TWM521800U - Wafer invalid edge residue cleaning apparatus - Google Patents

Description

Wafer ineffective edge residue removal device

The present invention relates to a wafer cleaning apparatus, and more particularly to a wafer ineffective edge residue removing device for removing irregularities on the surface of an ineffective side of a wafer.

A wafer is a germanium wafer used in the fabrication of a semiconductor integrated circuit, and is called a wafer because its shape is circular. Wafers are the carriers used in the production of integrated circuits. Generally, the wafer yield is mostly single crystal germanium wafers. Wafers are formed by processes such as deposition, lithography, etching, and grinding. Please refer to FIG. 1 and FIG. 2 . FIG. 1 is a plan view of the wafer, and FIG. 2 is a side view of the wafer. After the above process, the surface of the wafer 1 (ie, the ineffective side) is left with a metal plating residue 2 such as tin (Sn) and copper (Cu) remaining thereon, and the residue 2 It is rugged. The rugged residue 2 affects the subsequent process of wafer 1, so it must be removed.

A conventional wafer ineffective edge residue removing device is an electric pen knife having a small grinding wheel at its front end. The hand-held electric pen blade scrapes the uneven residue 2 on the surface of the ineffective side of the wafer 1. However, such a means for removing the residue of the wafer ineffective side is not easy to completely scrape the uneven residue 2, and it is easy to scratch the ineffective side of the wafer 1.

In view of the above, how to provide a wafer ineffective edge residue removing device capable of almost or even completely removing the uneven residue on the surface of the ineffective side of the wafer without scratching the ineffective side of the wafer and improving the crystal The yield of the circle is the research and development direction of the people in the field.

The main purpose of this creation is to provide a wafer ineffective edge residue removing device capable of almost or completely removing the uneven residue on the surface of the ineffective side of the wafer without scratching the ineffective side of the wafer and improving the crystal. Round yield.

In order to achieve the foregoing objects, the present invention provides a wafer ineffective edge residue removing device for removing irregularities on the surface of an ineffective side of a wafer having at least one surface having irregularities. The upside down section and at least the next section, the wafer ineffective edge residue removing device includes an adjusting device and a grinding device.

The adjusting device comprises a buffering member and a base, and the base is movably disposed on the buffering member.

The grinding device includes a spindle motor and a grinding tool. The spindle motor is disposed on the base, and the grinding tool is rotatably disposed on the spindle motor.

Wherein, when the polishing tool is positioned above the wafer, the adjusting device controls the polishing tool to maintain a distance from the surface of the inactive edge of the wafer, and the polishing tool rotationally contacts the surface of the uneven residue, when When the grinding tool climbs to the uphill section, the grinding device moves upwardly and drives the base to move relative to the buffering member to cause the cushioning member to generate a cushioning force. When the downhill section is lowered, the cushioning member pushes the base to move downward with the grinding device by the buffering force.

According to a preferred embodiment, the buffer member comprises a body, at least one pneumatic cylinder, at least one piston rod, a gas source, and a pressure regulating valve. The pneumatic cylinder is disposed on the seat body, and one end of the piston rod is Movably disposed in the pneumatic cylinder, the other end of the piston rod is disposed on the base, the pressure regulating valve is disposed between the pneumatic cylinder and the gas source, and controls the air pressure inside the pneumatic cylinder to a set value, To limit the maximum length of the piston rod from the pneumatic cylinder, the abrasive tool is controlled to maintain a distance from the surface of the inactive edge of the wafer.

Wherein, when the grinding tool climbs to the uphill section while rotating, the grinding device moves upward and drives the base to push the piston rod into the interior of the pneumatic cylinder so that the air pressure inside the pneumatic cylinder is greater than the setting The buffering force is generated, and when the grinding tool is rotated along the lower slope section, the air pressure inside the pneumatic cylinder gradually decreases, and the piston rod pushes the piston rod out of the pneumatic cylinder by the buffering force, and the piston rod pushes The base moves downward with the grinding device. When the air pressure inside the pneumatic cylinder returns to the set value, the buffering force disappears, the piston rod stops moving, and the base and the grinding device stop downward. Moving, the abrasive tool returns to a position that is at a distance from the surface of the inactive edge of the wafer.

