped cross section, and can be engaged with each other in a row so as to be between adjacent structural members. A first flow path and a second flow path are formed. However, under other considerations of cost or assembly, in other embodiments, the first structural member and the second structural member may have an L-shaped, inverted T-shaped or Z-shaped cross-sectional shape, and the two-phase engaged structural member Flow paths can still be formed between them.

With continued reference to FIGS. 1 through 4, the number of second structural members 130a is equal to the number of first structural members 120a, and the number of second structural members 130b is smaller than the number of first structural members 120b. In other words, the number and cross-sectional area of the first flow path 121 are equal to, for example, the number and cross-sectional area of the second flow path 131, and the cross-sectional area of the first flow path 122 is, for example, smaller than the cross-sectional area of the second flow path 132, and the first flow path The number of 122 is, for example, greater than the number of second flow paths 132. In detail, the design of the first heat dissipation structure 120 and the second heat dissipation structure 130 is mainly used to increase the contact area between the fluid 13 and the housing 110.

In this embodiment, since the number of the first flow passages 122 is greater than the number of the second flow passages 132, for example, the contact area of the first heat dissipation structure 120 with the fluid 13 may be greater than the contact area of the second heat dissipation structure 130 with the fluid 13. In this way, the vaporization rate of the fluid 13 flowing through the first heat dissipation structure 120 can be greater than the vaporization rate of the fluid 13 flowing through the second heat dissipation structure 130, thereby generating a pressure difference in the chamber 111 to increase the dynamic pressure. ) to drive the vaporized fluid 13 to flow to the second opening 113. Thereby, the circulation effect of the fluid 13 in the circuit formed by the first pipe member 11, the second pipe member 12 and the chamber 111 can be remarkably improved.

Secondly, in the partial second evaporation zone 111b or the entire second evaporation zone 111b, the average cross-sectional area of the first flow channel 122 is smaller than the average cross-sectional area of the second flow channel 132, and thus vaporized in the first flow channel 122. The bubbles generated by the fluid 13 are relatively dense, and the volume of the bubbles generated by the fluid 13 vaporized in the second flow path 132 is larger than this. The pressure generated by the fluid 13 vaporized in the first flow path 122 is smaller than the size of the air bubble generated by the fluid 13 vaporized in the second flow path 132, and the pressure at the first flow path 122 may be lower than that of the second flow path 122. The pressure at the flow path 132 is large. In other words, there is a pressure difference between the first flow path 122 and the second flow path 132. The pressure difference can drive the gaseous fluid 13 through the first flow path 122 and the second flow path 132 from the second flow path 132. The opening 113 smoothly flows out of the chamber 111, thereby increasing the flow rate of the fluid 13 (including liquid and gaseous) in the circuit formed by the first tubular member 11, the second tubular member 12, and the chamber 111.

On the other hand, since the bubble generated by the fluid 13 vaporized in the first flow path 122 is relatively dense, and the cross-sectional area of the second flow path 132 is, for example, larger than the cross-sectional area of the first flow path 122, it is in the first flow path 122. The bubbles generated by the vaporized fluid 13 can smoothly pass through the second flow path 132 without being blocked therein. In this embodiment, the housing 110 further has a first positioning portion 115, a second positioning portion 116, and a third positioning portion 117, wherein the first positioning portion 115, the second positioning portion 116, and the third positioning portion 117 are different from each other. The housing 110 protrudes into the chamber 111 and is juxtaposed in the chamber 111. The first positioning portion 115, the second positioning portion 116, and the third positioning portion 117 assume a lateral rib shape with respect to the flow direction of the fluid 13, and straddle the first evaporation zone 111a and the second evaporation zone 111b.

In addition, in the present embodiment, the first heat dissipation structure 120 has the first structural members 120a, 120b more than the second structural members 130a, 130b of the second heat dissipation structure 130, so that the total of the first flow paths 121 and 122 The cross-sectional area is smaller than the total cross-sectional area of the second flow paths 131 and 132. The first heat dissipation structure 120 has a flow resistance greater than that of the second heat dissipation structure 130. When the fluid 13 in the chamber 111 is vaporized, it tends to flow along the flow. Flow in a lower direction helps to flow the fluid 13 in the direction of the second structural members 130a, 130b and the second opening 113.

