TWM528513U - Chemical vapor deposition or epitaxial layer growth reactor and substrate tray and support shaft - Google Patents

Chemical vapor deposition or epitaxial layer growth reactor and substrate tray and support shaft Download PDF

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Publication number
TWM528513U
TWM528513U TW105206291U TW105206291U TWM528513U TW M528513 U TWM528513 U TW M528513U TW 105206291 U TW105206291 U TW 105206291U TW 105206291 U TW105206291 U TW 105206291U TW M528513 U TWM528513 U TW M528513U
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Taiwan
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support
substrate tray
main shaft
support shaft
outer side
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TW105206291U
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Chinese (zh)
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Yong Jiang
zhen-yu Zheng
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Advanced Micro Fab Equip Inc
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化學氣相沉積或外延層生長反應器及其基片托盤和支撐軸Chemical vapor deposition or epitaxial growth reactor and its substrate tray and support shaft

本創作涉及製造半導體器件,尤其涉及一種在諸如基片等基板上生長外延層或進行化學氣相沉積的裝置。The present invention relates to the manufacture of semiconductor devices, and more particularly to a device for growing an epitaxial layer or performing chemical vapor deposition on a substrate such as a substrate.

在諸如基片等基板上生長外延層或進行化學氣相沉積的生產過程中,反應器的設計十分關鍵。習知技術中,反應器有各種各樣的設計,包括:水平式反應器,該反應器中,基片被安裝成與流入的反應氣體成一定角度;行星式旋轉的水平式反應器,該反應器中,反應氣體水平藉由基片;以及垂直式反應器,該反應器中,當反應氣體向下注入到基片上時,基片被放置在反應腔內的基片托盤上並以相對較高的速度旋轉。該種高速旋轉的垂直式反應器為商業上最重要的MOCVD反應器之一。The design of the reactor is critical in the production of epitaxial layers or chemical vapor deposition on substrates such as substrates. In the prior art, the reactor has various designs including: a horizontal reactor in which the substrate is installed at an angle to the inflowing reaction gas; a planetary rotating horizontal reactor, In the reactor, the reaction gas level is through a substrate; and a vertical reactor in which, when the reaction gas is injected down onto the substrate, the substrate is placed on the substrate tray in the reaction chamber and is relatively Rotation at a higher speed. This high speed rotating vertical reactor is one of the most commercially important MOCVD reactors.

例如,發明名稱為“通過化學汽相沉積在基片上生長外延層的無基座式反應器”的中國發明專利(中國專利號:01822507.1)提出了一種無基座式反應器,如第1圖所示,其包括反應腔、可旋轉主軸400、用於加熱基片的加熱裝置140以及用來支撐基片的基片托盤300。主軸400包括頂面481和主軸壁482,基片托盤300包括一中心凹進部分390。在將基片托盤300安裝到主軸400時,主軸400被插入中心凹進部分390內,直到主軸壁482和凹進部分390的壁之間緊密配合,產生將基片托盤300保持在沉積位置的摩擦力,亦即,基片托盤300藉由摩擦力保持在主軸400的頂端上,並被帶動與主軸400一起旋轉。For example, the Chinese invention patent (Chinese Patent No.: 01822507.1) entitled "The pedestal-free reactor for growing an epitaxial layer on a substrate by chemical vapor deposition" proposes a pedestal-free reactor, as shown in FIG. Shown, it includes a reaction chamber, a rotatable spindle 400, a heating device 140 for heating the substrate, and a substrate tray 300 for supporting the substrate. The spindle 400 includes a top surface 481 and a spindle wall 482, and the substrate tray 300 includes a central recessed portion 390. When the substrate tray 300 is mounted to the spindle 400, the spindle 400 is inserted into the central recessed portion 390 until a tight fit between the spindle wall 482 and the wall of the recessed portion 390 creates a retention of the substrate tray 300 in the deposition position. The frictional force, that is, the substrate tray 300 is held on the top end of the spindle 400 by friction and is driven to rotate together with the spindle 400.

然而,在實際製程過程中,前述反應器僅僅藉由摩擦力很難(例如:因摩擦力不足而產生打滑)將基片托盤300保持在高速旋轉的主軸400上並使二者一起旋轉,若藉由額外設置的保持裝置解決此不足則會增加系統的複雜程度;此外,由於主軸400直徑的局限,在沉積過程中很難保證基片托盤300始終保持平衡,倘若基片托盤300在沉積過程中重心失去平衡,發生搖擺,使得得到的基片外延層生長不均勻;再者,由於主軸壁482和凹進部分390的壁之間緊密配合,在基片加工過程中,通常為高溫環境,主軸400會產生熱膨脹,且主軸400的熱膨脹係數高於基片托盤300的熱膨脹係數,凹進部分390將會因主軸400的熱膨脹而被撐壞,最終導致整個基片托盤300裂開;最後,在沉積過程中,主軸400的旋轉速度與基片托盤300的轉速通常不一致,二者有一定的偏差,這使得不能準確測量反應器內基片的位置,進而不能準確測量基片的溫度和進一步地控制基片的溫度。However, in the actual process, the foregoing reactor is hard to be held by the frictional force only (for example, slip due to insufficient friction) to hold the substrate tray 300 on the spindle 400 rotating at a high speed and rotate the two together. Resolving this deficiency by an additionally provided holding device increases the complexity of the system; in addition, due to the limitation of the diameter of the main shaft 400, it is difficult to ensure that the substrate tray 300 is always balanced during the deposition process, provided that the substrate tray 300 is in the deposition process. The center of gravity loses balance and sways, resulting in uneven growth of the resulting substrate epitaxial layer; further, due to the close fit between the main wall 482 and the wall of the recessed portion 390, the substrate is usually processed in a high temperature environment. The main shaft 400 generates thermal expansion, and the thermal expansion coefficient of the main shaft 400 is higher than the thermal expansion coefficient of the substrate tray 300, and the recessed portion 390 will be broken due to thermal expansion of the main shaft 400, eventually causing the entire substrate tray 300 to be cracked; During the deposition process, the rotational speed of the spindle 400 is generally inconsistent with the rotational speed of the substrate tray 300, and there is a certain deviation between the two, which makes it impossible to be accurate. The amount of the position of the substrate of the reactor, and thus can not accurately measure the temperature of the substrate and a further control temperature of the substrate.

在基板上生長外延層或進行化學氣相沉積的製程過程中,基片托盤的溫度是一個至關重要的參數,其決定了在基板上生長外延層或化學沉積的均勻性,由於基片托盤的面積較大,不同區域基片托盤的溫度不同會造成製程的不均勻性,達不到生產製程的合格率要求,因此,調節不同區域基片托盤的溫度均勻性是控制上述製程結果均勻與否的一個重要因素。The substrate tray temperature is a critical parameter in the process of growing epitaxial layers or chemical vapor deposition on a substrate, which determines the uniformity of epitaxial layers or chemical deposition on the substrate, due to the substrate tray. The area of the substrate tray is different, and the temperature of the substrate tray in different regions may cause unevenness of the process, which does not meet the qualification requirements of the production process. Therefore, adjusting the temperature uniformity of the substrate trays in different regions is to control the uniformity of the above process results. No important factor.

本創作的目的在於提供一種化學氣相沉積或外延層生長反應器及位於反應器內的基片托盤及其支撐軸,基片托盤在基片加工過程中能夠在支撐軸的支撐下實現平衡、可靠地旋轉,並且基片托盤不會因支撐軸受熱膨脹而被撐壞,同時,本創作的支撐軸能減少基片托盤中心區域的熱量沿著支撐軸向下傳導,提高基片托盤中心區域和邊緣區域的溫度均勻性。The purpose of the present invention is to provide a chemical vapor deposition or epitaxial growth reactor and a substrate tray located in the reactor and a support shaft thereof, and the substrate tray can be balanced under the support of the support shaft during the processing of the substrate, Reliably rotating, and the substrate tray is not broken by the thermal expansion of the support shaft. At the same time, the support shaft of the present invention can reduce the heat in the central area of the substrate tray and conduct along the support axial direction, thereby improving the central area of the substrate tray and Temperature uniformity in the edge region.

具體的,本創作公開了一種用於化學氣相沉積或外延層生長反應器內的支撐軸,用以支撐基片托盤並帶動其旋轉,支撐軸包括:Specifically, the present invention discloses a support shaft for use in a chemical vapor deposition or epitaxial growth reactor for supporting a substrate tray and causing it to rotate. The support shaft includes:

主軸部;Spindle section

與主軸部的一端相連接、並沿主軸部週邊向外延伸開來的支撐部,支撐部包括一延展面;以及a support portion connected to one end of the main shaft portion and extending outwardly along the periphery of the main shaft portion, the support portion including an extension surface;

與主軸部相連接、並沿著延展面向與主軸部反方向延伸一高度的插接部;a plug portion connected to the main shaft portion and extending a height in a direction opposite to the main shaft portion along the extending surface;

延展面上方環繞插接部設置一個或多個支撐台,支撐台包括支撐面用以支撐基片托盤,支撐面高於延展面一段距離。One or more support platforms are disposed around the extension surface around the extension surface, and the support table includes a support surface for supporting the substrate tray, and the support surface is higher than the extension surface.

較佳地,插接部包括一頂表面和一外側面,外側面包括第一外側面和第二外側面,其中第一外側面垂直設置於延展面上方,第二外側面設置為自第一外側面向頂表面傾斜的弧面。Preferably, the insertion portion includes a top surface and an outer side surface, the outer side surface includes a first outer side surface and a second outer side surface, wherein the first outer side surface is vertically disposed above the extension surface, and the second outer side surface is disposed from the first The outer side faces the curved surface of the top surface.