Wherein, the base body comprises a plurality of blocks, a cylinder block and a slider, wherein one block is disposed on the slide seat, and the other blocks are coupled to each other, and one side of the cylinder block is disposed in one of the bodies and at least one slot is opened. The slider is disposed on the other side of the cylinder block, and the pneumatic cylinder is disposed in the through slot.

The base includes a sliding block, the base includes a sliding portion, a plate body and a clamping seat, the sliding portion includes a base and a body, and the bottom end of the body is disposed at a side of the top end of the base The sliding portion has an L shape, a side of the body defines a track, the slider is movably disposed on the rail, and the other end of the piston rod is disposed at a top end of the base, and one side of the plate body is fixed to The ontology On the other side, the holder is disposed on the other side of the body opposite to the body, and the spindle motor is clamped by the holder.

According to a preferred embodiment, the wafer inactive edge residue removing device further includes a wafer stage and a mobile device for adsorbing the wafer thereon and rotating the wafer, the mobile device Located on one side of the wafer stage, the buffer member is disposed on the mobile device, and the mobile device moves the adjustment device and the polishing device approaches or away from the wafer.

The mobile device includes a fixing base, a servo shaft and a sliding seat. The fixing base is disposed on one side of the wafer carrier. The servo shaft is movably disposed on the fixing base, and the sliding seat is movably disposed. In the servo shaft, a buffering member of the adjusting device is disposed on the sliding seat. The servo shaft moves along the fixed seat, and moves to the upper surface of the wafer with the sliding seat, the adjusting device and the grinding device, and the sliding seat carries the adjusting device and the grinding device along the servo shaft. Move up or down.

Preferably, the wafer inactive edge residue removing device further comprises a wafer thickness sensor disposed on the base for sensing the actual thickness of the wafer to establish a residue residual standard value. When the residual amount of the uneven residue is reduced to the residual amount standard value, the wafer stage and the spindle motor stop rotating.

Preferably, the wafer thickness sensor is a laser sensor.

According to a preferred embodiment, wherein the abrasive tool is a milling cutter.

The effect of the present invention is that the unevenness on the surface of the ineffective side of the wafer can be almost or completely removed, and the ineffective side of the wafer is not scratched, thereby improving the yield of the wafer.

1‧‧‧ wafer

2‧‧‧Residues

202‧‧‧Uphill section

204‧‧‧downhill section

206‧‧‧ highest point

10‧‧‧ Wafer stage

12‧‧ ‧ socket

20‧‧‧Mobile devices

22‧‧‧ Fixed seat

24‧‧‧Servo axis

26‧‧‧Slide

30‧‧‧Adjustment device

32‧‧‧ cushioning parts

321‧‧‧ body

3212‧‧‧ Block

3214‧‧‧Cylinder seat

32142‧‧‧through slot

3216‧‧‧ Slider

322‧‧‧ pneumatic cylinder

323‧‧‧Piston rod

325‧‧‧pressure regulator

34‧‧‧Base

342‧‧‧Sliding section

3422‧‧‧Base

3424‧‧‧ Ontology

34242‧‧‧ Track

344‧‧‧ board

346‧‧‧Clip seat

40‧‧‧ Wafer Thickness Sensor

50‧‧‧ grinding device

52‧‧‧Spindle motor

54‧‧‧ grinding tools

Figure 1 is a top view of the wafer.

Figure 2 is a side view of the wafer.

FIG. 3A is a perspective view of the wafer ineffective edge residue removing device of the present invention.

FIG. 3B is an exploded view of the wafer ineffective edge residue removing device of the present invention.

