TWM531656U - Ultraviolet LED package structure - Google Patents

Description

UV LED package construction

The present invention relates to a package structure of an LED, and more particularly to an ultraviolet LED package structure for packaging an ultraviolet LED chip using a ceramic substrate and a glass convex mirror.

Currently known ultraviolet light (UV) is divided into three wavelength bands of light, UVA is 310-470NM, commonly used in industrial applications, such as UV polishing ink and UV paint, UVA exposure is required to dry and solidify the ink. The UVB is 285-310 NM, which can be applied to a photosensitive resin such as UV nail polish to dry and cure the nail polish by exposing the UVA lamp. The UVC is 250-285NM, and the UVC is a deep purple band, which has a lethal effect on organic biological fungi, even if a small amount of UVC is harmful to the human body.

At present, the structural design of the LED package has been in the stage of mature saturation, from the construction of the early LED copper bracket to the packaging of the SMD (surface mount component), and further to the micro and high power package mode. A large number of packaging materials for the application of mixed materials of copper and engineering plastics are aimed at making LED wafers easier to apply to market end products.

According to the current packaging technology and material statistics, there are mainly the following package structures:

1. Using copper stamping and forming, it is directly bonded to the surface of the copper bracket, and is packaged with epoxy resin.

2, after the use of copper stamping and forming, and then through the in-mold injection molding technology, become a mix The structure of the bracket is subjected to a solid crystal packaging operation, and is packaged using epoxy resin or packaged by using a silicone package.

3. Apply ceramic substrate porcelain as substrate for die bonding operation, and then inject epoxy resin packaging or silicone molding.

4. The glass fiber epoxy resin copper foil substrate (FR-4) and the ceramic substrate are mixed and used as a substrate for solid crystal packaging, and then injected into a resin package.

As shown in FIG. 5, the application of the second package structure described above is a package of an SMD (Surface Mounted Component) LED having a concave cup hole 50 at the center thereof for accommodating an LED chip 51 for solidification and concave. The position of the cup 50 is further filled with the resin 52, and the LED wafer 51 is covered with a resin 52. The structure of the package requires the wire 53 of the wire bonding electrode during packaging, and finally the transparent resin is injected into the concave cavity 50. After the 52 (or silicone) covers the LED chip 51 and is cured, the LED package is completed.

The various packaging methods mentioned above are packages for visible light LEDs. The difference is only in the difference in LED power size. Up to now, there is no packaging material and structure for UV (ultraviolet light). LED.

In addition to copper metal materials, commonly used engineering plastics and epoxy resin or silicone rubber can not be exposed to ultraviolet light, mainly because the raw materials such as epoxy resin or silicone rubber are derived from petrochemical refining and decomposing, which are organic raw materials. The basic components include organic structures of DNA structure (DNA) or ribonucleic acid (RNA). The energy of ultraviolet light, such as the energy of UVC, can easily destroy the valence bond chain of an organism. These engineering plastics, after being exposed to strong ultraviolet light, are destroyed by valence bonds. The breakage of the valence bond chain causes the material to yellow, which affects the optical effect.

Therefore, materials such as epoxy or silicone which are commonly used for packaging LEDs cannot be used as packaging materials for ultraviolet LED chips, and cannot be directly penetrated by ultraviolet light, which also causes The packaging difficulty of the ultraviolet LED chip makes the packaging cost high, and a better mechanism is needed to improve the ultraviolet LED chip to be packaged smoothly.

In order to overcome the problem that the materials used in the existing LED package suffer from ultraviolet light damage and yellowing affects the optical effect, it is necessary to redesign a new packaging mechanism to avoid coating the packaged ultraviolet LED chip with a petrochemical-based material such as a resin or a silicone.

