CN114932325A - High-precision laser cutting device for wafer slicing - Google Patents
High-precision laser cutting device for wafer slicing Download PDFInfo
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- CN114932325A CN114932325A CN202210714774.5A CN202210714774A CN114932325A CN 114932325 A CN114932325 A CN 114932325A CN 202210714774 A CN202210714774 A CN 202210714774A CN 114932325 A CN114932325 A CN 114932325A
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- pipe
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- cleaning cover
- dust
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- 238000003698 laser cutting Methods 0.000 title claims abstract description 19
- 239000000428 dust Substances 0.000 claims abstract description 82
- 238000004140 cleaning Methods 0.000 claims abstract description 62
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 37
- 239000010703 silicon Substances 0.000 claims abstract description 37
- 239000013078 crystal Substances 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 22
- 238000005520 cutting process Methods 0.000 claims abstract description 17
- 238000010521 absorption reaction Methods 0.000 claims abstract description 9
- 230000009471 action Effects 0.000 claims abstract description 6
- 238000005096 rolling process Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims 1
- 239000000725 suspension Substances 0.000 claims 1
- 239000000843 powder Substances 0.000 abstract description 2
- 230000005284 excitation Effects 0.000 abstract 1
- 230000007246 mechanism Effects 0.000 description 4
- 244000309464 bull Species 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention provides a high-precision laser cutting device for wafer slicing, which comprises a machine head and a laser knife arranged at the bottom of the machine head, wherein the top of the machine head is fixedly provided with a flange plate which is used for fixing the machine head on a manipulator and enabling the machine head to carry the laser knife to carry out rotary cutting action above a silicon crystal plate material, one end of a cleaning cover is provided with a baffle plate which follows the laser knife to carry out the same rotary track above the silicon crystal plate material, a scraper can clean downwards a curled edge generated by high heat at the periphery of a light wafer plate during excitation cutting, the cleaned curled edge powder can be absorbed into a micro dust absorption fan by a dust absorption pipe, the smoothness of the periphery of the cut wafer plate is ensured, the diameter size of the wafer plate can be accurately controlled due to the treatment of the curled edge at the outer circumference of the wafer plate, and the dust absorption function can prevent the dust from being re-coated on the wafer plate when the scraper continues to move, meanwhile, the influence of dust on the surface precision of the next wafer to be cut off due to the fact that the dust is coated on the silicon crystal material plate is avoided.
Description
Technical Field
The invention relates to the technical field of laser cutting, in particular to a high-precision laser cutting device for wafer slicing.
Background
A wafer plate is a silicon wafer unit cut out from a silicon wafer plate, and the wafer plate is used as a silicon wafer in the fabrication of a semiconductor integrated circuit and is called a wafer because the shape thereof is circular; various circuit device structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions. The original material of the wafer is silicon, the surface of the earth crust has inexhaustible silicon dioxide, the crystal round plates are cut from the silicon crystal material plate by adopting a streamer cutting device, and a plurality of round crystal round plates can be obtained from one silicon crystal plate material by a laser cutting mode.
When the laser cutter head is used for cutting the silicon wafer into the round, because the thermal conductivity of the wafer is poor, the edge melting phenomenon can occur at the cut part in the process of laser cutting, the cut edge area can be rolled upwards due to the edge melting phenomenon when the laser advances, the peripheral quality of the wafer is influenced, and the diameter precision of the wafer is difficult to control.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides the high-precision laser cutting device for wafer slicing, which can be used for cleaning the curled edge excess material generated by high-temperature cutting at the laser trimming part of the wafer so as to improve the diameter precision of the wafer.