3C is a perspective view of the wafer stage of the wafer inactive edge residue removing device of the present invention.

FIG. 3D is an exploded view of the moving device of the wafer ineffective edge residue removing device of the present invention.

FIG. 3E is an exploded view of the adjustment device, the wafer thickness sensor, and the polishing device of the wafer ineffective edge residue removing device of the present invention.

FIG. 4 is a schematic view showing the unevenness of the wafer ineffective side residue removing device without clearing the uneven edge of the wafer ineffective side.

FIG. 5A is a schematic view showing the grinding tool of the polishing apparatus of the wafer ineffective edge residue removing device of the present invention climbing up the uneven slope of the uneven residue.

FIG. 5B is a schematic view showing the grinding tool of the polishing apparatus of the wafer ineffective side residue removing device of the present invention located at the highest point of the upper and lower slopes of the uneven residue.

FIG. 5C is a schematic view showing the lowering section of the polishing tool of the polishing apparatus of the wafer ineffective edge residue removing device of the present invention which is lowered to the uneven residue.

FIG. 6 is a schematic view showing the wafer ineffective edge residue removing device of the present invention completely removing the unevenness of the surface of the ineffective side of the wafer.

The implementation of the present invention will be described in more detail below with reference to the drawings and component symbols, so that those skilled in the art can implement the present specification after studying the present specification.

Please refer to FIG. 3A to FIG. 4 . FIG. 3A is a perspective view of the wafer ineffective edge residue removing device. FIG. 3B is an exploded view of the wafer inactive edge residue removing device. FIG. 3D is a perspective view of a wafer stage of the ineffective edge residue removing device, FIG. 3D is an exploded view of the moving device of the wafer ineffective edge residue removing device, and FIG. 3E is a schematic view of the wafer ineffective edge residue removing device. An exploded view of the adjustment device, the wafer thickness sensor, and the polishing device. FIG. 4 is a schematic view showing the uneven residue of the wafer ineffective side residue removing device without clearing the ineffective side of the wafer. The present invention provides a wafer ineffective edge residue removing device for removing the uneven residue 2 on the surface of the ineffective side of the wafer 1 as shown in FIGS. 1 and 2, the uneven residue 2 The surface has at least one uphill section 202 and at least a lower section 204. The wafer inactive edge residue removing device includes a wafer stage 10, a moving device 20, an adjusting device 30, a wafer thickness sensor 40, and a grinding device 50.

The wafer stage 10 is for adsorbing a wafer 1 thereon and rotating the wafer 1. More specifically, the wafer stage 10 includes a holder 12, an adsorption device, and a motor. The socket 12 defines a plurality of through holes, the adsorption device is disposed under the socket 12, and the wafer 1 is disposed on the top surface of the socket 12. When the adsorption device is opened, air passing between the wafer 1 and the top surface of the socket 12 passes. The through hole is evacuated by the adsorption device to bring a vacuum between the wafer 1 and the top surface of the socket 12, so that the wafer 1 is adsorbed on the top surface of the socket. The rotation shaft of the motor is connected to the socket 12 so that the motor can drive the socket 12 to drive the rotation of the wafer 1, and can control the rotation speed and the rotation direction of the wafer.

The mobile device 20 is disposed on one side of the wafer stage 10, and the movement adjusting device 30, the wafer thickness sensor 40, and the polishing device 40 are close to or away from the wafer 1. More specifically, the mobile device 20 includes a The fixing base 22, a servo shaft 24 and a sliding seat 26 are provided. The holder 22 is provided on one side of the wafer stage 10. The servo shaft 24 is movably disposed on the fixed seat 22, and the slide 26 is movably disposed on the servo shaft 24. Preferably, the servo shaft 24 moves along the track of the fixed seat 22 in the X-axis and the Z-axis direction, and moves to the crystal with the slider 26, the adjusting device 30, the wafer thickness sensor 40 and the grinding device 50. Above the circle 1 or removed from above the wafer 1, the carriage 26 moves in the Z-axis direction along a track of the servo shaft 24, and carries the adjusting device 30, the wafer thickness sensor 40 and the grinding device 50. Move up or down.