In order to achieve the above creation, the present invention uses different substrate and lens structures for packaging, and provides an ultraviolet LED package structure, the structure comprising: a ceramic substrate, and two sides are formed in the upper and lower directions on opposite sides of the ceramic substrate. a through hole is formed in each of the two through holes, and two bottom electrodes are formed on opposite sides of the bottom surface of the ceramic substrate. The bottom ends of the two through hole electrodes are electrically connected to the bottom electrodes, and are further on the top surface of the ceramic substrate. On the opposite sides, two top electrodes are formed, and the top ends of the two through-hole electrodes are electrically connected to the two top electrodes; an ultraviolet LED chip is fixed in a flip-chip form on the top surface of the ceramic substrate, two through holes The electrode is electrically connected to the ultraviolet LED chip through the two top electrodes; and a lens structure is provided with a sheet portion, and an adhesive surface is formed on the bottom surface of the sheet portion, and the bonding surface is adhered to the top surface of the ceramic substrate, Forming a concave cup hole in the sheet portion, the ultraviolet LED chip is received in the concave cup hole, and a glass lens is disposed on the sheet portion, the ultraviolet light LED crystal UV light may be emitted outward through the glass lens output.

Further, the sheet portion of the present invention is a ceramic sheet body, and the concave cup hole is a through hole extending in the up and down direction, and the glass lens is adhered to the top surface of the sheet portion and shields the top of the concave cup hole. The top surface of the ultraviolet LED chip is attached to the bottom surface of the glass lens.

Furthermore, the ultraviolet LED chip of the present invention is provided with a sapphire sheet on the top thereof, the sapphire sheet being located above and attached to the bottom surface of the glass lens.

Preferably, the glass lens of the present invention is a convex lens of a glass or a glass lens of a flat shape.

Preferably, the ultraviolet LED chip of the present invention is a UVC ultraviolet LED chip.

The novel uses a ceramic substrate as a substrate. Since the ceramic substrate of alumina is a mineral, it needs to be sintered at a high temperature of 1500 degrees, and is not afraid of strong acid, salty and the like, thereby providing a basis for the ceramic substrate to have a rigid structure. When the present invention conducts the bottom electrode on both sides of the bottom, the ultraviolet LED chip emits ultraviolet light, and the light passes through the glass lens to achieve good ultraviolet light emission, and since the ultraviolet light LED chip is a ceramic substrate, A non-organic structure such as a lens structure, and a glass lens through which ultraviolet light directly passes is a glass that is not damaged by ultraviolet light. Therefore, the present invention does not have a problem that the package structure is damaged by ultraviolet rays and yellowing to affect the optical effect.

In addition to the above-mentioned effects of not being damaged by ultraviolet rays, the ultraviolet light LED chip of the present invention is flip-chip bonded to the surface of the ceramic substrate, so that the sapphire sheet at the bottom of the ultraviolet LED chip is oriented upward. On the one hand, it is easy to connect the top electrode, and on the other hand, the P-type N-type semiconductor layer is close to the ceramic substrate, so that the temperature of the P-type N-type semiconductor layer can be easily evaporated to the ceramic substrate, and the heat dissipation effect is good, and the use of the ultraviolet LED chip can be prolonged. life.

The present invention further sets the sapphire sheet of the ultraviolet LED chip to be placed on the bottom surface of the glass lens. Since the refractive index of the sapphire is 1.41% and the refractive index of the air is 1.0%, if the ultraviolet light directly emits light into the air, Instantly attenuates 40% of the power, for example, UVC is absorbed by ozone or air, reducing the ability to penetrate, but the refractive index of the glass is 1.4%, which is equal to sapphire, so use glass The glass lens directly guides the ultraviolet light emitted by the ultraviolet LED chip on the mechanism, and can achieve the effect of avoiding the ultraviolet light being internally attenuated and guiding the ultraviolet light.

10‧‧‧Ceramic substrate

11‧‧‧through holes

111‧‧‧through hole electrode

12‧‧‧ bottom electrode

20‧‧‧UV LED chip

21‧‧‧Sapphire tablets

211‧‧‧P type N-type semiconductor layer

22‧‧‧Top electrode

30‧‧‧ lens construction

31‧‧‧Face

311‧‧‧Adhesive surface

32‧‧‧ concave cup

33‧‧‧glass lens

A‧‧‧矽 glue layer

50‧‧‧ concave cup

51‧‧‧LED chip

52‧‧‧Resin

53‧‧‧Top electrode

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is an exploded plan view showing a first preferred embodiment of the present invention.

Figure 2 is a plan view showing the combination of the first preferred embodiment of the present invention.

Figure 3 is a plan view showing the first preferred embodiment of the present invention in a bottom view.

Figure 4 is a plan view showing the combination of the second preferred embodiment of the present invention.

