TWM535456U - Evaporator - Google Patents
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- TWM535456U TWM535456U TW105213532U TW105213532U TWM535456U TW M535456 U TWM535456 U TW M535456U TW 105213532 U TW105213532 U TW 105213532U TW 105213532 U TW105213532 U TW 105213532U TW M535456 U TWM535456 U TW M535456U
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Description
本新型創作是有關於一種蒸發器,且特別是有關於一種適用於散熱模組的蒸發器。The present invention relates to an evaporator, and more particularly to an evaporator suitable for use in a heat dissipation module.
近年來,隨著科技產業日益發達,電子裝置例如筆記型電腦、平板電腦與智慧型手機等產品已頻繁地出現在日常生活中。這些電子裝置內部所搭載的部分電子元件在運作過程中通常會產生熱能,一旦熱能積累於電子裝置內部而無法即時地逸散至外界,便會對電子裝置的效能造成影響。因此,電子裝置內部通常會設置散熱模組或散熱元件,例如是散熱風扇、散熱貼材、散熱管或兩相流虹吸式散熱系統(two-phase thermosyphon cooling system),以協助將電子元件運作時所產生的熱能逸散至外界。In recent years, with the development of the technology industry, electronic devices such as notebook computers, tablet computers, and smart phones have frequently appeared in daily life. Some of the electronic components mounted inside these electronic devices usually generate thermal energy during operation. Once the thermal energy accumulates inside the electronic device and cannot be immediately released to the outside world, the performance of the electronic device may be affected. Therefore, a heat dissipating module or a heat dissipating component is usually disposed inside the electronic device, such as a cooling fan, a heat dissipating material, a heat pipe, or a two-phase thermosyphon cooling system to assist in operating the electronic components. The generated heat energy escapes to the outside world.
在上述的散熱模組或散熱元件中,散熱貼材與散熱管的散熱效果有限,因此又以散熱風扇的使用最為廣泛。然而,散熱風扇的運作需仰賴電子裝置的電池所提供的電力,勢必會加速電力的消耗。目前,亦有部分電子裝置採用兩相流虹吸式散熱系統,以透過流體在相變化時所需的潛熱,來達到散熱之目的。然而,兩相流虹吸式散熱系統需藉由位能差以及流體分子間的引力來作為流體在管路中循環的動力,一旦電子裝置與重力方向之間的相對狀態改變,便可能對流體的循環效果造成影響。In the above-mentioned heat dissipation module or heat dissipation component, the heat dissipation effect of the heat dissipation material and the heat dissipation tube is limited, and thus the heat dissipation fan is most widely used. However, the operation of the cooling fan depends on the power provided by the battery of the electronic device, which is bound to accelerate the consumption of electricity. At present, some electronic devices use a two-phase flow siphon cooling system to achieve the purpose of heat dissipation by transmitting the latent heat required by the fluid during phase change. However, the two-phase flow siphon heat dissipation system needs to be used as the power of the fluid to circulate in the pipeline by the difference of the potential energy and the attraction between the fluid molecules. Once the relative state between the electronic device and the gravity direction changes, the fluid may be The effect of the loop is affected.
本新型創作提供一種蒸發器,其能提高散熱模組中的流體的循環效果。The novel creation provides an evaporator that can improve the circulation of fluid in the heat dissipation module.
本新型創作的蒸發器,適用於散熱模組,其中散熱模組包括管件以及流體。蒸發器包括殼體與第一散熱結構。殼體具有用於與管件相連通的腔室,流體配置用以在管件與腔室中流動。第一散熱結構設置於腔室中,其中第一散熱結構具有多個第一流道,且可供流體在腔室中流動時流經這些第一流道。The novel created evaporator is suitable for a heat dissipation module, wherein the heat dissipation module includes a pipe member and a fluid. The evaporator includes a housing and a first heat dissipation structure. The housing has a chamber for communicating with the tubular member and the fluid is configured to flow within the tubular member and the chamber. The first heat dissipation structure is disposed in the chamber, wherein the first heat dissipation structure has a plurality of first flow channels and is flowable through the first flow channels when the fluid flows in the chamber.
基於上述,本新型創作的蒸發器係在殼體的腔室內設置有第一散熱結構,且第一散熱結構具有多個第一流道,以供流體通過。如此設置下,有助於提高流體與殼體之間的接觸面積,以提高流體接收自電子元件或熱管傳導至殼體的熱量後的汽化速率以及流體於管件與腔室所構成的迴路內的循環效果。另一方面,第一散熱結構係在製作完成後才組裝至殼體內,相較於現有的蒸發器的製作方式而言,例如採用蝕刻或以電腦數值控制工具進行加工以形成位於蒸發器內的散熱結構,本新型創作的蒸發器的製作方法不僅能提高產品良率,亦能降低製作成本。Based on the above, the evaporator of the present invention is provided with a first heat dissipation structure in the chamber of the housing, and the first heat dissipation structure has a plurality of first flow passages for the passage of fluid. With this arrangement, it is helpful to increase the contact area between the fluid and the casing to increase the vaporization rate of the fluid after receiving heat from the electronic component or the heat pipe to the casing and the fluid in the loop formed by the pipe and the chamber. Loop effect. On the other hand, the first heat dissipation structure is assembled into the housing after the fabrication is completed, and is processed by etching or computer numerical control tools to form the evaporator, for example, compared to the existing evaporator. The heat dissipation structure, the manufacturing method of the evaporator created by the novel can not only improve the product yield but also reduce the production cost.
為讓本新型創作的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will become more apparent and understood from the following description.
