TWM526649U - Improved projection lamp heat dissipation structure - Google Patents

Description

Improved projection lamp heat dissipation structure

The present invention relates to a construction of a projection lamp, and more particularly to a heat dissipation structure of a projection lamp.

Due to the high brightness of the projection lamp, the concentration of the beam and the long distance of the illumination, it is suitable as an outdoor lighting device. The conventional projection lamp mostly uses a mercury bulb, a high-intensity discharge lamp or a halogen bulb as a light-emitting element. Due to the large power consumption and less environmental protection, in addition to the places where high-power lighting is required, more environmentally friendly and power-saving LED light-emitting diodes are currently used as the light-emitting elements of low-power projection lamps.

The projection lamp using LED light-emitting diodes has become a new generation of green lighting fixtures due to its advantages of energy saving, environmental protection and long life. Since the power of the projection lamps is generally higher than that of general lighting fixtures, the generated heat is also large. Therefore, the projection lamp usually needs to be provided with a heat dissipation structure.

The principle and structure of the LED light-emitting diode are different from those of the conventional light-emitting element. Since the heat capacity of the LED chip is small, a little heat accumulation will cause the junction temperature of the wafer to increase rapidly, if it is working at a high junction temperature for a long period of time. State, its life will soon be shortened. Therefore, a projection lamp using an LED light-emitting diode requires a special attention to heat dissipation.

The traditional projection lamp uses its outer casing to dissipate heat, but its heat dissipation effect is not good, resulting in a short life of the projection lamp; more advanced, such as the new M452298 patent case in China, the rest The light-emitting fin is disposed on the back surface of the lamp holder of the projection lamp, and the light-emitting element is attached to the heat-dissipating fin; however, in the structure, the projection lamp is a high-power, high-heating lamp, and the LED light-emitting diode is used as the light-emitting element. The heat source is concentrated. Although the light-emitting element is in a state of being bonded to the heat-dissipating fins, it is still unable to be efficiently and quickly transmitted to the heat-dissipating fins due to the high heat accumulation of the light-emitting elements, resulting in poor heat dissipation of the light-emitting elements.

In view of the poor heat dissipation effect of the heat dissipation structure of the conventional projection lamp, the present invention proposes an improved projection lamp heat dissipation structure for solving the problem of poor heat dissipation of the conventional projection lamp.

An embodiment of the improved heat dissipation structure of the projection lamp comprises: a lamp housing, a light-emitting component and a light-transmissive cover; the lamp housing is a box-shaped component having a bottom plate and an opening, the bottom plate having an opening The back side of the lamp housing has a heat sink, and the heat sink has a contact surface facing the bottom plate. The light emitting element is disposed at the opening position of the bottom plate of the lamp housing, and the back surface thereof is in contact with the heat sink. The lamp housing has a reflector built therein. The light emitted by the light-emitting element is reflected toward the opening, and the light-transmissive cover is a light-transmissive sheet-like component and is disposed in the opening of the lamp housing. The edge of the light-transmitting cover is fixed by a plurality of fasteners disposed on the lamp housing. The improved portion is formed by a contact surface of the heat sink having at least one heat pipe embedded in the lamp housing. The heat pipe has an exposed heat absorbing surface that can be in contact with the light emitting element to assist the heat sink to enhance the heat dissipation effect.

The heat conduction generated by the light-emitting element can be transmitted to the heat sink through the heat conduction capability of the heat pipe through the heat pipe embedded on the contact surface of the heat sink, thereby improving the heat dissipation of the passive heat dissipation structure using the heat sink. effect.

In an embodiment of the present invention, which includes a plurality of heat pipes, the heat pipes are There is a gap between them, which is better than the heat conduction capacity of several heat pipes, thereby improving the heat dissipation effect of the passive heat dissipation structure using the heat sink.

The details of other functions and implementations of this creation will be described below with reference to the drawings.

A‧‧‧ openings

10‧‧‧Light shell

11‧‧‧floor

110‧‧‧Opening

12‧‧‧ side wall

20‧‧‧ radiator

21‧‧‧Connecting components

22‧‧‧Contact surface

221‧‧‧ fitting slot

23‧‧‧ Heat sink fins

30‧‧‧reflector

31‧‧‧ Reflective surface

40‧‧‧ buckle

41‧‧‧Installation bracket

50‧‧‧Lighting elements

60‧‧‧heat pipe

61‧‧‧Heat absorption surface

70‧‧‧Light cover

71‧‧‧ Sealing ring

Fig. 1 is a structural view showing an embodiment of the creation of the present invention, showing the appearance of the projection lamp.

Fig. 2 is an exploded perspective view showing the construction of the embodiment of Fig. 1 showing the connection relationship of the respective elements of the projection lamp.

Fig. 3 is a structural sectional view of the first figure at the position III-III.

Referring to FIG. 1 and FIG. 2, an embodiment of the present invention includes a lamp housing 10, a light-emitting element 50, at least one heat pipe 60, and a light-transmissive cover 70.