The invention adopts the technical scheme that the high-precision laser cutting device for wafer slicing comprises a machine head and a laser knife arranged at the bottom of the machine head, wherein a flange plate used for fixing the machine head on a manipulator and enabling the machine head to drive the laser knife to perform rotary cutting action above a silicon crystal plate material is fixed at the top of the machine head, a vertically downward hanging rod is fixed at the bottom of the machine head, a cleaning cover horizontally extending at the top of the silicon crystal plate material is connected at the bottom end of the hanging rod, a baffle plate which follows the laser knife to perform the same rotary track above the silicon crystal plate material is arranged at one end of the cleaning cover, a caster which is in rolling contact with the surface of the silicon crystal plate material is arranged at the other end of the cleaning cover, the baffle plate is an arc-shaped plate which is bent towards the port direction of the cleaning cover, and an arc-shaped scraper which is consistent with the arc-shaped profile of the baffle plate and is in contact with the surface of the silicon crystal plate material is arranged at the bottom end of the baffle plate, the cleaning device is characterized in that a gap is reserved between the bottom surface of the cleaning cover and the bottom surface of the scraper, a fan is fixed on the top surface of the cleaning cover, a dust suction pipe is connected to an air inlet of the fan, the dust suction pipe penetrates into the cleaning cover from the top surface of the cleaning cover and extends to one end, provided with a baffle, of the cleaning cover along an inner cavity of the cleaning cover, the air inlet direction of the dust suction pipe faces to the dust suction cover of the baffle, an inclined plate located on the opposite surface of the baffle is further arranged at the end of the cleaning cover, the inclined plate is close to the dust suction cover and faces to the baffle, a clamping groove is formed in the middle of the cleaning cover, a collecting pipe is arranged in the clamping groove, the dust suction pipe penetrates into the collecting pipe, and a discharge hole corresponding to the collecting pipe is formed in a pipeline of the dust suction pipe.
Preferably, the head is provided with a threaded connection hole, and the top end of the boom is provided with an external thread which is detachably connected to the threaded connection hole through the external thread.
Preferably, the baffle is an arc-shaped thin-sheet spring plate, and one end of the baffle close to the cleaning cover is provided with a hinge shaft, through which the baffle is movably connected to the cleaning cover and can rotate angularly around the hinge shaft at the end side of the cleaning cover towards or away from the dust hood.
Preferably, a rotating rod penetrates through the cleaning cover along the length direction of the cleaning cover, one end of the rotating rod extends to be connected with a caster and can synchronously rotate in the cleaning cover along with the caster, the other end of this bull stick extends to and is close to in the suction hood, and correspond the inboard at the baffle, the tip at the bull stick is fixed with the trigger bar that can follow its synchronous revolution, be connected with on the inboard arcwall face of baffle and be close to in the bearing block of hinge, the trigger bar passes through connecting rod structure swing joint on the bearing block, the trigger bar utilizes the mode of connecting rod structure drive bearing block to drive the baffle when the bull stick is rotatory and is close to or keeps away from in the direction round trip movement of suction hood, the outside of clearance hood is equipped with impact spring, impact spring's one end is connected on the outer wall of clearance hood, impact spring's the other end extends to and connects on the lateral surface of baffle, a rotation amplitude for the restriction baffle produces because of the collision.
Preferably, the dust suction pipe passes near the rotating rod, and the dust suction pipe and the rotating rod penetrate through the collecting pipe together.
Preferably, the collecting pipe is composed of two parts, and comprises a thick pipe connected in the clamping groove and a thin pipe spliced and welded with the thick pipe, wherein the thin pipe is close to the baffle, the dust hood corresponds to the thin pipe, and the thin pipe is gradually inclined downwards to the thick pipe from one end close to the baffle to the other end.
As a further preference, the bottom of the collection tube is horizontal.
Preferably, the rotating rod is provided with a screw feeder, one end of the screw feeder extends into the thick pipe, the other end of the screw feeder extends into the thin pipe, and the end extending into the thin pipe is spaced from the outer end of the thin pipe.