As shown in FIG. 2 and FIG. 3 , the first positioning portion 115 is located between the second positioning portion 116 and the first positioning portion 112 , and the second positioning portion 116 is located between the first positioning portion 115 and the third positioning portion 117 . The three positioning portions 117 are located between the second positioning portion 116 and the second opening 113. The first heat dissipation structure 120 is disposed between the two adjacent first positioning portions 115 and the second positioning portion 116. The positioning of the first positioning portion 115 and the second positioning portion 116 can improve the assembly of the first heat dissipation structure 120 to the shell. The convenience of the body 110. The second heat dissipation structure 130 is disposed between the two adjacent second positioning portions 116 and the third positioning portion 160. The positioning of the second positioning portion 116 and the third positioning portion 160 can improve the assembly of the second heat dissipation structure 130 to the shell. The convenience of the body 110. On the other hand, the second positioning portion 116 located between the first heat dissipation structure 120 and the second heat dissipation structure 130 may separate the two, thereby increasing the flow of the fluid 13 from the first flow path 121 or 122 to the second flow path. The fluidity of 131 or 132 causes bubbles generated by the fluid 13 vaporized in the first flow paths 121 and 122 to flow into the second flow path 131 or 132 in the shortest path.

Referring to FIG. 1 and FIG. 2 , in the embodiment, the manufacturing method of the evaporator 100 includes the following steps: First, the housing 110 , the cover 140 , and the first structural member 120 and the second structural member 130 are respectively fabricated. The housing 110 is manufactured, for example, by forging, casting, or cutting. The first structural members 120a, 120b and the second structural members 130a, 130b are, for example, formed into a plurality of first structural members 120a, 120b and second structural members 130a, 130b by forging. Then, any two adjacent first structural members 120a are engaged with each other, any two adjacent first structural members 120b are engaged with each other, and one of the first structural members 120a is engaged with one of the first structural members 120b to constitute A first heat dissipation structure 120 having a plurality of first flow channels 121 and 122. Similarly, any two adjacent second structural members 130a are engaged with each other, any two adjacent second structural members 130b are engaged with each other, and one of the second structural members 130a is engaged with one of the second structural members 130b. A second heat dissipation structure 130 having a plurality of second flow paths 131 and 132 is formed.

Then, the first heat dissipation structure 120 and the second heat dissipation structure 130 are assembled in the chamber 111, and the first heat dissipation structure 120 and the second heat dissipation structure 130 are fixed to the housing 110 by soldering. In detail, the first heat dissipation structure 120 and the second heat dissipation structure 130 both span the first evaporation zone 111a and the second evaporation zone 112a. Thereafter, the cover 140 is disposed on the housing 110, and the cover 140 covers the chamber 111 and the first heat dissipation structure 120 and the second heat dissipation structure 130 located in the chamber 111. It is worth mentioning that in the case of soldering with solder paste, between the first heat dissipation structure 120 and the housing 110, between the second heat dissipation junction 130 and the housing 110, and between the cover 140 and the housing 110 The welding may be completed by a single heating welding after the assembly is completed, or when the welding between the cover 140 and the housing 110 is performed, because the housing 110 is heated to cause the first heat dissipation structure 120 and the housing 110 to be between The second heat dissipation structure 130 and the solder paste between the housings 110 are welded together, which has advantages in the processing procedure. Compared with the existing manufacturing method of the evaporator, for example, by etching or machining with a computer numerical control tool to form a heat dissipation structure integrally formed on the casing, the manufacturing method of the evaporator 100 of the present embodiment can not only improve the product. Rate can also reduce production costs.

In other embodiments, the first structural member of the first heat dissipation structure and the second structural member of the second heat dissipation structure may also be directly assembled and assembled in the housing after being forged by the forging process without being engaged with each other. To complete the evaporator.

In summary, the evaporator of the present invention is provided with a first heat dissipation structure and a second heat dissipation structure in the chamber of the housing, and the first heat dissipation structure and the second heat dissipation structure respectively have a plurality of first flow paths and a second flow path. A flow path for fluid to pass through. This arrangement helps to increase the contact area between the fluid and the housing to increase the vaporization rate of the fluid. In detail, since the number of the first flow channels located in the second evaporation zone is greater than the number of the second flow channels located in the second evaporation zone, and the cross-sectional area of the first flow channel located in the second evaporation zone is smaller than that located in the second a cross-sectional area of the second flow passage in the evaporation zone, so that after the fluid is vaporized, there is a pressure between the first flow passage located in the second evaporation zone and the second flow passage located in the second evaporation zone Poorly, the pressure difference can drive the gaseous fluid to smoothly flow out of the chamber from the second opening through the first flow path and the second flow path, thereby increasing the flow rate of the fluid in the circuit formed by the tube and the chamber.

On the other hand, the first heat dissipation structure and the second heat dissipation structure created by the present invention can be fabricated through steps such as forging and clamping, and then assembled into a casing, which is formed by etching or cutting with a computer numerical control tool. The heat-dissipating structure integrally formed in the casing, the manufacturing method of the evaporator created by the novel can not only improve product yield and production efficiency, but also reduce production cost.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the novel creation, and any person skilled in the art can make some changes without departing from the spirit and scope of the novel creation. Retouching, the scope of protection of this new creation is subject to the definition of the scope of the patent application attached.