圖1是本新型創作一實施例的蒸發器的爆炸示意圖。圖2是圖1的蒸發器與散熱模組的結構示意圖。圖3是圖2的蒸發器與散熱模組的俯視示意圖。圖4是圖3沿剖線I-I的剖面示意圖。為求清楚表示與便於說明,圖2與圖3的蓋體140係以虛線繪示。請參考圖1至圖4,在本實施例中,蒸發器100可整合於散熱模組10,且設置於電子裝置(圖未示)中。電子裝置(圖未示)可以是智慧型手機、平板電腦、筆記型電腦、擴充基座或其他電子產品,且其內部設置有電子元件(圖未示)例如是中央處理器或顯示晶片。散熱模組10可透過蒸發器100熱耦接於電子元件(圖未示),例如蒸發器100直接接觸電子元件(圖未示)而吸收電子元件(圖未示)所產生的熱量,或者是使蒸發器100透過熱管20吸收電子元件(圖未示)所產生的熱量。藉此,電子元件(圖未示)運行時所產生的熱量可透過蒸發器100與散熱模組10逸散至外界。BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic exploded view of an evaporator of an embodiment of the present invention. 2 is a schematic structural view of the evaporator and the heat dissipation module of FIG. 1. 3 is a top plan view of the evaporator and heat dissipation module of FIG. 2. Figure 4 is a cross-sectional view of Figure 3 taken along line I-I. For clarity and ease of illustration, the cover 140 of Figures 2 and 3 is shown in dashed lines. Referring to FIG. 1 to FIG. 4 , in the embodiment, the evaporator 100 can be integrated into the heat dissipation module 10 and disposed in an electronic device (not shown). The electronic device (not shown) may be a smart phone, a tablet, a notebook computer, a docking station or other electronic products, and is internally provided with electronic components (not shown) such as a central processing unit or a display chip. The heat dissipation module 10 is thermally coupled to the electronic component (not shown) through the evaporator 100. For example, the evaporator 100 directly contacts the electronic component (not shown) to absorb heat generated by the electronic component (not shown), or The evaporator 100 is caused to absorb heat generated by an electronic component (not shown) through the heat pipe 20. Thereby, the heat generated by the operation of the electronic component (not shown) can be dissipated to the outside through the evaporator 100 and the heat dissipation module 10.
蒸發器100與散熱模組10可構成虹吸式散熱組件,其中散熱模組10包括第一管件11、第二管件12與流體13(在圖式中以箭號代表其流向),第一管件11與第二管件12分別連通於蒸發器100,且流體13配置用以在第一管件11、第二管件12以及蒸發器100中流動。蒸發器100可包括殼體110、第一散熱結構120、第二散熱結構130以及蓋體140,其中殼體110具有腔室111、第一開口112以及相對於第一開口112的第二開口113,且第一開口112與第二開口113分別連通於腔室111。另一方面,第一管件11穿設於第一開口112,而與腔室111相連通。第二管件12穿設於第二開口113,而與腔室111相連通。詳細而言,流體13可經由第一管件11流入腔室111,再經由第二管件12自腔室111流出。第二管件12的末端可直接連接第一管件11,即第二管件12與第一管件11為同一管件的兩端末端部分,或者第二管件12的末端可透過冷凝器(圖未示)間接地連接第一管件11,使流體自第二管件12流出腔室111後能繼續流動至第一管件11,再進一步流入腔室111。也就是說,第一管件11、第二管件12以及腔室111可構成供流體13循環流動的迴路。The evaporator 100 and the heat dissipation module 10 can constitute a siphon type heat dissipation assembly, wherein the heat dissipation module 10 includes a first tube member 11, a second tube member 12 and a fluid 13 (in the figure, the flow direction is represented by an arrow), and the first tube member 11 The second tube 12 is in communication with the evaporator 100, respectively, and the fluid 13 is configured to flow in the first tube 11, the second tube 12, and the evaporator 100. The evaporator 100 may include a housing 110, a first heat dissipation structure 120, a second heat dissipation structure 130, and a cover 140, wherein the housing 110 has a chamber 111, a first opening 112, and a second opening 113 relative to the first opening 112. And the first opening 112 and the second opening 113 are respectively communicated with the chamber 111. On the other hand, the first pipe member 11 is bored in the first opening 112 and communicates with the chamber 111. The second tube member 12 is disposed through the second opening 113 and communicates with the chamber 111. In detail, the fluid 13 can flow into the chamber 111 via the first tube 11 and out of the chamber 111 via the second tube 12. The end of the second tubular member 12 can be directly connected to the first tubular member 11, that is, the second tubular member 12 and the first tubular member 11 are both end portions of the same tubular member, or the end of the second tubular member 12 can be indirectly transmitted through a condenser (not shown). The first pipe member 11 is grounded so that the fluid can continue to flow from the second pipe member 12 to the first pipe member 11 after flowing out of the chamber 111, and further flows into the chamber 111. That is, the first tubular member 11, the second tubular member 12, and the chamber 111 may constitute a circuit for circulating the fluid 13.