較佳地,插接部位於延展面的中心區域,形狀為非圓柱形。Preferably, the insertion portion is located in a central region of the extension surface and is non-cylindrical in shape.

較佳地,第一外側面包括一組相互平行的平面及一組向相反方向突起的弧面。Preferably, the first outer side surface includes a plurality of mutually parallel planes and a plurality of arcuate surfaces that protrude in opposite directions.

較佳地,支撐台為環繞插接部設置的圓環狀結構,圓環狀支撐台為連續或斷續結構。Preferably, the support table is an annular structure provided around the insertion portion, and the annular support table is a continuous or intermittent structure.

較佳地,支撐台為環繞插接部設置的若干凸起。Preferably, the support table is a plurality of protrusions disposed around the insertion portion.

較佳地,支撐台的高度小於插接部高度。Preferably, the height of the support table is less than the height of the plug portion.

較佳地,主軸部包括與支撐部連接的第一主軸部和與第一主軸部另一端連接的第二主軸部,第一主軸部的直徑小於第二主軸部的直徑。Preferably, the main shaft portion includes a first main shaft portion coupled to the support portion and a second main shaft portion coupled to the other end of the first main shaft portion, the diameter of the first main shaft portion being smaller than the diameter of the second main shaft portion.

較佳地,支撐軸設置有機械安裝孔,機械安裝孔在插接部的頂表面上設有開口,並沿著主軸部的方向延伸一定深度。Preferably, the support shaft is provided with a mechanical mounting hole, and the mechanical mounting hole is provided with an opening on the top surface of the insertion portion and extends to a certain depth in the direction of the main shaft portion.

進一步的,本創作公開了一種與上述支撐軸匹配的基片托盤,基片托盤包括一第一表面和一第二表面,第一表面上用於放置若干待處理的基片,第二表面的中心位置設置有一個向內凹陷的凹進部,凹進部在基片托盤內部形成一頂表面,凹進部的頂表面形狀為非圓形,凹進部用於容納支撐軸的插接部,第二表面至少部分與支撐台的支撐面接觸。Further, the present invention discloses a substrate tray matched with the support shaft, the substrate tray including a first surface and a second surface, the first surface for placing a plurality of substrates to be processed, and the second surface The central position is provided with an inwardly recessed recess, the recess forming a top surface inside the substrate tray, the top surface of the recess is non-circular, and the recess is for receiving the plug of the support shaft The second surface is at least partially in contact with the support surface of the support table.

較佳地,凹進部的凹進深度與基片托盤的厚度比例範圍為1/2至3/4。Preferably, the ratio of the recess depth of the recess to the thickness of the substrate tray ranges from 1/2 to 3/4.

較佳地,基片托盤週邊設置一臺階,臺階用於容納機械手臂,便於取放基片托盤。Preferably, a step is arranged around the substrate tray, and the step is for accommodating the robot arm for conveniently accessing the substrate tray.

進一步的,本創作公開了一種化學氣相沉積或外延層生長反應器,反應器內包括一基片托盤及其支撐軸,支撐軸用以支撐基片托盤並帶動其旋轉,支撐軸包括:Further, the present invention discloses a chemical vapor deposition or epitaxial growth reactor comprising a substrate tray and a support shaft therein for supporting the substrate tray and rotating the support shaft, the support shaft comprising:

主軸部;Spindle section

與主軸部的一端相連接、並沿主軸部週邊向外延伸開來的支撐部,支撐部包括一延展面;以及a support portion connected to one end of the main shaft portion and extending outwardly along the periphery of the main shaft portion, the support portion including an extension surface;

與主軸部相連接、並沿著延展面向與主軸部反方向延伸一高度的插接部;a plug portion connected to the main shaft portion and extending a height in a direction opposite to the main shaft portion along the extending surface;

延展面上方環繞插接部設置一個或多個支撐台,支撐台包括支撐面用以支撐基片托盤,支撐面高於延展面一段距離;One or more support platforms are disposed around the extension surface of the extension surface, and the support platform includes a support surface for supporting the substrate tray, and the support surface is higher than the extension surface;

基片托盤包括一第一表面和一第二表面,第一表面上用於放置若干待處理的基片,第二表面的中心位置設置有一個向內凹陷的凹進部,凹進部在基片托盤內部形成一頂表面,凹進部的頂表面形狀為非圓形,凹進部用於容納支撐軸的插接部,第二表面至少部分與支撐台的支撐面接觸。The substrate tray includes a first surface for placing a plurality of substrates to be processed, and a second surface having a recessed portion recessed inwardly, the recessed portion being at the base A top surface is formed inside the sheet tray, and the top surface of the recess is non-circular in shape, the recess is for receiving the insertion portion of the support shaft, and the second surface is at least partially in contact with the support surface of the support table.

進一步的,本創作還公開了一種用於化學氣相沉積或外延層生長反應器內的支撐軸,用以支撐基片托盤並帶動其旋轉,其特徵在於:支撐軸包括:Further, the present invention also discloses a support shaft for use in a chemical vapor deposition or epitaxial growth reactor for supporting a substrate tray and driving the rotation thereof, wherein the support shaft comprises:

主軸部;Spindle section

與主軸部的一端相連接、並沿主軸部週邊向外延伸開來的支撐部,支撐部包括一支撐面;a support portion connected to one end of the main shaft portion and extending outwardly along the periphery of the main shaft portion, the support portion including a support surface;

與主軸部相連接、並沿著支撐面中心區域向與主軸部反方向延伸一高度的插接部;a plug portion connected to the main shaft portion and extending to a height in a direction opposite to the main shaft portion along a central portion of the support surface;

支撐面上設置一個或多個向下凹陷的隔熱管道。One or more insulated pipes that are recessed downward are disposed on the support surface.

較佳地,隔熱管道為環繞插接部設置的環狀結構,環狀結構為連續或斷續設置。Preferably, the insulated pipe is an annular structure disposed around the plug portion, and the annular structure is continuously or intermittently disposed.

較佳地,隔熱管道為若干個不連續的凹陷結構。Preferably, the insulated pipe is a plurality of discrete recessed structures.

較佳地,若干個不連續隔熱管道貫穿支撐部設置。Preferably, a plurality of discrete insulated pipes are disposed through the support.

本創作所提供的反應器及其支撐軸具有諸多優點:首先,整個基片托盤在被放置於支撐軸上後及在基片加工過程中不會因重心不穩而左右搖擺,使得支撐軸能帶動基片托盤平穩地同步轉動;此外,基片托盤的旋轉是藉由插接部在水平表面方向上的作用力(推動力或抵靠作用)來實現的,因而不會出現如習知技術中二者出現“摩擦打滑”的現象;再者,插接部和凹進部在連接配合後,由於二者之間允許存在一定的間隙,該間隙允許插接部在高溫的加工製程環境下熱膨脹,不會出現習知技術中二者因摩擦配合而導致熱膨脹,最終使基片托盤因受熱而被膨脹的插接部撐壞的問題。本創作在支撐部的支撐面上設置向下凹陷的隔熱管道,或者設置支撐部的延展面低於支撐台的支撐面,使得支撐軸上除了提供必要的支撐作用外,儘量減少支撐面與基片托盤的接觸面積,從而避免基片托盤與支撐軸接觸的中心區域的熱量在接觸過程中過多地向支撐軸傳遞,降低基片托盤中心區域的熱量損失,減少基片托盤的中心區域與其他區域的溫度差,實現基片加工的均勻性。最後,本創作的設置還有利於在基片加工過程中即時地、原位地測量位於封閉反應腔內基片的具體位置和基片的溫度。The reactor and its support shaft provided by the present invention have many advantages: first, the entire substrate tray is not swayed by the center of gravity after being placed on the support shaft and during the processing of the substrate, so that the support shaft can The substrate tray is driven to rotate smoothly and synchronously; in addition, the rotation of the substrate tray is achieved by the force (pushing force or abutting action) of the insertion portion in the horizontal surface direction, so that the prior art does not occur. In the middle, there is a phenomenon of “friction and slip”; in addition, after the joint and the recess are connected, a gap is allowed between the two, which allows the plug to be in a high-temperature processing environment. The thermal expansion does not cause the problem of thermal expansion caused by frictional fit between the two in the prior art, and eventually the insertion of the substrate tray by the expansion of the substrate tray due to heat. The creation is provided with a downwardly recessed heat insulating pipe on the support surface of the support portion, or the extension surface of the support portion is lower than the support surface of the support table, so that the support shaft not only provides the necessary supporting effect, but also minimizes the support surface and The contact area of the substrate tray, thereby preventing the heat of the central region of the substrate tray contacting the support shaft from being excessively transmitted to the support shaft during the contact, reducing heat loss in the central region of the substrate tray, and reducing the central area of the substrate tray and The temperature difference in other areas enables uniformity of substrate processing. Finally, the present setup also facilitates the immediate, in situ measurement of the specific location of the substrate within the closed reaction chamber and the temperature of the substrate during substrate processing.