10‧‧‧ Thermal Module
11‧‧‧First pipe fittings
12‧‧‧Second pipe fittings
13‧‧‧ Fluid
20‧‧‧heat pipe
100‧‧‧Evaporator
110‧‧‧shell
111‧‧‧ chamber
111a‧‧‧First evaporation zone
111b‧‧‧Second evaporation zone
112‧‧‧ first opening
113‧‧‧ second opening
114‧‧‧ bearing surface
115‧‧‧First Positioning Department
116‧‧‧Second Positioning Department
117‧‧‧ Third Positioning Department
120‧‧‧First heat dissipation structure
120a, 120b‧‧‧ first structural parts
121, 122‧‧‧ first runner
123‧‧‧First upper surface
130‧‧‧Second heat dissipation structure
130a, 130b‧‧‧Second structural parts
131, 132‧‧‧ second runner
133‧‧‧Second upper surface
140‧‧‧ cover
D1, D2‧‧ depth

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic exploded view of an evaporator of an embodiment of the present invention. 2 is a schematic structural view of the evaporator and the heat dissipation module of FIG. 1. 3 is a top plan view of the evaporator and heat dissipation module of FIG. 2. Figure 4 is a cross-sectional view of Figure 3 taken along line I-I.

10‧‧‧ Thermal Module

11‧‧‧First pipe fittings

12‧‧‧Second pipe fittings

13‧‧‧ Fluid

20‧‧‧heat pipe

100‧‧‧Evaporator

110‧‧‧shell

111‧‧‧ chamber

111a‧‧‧First evaporation zone

111b‧‧‧Second evaporation zone

112‧‧‧ first opening

113‧‧‧ second opening

114‧‧‧ bearing surface

120‧‧‧First heat dissipation structure

120a, 120b‧‧‧ first structural parts

121, 122‧‧‧ first runner

123‧‧‧First upper surface

130‧‧‧Second heat dissipation structure

130a, 130b‧‧‧Second structural parts

131, 132‧‧‧ second runner

133‧‧‧Second upper surface

140‧‧‧ cover

D1, D2‧‧ depth

Claims (11)

An evaporator suitable for use in a heat dissipation module, wherein the heat dissipation module includes a tube member and a fluid, the evaporator comprising: a housing having a chamber for communicating with the tube member for fluid configuration For flowing in the tube and the chamber; a first heat dissipation structure disposed in the chamber, wherein the first heat dissipation structure has a plurality of first flow channels and is flowable when the fluid flows in the chamber Through the first flow channels. The evaporator of claim 1, wherein the housing further has a first opening and a second opening opposite to the first opening, and the tube communicates with the second opening through the first opening a chamber having a first evaporation zone and a second evaporation zone, the first opening being viewed from the second opening, the first evaporation zone being separated from the second evaporation by the chamber The first heat dissipation structure spans the first evaporation zone and the second evaporation zone on the left and right sides. The evaporator of claim 2, further comprising: a second heat dissipation structure disposed in the chamber and having a plurality of second flow channels, wherein the first heat dissipation structure is located at the first opening Between the second heat dissipation structures, the second heat dissipation structure is located between the first heat dissipation structure and the second opening, so that the fluid can flow into the chamber from the first opening, and sequentially pass the first flows. The channel and the second flow channels exit the chamber from the second opening. The evaporator of claim 2, wherein the depth of the first evaporation zone is less than the depth of the second evaporation zone. The evaporator of claim 3, wherein the number of the first flow passages located in the first evaporation zone is equal to the number of the second flow passages located in the first evaporation zone. The evaporator of claim 3, wherein a cross-sectional area of each of the first flow passages located in the second evaporation zone is smaller than a cross-sectional area of each of the second flow passages located in the second evaporation zone. The evaporator of claim 1, wherein the first heat dissipation structure comprises a plurality of C-shaped structural members, and any two adjacent C-shaped structural members are engaged with each other. The evaporator of claim 3, wherein the second heat dissipation structure comprises a plurality of structural members, and any two adjacent C-shaped structural members are engaged with each other. The evaporator of claim 1, further comprising: a cover disposed on the housing and covering the chamber, the housing further having a bearing surface, the chamber being defined on the bearing surface The bearing surface is flush with a first upper surface of the first heat dissipation structure, and the cover abuts the bearing surface and the first upper surface. The evaporator of claim 3, wherein the housing further has a first positioning portion, a second positioning portion, and a third positioning portion, the first positioning portion, the second positioning portion, and the The third positioning portion is juxtaposed in the chamber, and the first positioning portion, the second positioning portion and the third positioning portion span the first evaporation region and the second evaporation region, and the first heat dissipation structure is disposed on Between the two adjacent first positioning portions and the second positioning portion, the second heat dissipation structure is disposed between the two adjacent second positioning portions and the third positioning portion. The evaporator of claim 1, wherein the first heat dissipation structure is welded to the housing.