在本實施例中,腔室111可概分為第一蒸發區111a與第二蒸發區111b,由第一開口112向第二開口113觀之,第一蒸發區111a與第二蒸發區111b大致上分列於腔室的左右兩側,電子元件(圖未示)可透過熱管20熱耦接於殼體110,且熱管20位於第一蒸發區111a的正下方。熱管20的熱量可經由殼體110傳導至腔室111內,在流體13經由第一管件11流入腔室111後,其會分別流經第一蒸發區111a與第二蒸發區111b,並吸收熱量而產生相變化,例如使液態的流體13轉變為氣態的流體13,並隨著氣態的流體13經由第二管件12流出腔室111而使熱量隨之被帶離。氣態的流體13可隨著第二管件12與第一管件11通過電子裝置(圖未示)的其他溫度較低的部位,而再次進行相變化冷凝(由氣態轉變回液態),將前述熱量散逸至外界。之後,由氣態轉變回液態的流體13可再經由第一管件11回流到腔室111中。In the present embodiment, the chamber 111 can be roughly divided into a first evaporation zone 111a and a second evaporation zone 111b, which are viewed from the first opening 112 to the second opening 113, and the first evaporation zone 111a and the second evaporation zone 111b are substantially The upper and lower sides of the chamber are arranged on the left and right sides of the chamber, and electronic components (not shown) are thermally coupled to the housing 110 through the heat pipe 20, and the heat pipe 20 is located directly below the first evaporation zone 111a. The heat of the heat pipe 20 can be conducted into the chamber 111 via the casing 110. After the fluid 13 flows into the chamber 111 via the first pipe member 11, it flows through the first evaporation zone 111a and the second evaporation zone 111b, respectively, and absorbs heat. The phase change is generated, for example, by converting the liquid fluid 13 into a gaseous fluid 13 and causing the heat to be carried away as the gaseous fluid 13 flows out of the chamber 111 via the second tubular member 12. The gaseous fluid 13 can again undergo phase change condensation (from a gaseous state back to a liquid state) as the second tubular member 12 and the first tubular member 11 pass through other lower temperature portions of the electronic device (not shown), dissipating the aforementioned heat. To the outside world. Thereafter, the fluid 13 converted from the gaseous state back to the liquid state can be returned to the chamber 111 via the first tubular member 11.
第一散熱結構120與第二散熱結構130並列於腔室111中,由第一開口112向第二開口113觀之,第二散熱結構130排列於第一散熱結構120的後方。第一散熱結構120與第二散熱結構130可透過焊接的方式固定於殼體110,舉例來說,可先在第一、二散熱結構120、130與殼體110之間設置錫膏或其他焊料,並在第一、二散熱結構120、130設置於殼體110後加熱,使第一散熱結構120以及第二散熱結構130分別與殼體110焊接,藉以提高第一、二散熱結構120、130與殼體110之間的熱傳導效率。然而,在其他實施例中,在第一、二散熱結構與殼體之間可使用如導熱膏之導熱介質,或將第一、二散熱結構單純地接觸於殼體,而未進行焊接,亦為可選擇的作法。蓋體140設置於殼體110上,且覆蓋腔室111以及位於腔室111中的第一散熱結構120與第二散熱結構130,使得腔室111密閉於外界。準確來說,蓋體140覆蓋腔室111後,腔室111與第一管件11以及第二管件12構成密閉空間。The first heat dissipation structure 120 and the second heat dissipation structure 130 are juxtaposed in the chamber 111 , and are viewed from the first opening 112 toward the second opening 113 , and the second heat dissipation structure 130 is arranged behind the first heat dissipation structure 120 . The first heat dissipation structure 120 and the second heat dissipation structure 130 are fixed to the housing 110 by soldering. For example, solder paste or other solder may be disposed between the first and second heat dissipation structures 120, 130 and the housing 110. After the first and second heat dissipation structures 120 and 130 are disposed on the housing 110, the first heat dissipation structure 120 and the second heat dissipation structure 130 are respectively soldered to the housing 110, thereby improving the first and second heat dissipation structures 120 and 130. Heat transfer efficiency with the housing 110. However, in other embodiments, a heat conductive medium such as a thermal paste may be used between the first and second heat dissipating structures and the housing, or the first and second heat dissipating structures may be simply brought into contact with the housing without being soldered. For alternatives. The cover body 140 is disposed on the housing 110 and covers the chamber 111 and the first heat dissipation structure 120 and the second heat dissipation structure 130 located in the chamber 111 such that the chamber 111 is sealed to the outside. To be precise, after the cover 140 covers the chamber 111, the chamber 111 forms a closed space with the first tube member 11 and the second tube member 12.
舉例來說,蓋體140與殼體110的銜接處可設有防洩漏結構,以防止流體13自蓋體140與殼體110的銜接處洩漏至電子裝置(圖未示)的內部,而造成電子元件(圖未示)故障或損壞,較佳者,蓋體140周圍均焊接於殼體110而能將腔室111密封。特別說明的是,殼體110還具有承載面114,其中腔室111開設於承載面114,承載面114實質上係與第一散熱結構120的第一上表面123以及第二散熱結構130的第二上表面133相齊平,且蓋體140抵接承載面114、第一上表面123以及第二上表面133,如此可利用第一散熱結構120與第二散熱結構130支撐蓋體140,減少或避免在焊接蓋體140於殼體110時蓋體140受熱軟化而向腔室111內塌陷的情形發生。For example, the joint between the cover body 140 and the housing 110 may be provided with a leakage preventing structure to prevent the fluid 13 from leaking from the interface between the cover body 140 and the housing 110 to the inside of the electronic device (not shown), thereby causing The electronic component (not shown) is faulty or damaged. Preferably, the cover 140 is welded to the housing 110 to seal the chamber 111. In particular, the housing 110 further has a bearing surface 114, wherein the chamber 111 is formed on the bearing surface 114, and the bearing surface 114 is substantially associated with the first upper surface 123 of the first heat dissipation structure 120 and the second heat dissipation structure 130. The two upper surfaces 133 are flush with each other, and the cover 140 abuts the bearing surface 114, the first upper surface 123 and the second upper surface 133, so that the first heat dissipation structure 120 and the second heat dissipation structure 130 can be used to support the cover 140, thereby reducing Or avoiding the situation in which the cover 140 is softened by heat when the cover body 140 is welded to the housing 110 and collapses into the chamber 111.