Compared with the prior art, the invention has the beneficial effects that: the hanger rod on the machine head is provided with a cleaning mechanism which comprises a baffle plate with a scraper at the bottom and a dust suction fan positioned on the mechanism, the scraper follows the rear side of the laser tool bit along with the baffle plate, the laser tool bit utilizes laser to cut a wafer plate on a silicon wafer plate, the scraper can clean the edge curl generated by high heat at the periphery of the optical wafer plate downwards during the cutting, the cleaned edge curl powder can be absorbed into the miniature dust absorption fan by the dust absorption pipe, because the edge curling of the wafer plate is processed during the ring cutting and the processed dust is cleaned, the smoothness of the periphery of the cut wafer plate is ensured, since the outer circumference of the wafer plate is curled, its diameter size is precisely controlled, meanwhile, the dust collection function can prevent the scraper from moving continuously to re-coat dust on the wafer plate and prevent the scraper from coating on the silicon wafer plate to influence the surface precision quality of the next wafer to be cut off.
Drawings
FIG. 1 is a schematic view of the structure of the present invention;
FIG. 2 is an enlarged view of part A of FIG. 1;
FIG. 3 is a schematic diagram of the present invention taken from FIG. 1 at a rear side view angle;
FIG. 4 is a schematic view showing a cross-sectional internal structure of the collecting tube according to the present invention;
FIG. 5 is a schematic bottom plan view of the handpiece of the present invention;
FIG. 6 is a schematic view showing a screw propeller mounted on a rotary shaft according to a second embodiment of the present invention;
FIG. 7 is a schematic view of the cut-away internal structure of the present invention, which is drawn from FIG. 6;
fig. 8 is a schematic diagram of a case where a wafer plate is cut out from a silicon wafer plate by the present dicing apparatus and obtained (GJ denotes a silicon wafer plate material, JY denotes an obtained wafer plate, B denotes a laser blade, and C denotes all mechanisms of the cleaning cover and the upper surface thereof in the present invention).
In the figure: 1. a laser knife; 2. a machine head; 3. a flange plate; 4. a boom; 5. cleaning the cover; 6. a fan; 7. a baffle plate; 8. a caster wheel; 9. an arc-shaped scraper; 11. a dust collection pipe; 12. a dust hood; 13. a sloping plate; 14. a clamping groove; 15. a collection pipe; 16. a discharge hole; 17. connecting a threaded hole; 18. a hinge shaft; 19. a rotating rod; 20. a trigger lever; 21. a pressure-bearing block; 22. an impact spring; 23. a thick pipe; 24. a thin tube; 25. a screw feeder.
Detailed Description
The technical solutions of the present invention will be described in detail and fully with reference to the accompanying drawings, and it should be understood that the described embodiments are only some embodiments, but not all embodiments, of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
One embodiment is shown in fig. 1-8.
The invention provides a high-precision laser cutting device for wafer slicing, which comprises a machine head 2 and a laser knife 1 arranged at the bottom of the machine head 2, wherein a flange 3 which is used for fixing the machine head 2 on a manipulator and enabling the machine head 2 to carry the laser knife 1 to carry out rotary cutting action above a silicon crystal plate material is fixed at the top of the machine head 2, the invention aims to provide the high-precision laser cutting device, on the basis of the existing cutting device, a vertically downward hanging rod 4 is fixed at the bottom of the machine head 2, a cleaning cover 5 which horizontally extends at the top of the silicon crystal plate material is connected at the bottom end of the hanging rod 4, a baffle 7 which follows the laser knife 1 to carry out the same rotary track above the silicon crystal plate material is arranged at one end of the cleaning cover 5, and in the process that the laser knife 1 cuts the silicon crystal plate in a circular track, the cleaning cover 5 connected with the hanging rod 4 follows the silicon crystal plate material to synchronously, the other end of the cleaning cover 5 is provided with a caster 8 which is in rolling contact with the surface of a silicon crystal plate material, namely when the cleaning cover 5 moves along a circular track along the laser knife 1, stable guiding is realized by a mode that the caster 8 rolls along the surface of the silicon crystal plate, a baffle 7 on the cleaning cover 5 is an arc-shaped plate which is bent towards the port direction of the cleaning cover 5 and also follows the rear side of the laser knife 1, and can smoothly move along a cutting trace synchronously with the moving track of the laser knife 1, so that a warped edge or curled edge area which appears due to high temperature in cutting is scraped by an arc-shaped scraper 9 at the bottom of the warped edge or curled edge area, a wafer is cut off from the silicon crystal plate by the laser knife 1 and stays in the silicon crystal plate, after the silicon crystal plate is lifted up after cutting is finished, the cut-off wafer plate downwards leaks from a cutting hole, and curled edges formed when the cut-off wafer plate is cut off due to high temperature are synchronously scraped along the moving track of the laser knife 1 by the arc-shaped scraper 9 And cleaning is carried out, so that the precision of the edge of the wafer is improved.