如第2圖所示,第2圖示出根據本創作實施方式所提供的一種反應器的前視橫載面示意圖。反應器可以用於化學氣相沉積或外延層生長,但應當理解,其並不限於此類應用。反應器包括反應腔10,反應腔10內設置至少一個基片托盤200和用於支撐基片托盤200的支撐軸100。反應腔10的側壁上設置有一供基片托盤200傳輸進出的傳輸口P。基片托盤200包括大體平行的第一表面201和第二表面202。其中第一表面201上用於放置若干被處理加工的基片。基片托盤200的第二表面202上設置有向內凹陷的凹進部210。第2圖顯示,基片托盤200邊緣設置一圈臺階205,即基片托盤200第一表面201的直徑大於第二表面202的直徑,該臺階205的設置目的是,在將基片托盤200自傳輸口P移入移出時,臺階205可以容納機械手(圖中未示出),機械手藉由臺階205(支撐台)實現對基片托盤的抬起和移動。As shown in Fig. 2, Fig. 2 is a schematic view showing a front cross-sectional surface of a reactor according to the present embodiment. The reactor can be used for chemical vapor deposition or epitaxial layer growth, but it should be understood that it is not limited to such applications. The reactor includes a reaction chamber 10 in which at least one substrate tray 200 and a support shaft 100 for supporting the substrate tray 200 are disposed. A side wall of the reaction chamber 10 is provided with a transfer port P for the substrate tray 200 to be transported in and out. The substrate tray 200 includes a first surface 201 and a second surface 202 that are substantially parallel. The first surface 201 is used to place a plurality of processed substrates. The second surface 202 of the substrate tray 200 is provided with a recess 210 that is recessed inward. 2 shows that the edge of the substrate tray 200 is provided with a step 205, that is, the diameter of the first surface 201 of the substrate tray 200 is larger than the diameter of the second surface 202. The step 205 is provided for the purpose of the substrate tray 200. When the transfer port P is moved in and out, the step 205 can accommodate a robot (not shown), and the robot can lift and move the substrate tray by the step 205 (support table).

通常,在反應腔10進行基片製程處理之前,基片托盤200位於反應腔10之外,基片托盤200上會事先放置好若干待處理的基片。然後,基片托盤200會藉由傳輸口P被機械手或其他方式傳送到反應腔10內,再被可分離地放置在支撐軸100上,並且由支撐軸100支撐住,從而準備進入基片製程處理狀態。在接下來的基片製程處理過程中,基片托盤200一直由支撐軸100支撐。支撐軸100還與一旋轉機構M連接,旋轉機構M包括一電機,在製程過程中,旋轉機構M帶動支撐軸100旋轉,支撐軸100再帶動或驅動基片托盤200旋轉。在基片製程處理結束後,停止旋轉機構M的旋轉,使支撐軸100和基片托盤200不再旋轉,藉由機械手或其他方式使基片托盤200從支撐軸100上脫離開,再藉由傳輸口P被送出至反應腔10外。Generally, before the substrate 10 is subjected to the substrate processing, the substrate tray 200 is placed outside the reaction chamber 10, and a plurality of substrates to be processed are placed in advance on the substrate tray 200. Then, the substrate tray 200 is transferred into the reaction chamber 10 by the robot or other means through the transfer port P, and is detachably placed on the support shaft 100, and supported by the support shaft 100, thereby preparing to enter the substrate. Process status. The substrate tray 200 is always supported by the support shaft 100 during the subsequent substrate process. The support shaft 100 is also coupled to a rotating mechanism M. The rotating mechanism M includes a motor. During the manufacturing process, the rotating mechanism M drives the support shaft 100 to rotate, and the support shaft 100 drives or drives the substrate tray 200 to rotate. After the substrate processing is finished, the rotation of the rotating mechanism M is stopped, so that the support shaft 100 and the substrate tray 200 are no longer rotated, and the substrate tray 200 is detached from the support shaft 100 by a robot or the like, and then borrowed. It is sent out of the reaction chamber 10 by the transfer port P.

結合參考第3A圖和第3B圖,第3A圖示出一種基片托盤的第一表面立體示意圖,基片托盤200大致呈一圓盤形,其示例性地示出在第一表面201上設置若干個用於放置被加工基片的槽或窪坑220,槽或窪坑220內放置待處理基片,以避免基片在處理過程中脫離基片托盤。槽或窪坑220的尺寸和分佈形式可以有多種形式的變換,根據具體製程需要處理的基片的尺寸進行設計分佈,在此不一一繪圖展示。第3B圖示出基片托盤的第二表面的立體示意圖;第3B圖顯示凹進部210位於第二表面202的中心區域,為了保證支撐軸帶動基片托盤實現同步旋轉,凹進部210在水平方向上的截面形狀為非圓形,本實施例中凹進部的水平截面的形狀為大致為橢圓形,但是為了便於確定加工尺寸,將橢圓形的一組相對的兩個側面設置為兩個大致平行的平面,相比測量橢圓形的兩個相對的弧形面之間距離的難度,兩平行面之間的距離更易測量,因此使得測量凹進部的尺寸變得容易。本實施例中,凹進部210的內周壁216包括兩個相互平行的凹陷側面,以及兩個向相反方向凸起的弧形側面,其中,凹進部210的內周壁216大體垂直於第二表面202設置。凹進部210在基片托盤內部形成一頂表面215,採用該種形狀的設計一是為了便於確定加工尺寸;二是兩個平行凹陷側面兩端設置向相反方向凸起的弧形側面是為了形成較為流暢的加工線條,考慮到基片托盤200通常為石墨材料,減少出現尖銳的加工角度可以有效地減少加工過程中出現破損及顆粒污染物。基片托盤的直徑通常與其所處的化學氣相沉積反應器的大小相匹配。例如,本實施例中,基片托盤200的直徑範圍為450mm~600mm,具體的,基片托盤的直徑可以為450mm、480mm、500mm、550mm、580mm、600mm中的任一直徑。本實施例中,凹進部210的凹進深度與基片托盤的厚度比例是一個重要的參數。比例太小,凹進部的凹進深度太小,插接部插入凹進部的深度太小,基片托盤容易在支撐軸帶動旋轉過程中脫離支撐軸,造成危險;比例太大,凹進部210頂表面215距離基片托盤第一表面的距離過小,由於基片托盤通常為石墨材質,容易造成基片托盤的破裂,不能滿足生產製程的需求。因此設定凹進部210的凹進深度與基片托盤的厚度比例範圍為1/2至3/4。Referring to FIGS. 3A and 3B, FIG. 3A is a perspective view showing a first surface of a substrate tray 200. The substrate tray 200 has a substantially disk shape, which is exemplarily shown on the first surface 201. A plurality of grooves or craters 220 for placing the substrate to be processed are placed in the grooves or craters 220 to prevent the substrate from being detached from the substrate tray during processing. The size and distribution of the grooves or craters 220 can be varied in various forms, and the design is distributed according to the size of the substrate to be processed in a specific process, and is not shown here. 3B is a perspective view showing the second surface of the substrate tray; FIG. 3B is a view showing the recessed portion 210 at a central portion of the second surface 202. In order to ensure that the support shaft drives the substrate tray to achieve synchronous rotation, the recess 210 is The cross-sectional shape in the horizontal direction is non-circular, and the shape of the horizontal cross section of the recessed portion in the present embodiment is substantially elliptical, but in order to facilitate the determination of the processing size, a pair of opposite side faces of the elliptical shape are set to two. The substantially parallel plane, the distance between the two parallel faces is easier to measure than the difficulty of measuring the distance between the two opposite curved faces of the ellipse, thus making it easier to measure the size of the recess. In this embodiment, the inner peripheral wall 216 of the recessed portion 210 includes two mutually parallel concave side faces and two curved side faces that are convex in opposite directions, wherein the inner peripheral wall 216 of the recessed portion 210 is substantially perpendicular to the second Surface 202 is provided. The recessed portion 210 forms a top surface 215 inside the substrate tray, and the shape of the shape is designed to facilitate the determination of the processing size; the second is that the two parallel concave side surfaces are provided with arcuate sides convex in opposite directions for the purpose of The formation of a relatively smooth processing line, considering that the substrate tray 200 is generally a graphite material, reducing the sharp processing angle can effectively reduce damage and particle contaminants during processing. The diameter of the substrate tray is typically matched to the size of the chemical vapor deposition reactor in which it is placed. For example, in the embodiment, the diameter of the substrate tray 200 ranges from 450 mm to 600 mm. Specifically, the diameter of the substrate tray may be any one of 450 mm, 480 mm, 500 mm, 550 mm, 580 mm, and 600 mm. In the present embodiment, the ratio of the recess depth of the recessed portion 210 to the thickness of the substrate tray is an important parameter. The ratio is too small, the recessed depth of the recessed portion is too small, the depth of the insertion portion into the recessed portion is too small, and the substrate tray is easily separated from the support shaft during the rotation of the support shaft, causing danger; the ratio is too large, the recess is The distance between the top surface 215 of the portion 210 and the first surface of the substrate tray is too small. Since the substrate tray is usually made of graphite, the substrate tray is easily broken, which cannot meet the requirements of the production process. Therefore, the ratio of the recess depth of the recessed portion 210 to the thickness of the substrate tray is set to be 1/2 to 3/4.