另一方面,第一散熱結構120位於第一開口112與第二散熱結構130之間,且第二散熱結構130位於第一散熱結構120與第二開口113之間。第一散熱結構120橫跨第一蒸發區111a與第二蒸發區111b,且具有多個第一流道121與122,相似地,第二散熱結構130橫跨第一蒸發區111a與第二蒸發區111b,且具有多個第二流道131與132。因此,自第一開口112流入腔室111內的流體13係先通過第一流道121與122,再通過第二流道131與132,最後自第二開口113流出腔室111。On the other hand, the first heat dissipation structure 120 is located between the first opening 112 and the second heat dissipation structure 130 , and the second heat dissipation structure 130 is located between the first heat dissipation structure 120 and the second opening 113 . The first heat dissipation structure 120 spans the first evaporation zone 111a and the second evaporation zone 111b and has a plurality of first flow channels 121 and 122. Similarly, the second heat dissipation structure 130 spans the first evaporation zone 111a and the second evaporation zone. 111b and having a plurality of second flow paths 131 and 132. Therefore, the fluid 13 flowing into the chamber 111 from the first opening 112 first passes through the first flow paths 121 and 122, passes through the second flow paths 131 and 132, and finally flows out of the chamber 111 from the second opening 113.
詳細而言,第一散熱結構120可由多個第一結構件120a與120b所構成,並由這些相互卡合的第一結構件120a定義出第一流道121以及由這些相互卡合的第一結構件120b定義出第一流道122。在本實施例中,第一蒸發區111a的深度D1小於第二蒸發區111b的深度D2,其中第一結構件120a設置於第一蒸發區111a內,且第一結構件120a的高度實質上等於深度D1。第一結構件120b設置於第二蒸發區111b內,且第一結構件120b的高度實質上等於深度D2。另一方面,第一結構件120b的數量例如是大於第一結構件120a的數量,因此第一結構件120a與120b分別具有兩不同尺寸,其中位於第一蒸發區111a內的第一流道121的截面形狀(或截面積)不同於位於第二蒸發區111b內的第一流道122的截面形狀(或截面積),且第一流道121的數量小於第一流道122的數量。In detail, the first heat dissipation structure 120 may be composed of a plurality of first structural members 120a and 120b, and the first flow path 121 and the first structure that are engaged with each other are defined by the first structural members 120a that are engaged with each other. The member 120b defines a first flow path 122. In this embodiment, the depth D1 of the first evaporation zone 111a is smaller than the depth D2 of the second evaporation zone 111b, wherein the first structural member 120a is disposed in the first evaporation zone 111a, and the height of the first structural member 120a is substantially equal to Depth D1. The first structural member 120b is disposed within the second evaporation zone 111b, and the height of the first structural member 120b is substantially equal to the depth D2. On the other hand, the number of the first structural members 120b is, for example, greater than the number of the first structural members 120a, and thus the first structural members 120a and 120b respectively have two different sizes, wherein the first flow path 121 located in the first evaporation region 111a The cross-sectional shape (or cross-sectional area) is different from the cross-sectional shape (or cross-sectional area) of the first flow path 122 located in the second evaporation zone 111b, and the number of the first flow paths 121 is smaller than the number of the first flow paths 122.
第二散熱結構130可由多個第二結構件130a與130b所構成,並由這些相互卡合的第二結構件130a定義出第二流道131以及由這些相互卡合的第二結構件130b定義出第二流道132。在本實施例中,第二結構件130a設置於第一蒸發區111a內,且第二結構件130a的高度實質上等於深度D1。第二結構件130b設置於第二蒸發區111b內,且第二結構件130b的高度實質上等於深度D2。另一方面,第二結構件130b的數量例如是大於第二結構件130a的數量,因此第二結構件130a與130b分別具有兩不同尺寸,其中位於第一蒸發區111a內的第二流道131的截面形狀(或截面積)不同於位於第二蒸發區111b內的第二流道132的截面形狀(或截面積),且第二流道131的數量小於第二流道132的數量。The second heat dissipation structure 130 may be composed of a plurality of second structural members 130a and 130b, and the second flow path 131 is defined by the mutually engaged second structural members 130a and defined by the mutually engaged second structural members 130b. The second flow path 132 is exited. In the present embodiment, the second structural member 130a is disposed in the first evaporation zone 111a, and the height of the second structural member 130a is substantially equal to the depth D1. The second structural member 130b is disposed within the second evaporation zone 111b, and the height of the second structural member 130b is substantially equal to the depth D2. On the other hand, the number of the second structural members 130b is, for example, greater than the number of the second structural members 130a, so that the second structural members 130a and 130b respectively have two different sizes, wherein the second flow path 131 located in the first evaporation region 111a The cross-sectional shape (or cross-sectional area) is different from the cross-sectional shape (or cross-sectional area) of the second flow path 132 located in the second evaporation zone 111b, and the number of the second flow channels 131 is smaller than the number of the second flow paths 132.