A fan 6 is fixed on the top surface of the cleaning cover 5, a dust suction pipe 11 is connected to an air inlet of the fan 6, the dust suction pipe 11 penetrates into the cleaning cover 5 from the top surface of the cleaning cover 5, and extends to one end of the cleaning cover 5, where the baffle 7 is installed, along the inner cavity of the cleaning cover 5, the baffle 7 is an arc-shaped sheet spring plate, a dust suction cover 12 facing the baffle 7 is arranged at the end of the dust suction pipe 11, an inclined plate 13 is also arranged at the end of the cleaning cover 5, the inclined plate 13 is close to the dust suction cover 12, the inclined surface of the inclined plate faces the baffle 7, a clamping groove 14 is formed in the middle of the cleaning cover 5, a collecting pipe 15 is arranged in the clamping groove 14, the dust suction pipe 11 penetrates into the collecting pipe 15, a discharge hole 16 corresponding to the collecting pipe 15 is formed in the pipeline of the dust suction pipe 11, the arc-shaped scraper 9 scrapes off the residual material curled edge on the wafer plate from the same side as the dust suction cover 12 by the baffle 7, when the fan 6 is powered on, the residual dust is sucked into the dust suction pipe 11 by the dust suction hood 12, meanwhile, the inclined plate 13 can block the dust formed when the arc scraper 9 scrapes the curled residual, and the scraped residual dust can be ensured to be concentrated near the dust suction hood 12 to the maximum extent, so that the purpose of absorbing and cleaning the scraped residual dust is achieved, and the residual dust is prevented from being adhered to the wafer plate again to influence the edge precision of the wafer plate. Threaded connection hole 17 has been seted up on the aircraft nose 2, and the top of jib 4 is equipped with the external screw thread, and it is connected in threaded connection hole 17 through the external screw thread with removable mode, and this mechanism can be followed aircraft nose 2 and all demolishd promptly, is convenient for clear up alone or change the accessory after demolising.