結合參考第4圖,第4圖為第2圖所示實施方式中的支撐軸100的立體示意圖。支撐軸100包括:主軸部130;與主軸部130的一端相連接、並沿主軸部130的週邊向外延伸開來的一支撐部120,支撐部120包括一延展面121;以及與支撐部120相連接、並沿延展面121向外突起一定距離或高度的插接部110。延展面121的週邊設置一支撐台125,支撐台125包括一支撐面126用於支撐基片托盤200,支撐面126高於延展面121一段距離,支撐台125的凸起高度小於插接部110的凸起高度。插接部110包括一豎直側面111、一弧形側面112以及一頂表面115,其中,豎直側面111與延展面121相連接並大致垂直於延展面121,其包括兩個相互平行的平面1111以及兩個向相反方向突起的弧面1112。頂表面115與延展面121大致平行設置,頂表面115的形狀與凹進部210的水平橫截面形狀大致相同,包括兩個互相平行的直邊和兩個向相反方向突起的弧形邊。相對於插接部110與延展面121的接觸面,頂表面115雖然形狀與之相同,但面積較小,因此在豎直側面111和頂表面115之間形成一自豎直側面111向頂表面115傾斜的弧形側面112。設置弧形側面112的目的在於當插接部110與基片托盤的凹進部210相互配合時,可以使得插接部110方便的插進凹進部210內,避免插接部的頂表面115與凹進部發生碰撞摩擦。4, FIG. 4 is a perspective view of the support shaft 100 in the embodiment shown in FIG. 2. The support shaft 100 includes a main shaft portion 130, a support portion 120 connected to one end of the main shaft portion 130 and extending outwardly along the periphery of the main shaft portion 130. The support portion 120 includes an extension surface 121; and the support portion 120 The plug portion 110 is connected to the outside of the extension surface 121 by a certain distance or height. A support table 125 is disposed on the periphery of the extension surface 121. The support table 125 includes a support surface 126 for supporting the substrate tray 200. The support surface 126 is higher than the extension surface 121. The protrusion height of the support table 125 is smaller than the insertion portion 110. Raised height. The plug portion 110 includes a vertical side surface 111, an arcuate side surface 112, and a top surface 115, wherein the vertical side surface 111 is coupled to the extension surface 121 and substantially perpendicular to the extension surface 121, and includes two mutually parallel planes. 1111 and two curved faces 1112 protruding in opposite directions. The top surface 115 is disposed substantially parallel to the extension surface 121, and the shape of the top surface 115 is substantially the same as the horizontal cross-sectional shape of the recessed portion 210, and includes two straight sides that are parallel to each other and two curved sides that protrude in opposite directions. With respect to the contact surface of the insertion portion 110 and the extension surface 121, the top surface 115 has the same shape but a small area, so a vertical surface 111 to the top surface is formed between the vertical side surface 111 and the top surface 115. 115 inclined curved sides 112. The purpose of providing the curved side surface 112 is to allow the insertion portion 110 to be easily inserted into the recessed portion 210 when the insertion portion 110 and the recessed portion 210 of the substrate tray are engaged with each other, avoiding the top surface 115 of the insertion portion. Collision friction with the recess.

本創作中,支撐軸100的主軸部130包括一與支撐部120連接的第一主軸部131和與第一主軸部131另一端連接的第二主軸部132,第一主軸部131的直徑比第二主軸部132的直徑可以相同或不相同。較佳地,設計使得第一主軸部131的直徑比第二主軸部132的直徑小,這樣,第一主軸部131的較小的直徑可以減小主軸部與支撐部120的接觸面積,因此可以減小基片托盤200的熱量藉由第一主軸部131向下傳導,但是如果主軸部130的直徑過小,會影響主軸部的機械強度,造成主軸部高速旋轉時存在一定風險。因此本創作設計主軸部靠近基片托盤處的第一主軸部131內徑小於靠近反應腔底部的第二主軸部132的內徑,在保證減少基片托盤的熱量藉由主軸部流失的同時保證支撐軸100的支撐強度和旋轉強度。In the present creation, the main shaft portion 130 of the support shaft 100 includes a first main shaft portion 131 connected to the support portion 120 and a second main shaft portion 132 connected to the other end of the first main shaft portion 131. The diameter of the first main shaft portion 131 is larger than that of the first main shaft portion 131. The diameters of the two main shaft portions 132 may be the same or different. Preferably, the diameter of the first main shaft portion 131 is smaller than the diameter of the second main shaft portion 132, so that the smaller diameter of the first main shaft portion 131 can reduce the contact area between the main shaft portion and the support portion 120, and thus can Reducing the heat of the substrate tray 200 is conducted downward by the first main shaft portion 131. However, if the diameter of the main shaft portion 130 is too small, the mechanical strength of the main shaft portion is affected, and there is a risk in causing the main shaft portion to rotate at a high speed. Therefore, the inner diameter of the first main shaft portion 131 of the main shaft portion near the substrate tray is smaller than the inner diameter of the second main shaft portion 132 near the bottom of the reaction chamber, thereby ensuring that the heat of the substrate tray is reduced while the main shaft portion is lost. Support strength and rotational strength of the support shaft 100.

本創作所提供的支撐軸100和基片托盤200相互之間的連接和分離均很方便,二者不是固定地連接在一起,並且二者在反應腔10進行基片加工時可以保持同步旋轉。為了實現此目的,支撐軸100的插接部110能夠可分離地插接於前述凹進部210內,從而使基片托盤200放置於支撐軸100上並由其支撐,在此位置及狀態下,延展面121上的支撐台125的支撐面126與基片托盤200的第二表面202的至少部分相接觸,並且藉由該接觸的支撐面126來支撐基片托盤200。前述支撐部120設置於主軸部130的一端並二者相互連接,支撐部120沿主軸部130的週邊向外延伸開來一定距離,構成一個類似“肩膀”或“支撐架”的結構,從而可以在水平方向上平衡地支撐住或托住放置於其上的基片托盤200。支撐部120可以是各種形狀或結構的支撐結構,例如,如圖所示的圓柱形,或立方體或其他不規則形狀的支撐結構。支撐部120包括一延展面121,延展面的邊緣區域設置一圈支撐台125,利用支撐台125的支撐面126支撐基片托盤,在實現平穩支撐基片托盤的同時,避免支撐面和基片托盤第二表面202接觸面過大,從而導致基片托盤中心區域的熱量藉由支撐軸100向下傳導,造成基片托盤的中心區域和邊緣區域的溫度分佈不均勻。在本創作的實施方式中,當基片托盤200放置於支撐軸100上方後,在進行基片加工的過程中,基片托盤200通常需要以一定的速度保持平穩地旋轉。基片托盤200的旋轉運動由支撐軸100的插接部110在水平面方向上推動或驅動或帶動基片托盤200來實現,而不是如習知技術中藉由基片托盤和支撐軸之間的摩擦力來實現二者共同運動。由於插接部110可以隨著位於其下方的旋轉機構M帶動旋轉而調整其在水平面的位置,在其旋轉到某一位置或角度處,插接部110的豎直側面111的某些部分能夠頂住或抵住凹進部210的內周壁216的某些部分,這樣,插接部110就能夠在旋轉機構M的旋轉帶動下沿水平面方向上推動或帶動或驅動基片托盤200跟隨其一起旋轉。應當說明:本創作中的插接部110與凹進部210的配合是可以具有一定間隙的配合,並不需要如習知技術那樣二者為緊密連接的摩擦配合;此外,本創作中的基片托盤200是藉由由支撐部120的支撐面126在豎直方向上支撐住基片托盤200的第二表面202來實現的,因而,在基片托盤200放置於支撐軸100上方後,凹進部210的頂表面215與插接部110的頂表面115之間允許存在一定大小的間隙(當然也可以不存在此間隙),換言之,插接部110沿其延展面121向外突起一距離(插接部110的延展面121與頂表面115之間的豎直距離),該距離小於或等於凹進部210向內凹陷的深度(凹進部210的第二表面202與頂表面215之間的豎直距離)。The support shaft 100 and the substrate tray 200 provided by the present invention are convenient to connect and separate from each other, and the two are not fixedly coupled together, and both of them can maintain synchronous rotation when the reaction chamber 10 performs substrate processing. In order to achieve this, the insertion portion 110 of the support shaft 100 can be detachably inserted into the recessed portion 210, so that the substrate tray 200 is placed on and supported by the support shaft 100, in this position and state. The support surface 126 of the support table 125 on the extension surface 121 is in contact with at least a portion of the second surface 202 of the substrate tray 200, and the substrate tray 200 is supported by the contact support surface 126. The support portion 120 is disposed at one end of the main shaft portion 130 and connected to each other. The support portion 120 extends outwardly along the periphery of the main shaft portion 130 to form a structure similar to a "shoulder" or a "support frame", thereby The substrate tray 200 placed thereon is supported or held in a balanced manner in the horizontal direction. The support portion 120 can be a support structure of various shapes or configurations, such as a cylindrical shape as shown, or a cube or other irregularly shaped support structure. The support portion 120 includes an extension surface 121. The edge portion of the extension surface is provided with a support base 125. The support surface 126 of the support table 125 supports the substrate tray, thereby avoiding the support surface and the substrate while achieving smooth support of the substrate tray. The contact surface of the second surface 202 of the tray is too large, so that the heat in the central portion of the substrate tray is conducted downward by the support shaft 100, resulting in uneven temperature distribution in the central region and the edge region of the substrate tray. In the present embodiment, after the substrate tray 200 is placed over the support shaft 100, the substrate tray 200 generally needs to maintain a smooth rotation at a certain speed during substrate processing. The rotational movement of the substrate tray 200 is achieved by the insertion portion 110 of the support shaft 100 pushing or driving or driving the substrate tray 200 in the horizontal direction, instead of being between the substrate tray and the support shaft as in the prior art. Friction to achieve the joint movement of the two. Since the plug portion 110 can adjust its position in the horizontal plane as the rotating mechanism M located below it rotates, some portions of the vertical side 111 of the plug portion 110 can be rotated at a certain position or angle thereof. Some portions of the inner peripheral wall 216 of the recessed portion 210 are received or held so that the plug portion 110 can push or drive or drive the substrate tray 200 to follow the direction of the horizontal direction of the rotating mechanism M. Rotate. It should be noted that the engagement of the insertion portion 110 and the recessed portion 210 in the present creation is a fit that can have a certain gap, and does not require a tight fit of the friction fit as in the prior art; in addition, the base in the present creation The sheet tray 200 is realized by supporting the second surface 202 of the substrate tray 200 in the vertical direction by the support surface 126 of the support portion 120, and thus, after the substrate tray 200 is placed over the support shaft 100, the concave portion is recessed. A gap of a certain size is allowed between the top surface 215 of the insertion portion 210 and the top surface 115 of the insertion portion 110 (of course, there may be no such gap), in other words, the insertion portion 110 protrudes outward along the extension surface 121 by a distance. (vertical distance between the extension surface 121 of the plug portion 110 and the top surface 115) that is less than or equal to the depth of the recess 210 recessed inwardly (the second surface 202 and the top surface 215 of the recess 210) Vertical distance between)).