在本實施例中,第一結構件120a、120b與第二結構件130a、130b均為截面呈C形的長條板,並可成排地相互卡合,從而在相鄰的結構件之間形成第一流道與第二流道。然而,基於成本或組裝的其他考量之下,在其他實施例中,第一結構件與第二結構件可具有L形、倒T形或Z形等截面形狀,且兩相卡合的結構件之間仍可形成流道。In this embodiment, the first structural members 120a, 120b and the second structural members 130a, 130b are long strips having a C-shaped cross section, and can be engaged with each other in a row so as to be between adjacent structural members. A first flow path and a second flow path are formed. However, under other considerations of cost or assembly, in other embodiments, the first structural member and the second structural member may have an L-shaped, inverted T-shaped or Z-shaped cross-sectional shape, and the two-phase engaged structural member Flow paths can still be formed between them.
請繼續參考圖1至圖4,第二結構件130a的數量等於第一結構件120a的數量,且第二結構件130b的數量小於第一結構件120b的數量。換句話說,第一流道121的數量及截面積例如是等於第二流道131的數量及截面積,第一流道122的截面積例如是小於第二流道132的截面積,且第一流道122的數量例如是大於第二流道132的數量。詳細而言,第一散熱結構120與第二散熱結構130的設計,主要係用以增加流體13與殼體110之間的接觸面積。With continued reference to FIGS. 1 through 4, the number of second structural members 130a is equal to the number of first structural members 120a, and the number of second structural members 130b is smaller than the number of first structural members 120b. In other words, the number and cross-sectional area of the first flow path 121 are equal to, for example, the number and cross-sectional area of the second flow path 131, and the cross-sectional area of the first flow path 122 is, for example, smaller than the cross-sectional area of the second flow path 132, and the first flow path The number of 122 is, for example, greater than the number of second flow paths 132. In detail, the design of the first heat dissipation structure 120 and the second heat dissipation structure 130 is mainly used to increase the contact area between the fluid 13 and the housing 110.
在本實施例中,由於第一流道122的數量例如是大於第二流道132的數量,因此第一散熱結構120與流體13的接觸面積可大於第二散熱結構130與流體13的接觸面積。如此一來,流經第一散熱結構120的流體13的汽化速率可大於流經第二散熱結構130的流體13的汽化速率,進而於腔室111內產生壓力差,以增加動壓(dynamic pressure)來驅動汽化後的流體13流向第二開口113。藉此,流體13於第一管件11、第二管件12以及腔室111所構成的迴路內的循環效果便能獲得顯著地提升。In this embodiment, since the number of the first flow passages 122 is greater than the number of the second flow passages 132, for example, the contact area of the first heat dissipation structure 120 with the fluid 13 may be greater than the contact area of the second heat dissipation structure 130 with the fluid 13. In this way, the vaporization rate of the fluid 13 flowing through the first heat dissipation structure 120 can be greater than the vaporization rate of the fluid 13 flowing through the second heat dissipation structure 130, thereby generating a pressure difference in the chamber 111 to increase the dynamic pressure. ) to drive the vaporized fluid 13 to flow to the second opening 113. Thereby, the circulation effect of the fluid 13 in the circuit formed by the first pipe member 11, the second pipe member 12 and the chamber 111 can be remarkably improved.
其次,在局部的第二蒸發區111b中或是整個第二蒸發區111b中,第一流道122的平均截面積小於第二流道132的平均截面積,因此在第一流道122內汽化後的流體13所產生的氣泡較為致密,相較於此,在第二流道132內汽化後的流體13所產生的氣泡的體積較大。基於在第一流道122內汽化後的流體13所產生的氣泡的尺寸小於在第二流道132內汽化後的流體13所產生的氣泡的尺寸,第一流道122所在處的壓力可較第二流道132所在處的壓力為大。換言之,第一流道122所在處與第二流道132所在處之間存在一壓力差,透過此壓力差可驅動氣態的流體13依序經由第一流道122與第二流道132而自第二開口113順暢地流出腔室111,進而提高流體13(包含液態與氣態)於第一管件11、第二管件12以及腔室111所構成的迴路內的流動速率。Secondly, in the partial second evaporation zone 111b or the entire second evaporation zone 111b, the average cross-sectional area of the first flow channel 122 is smaller than the average cross-sectional area of the second flow channel 132, and thus vaporized in the first flow channel 122. The bubbles generated by the fluid 13 are relatively dense, and the volume of the bubbles generated by the fluid 13 vaporized in the second flow path 132 is larger than this. The pressure generated by the fluid 13 vaporized in the first flow path 122 is smaller than the size of the air bubble generated by the fluid 13 vaporized in the second flow path 132, and the pressure at the first flow path 122 may be lower than that of the second flow path 122. The pressure at the flow path 132 is large. In other words, there is a pressure difference between the first flow path 122 and the second flow path 132. The pressure difference can drive the gaseous fluid 13 through the first flow path 122 and the second flow path 132 from the second flow path 132. The opening 113 smoothly flows out of the chamber 111, thereby increasing the flow rate of the fluid 13 (including liquid and gaseous) in the circuit formed by the first tubular member 11, the second tubular member 12, and the chamber 111.
另一方面,由於在第一流道122內汽化後的流體13所產生的氣泡較為致密,且第二流道132的截面積例如是大於第一流道122的截面積,因此在第一流道122內汽化後的流體13所產生的氣泡可順利地通過第二流道132,而不會阻塞於其中。在本實施例中,殼體110還具有第一定位部115、第二定位部116以及第三定位部117,其中第一定位部115、第二定位部116以及第三定位部117各別自從殼體110凸出於腔室111中,且並排於腔室111中。相對於流體13的流動方向,第一定位部115、第二定位部116以及第三定位部117呈現橫向的肋條狀,橫跨第一蒸發區111a與第二蒸發區111b。On the other hand, since the bubble generated by the fluid 13 vaporized in the first flow path 122 is relatively dense, and the cross-sectional area of the second flow path 132 is, for example, larger than the cross-sectional area of the first flow path 122, it is in the first flow path 122. The bubbles generated by the vaporized fluid 13 can smoothly pass through the second flow path 132 without being blocked therein. In this embodiment, the housing 110 further has a first positioning portion 115, a second positioning portion 116, and a third positioning portion 117, wherein the first positioning portion 115, the second positioning portion 116, and the third positioning portion 117 are different from each other. The housing 110 protrudes into the chamber 111 and is juxtaposed in the chamber 111. The first positioning portion 115, the second positioning portion 116, and the third positioning portion 117 assume a lateral rib shape with respect to the flow direction of the fluid 13, and straddle the first evaporation zone 111a and the second evaporation zone 111b.