The adjusting device 30 includes a buffer member 32 and a base 34. The cushioning member 32 is disposed on the sliding seat 26, and the base 34 is movably disposed on the cushioning member 32. More specifically, the cushioning member 32 includes a body 321, a two-pressure cylinder 322, two piston rods 323, a gas source (not shown), and a pressure regulating valve 325. The base 321 includes a plurality of blocks 3212, a cylinder block 3214 and a slider 3216. One block 3212 is disposed on the slide block 26, and the other blocks 3212 are coupled to each other. One side of the cylinder block 3214 is disposed in one of the blocks 3212 and is opened. The second slot 32142 and the slider 3216 are disposed on the other side of the cylinder block 3214. The two pneumatic cylinders 322 are disposed in the two through slots 32142. One end of the two piston rods 323 is movably disposed in the two pneumatic cylinders 322, and the other ends of the two piston rods 323 are disposed on the base 34, as shown in FIG. 5A. The pressure regulating valve 325 is disposed between the two pneumatic cylinders 322 and the gas source, and controls the air pressure inside the two pneumatic cylinders 322 to a set value. The base 34 includes a sliding portion 342, a plate body 344 and a clamping seat 346. The sliding portion 342 includes a base 3422 and a body 3424. The bottom end of the body 3424 is disposed at one side of the top end of the base 3422, so that the sliding portion 342 has an L shape. A side of the body 3424 defines a track 34242, and the slider 3212 is movably disposed on the track 34242. The other end of the two piston rods 323 is disposed at the top end of the base 3422. One side of the plate body 344 is fixed to the other side of the body 3424. The holder 346 is disposed on the other side of the body 344 opposite the body 3424.

The wafer thickness sensor 40 is disposed on the susceptor 34 for sensing the actual thickness of the wafer 1 to establish a residue residual standard value. Preferably, the wafer thickness sensor 40 is disposed on the board body 344. The wafer thickness sensor 40 is a laser sensor that detects the actual thickness of the wafer 1 by means of a laser.

The grinding apparatus 50 includes a spindle motor 52 and an abrasive tool 54. The spindle motor 52 is provided on the base 34. Preferably, the spindle motor 52 is clamped by the clamp 346. The grinding tool 54 is rotatably provided to the spindle motor 52, and the spindle motor 52 can control the rotational speed and the rotational direction of the abrasive tool 54. Preferably, the abrasive tool 54 is a milling cutter. However, it is not limited thereto, and any tool capable of grinding the uneven residue 2 may be the grinding tool 54, which will be described first. When the polishing device 54 is positioned above the wafer 1, the adjustment device 30 controls the polishing tool 54 to maintain a distance from the surface of the inactive edge of the wafer 1, and the abrasive tool 54 rotatably contacts the surface of the uneven residue 2. More specifically, the pressure regulating valve 325 controls the air pressure inside the two pneumatic cylinder 322 to the set value, so that the maximum length of the two piston rods 323 protruding from the two pneumatic cylinders 322 is limited, and the grinding tool can be indirectly made. 54 is at a distance from the surface of the inactive edge of wafer 1, whereby polishing tool 54 does not contact the surface of the inactive edge of wafer 1.

Referring to FIG. 5A, FIG. 5A is a schematic diagram of the grinding tool of the polishing apparatus for the wafer ineffective edge residue removing device of the present invention climbing up the uneven slope of the uneven residue, and the grinding tool 54 is climbed uphill while rotating. At the time of the segment 202, the grinding device 50 moves upward, and the driving base 34 pushes the piston rod 323 into the interior of the pneumatic cylinder 322, so that the air pressure inside the pneumatic cylinder 322 is greater than the set value to generate a buffering force.