第5圖示出另一種實施例的支撐軸結構示意圖,該實施例的基本結構與第4圖中的實施例相同,區別在於本實施例為了安裝和維護的方便,在支撐軸上設置有機械安裝孔。從插接部110的頂表面115向下開設有空心的開口118。第5A圖示出沿第5圖的剖面線B方向的剖面結構示意圖,第5A圖中可清晰看到機械安裝孔117的結構,機械安裝孔117內表面設置螺紋(虛線框內),可以容納固定一螺栓(圖中未示出),當安裝支撐軸或拆卸支撐軸100時,可以利用螺栓實現與支撐軸100的固定,因此可以方便地提起移動支撐軸100,避免手持支撐軸給安裝帶來的不便。第5A圖中還清晰顯示支撐台125為自延展面121沿著與主軸部相反方向延伸一定高度,利用支撐面126與基片托盤200的第二表面202部分區域接觸實現對基片托盤200的支撐,利用此結構,環繞插接部110設置支撐台125,延展面121的其他區域與基片托盤的第二表面202之間形成縫隙,減少基片托盤的熱量藉由支撐部向下傳導。Fig. 5 is a view showing the structure of a support shaft of another embodiment, the basic structure of which is the same as that of the embodiment of Fig. 4, except that the embodiment is provided with a mechanism on the support shaft for the convenience of installation and maintenance. Mounting holes. A hollow opening 118 is opened downward from the top surface 115 of the plug portion 110. 5A is a schematic cross-sectional view along the line B of FIG. 5, and the structure of the mechanical mounting hole 117 can be clearly seen in FIG. 5A. The inner surface of the mechanical mounting hole 117 is provided with a thread (in the dotted line frame), which can accommodate Fixing a bolt (not shown), when the support shaft is installed or the support shaft 100 is detached, the fixing of the support shaft 100 can be achieved by bolts, so that the movable support shaft 100 can be conveniently lifted, and the hand-held support shaft can be prevented from being attached to the mounting belt. Inconvenience. It is also clearly shown in FIG. 5A that the support table 125 extends from the extension surface 121 in a direction opposite to the main shaft portion by a certain height, and the support surface 126 is in contact with the partial surface of the second surface 202 of the substrate tray 200 to realize the substrate tray 200. Supporting, with this structure, the support portion 125 is disposed around the insertion portion 110, and a gap is formed between the other portion of the extension surface 121 and the second surface 202 of the substrate tray, and the heat of the substrate tray is reduced to be conducted downward by the support portion.

第5B圖示出第5圖所示支撐軸100的俯視圖,在第5B圖中,插接部110包括一垂直於延展面121的豎直側面111、一頂表面115,以及豎直側面111與頂表面115之間的弧形側面112。本實施例中,豎直側面111包括一組相互平行的平面1111和一組向相反方向突起的弧面1112,平面1111和弧面1112確定了插接部110的形狀為一個類橢圓體。弧形側面112的設計可以方便基片托盤200與支撐軸100的安裝,便於插接部110與凹進部210的匹配嵌合。FIG. 5B is a plan view showing the support shaft 100 shown in FIG. 5. In FIG. 5B, the insertion portion 110 includes a vertical side surface 111 perpendicular to the extension surface 121, a top surface 115, and a vertical side surface 111. An arcuate side 112 between the top surfaces 115. In the present embodiment, the vertical side surface 111 includes a plurality of mutually parallel planes 1111 and a plurality of curved surfaces 1112 protruding in opposite directions. The plane 1111 and the curved surface 1112 define the shape of the insertion portion 110 as an ellipsoid. The design of the curved side surface 112 facilitates the mounting of the substrate tray 200 and the support shaft 100, facilitating the mating engagement of the insertion portion 110 with the recessed portion 210.

在本創作中,支撐部120上設置的支撐台可以為多種實施方式,在第4圖和第5圖的實施例中,支撐台125為環繞插接部110的圓環形結構,實際上,任何能夠在旋轉過程中實現對基片托盤200穩定支撐的結構都屬於本創作的設計構思,圓環狀支撐台125可以為連續結構,也可以為斷續結構。第6A圖示出一種實施方式,在該實施例中,支撐部120a包括延展面121a及設置在延展面121上方的若干支撐台125a,若干支撐台125a具有位於同一水平面上的支撐面126a,以保證對基片托盤的穩定支撐,該不連續的支撐台可以有效地減少與基片托盤的熱傳遞面積,盡可能地降低基片托盤的中心區域與邊緣區域的溫度差。支撐台125a的形狀可以設置為多種形式,第6B圖示出支撐部120b的延展面121b上設置的若干支撐台125b為圓柱形,若干支撐台125b具有位於同一水平面上的支撐面126b,以保證對基片托盤的穩定支撐。在第6A圖和第6B圖公開的實施例中,支撐台125a和125b的數量不受限制,較佳地,為了保證基片托盤的穩定支撐,支撐台的數量至少為兩個,較佳為對稱分佈。In the present creation, the support table provided on the support portion 120 can be in various embodiments. In the embodiments of FIGS. 4 and 5, the support table 125 is a circular ring structure surrounding the insertion portion 110. Any structure capable of achieving stable support for the substrate tray 200 during the rotation process belongs to the design concept of the present invention, and the annular support table 125 may be a continuous structure or a discontinuous structure. FIG. 6A illustrates an embodiment in which the support portion 120a includes an extension surface 121a and a plurality of support tables 125a disposed above the extension surface 121. The plurality of support tables 125a have support surfaces 126a on the same horizontal surface, To ensure stable support of the substrate tray, the discontinuous support table can effectively reduce the heat transfer area with the substrate tray, and reduce the temperature difference between the central area and the edge area of the substrate tray as much as possible. The shape of the support table 125a may be set in various forms, and FIG. 6B shows that the plurality of support tables 125b disposed on the extension surface 121b of the support portion 120b are cylindrical, and the plurality of support tables 125b have support surfaces 126b on the same horizontal surface to ensure Stable support for the substrate tray. In the embodiments disclosed in FIGS. 6A and 6B, the number of support stages 125a and 125b is not limited. Preferably, in order to ensure stable support of the substrate tray, the number of support stages is at least two, preferably Symmetrical distribution.

第7A圖公開了另一種實施例的的支撐軸結構示意圖,與上述實施例類似,支撐軸100包括插接部110、支撐部120及主軸部130,支撐部120包括支撐面124以及自支撐面向下凹陷的至少一個隔熱管道122,插接部110與主軸部130相連接、並沿著支撐面124中心區域向上延伸一定高度。本實施例中,隔熱管道122為環繞插接部110設置的環形結構,其作用在於減少支撐面124與基片托盤200的接觸面積,儘量降低基片托盤200的熱量向支撐部擴散,減小基片托盤中心區域與其他區域的溫度差,保證基片托盤上方製程的均勻一致性。隔熱管道122可以為圍繞插接部的一圈環形凹槽結構或多圈環形凹槽,一圈或多圈凹槽結構可以為連續設置,也可以為斷續設置。第7B圖示出第7A圖支撐軸的豎直剖面示意圖,圖中顯示隔熱管道122自支撐面124向下凹陷一定深度,避免與基片托盤第二表面接觸,不同於前文實施例,本實施例中支撐面124設置在隔熱管道兩側,在減少基片托盤熱量流失的同時,保證支撐部更加穩定的支撐基片托盤。圖中顯示的安裝孔117的結構與上文實施例相同,其設置目的在於便於安裝移動,也可以不設置該安裝孔,在此不再贅述。FIG. 7A is a schematic view showing a structure of a support shaft according to another embodiment. Similar to the above embodiment, the support shaft 100 includes a plug portion 110, a support portion 120 and a main shaft portion 130. The support portion 120 includes a support surface 124 and a self-supporting surface. The at least one insulated pipe 122 is recessed, and the insertion portion 110 is connected to the main shaft portion 130 and extends upward along the central portion of the support surface 124 by a certain height. In this embodiment, the heat insulating pipe 122 is an annular structure disposed around the plug portion 110, and functions to reduce the contact area between the support surface 124 and the substrate tray 200, and to minimize the heat diffusion of the substrate tray 200 to the support portion. The temperature difference between the central area of the small substrate tray and other areas ensures uniformity of the process above the substrate tray. The heat insulating pipe 122 may be a ring annular groove structure or a plurality of ring groove grooves surrounding the plug portion, and the one or more ring groove structures may be arranged continuously or intermittently. FIG. 7B is a vertical cross-sectional view showing the support shaft of FIG. 7A, which shows that the heat insulating pipe 122 is recessed downward from the support surface 124 to a certain depth to avoid contact with the second surface of the substrate tray, which is different from the previous embodiment. In the embodiment, the support surface 124 is disposed on both sides of the heat insulating pipe to ensure the support portion to support the substrate tray more stably while reducing the heat loss of the substrate tray. The structure of the mounting hole 117 shown in the figure is the same as that of the above embodiment, and is provided for the purpose of facilitating the installation movement or not, and will not be described herein.