The baffle 7 is provided with a hinge shaft 18 near one end of the cleaning cover 5, the baffle 7 is movably connected to the cleaning cover 5 through the hinge shaft 18 and can rotate around the hinge shaft 18 in an angle direction towards the dust hood 12 or away from the dust hood 12 at the end side of the cleaning cover 5, in order to enable the curled edge formed when the arc scraper 9 cuts the silicon crystal plate to obtain the crystal round plate to be scraped and cleaned, the curled edge is blocked to the position near the dust hood 12 by the baffle 7 or directly enters the collecting pipe 15 from the position of the dust hood 12, therefore, the baffle 7 is movably connected to the cleaning cover 5 through the hinge shaft 18, the baffle 7 is a sheet-type spring plate, a rotating rod 19 penetrates through the cleaning cover 5 along the length direction, one end of the rotating rod 19 extends to be connected to the caster 8 and can synchronously rotate in the cleaning cover 5 along with the caster 8, the other end of the rotating rod 19 extends to be near the dust hood 12, the trigger rod 20 is fixed at the end of the rotating rod 19 and can rotate synchronously with the rotating rod, the inner arc surface of the baffle 7 is connected with a bearing block 21 close to the hinge shaft 18, the trigger rod 20 rotates and can drive the baffle 7 to rotate (swing) back and forth (mainly, the trigger rod 20 and the bearing block 21 are connected by a crank connecting rod structure) by using a connecting rod structure, and the baffle 7 has certain impact force under the action of an impact spring 22 when acting, especially when acting towards the pipe orifice of the collecting pipe 15 and the direction of the dust collection cover 12, the residual dust on the surface of the silicon crystal plate, which is scraped by the arc scraper 9, is shielded near the dust collection cover 12 or directly slammed into the collecting pipe 15, and because the pipeline of the dust collection pipe 11 is provided with a discharge hole 16 corresponding to the collecting pipe 15, the dust in the collecting pipe 15 can also be sucked into the dust collection pipe 11 from the discharge hole 16 on the dust collection pipe 11, and finally discharged outside uniformly through an air outlet on the fan 6.
As shown in fig. 4, the collecting pipe 15 is composed of two parts, including a thick pipe 23 connected to the inside of the clamping groove 14 and a thin pipe 24 welded together with the thick pipe 23, the collecting pipe 15 formed by combining the two parts is a reducing step pipe, the residual dust enters the thin pipe 24 of the collecting pipe 15, then enters the thick pipe 23 through the step, finally is sucked into the dust suction pipe 11 through the discharge hole 16 on the dust suction pipe 11, and is collected and discharged outside through the air outlet on the fan 6 in a unified way with the dust entering the pipeline through the dust suction cover 12, namely, one part for sucking the residual dust is the dust suction cover 12, the second part is the collecting pipe 15 with a large caliber, thereby the scraped dust can be cleaned completely to the maximum extent, and as shown in fig. 6 and 7, the rotating rod 19 is also provided with a spiral feeder 25, one end of the spiral feeder 25 extends into the thick pipe 23, the other end extends into the thin tube 24, the spiral feeder 25 can reasonably collect the residual dust sucked into the collecting tube 15 into the thick tube 23 when rotating along with the rotating rod 19, and the residual dust is not easy to reversely flow back at the reducing steps of the thick tube 23 and the thin tube 24.
The dust suction pipe 11 passes near the rotating rod 19, and the dust suction pipe 11 and the rotating rod 19 penetrate through the collecting pipe 15 together, so that the dust suction pipe 11 is prevented from being influenced when the rotating rod 19 rotates, and the rotating action of the rotating rod 19 is prevented from being obstructed by the existence of the dust suction pipe 11.
The above-described embodiments further explain the object, technical means, and advantageous effects of the present invention in detail. It should be understood that the above description is only exemplary of the present invention, and is not intended to limit the scope of the present invention. It should be understood that any modifications, equivalents, improvements and the like, which come within the spirit and principle of the invention, may occur to those skilled in the art and are intended to be included within the scope of the invention.