Figure 5 is a schematic illustration of a prior art package construction.

In order to understand the technical features and practical effects of the present invention in detail, it can be implemented in accordance with the contents of the specification, and further described in detail with reference to the preferred embodiments shown in the drawings.

As shown in the first preferred embodiment of FIG. 1 to FIG. 3, the present invention provides an ultraviolet LED package structure, the configuration of which includes:

A ceramic substrate 10 is a rectangular ceramic sheet body. On the left and right sides of the ceramic substrate 10, two through holes 11 are burned in the vertical direction in a laser processing manner, and conductive silver paste is filled in the two through holes 11. The bottom electrode 12 is formed on the left and right sides of the bottom surface of the ceramic substrate 10, and the bottom electrodes 12 are each a sheet metal structure. The bottom ends of the two through hole electrodes 111 are electrically connected to the bottom electrodes 12 Two top electrodes 22 are formed on the left and right sides of the top surface of the ceramic substrate 10. The top electrodes 22 are each a sheet metal structure, and the top ends of the two through hole electrodes 111 are electrically connected to the top electrodes 22.

An ultraviolet LED chip 20, such as the preferred embodiment, is a UVC LED chip 20 comprising a sapphire sheet 21 and a P-type N-type semiconductor layer 211 formed on the sapphire sheet 21, The ultraviolet LED chip 20 is crystallized in a flip-chip manner in the middle of the top surface of the ceramic substrate 10 such that the sapphire sheet 21 is located above and the P-type N-type semiconductor layer 211 is located below, and the two through-hole electrodes 111 are transmitted through the two top electrodes 22 It is electrically connected to the ultraviolet LED chip 20.

A lens structure 30 is provided with a rectangular portion 31 having a contour contour conforming to the contour of the periphery of the top surface of the ceramic substrate 10. In the preferred embodiment, the sheet portion 31 is a ceramic sheet, and the sheet portion is in the sheet portion. The bottom surface of the 31 is formed with an adhesive surface 311, and the adhesive surface 311 is adhered and bonded to the top surface of the ceramic substrate 10 by a silicone layer A. The shape of the ultraviolet LED chip 20 is matched with the shape of the ultraviolet LED chip 20 in the middle of the sheet portion 31. In the middle of the sheet portion 31, a concave cup 32 is formed in the middle of the sheet portion 31. The concave cup 32 is sized to accommodate only one ultraviolet LED chip 20. The ultraviolet LED chip 20 is 20 It is accommodated in the concave cup hole 32.

A glass lens 33 is bonded to the top surface of the sheet portion 31 by another silicone layer A. The glass lens 33 is a convex lens of glass, and the glass lens 33 shields the top end of the concave cup 32. The ultraviolet LED chip The sapphire sheet 21 above the 20 is attached to the bottom surface of the glass lens 33, so that the ultraviolet light from the ultraviolet LED chip 20 can be collected through the glass lens 33 into a beam output. When the silicone layer A described above is irradiated with ultraviolet rays, it may be yellowed but does not lose its viscosity. Therefore, the glass lens 33 can be satisfactorily fixed to the sheet portion 31.

When the present invention is used, as shown in the first preferred embodiment of FIG. 1 to FIG. 3, the two bottom electrodes 12 at the bottom of the ceramic substrate 10 are connected to a power source, and a power source is input to the ultraviolet LED chip 20 to make the ultraviolet light. The LED wafer 20 emits ultraviolet light, and then the ultraviolet light passes through the glass lens 33 of the lens configuration 30 to concentrate the light beam.

The ultraviolet LED chip 20 of the present invention is a solid crystal on the ceramic substrate 10, and the ceramic substrate 10 has the characteristics of being hard and not afraid of strong acid, salty and the like, thereby providing a solid foundation for the solid crystal of the ultraviolet LED chip 20. Since the lens structure 30 of the packaged ultraviolet LED chip 20 is an inorganic structure of glass-bonded ceramic, when the ultraviolet light penetrates the glass lens 33, the glass lens 33 is not damaged by ultraviolet light and is not yellowed, and can be provided without being The UV-destroyed packaging structure allows the construction of this new type of technology material element to effectively transform the current daily necessities and household electrical appliances, create the electrical equipment application products that humans need, and improve the purification of air and drinking water. It is threatened by the infection of viruses and bacteria to create a clean living environment.