Please refer to FIG. 5B. FIG. 5B is a schematic diagram showing the highest point between the upper and lower bands of the unevenness of the grinding tool of the polishing apparatus of the wafer ineffective edge residue removing device. When the abrasive tool 54 is located at a highest point 206 between the upper and lower slope sections 202, 204 of the rugged residue 2, the cushioning force generated by the pneumatic cylinder 322 is maximized.

Referring to FIG. 5C, FIG. 5C is a schematic diagram of the grinding tool of the polishing apparatus for the wafer ineffective edge residue removing device of the present invention descending on the downhill section of the uneven residue. After the abrasive tool 54 has passed the highest point 206, it is lowered along the downhill section 204 while rotating. When the grinding tool 54 rotates along the downhill section 204 while rotating, the air pressure inside the pneumatic cylinder 322 gradually decreases, and the piston rod 323 is pushed out of the pneumatic cylinder 322 by the buffering force, and the piston rod 323 is pushed by the buffering force. The base 34 is moved downward with the grinding device 50. When the air pressure inside the pneumatic cylinder 322 returns to the set value, the buffering force disappears, the piston rod 323 stops moving, and the base 34, the wafer thickness sensor 40 and the grinding device 50 stop moving downward, and the grinding tool 50 returns. The position is maintained at a distance from the surface of the ineffective side of the wafer 1, thereby preventing the polishing tool 50 from scratching the surface of the ineffective side of the wafer 1, thereby improving the yield of the wafer 1.

As the wafer 1 is continuously rotated by the wafer stage 10, the uneven residue 2 on the surface of the ineffective side is gradually worn away by the grinding tool 50. Referring to FIG. 6, when the residual amount of the uneven residue 2 is lowered to the residual amount standard value, the uneven residue 2 on the surface representing the ineffective side of the wafer 1 is almost cleared or even completely removed. Clean and improve the yield of the wafer 1, the user can directly stop the motor of the wafer stage 10 and the spindle motor 52 of the polishing apparatus 50 to rotate.

The adjusting device 30 of the wafer ineffective edge residue removing device of the present invention controls the polishing tool 54 to maintain a distance from the surface of the ineffective side of the wafer 1, and can smoothly rotate along the surface of the uneven residue 2 to be ground. Not only the purpose of almost or completely removing the unevenness 2 on the surface of the ineffective side of the wafer 1 but also the effect of not scratching the surface of the ineffective side of the wafer 1 can be achieved, and the wafer 1 can be improved. Yield.

Furthermore, the carriage 26 can avoid severe vibration during grinding and can limit the linear motion of the adjustment device 30, the wafer thickness sensor 40, and the polishing device 50.

The above description is only for the purpose of explaining the preferred embodiment of the present invention, and is not intended to impose any form of limitation on the creation, so that any modification or alteration of the creation made in the same creative spirit is provided. , should still be included in the scope of protection of this creative intent.

10‧‧‧ Wafer stage

20‧‧‧Mobile devices

30‧‧‧Adjustment device

40‧‧‧ Wafer Thickness Sensor

50‧‧‧ grinding device

52‧‧‧Spindle motor

54‧‧‧ grinding tools

Claims (9)