第8A圖公開了用於如第2圖反應器內的另一種實施例的支撐軸結構示意圖,本實施例的主要特徵與上述實施例類似,區別在於,本實施例中隔熱管道122a為自支撐面124a向下設置的若干個凹陷部,即隔熱管道122a為不連續結構。由第8B圖的支撐軸的豎直剖面示意圖可見,隔熱管道122a自支撐面124a向下凹陷一定深度,在支撐部上形成若干個不連續的凹陷結構,隔熱作用與上文描述的一致。在該支撐軸的豎直剖面內,隔熱管道122a的形狀和分佈可以有多種設計,本實施例只是示意性的列舉了其中一種。Fig. 8A is a schematic view showing the structure of a support shaft for another embodiment in the reactor of Fig. 2. The main features of this embodiment are similar to those of the above embodiment, except that the heat insulating pipe 122a in the present embodiment is self. The plurality of recesses of the support surface 124a are downwardly disposed, that is, the heat insulating duct 122a is a discontinuous structure. As can be seen from the vertical sectional view of the support shaft of FIG. 8B, the heat insulating pipe 122a is recessed downward from the support surface 124a to a certain depth, and a plurality of discontinuous concave structures are formed on the support portion, and the heat insulation effect is consistent with the above description. . The shape and distribution of the insulated pipe 122a can be variously designed in the vertical section of the support shaft, and this embodiment is merely illustrative of one of them.

第9圖示出另一種實施例的支撐軸豎直剖面結構示意圖,不同於第8B圖所示的實施例,本實施例中隔熱管道122b貫穿支撐部的上下表面,形成若干個開口狀的不連續結構。FIG. 9 is a schematic view showing a vertical sectional structure of a support shaft according to another embodiment. Unlike the embodiment shown in FIG. 8B, the heat insulating pipe 122b penetrates the upper and lower surfaces of the support portion to form a plurality of openings. Discontinuous structure.

由上述可知,在本創作所提供的反應器中,一方面,基片托盤200的凹進部凹進空間水平橫截面積大於支撐軸100的插接部110的水平橫截面積,因而二者之間有間隙,從而使插接部110很容易地插入凹進部210內並且也很容易地使二者分離開,特別的,本創作設置一自豎直側面111向頂表面115傾斜的弧形側面112,使得插接部頂表面115的橫截面小於凹進部210的開口橫截面,進而使得插接部110插入凹進部210時更為容易,並且,可選擇地,插接部110還可以在凹進部210內轉動一定的角度或移動一定的距離,使插接部110在凹進部210內具有一特定位置,在此位置下,插接部110的某些部分頂住或抵住或卡住凹進部210的內周壁216的某些部分,從而使插接部110在旋轉機構M的作用下變成為一“驅動機構”,即,插接部110在水平方向上可以驅動或推動凹進部210一起旋轉;再者,本創作所提供的支撐軸100還設置有類似“肩膀”或“支撐架”結構的支撐部120,該支撐部120給基片托盤200在豎直方向上提供平穩的支撐作用。當基片托盤200被放置於支撐軸100上方並進行基片製程處理時,基片托盤200的旋轉運動由支撐軸100的插接部110在水平面方向上推動或帶動基片托盤200來實現,整個基片托盤200的重量則由支撐部120在豎直方向上來平穩地承擔。As can be seen from the above, in the reactor provided by the present invention, on the one hand, the recessed portion of the substrate tray 200 has a horizontal cross-sectional area larger than the horizontal cross-sectional area of the plug portion 110 of the support shaft 100, and thus both There is a gap therebetween so that the insertion portion 110 can be easily inserted into the recess 210 and the two can be easily separated. In particular, the present invention provides an arc that is inclined from the vertical side 111 toward the top surface 115. The side 112 is such that the cross-section of the plug top surface 115 is smaller than the opening cross-section of the recess 210, thereby making it easier to insert the plug 110 into the recess 210, and, optionally, the plug 110 It is also possible to rotate a certain angle or a certain distance within the recess 210 so that the plug portion 110 has a specific position within the recess 210, in which some portions of the plug portion 110 are held against or Abutting or catching some portions of the inner peripheral wall 216 of the recessed portion 210, so that the plug portion 110 becomes a "drive mechanism" under the action of the rotating mechanism M, that is, the plug portion 110 can be horizontally Driving or pushing the recess 210 to rotate together; in addition, the creation The support shaft 100 provided is also provided with a support portion 120 similar to a "shoulder" or "support frame" structure, which provides a smooth support for the substrate tray 200 in the vertical direction. When the substrate tray 200 is placed over the support shaft 100 and subjected to the substrate processing, the rotational movement of the substrate tray 200 is achieved by the insertion portion 110 of the support shaft 100 pushing or driving the substrate tray 200 in the horizontal direction. The weight of the entire substrate tray 200 is smoothly carried by the support portion 120 in the vertical direction.

相較於第1圖所示的習知技術的反應器,本創作的反應器具有諸多優點:首先,當基片托盤200被放置在支撐軸100上後,整個基片托盤200藉由支撐部120延展面上方的環形臺階狀支撐面126支撐,這樣,本創作的整個基片托盤200在被放置於支撐軸100上後及在基片加工過程中不會因重心不穩而左右搖擺;同時可以顯著降低基片托盤中心區域的熱量經支撐軸的損失。此外,基片托盤200的旋轉是藉由插接部110在水平表面方向上的作用力(推動力或抵靠作用)來實現的,因而不會出現如習知技術中二者出現“摩擦打滑”的現象;再者,前述插接部110和凹進部210在連接配合後,由於二者之間有一定的間隙,該間隙允許插接部110在高溫的加工製程環境下熱膨脹,不會出現如習知技術中二者因摩擦配合而導致熱膨脹,最終使易脆的基片托盤200被膨脹的插接部110撐壞的問題。最後,本創作的設置還有利於在基片加工過程中即時地、原位地測量位於封閉反應腔10內基片的具體位置和溫度。如第2圖所示,一速度感應器S與支撐軸100相連接。由於本創作所提供的支撐軸100和基片托盤200在旋轉過程中二者的速度是一致的,所以,藉由測量支撐軸100的轉速就可以得到基片托盤200的轉速,進而就可以準確地計算出每一片基片在旋轉過程中的相對位置。有了這個準確的位置,設置於反應腔10內的測量基片溫度的高溫計就可以準確地測量和計算出反應腔內處於高速旋轉的基片的溫度。The reactor of the present invention has many advantages over the reactor of the prior art shown in Fig. 1. First, after the substrate tray 200 is placed on the support shaft 100, the entire substrate tray 200 is supported by the support portion. The annular stepped support surface 126 above the 120 extension surface is supported, so that the entire substrate tray 200 of the present invention does not swing left and right due to the instability of the center of gravity after being placed on the support shaft 100 and during the processing of the substrate; The loss of heat in the central region of the substrate tray through the support shaft can be significantly reduced. In addition, the rotation of the substrate tray 200 is achieved by the force (pushing force or abutting action) of the insertion portion 110 in the direction of the horizontal surface, so that there is no occurrence of "frictional slippage" in the prior art. In addition, after the mating portion 110 and the recessed portion 210 are coupled and engaged, the gap allows the plug portion 110 to thermally expand in a high-temperature processing environment without a certain gap therebetween. There is a problem in that the thermal expansion of the two in the prior art due to the frictional fit eventually causes the fragile substrate tray 200 to be broken by the expanded plug portion 110. Finally, the present setup also facilitates the instantaneous and in situ measurement of the specific location and temperature of the substrate within the closed reaction chamber 10 during substrate processing. As shown in Fig. 2, a speed sensor S is coupled to the support shaft 100. Since the speeds of the support shaft 100 and the substrate tray 200 provided by the present invention are the same during the rotation process, the rotation speed of the substrate tray 200 can be obtained by measuring the rotation speed of the support shaft 100, thereby being accurate. The relative position of each substrate during the rotation is calculated. With this accurate position, the pyrometer that measures the substrate temperature within the reaction chamber 10 can accurately measure and calculate the temperature of the substrate that is rotating at high speed in the reaction chamber.

前述反應腔10中,基片托盤200下方還設置有加熱裝置,用於對基片托盤200上的基片加熱。為了達到對基片均勻加熱的效果,可以在基片托盤200下方設置有第一加熱裝置6a和第二加熱裝置6b。其中,第一加熱裝置6a靠近支撐軸100設置,例如,可以是一圍繞主軸部130週邊的一環形加熱裝置,其方向可以如圖所示呈水平方向放置,還可以設置成在豎直方向上環繞主軸部130週邊(未圖示)並靠近支撐部120,以改善由於支撐部120阻擋導致與支撐部120接觸的基片托盤200部分(即,基片托盤200的中心區域部分)受熱效果差的問題;第二加熱裝置6b設置於第一加熱裝置6a的週邊,用於對基片托盤200的邊緣區域部分提供加熱。較佳地,第一加熱裝置6a和第二加熱裝置6b分別與一加熱控制信號相連接,以單獨地提供加熱控制。In the foregoing reaction chamber 10, a heating means for heating the substrate on the substrate tray 200 is further disposed under the substrate tray 200. In order to achieve an effect of uniform heating of the substrate, a first heating device 6a and a second heating device 6b may be disposed under the substrate tray 200. Wherein, the first heating device 6a is disposed adjacent to the support shaft 100, for example, may be an annular heating device surrounding the periphery of the main shaft portion 130, the direction of which may be placed in a horizontal direction as shown, or may be set in a vertical direction. Surrounding the periphery of the main shaft portion 130 (not shown) and close to the support portion 120 to improve the portion of the substrate tray 200 that is in contact with the support portion 120 due to the blocking of the support portion 120 (i.e., the central portion of the substrate tray 200) is poorly heated. The second heating device 6b is disposed at the periphery of the first heating device 6a for providing heating to the edge region portion of the substrate tray 200. Preferably, the first heating means 6a and the second heating means 6b are respectively connected to a heating control signal to separately provide heating control.