Claims (8)
1. The utility model provides a high accuracy laser cutting device for wafer slicing, includes aircraft nose (2), sets up laser sword (1) bottom aircraft nose (2), its characterized in that: the cutting device is characterized in that a flange plate (3) used for fixing the cutting device on a manipulator and enabling the machine head (2) to drive a laser knife (1) to perform rotary cutting action above a silicon crystal plate material is fixed at the top of the machine head (2), a vertically downward hanging rod (4) is fixed at the bottom of the machine head, a cleaning cover (5) horizontally extending at the top of the silicon crystal plate material is connected at the bottom end of the hanging rod (4), a baffle (7) rotating along the same track above the silicon crystal plate material along with the laser knife (1) is arranged at one end of the cleaning cover (5), casters (8) in rolling contact with the surface of the silicon crystal plate are arranged at the other end of the cleaning cover (5), the baffle (7) is an arc-shaped plate bending towards the port direction of the cleaning cover (5), and an arc-shaped scraper (9) which is consistent with the arc-shaped profile of the baffle (7) and is in contact with the surface of the silicon crystal plate is arranged at the bottom end of the baffle (7), a fan (6) is fixed on the top surface of the cleaning cover (5), a dust suction pipe (11) is connected on the air inlet of the fan (6), the dust suction pipe (11) penetrates into the cleaning cover (5) from the top surface of the cleaning cover (5), and the dust absorption pipe (11) extends to one end of the cleaning cover (5) provided with the baffle (7) along the inner cavity of the cleaning cover (5), the end of the dust absorption pipe (11) is also provided with a dust absorption cover (12) facing to the baffle (7), the end of the cleaning cover (5) is also provided with an inclined plate (13) positioned on the opposite surface of the baffle (7), the inclined plate (13) is close to the dust absorption cover (12) and the inclined angle of the inclined plate faces to the baffle (7), a clamping groove (14) is arranged in the middle of the cleaning cover (5), a collecting pipe (15) is arranged in the clamping groove (14), a dust collecting pipe (11) penetrates through the collecting pipe (15), and a discharge hole (16) corresponding to the collection pipe (15) is arranged on the pipeline of the dust collection pipe (11).
2. The laser cutting device with high precision for wafer slicing as claimed in claim 1, wherein the head (2) is provided with a threaded connection hole (17), and the top end of the suspension rod (4) is provided with an external thread which is detachably connected to the threaded connection hole (17) through the external thread.
3. The high-precision laser cutting device for wafer slicing as claimed in claim 1, wherein the baffle (7) is an arc-shaped thin plate spring plate, a hinge shaft (18) is provided at one end of the baffle (7) close to the cleaning cover (5), the baffle (7) is movably connected to the cleaning cover (5) through the hinge shaft (18), and can be angularly rotated around the hinge shaft (18) towards the dust hood (12) or away from the dust hood (12) at the end side of the cleaning cover (5).
4. The high-precision laser cutting device for wafer slicing as claimed in claim 3, wherein a rotating rod (19) penetrates through the cleaning cover (5) along its length direction, one end of the rotating rod (19) extends to be connected to the caster (8) and can rotate synchronously with the caster (8) in the cleaning cover (5), the other end of the rotating rod (19) extends to be close to the dust hood (12) and corresponds to the inner side of the baffle (7), a triggering rod (20) capable of rotating synchronously with the rotating rod is fixed at the end of the rotating rod (19), a bearing block (21) close to the hinge shaft (18) is connected to the arc-shaped surface of the inner side of the baffle (7), the triggering rod (20) is movably connected to the bearing block (21) through a connecting rod structure, and the triggering rod (20) can drive the bearing block (21) in a manner of driving the connecting rod structure to drive the baffle (7) to move back and forth in a direction close to or far from the dust hood (12) when rotating along with the rotating rod (19), the outside of clearance cover (5) is equipped with impact spring (22), and the one end of impact spring (22) is connected on the outer wall surface of clearance cover (5), and the other end of impact spring (22) extends to and is connected on the lateral surface of baffle (7) for the rotation amplitude that restriction baffle (7) produced because of the collision.
5. The high-precision laser cutting device for wafer slicing as set forth in claim 4, wherein the dust suction pipe (11) is routed near the rotating rod (19), and the dust suction pipe (11) and the rotating rod (19) jointly penetrate the collecting pipe (15).
6. The laser cutting device with high precision for wafer slicing as claimed in claim 5, characterized in that the collecting pipe (15) is composed of two parts, including a thick pipe (23) connected in the clamping groove (14) and a thin pipe (24) welded together with the thick pipe (23), wherein the thin pipe (24) is close to the baffle plate (7), the dust hood (12) is corresponding in the thin pipe (24), and the thin pipe (24) is gradually inclined downwards to the thick pipe (23) from one end close to the baffle plate (7) to the other end.