A wafer ineffective edge residue removing device for removing irregularities on a surface of an ineffective side of a wafer, the surface of the uneven residue having at least one uphill section and at least a lower slope section, The wafer ineffective edge residue removing device comprises: an adjusting device comprising a buffering member and a base, wherein the base is movably disposed on the buffering member; and a grinding device comprising a spindle motor and an abrasive tool, a spindle motor is disposed on the base, the grinding tool is rotatably disposed on the spindle motor; wherein, when the abrasive tool is located above the wafer, the adjusting device controls the polishing tool to maintain a surface of the ineffective side of the wafer a distance and the abrasive tool rotatably contacts the surface of the rugged residue, the grinding device moves upward as the grinding tool climbs up the upslope and drives the base to move relative to the cushioning member The buffer member generates a buffering force, and when the grinding tool is rotated along the lower slope portion while rotating, the buffer member pushes the base to carry the research by the buffering force. Means for moving downward. The wafer ineffective side residue removing device according to claim 1, wherein the buffering member comprises a body, at least one pneumatic cylinder, at least one piston rod, a gas source, and a pressure regulating valve. Provided in the seat body, one end of the piston rod is movably disposed in the pneumatic cylinder, the other end of the piston rod is disposed at the base, and the pressure regulating valve is disposed between the pneumatic cylinder and the gas source, and Controlling the air pressure inside the pneumatic cylinder at a set value to limit the piston rod from extending from the pneumatic cylinder a maximum length that is controlled while maintaining the abrasive tool at a distance from the surface of the inactive edge of the wafer; wherein the grinding device moves upwardly and drives the base as the abrasive tool climbs up the upslope The seat pushes the piston rod into the interior of the pneumatic cylinder so that the air pressure inside the pneumatic cylinder is greater than the set value to generate the buffering force, and when the grinding tool rotates along the lower slope section, the inside of the pneumatic cylinder The air pressure gradually decreases and the piston rod pushes the piston rod out of the pneumatic cylinder, and the piston rod pushes the base to move downward with the grinding device. When the air pressure inside the pneumatic cylinder returns to the set value, the When the cushioning force disappears, the piston rod stops moving, the base and the grinding device stop moving downward, and the grinding tool returns to a position that is at a distance from the surface of the ineffective side of the wafer. The wafer invalid side residue removing device according to claim 2, wherein the base body comprises a plurality of blocks, a cylinder block and a slider, wherein one block is disposed on the sliding seat, and the other blocks are mutually In combination, one side of the cylinder block is disposed in one of the bodies and at least one through slot is defined. The slider is disposed on the other side of the cylinder block, and the pneumatic cylinder is disposed in the through slot. The wafer ineffective edge residue removing device according to claim 2, wherein the base body comprises a slider, the base comprises a sliding portion, a plate body and a clamping seat, and the sliding portion comprises a sliding portion a base and a body, the bottom end of the body is disposed on a side of the top end of the base, so that the sliding portion is L-shaped, a side of the body defines a track, the slider is movably disposed on the track, the piston The other end of the rod is located at A top end of the base, one side of the plate body is fixed to the other side of the body, the clamping seat is disposed on the other side of the plate body opposite to the body, and the spindle motor is clamped by the clamping seat. The wafer inactive edge residue removing device according to any one of claims 1 to 4, further comprising a wafer carrier and a mobile device, wherein the wafer carrier is configured to adsorb the wafer thereon, And rotating the wafer, the moving device is disposed on one side of the wafer stage, the buffering device is disposed on the mobile device, and the moving device moves the adjusting device and the polishing device approaches or away from the wafer. The wafer invalid side residue removing device according to claim 5, wherein the moving device comprises a fixing base, a servo shaft and a sliding seat, the fixing seat is disposed at one side of the wafer stage. The servo shaft is movably disposed on the fixed seat, the sliding seat is movably disposed on the servo shaft, and the buffering member of the adjusting device is disposed on the sliding seat; wherein the servo shaft moves along the fixed seat The carriage, the adjustment device and the polishing device are moved over the wafer, and the carriage moves up or down along the servo shaft with the adjustment device and the polishing device. The wafer ineffective edge residue removing device according to claim 5, further comprising a wafer thickness sensor disposed on the base for sensing the actual thickness of the wafer to establish a residue The standard value of the residual amount of the object, when the residual amount of the uneven residue is reduced to the standard value of the residual amount, the wafer stage and the spindle motor stop rotating. The wafer ineffective edge residue removing device of claim 7, wherein the wafer thickness sensor is a laser sensor. The wafer ineffective edge residue removing device according to any one of claims 1 to 4, wherein the grinding tool is a milling cutter.