此外,在本實施例中,第一散熱結構120所具有的第一結構件120a、120b較第二散熱結構130所具有的第二結構件130a、130b多,使得第一流道121與122的總截面積小於第二流道131與132的總截面積,第一散熱結構120具有的流阻大於第二散熱結構130具有的流阻,當腔室111內的流體13汽化後會傾向於沿流阻較低的方向流動,而有助於使流體13向第二結構件130a、130b及第二開口113的方向流動。In addition, in the present embodiment, the first heat dissipation structure 120 has the first structural members 120a, 120b more than the second structural members 130a, 130b of the second heat dissipation structure 130, so that the total of the first flow paths 121 and 122 The cross-sectional area is smaller than the total cross-sectional area of the second flow paths 131 and 132. The first heat dissipation structure 120 has a flow resistance greater than that of the second heat dissipation structure 130. When the fluid 13 in the chamber 111 is vaporized, it tends to flow along the flow. Flow in a lower direction helps to flow the fluid 13 in the direction of the second structural members 130a, 130b and the second opening 113.
如圖2與圖3所示,第一定位部115位於第二定位部116與第一開口112之間,第二定位部116位於第一定位部115與第三定位部117之間,且第三定位部117位於第二定位部116與第二開口113之間。第一散熱結構120設置於兩相鄰的第一定位部115與第二定位部116之間,藉由第一定位部115與第二定位部116的定位可提高組裝第一散熱結構120至殼體110的便利性。第二散熱結構130設置於兩相鄰的第二定位部116與第三定位部160之間,藉由第二定位部116與第三定位部160的定位可提高組裝第二散熱結構130至殼體110的便利性。另一方面,位於第一散熱結構120與第二散熱結構130之間的第二定位部116可將兩者分隔開來,藉以提高流體13自第一流道121或122流動至第二流道131或132的流動性,使得在第一流道121與122內汽化後的流體13所產生的氣泡可依最短路徑流入第二流道131或132。As shown in FIG. 2 and FIG. 3 , the first positioning portion 115 is located between the second positioning portion 116 and the first positioning portion 112 , and the second positioning portion 116 is located between the first positioning portion 115 and the third positioning portion 117 . The three positioning portions 117 are located between the second positioning portion 116 and the second opening 113. The first heat dissipation structure 120 is disposed between the two adjacent first positioning portions 115 and the second positioning portion 116. The positioning of the first positioning portion 115 and the second positioning portion 116 can improve the assembly of the first heat dissipation structure 120 to the shell. The convenience of the body 110. The second heat dissipation structure 130 is disposed between the two adjacent second positioning portions 116 and the third positioning portion 160. The positioning of the second positioning portion 116 and the third positioning portion 160 can improve the assembly of the second heat dissipation structure 130 to the shell. The convenience of the body 110. On the other hand, the second positioning portion 116 located between the first heat dissipation structure 120 and the second heat dissipation structure 130 may separate the two, thereby increasing the flow of the fluid 13 from the first flow path 121 or 122 to the second flow path. The fluidity of 131 or 132 causes bubbles generated by the fluid 13 vaporized in the first flow paths 121 and 122 to flow into the second flow path 131 or 132 in the shortest path.
請參考圖1與圖2,在本實施例中,蒸發器100的製作方法包括以下步驟:首先,分別製作殼體110、蓋體140以及第一結構件120與第二結構件130。殼體110例如是利用鍛造、鑄造或切削加工方式製作而成。第一結構件120a、120b與第二結構件130a、130b例如是透過鍛造的方式製作出多個第一結構件120a、120b以及第二結構件130a、130b。接著,使任兩相鄰的第一結構件120a彼此卡合、任兩相鄰的第一結構件120b彼此卡合以及其中一個第一結構件120a卡合於其中一個第一結構件120b以構成具有多個第一流道121與122的第一散熱結構120。相似地,使任兩相鄰的第二結構件130a彼此卡合、任兩相鄰的第二結構件130b彼此卡合以及其中一個第二結構件130a卡合於其中一個第二結構件130b以構成具有多個第二流道131與132的第二散熱結構130。Referring to FIG. 1 and FIG. 2 , in the embodiment, the manufacturing method of the evaporator 100 includes the following steps: First, the housing 110 , the cover 140 , and the first structural member 120 and the second structural member 130 are respectively fabricated. The housing 110 is manufactured, for example, by forging, casting, or cutting. The first structural members 120a, 120b and the second structural members 130a, 130b are, for example, formed into a plurality of first structural members 120a, 120b and second structural members 130a, 130b by forging. Then, any two adjacent first structural members 120a are engaged with each other, any two adjacent first structural members 120b are engaged with each other, and one of the first structural members 120a is engaged with one of the first structural members 120b to constitute A first heat dissipation structure 120 having a plurality of first flow channels 121 and 122. Similarly, any two adjacent second structural members 130a are engaged with each other, any two adjacent second structural members 130b are engaged with each other, and one of the second structural members 130a is engaged with one of the second structural members 130b. A second heat dissipation structure 130 having a plurality of second flow paths 131 and 132 is formed.