In addition, since the ultraviolet LED chip 20 is crystallized in a flip-chip manner, the sapphire sheet 21 faces upward and the P-type N-type semiconductor layer 211 faces downward, such a configuration that the sapphire sheet 21 can contact the bottom surface of the glass lens 33 when ultraviolet When the light LED chip 20 emits light, the ultraviolet light does not pass through the air, so the emitted ultraviolet light is not attenuated inside the novel, and the heat generated by the P-type N-type semiconductor layer 211 can conduct heat through the ceramic substrate 10 to enhance the ultraviolet light. The heat dissipation performance of the light LED chip 20 extends the service life of the present invention.

In addition to the foregoing first preferred embodiment, the glass lens 33 adhered to the sheet portion 31 is set as a convex lens of glass. As shown in the second preferred embodiment of FIG. 4, it may be bonded to The glass lens 33 on the sheet portion 31 is changed to a flat glass lens, and the sapphire sheet 21 above the ultraviolet LED chip 20 is also attached to the bottom surface of the glass lens 33, and the ultraviolet LED chip 20 is allowed to be attached. The emitted ultraviolet light can be directly radiated directly through the glass lens 33, and the glass lens 33 also has an advantage of being unaffected by ultraviolet light and not yellowing to affect the optical effect.

In addition to the above two preferred embodiments, the sheet portion 31 is made of a ceramic sheet body, and the sheet portion 31 can be changed to a glass sheet integrally formed with the glass lens 33. The recess 31 itself is permeable to light, so that the recessed pocket 32 formed in the sheet portion 31 may not be a through hole as long as a groove is formed which enables the top surface of the ultraviolet LED chip 20 to abut against the top surface of the recessed cup 32. Just fine.

The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. All other equivalent changes or modifications which are not departing from the spirit of the present invention are included in the present invention. Within the scope of the patent application.

10‧‧‧Ceramic substrate

11‧‧‧through holes

111‧‧‧through hole electrode

12‧‧‧ bottom electrode

20‧‧‧UV LED chip

21‧‧‧Sapphire tablets

211‧‧‧P type N-type semiconductor layer

22‧‧‧Top electrode

30‧‧‧ lens construction

31‧‧‧Face

311‧‧‧Adhesive surface

32‧‧‧ concave cup

33‧‧‧glass lens

Claims (5)

An ultraviolet LED package structure comprising: a ceramic substrate, two through holes are formed in the upper and lower sides on opposite sides of the ceramic substrate, and the perforated electrodes are respectively formed in the two through holes, on opposite sides of the bottom surface of the ceramic substrate Forming two bottom electrodes, the bottom ends of the two through-hole electrodes are electrically connected to the two bottom electrodes, and two top electrodes are formed on opposite sides of the top surface of the ceramic substrate, and the top ends of the two through-hole electrodes are electrically connected to the two top electrodes; An LED chip that is crystallized on the top surface of the ceramic substrate in a flip-chip form, two through-hole electrodes are electrically connected to the ultraviolet LED chip through the two top electrodes; and a lens structure is provided with a sheet shape And forming an adhesive surface on the bottom surface of the sheet portion, the adhesive surface is fixed on the top surface of the ceramic substrate, and a concave cup hole is formed in the sheet portion, and the ultraviolet LED chip is received in the concave cup hole. A glass lens is disposed on the sheet portion, and ultraviolet light emitted from the ultraviolet LED chip can be outputted outward through the glass lens. The ultraviolet LED package structure of claim 1, wherein the sheet portion is a ceramic sheet body, the concave cup hole is a through hole extending in an up and down direction, and the glass lens is adhered to a top surface of the sheet portion and The top end of the concave cup is shielded, and the top surface of the ultraviolet LED chip is attached to the bottom surface of the glass lens. The ultraviolet LED package construction of claim 2, wherein the ultraviolet LED chip is provided on top of a sapphire sheet, the sapphire sheet being positioned above and attached to a bottom surface of the glass lens. An ultraviolet LED package construction according to claim 1 or 2 or 3, wherein the glass lens is a convex lens or a flat glass lens of glass. The ultraviolet LED package construction of claim 4, wherein the ultraviolet LED chip is a UVC ultraviolet LED chip.