本創作雖然以較佳實施方式公開如上,但其並不是用來限定本創作,任何本領域技術人員在不脫離本創作的精神和範圍內,都可以做出可能的變動和修改,因此本創作的保護範圍應當以本創作申請專利範圍所界定的範圍為准。The present invention is disclosed in the above preferred embodiments, but it is not intended to limit the present invention, and any person skilled in the art can make possible changes and modifications without departing from the spirit and scope of the present invention. The scope of protection shall be subject to the scope defined by the scope of patent application of this creation.

10‧‧‧反應腔
100‧‧‧支撐軸
110‧‧‧插接部
111‧‧‧豎直側面
1111‧‧‧平面
1112‧‧‧弧面
112‧‧‧弧形側面
115、215‧‧‧頂表面
117‧‧‧機械安裝孔
118‧‧‧開口
120、120a、120b‧‧‧支撐部
121、121a、121b‧‧‧延展面
122、122b‧‧‧隔熱管道
124、124a、126、126a、124b、126b‧‧‧支撐面
125、125a、125b‧‧‧支撐台
130‧‧‧主軸部
131‧‧‧第一主軸部
132‧‧‧第二主軸部
140‧‧‧加熱裝置
200、300‧‧‧基片托盤
201‧‧‧第一表面
202‧‧‧第二表面
205‧‧‧臺階
210‧‧‧凹進部
216‧‧‧內周壁
220‧‧‧窪坑
390‧‧‧凹進部分
395‧‧‧平直表面
400‧‧‧主軸
480‧‧‧顶端
481‧‧‧頂面
482‧‧‧主軸壁
6a‧‧‧第一加熱裝置
6b‧‧‧第二加熱裝置
P‧‧‧傳輸口
I-I、B-B‧‧‧剖面線
M‧‧‧旋轉機構
S‧‧‧速度感應器
A‧‧‧視角
10‧‧‧Reaction chamber
100‧‧‧Support shaft
110‧‧‧Interface
111‧‧‧Vertical side
1111‧‧ plane
1112‧‧‧ curved surface
112‧‧‧ curved side
115, 215‧‧‧ top surface
117‧‧‧Mechanical mounting holes
118‧‧‧ openings
120, 120a, 120b‧‧‧ support
121, 121a, 121b‧‧‧Extended surface
122, 122b‧‧‧Insulated pipes
124, 124a, 126, 126a, 124b, 126b‧‧‧ support surface
125, 125a, 125b‧‧‧ support table
130‧‧‧Spindle Department
131‧‧‧First spindle
132‧‧‧Second spindle
140‧‧‧ heating device
200, 300‧‧‧ substrate tray
201‧‧‧ first surface
202‧‧‧ second surface
205‧‧‧ steps
210‧‧‧ recessed
216‧‧‧ inner wall
220‧‧‧洼坑
390‧‧‧ recessed part
395‧‧‧Single surface
400‧‧‧ Spindle
480‧‧‧Top
481‧‧‧ top surface
482‧‧‧ spindle wall
6a‧‧‧First heating unit
6b‧‧‧second heating unit
P‧‧‧Transport
II, BB‧‧‧ hatching
M‧‧‧Rotating mechanism
S‧‧‧Speed sensor
A‧‧‧ perspective

藉由閱讀參照以下圖式對非限制性實施方式所作的詳細描述,本創作的其它特徵、目的和優點將會變得更明顯:Other features, objects, and advantages of the present invention will become more apparent from the detailed description of the <RTIgt;

第1圖示出習知技術中一種無基座式反應器。Figure 1 shows a pedestal-free reactor of the prior art.

第2圖示出根據本創作所提供的一種反應器的前視橫載面示意圖。Figure 2 is a schematic illustration of a front cross-sectional view of a reactor provided in accordance with the present teachings.

第3A圖為第2圖所示實施方式中的基片托盤的第一表面立體示意圖。Fig. 3A is a perspective view showing the first surface of the substrate tray in the embodiment shown in Fig. 2.

第3B圖為第2圖所示實施方式中的基片托盤的第二表面立體示意圖。Fig. 3B is a perspective view showing the second surface of the substrate tray in the embodiment shown in Fig. 2.

第4圖為第2圖所示實施方式中的支撐軸的立體示意圖。Fig. 4 is a perspective view showing the support shaft in the embodiment shown in Fig. 2.

第5圖為另一種實施方式中的支撐軸的立體示意圖。Fig. 5 is a perspective view showing a support shaft in another embodiment.

第5A圖示出第5圖所示實施例的支撐軸的豎直剖面示意圖。Fig. 5A is a vertical sectional view showing the support shaft of the embodiment shown in Fig. 5.

第5B圖示出第5圖所示實施例的支撐軸的俯視圖。Fig. 5B is a plan view showing the support shaft of the embodiment shown in Fig. 5.

第6A圖為另一種實施方式中的支撐軸的立體示意圖。Figure 6A is a perspective view of the support shaft in another embodiment.

第6B圖為另一種實施方式中的支撐軸的立體示意圖。Figure 6B is a perspective view of the support shaft in another embodiment.

第7A圖及第7B圖示出另一種實施方式中的支撐軸結構示意圖。7A and 7B are schematic views showing the structure of the support shaft in another embodiment.

第8A圖及第8B圖示出另一種實施方式中的支撐軸結構示意圖。8A and 8B are schematic views showing the structure of the support shaft in another embodiment.

第9圖示出另一種實施方式中的支撐軸豎直剖面示意圖。Fig. 9 is a schematic vertical sectional view showing a support shaft in another embodiment.

110‧‧‧插接部 110‧‧‧Interface

111‧‧‧豎直側面 111‧‧‧Vertical side

1111‧‧‧平面 1111‧‧ plane

1112‧‧‧弧面 1112‧‧‧ curved surface

112‧‧‧弧形側面 112‧‧‧ curved side

115‧‧‧頂表面 115‧‧‧ top surface

120‧‧‧支撐部 120‧‧‧Support

121‧‧‧延展面 121‧‧‧Extended surface

125‧‧‧支撐台 125‧‧‧Support table

126‧‧‧支撐面 126‧‧‧Support surface

118‧‧‧開口 118‧‧‧ openings

Claims (25)