The lamp housing 10 has a bottom plate 11 and a side wall 12 surrounding the periphery of the bottom plate 11. The bottom plate 11 and the side wall 12 form a box-like member having an opening A, and the opening A is located in front of the lamp housing toward the light projection direction. The bottom plate 11 has an opening 110, and a heat sink 20 is disposed on the back surface of the lamp housing 10. The heat sink 20 is disposed on the back surface of the bottom plate 11 of the lamp housing 10 by a plurality of connecting elements 21 (which may be bolts or other equivalent elements). The heat sink 20 has a contact surface 22 and a plurality of heat dissipation fins 23, and the heat sink 20 is a metal heat sink (which may be made of aluminum or copper). The contact surface 22 is a flat surface and faces the bottom plate. The opening 110 of the 11 , a reflector cover 30 is disposed on the bottom plate 11 and surrounds the periphery of the opening 110. The reflector cover 30 is a funnel-like component, and one embodiment of the reflector cover 30 is a component made of a metal sheet. The reflector 30 has an inverse on a plurality of reflective surfaces 31 of its axis of symmetry The light capability is used to reflect the light emitted by the projection lamp toward the opening A. The lamp housing 10 is further provided with a plurality of clips 40 and a mounting bracket 41. The clips 40 are disposed at the outer symmetric position of the side wall 12, and the bracket 41 is The rotatable relationship is coupled to the side wall 12 of the lamp envelope 10 (which may be coupled to the side wall 12 of the lamp envelope 10 by, for example, but not limited to, a bolt or pivot) and may extend toward the back of the lamp housing 10 for use in the lamp housing 10 The device is placed on the wall or where the projection lamp is to be mounted.

A light-emitting element 50 (which may be an LED light-emitting diode) is disposed at a position of the opening 110 of the bottom plate 11 of the lamp housing 10 and in close contact with the contact surface 22 of the heat sink 20 to cause the light-emitting element 50 to be generated. The heat can be dissipated by the assistance of the heat sink 20.

The heat pipe 60 is embedded in the contact surface 22 of the heat sink 20 of the lamp housing 10 (see "Fig. 3"). The heat pipe 60 has an exposed heat absorbing surface 61 which can be in contact with the light emitting element 50 for assisting the heat sink 20. The heat dissipation effect on the light emitting element 50 is enhanced.

In an embodiment of the present invention, a plurality of heat pipes 60 may be provided. As shown in the "FIG. 1" embodiment, there are three heat pipes 60 having a space between each other and depending on the light. The area of the heat generating portion of the element 50 is equally divided, and the heat pipe 60 has an exposed heat absorbing surface 61. One embodiment is provided with a plurality of matching grooves 221 corresponding to the heat pipe 60 at the contact surface 22 of the heat sink 20. A plurality of heat pipes 60 are embedded in the fitting grooves 221, and the heat absorbing surface 61 of the heat pipe 60 is flush with the contact surface 22 of the heat sink 20, and the heat absorbing surface 61 and the contact surface 22 are further coated with a heat conductive medium (such as The thermal conductive paste, the thermal conductive paste) is in contact with the back surface of the light-emitting element 50 to increase the heat conduction effect.

The light-transmissive cover 70 is a light-transmissive sheet-like component, and one embodiment is a sheet-like component made of glass or a light-transmissive and heat-resistant light-transmitting material as a light-transmitting cover 70. The cover 70 is disposed in the opening A of the lamp housing 10 to cover the opening A, in an implementation of the present creation In the example, a sealing rubber ring 71 is disposed at a position where the light-transmitting cover 70 and the lamp housing 10 are in contact with each other, and the edge of the light-transmitting cover 70 is fixed to the opening A of the lamp housing 10 by the plurality of fasteners 40 described above. It can be waterproof.

Although the present invention has been disclosed above through the above embodiments, it is not intended to limit the creation of the present invention. Anyone skilled in the art can make some changes and refinements without departing from the spirit and scope of the present creation. The scope of patent protection is subject to the terms of the claims attached to this specification.

A‧‧‧ openings

10‧‧‧Light shell

11‧‧‧floor

110‧‧‧Opening

12‧‧‧ side wall

20‧‧‧ radiator

21‧‧‧Connecting components

22‧‧‧Contact surface

221‧‧‧ fitting slot

23‧‧‧ Heat sink fins

30‧‧‧reflector

31‧‧‧ Reflective surface

40‧‧‧ buckle

41‧‧‧Installation bracket

50‧‧‧Lighting elements

60‧‧‧heat pipe

61‧‧‧Heat absorption surface

70‧‧‧Light cover

71‧‧‧ Sealing ring

Claims (5)

An improved projection lamp heat dissipation structure comprises: a lamp housing, a light-emitting component and a light-transmissive cover, the lamp housing is a box-shaped component having a bottom plate and an opening, the bottom plate having an opening, the lamp housing The back surface has a heat sink having a contact surface facing the opening of the bottom plate. The light emitting element is disposed at an opening position of the bottom plate of the lamp housing, and the back surface thereof is in contact with the contact surface of the heat sink. A reflector is built in to reflect the light emitted by the light-emitting element toward the opening, the light-transmissive cover is a light-transmissive sheet-like component and is disposed on the opening of the lamp housing, the edge of the light-transmitting cover The opening is fixed to the opening by a plurality of fasteners disposed on the lamp housing; the improved portion is provided with at least one heat pipe embedded in the contact surface of the heat sink of the lamp housing, the heat pipe having an exposed heat absorption surface It can be in contact with the back surface of the light-emitting element. The improved projection lamp heat dissipation structure of claim 1, wherein there are a plurality of the heat pipes, the heat pipes having a space therebetween. The improved projection lamp heat dissipation structure according to claim 1, wherein the contact surface of the heat sink is provided with a plurality of fitting grooves corresponding to the heat pipes, and the heat pipes are embedded in the fitting grooves, and The heat absorbing surface of the heat pipe is flush with the contact surface of the heat sink. The improved projection lamp heat dissipation structure according to claim 1, wherein the light emitting element is an LED light emitting diode. According to claim 3, wherein the contact surface of the heat sink and the heat absorbing surface of the heat pipe are coated with a heat conductive medium and are in contact with the back surface of the light emitting element.