接著,組裝第一散熱結構120與第二散熱結構130於腔室111中,並可透過焊接的方式使第一散熱結構120與第二散熱結構130固定於殼體110。詳細而言,第一散熱結構120與第二散熱結構130皆橫跨第一蒸發區111a與第二蒸發區112a。之後,設置蓋體140於殼體110上,並使蓋體140覆蓋腔室111以及位於腔室111內的第一散熱結構120與第二散熱結構130。值得一提的是,在利用錫膏焊接的情形下,在第一散熱結構120與殼體110之間、第二散熱結130構與殼體110之間以及蓋體140與殼體110之間的焊接,可以在組裝完成後經由單一次加熱焊接完成,或者是在蓋體140與殼體110之間進行焊接時,因殼體110受熱而使第一散熱結構120與殼體110之間以及第二散熱結構130與殼體110之間的錫膏一同完成焊接,在加工程序具有優勢。相較於現有的蒸發器的製作方式而言,例如採用蝕刻或以電腦數值控制工具進行加工以形成一體成型於殼體的散熱結構,本實施例的蒸發器100的製作方法不僅能提高產品良率,亦能降低製作成本。Then, the first heat dissipation structure 120 and the second heat dissipation structure 130 are assembled in the chamber 111, and the first heat dissipation structure 120 and the second heat dissipation structure 130 are fixed to the housing 110 by soldering. In detail, the first heat dissipation structure 120 and the second heat dissipation structure 130 both span the first evaporation zone 111a and the second evaporation zone 112a. Thereafter, the cover 140 is disposed on the housing 110, and the cover 140 covers the chamber 111 and the first heat dissipation structure 120 and the second heat dissipation structure 130 located in the chamber 111. It is worth mentioning that in the case of soldering with solder paste, between the first heat dissipation structure 120 and the housing 110, between the second heat dissipation junction 130 and the housing 110, and between the cover 140 and the housing 110 The welding may be completed by a single heating welding after the assembly is completed, or when the welding between the cover 140 and the housing 110 is performed, because the housing 110 is heated to cause the first heat dissipation structure 120 and the housing 110 to be between The second heat dissipation structure 130 and the solder paste between the housings 110 are welded together, which has advantages in the processing procedure. Compared with the existing manufacturing method of the evaporator, for example, by etching or machining with a computer numerical control tool to form a heat dissipation structure integrally formed on the casing, the manufacturing method of the evaporator 100 of the present embodiment can not only improve the product. Rate can also reduce production costs.
在其他實施例中,第一散熱結構的第一結構件與第二散熱結構的第二結構件也可以在鍛造加工製作成型後,不經過彼此卡合的步驟而直接排列組裝於殼體中,以製作完成蒸發器。In other embodiments, the first structural member of the first heat dissipation structure and the second structural member of the second heat dissipation structure may also be directly assembled and assembled in the housing after being forged by the forging process without being engaged with each other. To complete the evaporator.
綜上所述,本新型創作的蒸發器係在殼體的腔室內設置有第一散熱結構與第二散熱結構,且第一散熱結構與第二散熱結構分別具有多個第一流道與第二流道,以供流體通過。如此設置下,有助於提高流體與殼體之間的接觸面積,以提高流體的汽化速率。詳細而言,由於位於第二蒸發區內的第一流道的數量大於位於第二蒸發區內的第二流道的數量,且位於第二蒸發區內的第一流道的截面積小於位於第二蒸發區內的第二流道的的截面積,因此在流體汽化後,位於第二蒸發區內的第一流道所在處與位於第二蒸發區內的第二流道所在處之間存在一壓力差,透過此壓力差可驅動氣態的流體依序經由第一流道與第二流道而自第二開口順暢地流出腔室,進而提高流體於管件與腔室所構成的迴路內的流動速率。In summary, the evaporator of the present invention is provided with a first heat dissipation structure and a second heat dissipation structure in the chamber of the housing, and the first heat dissipation structure and the second heat dissipation structure respectively have a plurality of first flow paths and a second flow path. A flow path for fluid to pass through. This arrangement helps to increase the contact area between the fluid and the housing to increase the vaporization rate of the fluid. In detail, since the number of the first flow channels located in the second evaporation zone is greater than the number of the second flow channels located in the second evaporation zone, and the cross-sectional area of the first flow channel located in the second evaporation zone is smaller than that located in the second a cross-sectional area of the second flow passage in the evaporation zone, so that after the fluid is vaporized, there is a pressure between the first flow passage located in the second evaporation zone and the second flow passage located in the second evaporation zone Poorly, the pressure difference can drive the gaseous fluid to smoothly flow out of the chamber from the second opening through the first flow path and the second flow path, thereby increasing the flow rate of the fluid in the circuit formed by the tube and the chamber.
另一方面,本新型創作的第一散熱結構與第二散熱結構可經由鍛造與卡合等步驟製作而得,接著組裝至殼體內,相較於蝕刻或以電腦數值控制工具進行切削加工以形成一體成型於殼體的散熱結構,本新型創作的蒸發器的製作方法不僅能提高產品良率及生產效率,亦能降低製作成本。On the other hand, the first heat dissipation structure and the second heat dissipation structure created by the present invention can be fabricated through steps such as forging and clamping, and then assembled into a casing, which is formed by etching or cutting with a computer numerical control tool. The heat-dissipating structure integrally formed in the casing, the manufacturing method of the evaporator created by the novel can not only improve product yield and production efficiency, but also reduce production cost.