一種用於化學氣相沉積或外延層生長反應器內的支撐軸,用以支撐一基片托盤並帶動其旋轉,該支撐軸包括: 一主軸部; 一支撐部,與該主軸部的一端相連接、並沿該主軸部週邊向外延伸,該支撐部包括一延展面;以及 一插接部,與該主軸部相連接、並沿著該延展面向與該主軸部反方向延伸一高度; 其中,該延展面上方環繞該插接部設置一或複數個支撐台,該支撐台包括一支撐面用以支撐該基片托盤,該支撐面高於該延展面一距離。A support shaft for use in a chemical vapor deposition or epitaxial growth reactor for supporting a substrate tray and rotating it, the support shaft comprising: a spindle portion; a support portion opposite to one end of the spindle portion Connecting and extending outwardly along the periphery of the main shaft portion, the support portion includes an extension surface; and a plug portion connected to the main shaft portion and extending along the extension surface in a direction opposite to the main shaft portion; One or more support platforms are disposed around the extension portion around the extension surface, and the support table includes a support surface for supporting the substrate tray, the support surface being higher than the extension surface. 如申請專利範圍第1項所述之支撐軸,其中該插接部包括一頂表面和一外側面,該外側面包括一第一外側面和一第二外側面,其中該第一外側面垂直設置於該延展面上方,該第二外側面設置為自該第一外側面向該頂表面傾斜的弧面。The support shaft of claim 1, wherein the insertion portion includes a top surface and an outer side surface, the outer side surface including a first outer side surface and a second outer side surface, wherein the first outer side surface is vertical Provided above the extension surface, the second outer side surface is disposed as a curved surface inclined from the first outer surface toward the top surface. 如申請專利範圍第1項所述之支撐軸,其中該插接部位於該延展面的中心區域,形狀為非圓柱形。The support shaft according to claim 1, wherein the insertion portion is located in a central region of the extension surface and is non-cylindrical in shape. 如申請專利範圍第2項所述之支撐軸,其中該第一外側面包括一組相互平行的平面及一組向相反方向突起的弧面。A support shaft according to claim 2, wherein the first outer side surface comprises a set of mutually parallel planes and a plurality of arcuate surfaces projecting in opposite directions. 如申請專利範圍第1項所述之支撐軸,其中該支撐台為環繞該插接部設置的圓環狀結構,圓環狀的該支撐台為連續或斷續結構。The support shaft according to claim 1, wherein the support base is an annular structure disposed around the insertion portion, and the annular support base is a continuous or intermittent structure. 如申請專利範圍第1項所述之支撐軸,其中該支撐台為環繞該插接部設置的複數個凸起。The support shaft according to claim 1, wherein the support table is a plurality of protrusions disposed around the insertion portion. 如申請專利範圍第1項所述之支撐軸,其中該支撐台的高度小於該插接部的高度。The support shaft according to claim 1, wherein the height of the support table is smaller than the height of the insertion portion. 如申請專利範圍第1項所述之支撐軸,其中該主軸部包括與該支撐部連接的一第一主軸部和與該第一主軸部另一端連接的一第二主軸部,該第一主軸部的直徑小於該第二主軸部的直徑。The support shaft according to claim 1, wherein the main shaft portion includes a first main shaft portion connected to the support portion and a second main shaft portion connected to the other end of the first main shaft portion, the first main shaft The diameter of the portion is smaller than the diameter of the second main shaft portion. 如申請專利範圍第1項所述之支撐軸,其中該支撐軸設置有一機械安裝孔,該機械安裝孔在該插接部的頂表面上設有開口,並沿著該主軸部的方向延伸一深度。The support shaft according to claim 1, wherein the support shaft is provided with a mechanical mounting hole, the mechanical mounting hole is provided with an opening on a top surface of the insertion portion, and extends along a direction of the main shaft portion. depth. 一種與申請專利範圍第1項所述之支撐軸匹配的基片托盤,該基片托盤包括一第一表面和一第二表面,該第一表面上用於放置複數個待處理的基片,該第二表面的中心位置設置有向內凹陷的一凹進部,該凹進部在該基片托盤內部形成一頂表面,該凹進部的該頂表面形狀為非圓形,該凹進部用於容納該支撐軸的該插接部,該第二表面至少部分與該支撐台的該支撐面接觸。A substrate tray matched with a support shaft according to claim 1, wherein the substrate tray comprises a first surface and a second surface, wherein the first surface is used for placing a plurality of substrates to be processed, a central portion of the second surface is provided with a recess recessed inwardly, the recess forming a top surface inside the substrate tray, the top surface of the recess being non-circular in shape, the recess The plug portion for receiving the support shaft, the second surface being at least partially in contact with the support surface of the support table. 如申請專利範圍第10項所述之基片托盤,其中該凹進部的凹進深度與該基片托盤的厚度比例範圍為1/2至3/4。The substrate tray of claim 10, wherein a ratio of a recessed depth of the recess to a thickness of the substrate tray ranges from 1/2 to 3/4. 如申請專利範圍第10項所述之基片托盤,其中該基片托盤週邊設置一臺階,該臺階用於容納機械手臂,便於取放基片托盤。The substrate tray of claim 10, wherein a step is provided around the substrate tray, the step is for accommodating a robot arm for facilitating access to the substrate tray. 一種化學氣相沉積或外延層生長反應器,該反應器內包括一基片托盤及其支撐軸,該支撐軸用以支撐該基片托盤並帶動其旋轉,該支撐軸包括: 一主軸部; 一支撐部,與該主軸部的一端相連接、並沿該主軸部週邊向外延伸,該支撐部包括一延展面;以及 一插接部,與該主軸部相連接、並沿著該延展面向與該主軸部反方向延伸一高度; 其中,該延展面上方環繞該插接部設置一或複數個支撐台,該支撐台包括一支撐面用以支撐該基片托盤,該支撐面高於該延展面一距離; 其中,該基片托盤包括一第一表面和一第二表面,該第一表面上用於放置複數個待處理的基片,該第二表面的中心位置設置有向內凹陷的一凹進部,該凹進部在該基片托盤內部形成一頂表面,該凹進部的該頂表面形狀為非圓形,該凹進部用於容納該支撐軸的該插接部,該第二表面至少部分與該支撐台的該支撐面接觸。A chemical vapor deposition or epitaxial layer growth reactor, the reactor comprising a substrate tray and a support shaft thereof for supporting the substrate tray and driving the rotation thereof, the support shaft comprising: a spindle portion; a support portion connected to one end of the main shaft portion and extending outward along a periphery of the main shaft portion, the support portion including an extension surface, and a plug portion connected to the main shaft portion and along the extension surface Extending a height in a direction opposite to the main shaft portion; wherein the extension surface is provided with one or more support platforms around the insertion portion, the support platform includes a support surface for supporting the substrate tray, wherein the support surface is higher than the height The substrate tray comprises a first surface and a second surface, wherein the first surface is used for placing a plurality of substrates to be processed, and the central surface of the second surface is provided with an inward depression a recessed portion forming a top surface inside the substrate tray, the top surface of the recessed portion being non-circular in shape, the recessed portion for receiving the plug portion of the support shaft The second surface to Portion in contact with the supporting surface of the support base. 如申請專利範圍第13項所述之反應器,其中該插接部包括一頂表面和一外側面,該外側面包括一第一外側面和一第二外側面,其中該第一外側面垂直設置於該延展面上方,該第二外側面設置為自該第一外側面向該頂表面傾斜的弧面。The reactor of claim 13, wherein the plug portion includes a top surface and an outer side surface, the outer side surface including a first outer side surface and a second outer side surface, wherein the first outer side surface is vertical Provided above the extension surface, the second outer side surface is disposed as a curved surface inclined from the first outer surface toward the top surface. 如申請專利範圍第13項所述之反應器,其中該插接部位於該延展面的中心區域,形狀為非圓柱形。The reactor of claim 13, wherein the plug portion is located in a central region of the extension surface and is non-cylindrical in shape. 如申請專利範圍第14項所述之反應器,其中該第一外側面包括一組相互平行的平面及一組向相反方向突起的弧面。The reactor of claim 14, wherein the first outer side comprises a set of mutually parallel planes and a plurality of arcuate surfaces projecting in opposite directions. 如申請專利範圍第13項所述之反應器,其中該支撐台為環繞該插接部設置的圓環狀結構或複數個凸起,圓環狀的該支撐台為連續或斷續結構。The reactor of claim 13, wherein the support table is an annular structure or a plurality of protrusions disposed around the insertion portion, and the annular support table is a continuous or intermittent structure. 如申請專利範圍第13項所述之反應器,其中該主軸部包括與該支撐部連接的一第一主軸部和與該第一主軸部另一端連接的一第二主軸部,該第一主軸部的直徑小於該第二主軸部的直徑。The reactor of claim 13, wherein the main shaft portion includes a first main shaft portion connected to the support portion and a second main shaft portion connected to the other end of the first main shaft portion, the first main shaft portion The diameter of the portion is smaller than the diameter of the second main shaft portion. 如申請專利範圍第13項所述之反應器,其中該支撐軸設置有一機械安裝孔,該機械安裝孔在該插接部的該頂表面上設有開口,並沿著該主軸部的方向延伸一深度。The reactor of claim 13, wherein the support shaft is provided with a mechanical mounting hole, the mechanical mounting hole is provided with an opening on the top surface of the plug portion, and extends along the direction of the main shaft portion A depth. 如申請專利範圍第13項所述之反應器,其中該基片托盤的該第二表面之該凹進部的凹進深度與該基片托盤的厚度比例範圍為1/2至3/4。The reactor of claim 13, wherein the recessed depth of the recessed portion of the second surface of the substrate tray and the thickness ratio of the substrate tray are in the range of 1/2 to 3/4. 一種用於化學氣相沉積或外延層生長反應器內的支撐軸,用以支撐一基片托盤並帶動其旋轉,該支撐軸包括: 一主軸部; 一支撐部,與該主軸部的一端相連接、並沿該主軸部週邊向外延伸,該支撐部包括一支撐面; 一插接部,與該主軸部相連接、並沿著該支撐面中心區域向與該主軸部反方向延伸一高度; 其中,該支撐部上設置一或複數個自該支撐面向下凹陷的隔熱管道。A support shaft for use in a chemical vapor deposition or epitaxial growth reactor for supporting a substrate tray and rotating it, the support shaft comprising: a spindle portion; a support portion opposite to one end of the spindle portion Connecting and extending outward along the periphery of the main shaft portion, the support portion includes a support surface; a plug portion connected to the main shaft portion and extending along a central portion of the support surface in a direction opposite to the main shaft portion Wherein, the support portion is provided with one or a plurality of heat insulating pipes recessed downward from the support surface. 如申請專利範圍第21項所述之支撐軸,其中該隔熱管道為環繞該插接部設置的一環狀結構,該環狀結構為連續或斷續設置。The support shaft according to claim 21, wherein the heat insulating pipe is an annular structure disposed around the plug portion, and the annular structure is continuously or intermittently disposed. 如申請專利範圍第22項所述之支撐軸,其中該隔熱管道為圍繞該插接部的一或複數個環形凹槽。The support shaft of claim 22, wherein the insulated pipe is one or more annular grooves surrounding the plug. 如申請專利範圍第21項所述之支撐軸,其中該隔熱管道為複數個不連續的凹陷結構。The support shaft according to claim 21, wherein the heat insulating pipe is a plurality of discontinuous concave structures. 如申請專利範圍第24項所述之支撐軸,其中複數個不連續的該隔熱管道貫穿該支撐部設置。The support shaft according to claim 24, wherein the plurality of discontinuous heat insulating pipes are disposed through the support portion.
TW105206291U 2015-09-06 2016-05-03 Chemical vapor deposition or epitaxial layer growth reactor and substrate tray and support shaft TWM528513U (en)

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USD863239S1 (en) 2018-03-26 2019-10-15 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD854506S1 (en) 2018-03-26 2019-07-23 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD866491S1 (en) 2018-03-26 2019-11-12 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
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