雖然本新型創作已以實施例揭露如上,然其並非用以限定本新型創作,任何所屬技術領域中具有通常知識者,在不脫離本新型創作的精神和範圍內,當可作些許的更動與潤飾,故本新型創作的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the novel creation, and any person skilled in the art can make some changes without departing from the spirit and scope of the novel creation. Retouching, the scope of protection of this new creation is subject to the definition of the scope of the patent application attached.
10‧‧‧散熱模組
11‧‧‧第一管件
12‧‧‧第二管件
13‧‧‧流體
20‧‧‧熱管
100‧‧‧蒸發器
110‧‧‧殼體
111‧‧‧腔室
111a‧‧‧第一蒸發區
111b‧‧‧第二蒸發區
112‧‧‧第一開口
113‧‧‧第二開口
114‧‧‧承載面
115‧‧‧第一定位部
116‧‧‧第二定位部
117‧‧‧第三定位部
120‧‧‧第一散熱結構
120a、120b‧‧‧第一結構件
121、122‧‧‧第一流道
123‧‧‧第一上表面
130‧‧‧第二散熱結構
130a、130b‧‧‧第二結構件
131、132‧‧‧第二流道
133‧‧‧第二上表面
140‧‧‧蓋體
D1、D2‧‧‧深度10‧‧‧ Thermal Module
11‧‧‧First pipe fittings
12‧‧‧Second pipe fittings
13‧‧‧ Fluid
20‧‧‧heat pipe
100‧‧‧Evaporator
110‧‧‧shell
111‧‧‧ chamber
111a‧‧‧First evaporation zone
111b‧‧‧Second evaporation zone
112‧‧‧ first opening
113‧‧‧ second opening
114‧‧‧ bearing surface
115‧‧‧First Positioning Department
116‧‧‧Second Positioning Department
117‧‧‧ Third Positioning Department
120‧‧‧First heat dissipation structure
120a, 120b‧‧‧ first structural parts
121, 122‧‧‧ first runner
123‧‧‧First upper surface
130‧‧‧Second heat dissipation structure
130a, 130b‧‧‧Second structural parts
131, 132‧‧‧ second runner
133‧‧‧Second upper surface
140‧‧‧ cover
D1, D2‧‧ depth
圖1是本新型創作一實施例的蒸發器的爆炸示意圖。 圖2是圖1的蒸發器與散熱模組的結構示意圖。 圖3是圖2的蒸發器與散熱模組的俯視示意圖。 圖4是圖3沿剖線I-I的剖面示意圖。BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic exploded view of an evaporator of an embodiment of the present invention. 2 is a schematic structural view of the evaporator and the heat dissipation module of FIG. 1. 3 is a top plan view of the evaporator and heat dissipation module of FIG. 2. Figure 4 is a cross-sectional view of Figure 3 taken along line I-I.
10‧‧‧散熱模組 10‧‧‧ Thermal Module
11‧‧‧第一管件 11‧‧‧First pipe fittings
12‧‧‧第二管件 12‧‧‧Second pipe fittings
13‧‧‧流體 13‧‧‧ Fluid
20‧‧‧熱管 20‧‧‧heat pipe
100‧‧‧蒸發器 100‧‧‧Evaporator
110‧‧‧殼體 110‧‧‧shell
111‧‧‧腔室 111‧‧‧ chamber
111a‧‧‧第一蒸發區 111a‧‧‧First evaporation zone
111b‧‧‧第二蒸發區 111b‧‧‧Second evaporation zone
112‧‧‧第一開口 112‧‧‧ first opening
113‧‧‧第二開口 113‧‧‧ second opening
114‧‧‧承載面 114‧‧‧ bearing surface
120‧‧‧第一散熱結構 120‧‧‧First heat dissipation structure
120a、120b‧‧‧第一結構件 120a, 120b‧‧‧ first structural parts
121、122‧‧‧第一流道 121, 122‧‧‧ first runner
123‧‧‧第一上表面 123‧‧‧First upper surface
130‧‧‧第二散熱結構 130‧‧‧Second heat dissipation structure
130a、130b‧‧‧第二結構件 130a, 130b‧‧‧Second structural parts
131、132‧‧‧第二流道 131, 132‧‧‧ second runner
133‧‧‧第二上表面 133‧‧‧Second upper surface
140‧‧‧蓋體 140‧‧‧ cover
D1、D2‧‧‧深度 D1, D2‧‧ depth
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105213532U TWM535456U (en) | 2016-09-02 | 2016-09-02 | Evaporator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW105213532U TWM535456U (en) | 2016-09-02 | 2016-09-02 | Evaporator |
Publications (1)
Publication Number | Publication Date |
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TWM535456U true TWM535456U (en) | 2017-01-11 |
Family
ID=58400016
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW105213532U TWM535456U (en) | 2016-09-02 | 2016-09-02 | Evaporator |
Country Status (1)
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI635248B (en) * | 2016-09-02 | 2018-09-11 | 宏碁股份有限公司 | Evaporator and manufacturing method thereof |
-
2016
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI635248B (en) * | 2016-09-02 | 2018-09-11 | 宏碁股份有限公司 | Evaporator and manufacturing method thereof |
US10563926B2 (en) | 2016-09-02 | 2020-02-18 | Acer Incorporated | Lattice boiler evaporator |
US11402157B2 (en) | 2016-09-02 | 2022-08-02 | Acer Incorporated | Lattice boiler evaporator |
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