7. The laser cutting device for wafer slicing according to claim 6, wherein the bottom of the collecting pipe (15) is a horizontal plane.
8. The high-precision laser cutting device for wafer slicing as claimed in claim 7, wherein a screw feeder (25) is arranged on the rotating rod (19), one end of the screw feeder (25) extends into the thick pipe (23), the other end extends into the thin pipe (24), and the end extending into the thin pipe (24) is spaced from the outer end of the thin pipe (24).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210714774.5A CN114932325A (en) | 2022-06-23 | 2022-06-23 | High-precision laser cutting device for wafer slicing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210714774.5A CN114932325A (en) | 2022-06-23 | 2022-06-23 | High-precision laser cutting device for wafer slicing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114932325A true CN114932325A (en) | 2022-08-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210714774.5A Pending CN114932325A (en) | 2022-06-23 | 2022-06-23 | High-precision laser cutting device for wafer slicing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114932325A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116551210A (en) * | 2023-06-06 | 2023-08-08 | 江苏铭扬激光科技有限公司 | Realize laser cutting machine of pipelined vision location continuous cutting production |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200527522A (en) * | 2003-06-20 | 2005-08-16 | Sumitomo Electric Industries | Method of producing semiconductor single crystal wafer and laser processing device for thereof |
| CN202498566U (en) * | 2012-03-13 | 2012-10-24 | 均豪精密工业股份有限公司 | Cutting and scraping device |
| TWM521800U (en) * | 2016-02-23 | 2016-05-11 | Yi Lay Prec Machinery Co Ltd | Wafer invalid edge residue cleaning apparatus |
| CN108857091A (en) * | 2018-07-12 | 2018-11-23 | 深圳市晓控通信科技有限公司 | A kind of laser cutting machine with safeguard function |
| CN109494148A (en) * | 2018-12-28 | 2019-03-19 | 苏州邱伦智能科技有限公司 | A kind of wafer scraping machine and its application method |
| CN210908586U (en) * | 2019-08-26 | 2020-07-03 | 长春森格睿科技有限公司 | Laser cutting protector |
| CN211305240U (en) * | 2019-12-24 | 2020-08-21 | 青岛路而得电气有限公司 | Laser cutting machine |
| CN112207435A (en) * | 2020-09-30 | 2021-01-12 | 吉安持凡电子科技有限公司 | Multifunctional automatic laser cutting equipment |
| CN212634687U (en) * | 2020-04-10 | 2021-03-02 | 厦门三安光电有限公司 | Wafer laser edge scraping machine |
| CN212885747U (en) * | 2020-06-10 | 2021-04-06 | 昆山逊联融金属制品有限公司 | Cutting probe for metal plate laser cutting machine |
| CN214264327U (en) * | 2020-12-09 | 2021-09-24 | 太仓靓特金属制品有限公司 | Laser plate cutting device for iron display rack |
| CN214602518U (en) * | 2021-04-07 | 2021-11-05 | 青岛松瑞和机械制造有限公司 | Dust collector for laser cutting machine |
| CN216066044U (en) * | 2021-09-09 | 2022-03-18 | 江苏龙海汇鑫智能科技有限公司 | Dust excluding hood for magnetic material laser cutting processing |
-
2022
- 2022-06-23 CN CN202210714774.5A patent/CN114932325A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200527522A (en) * | 2003-06-20 | 2005-08-16 | Sumitomo Electric Industries | Method of producing semiconductor single crystal wafer and laser processing device for thereof |
| CN202498566U (en) * | 2012-03-13 | 2012-10-24 | 均豪精密工业股份有限公司 | Cutting and scraping device |
| TWM521800U (en) * | 2016-02-23 | 2016-05-11 | Yi Lay Prec Machinery Co Ltd | Wafer invalid edge residue cleaning apparatus |
| CN108857091A (en) * | 2018-07-12 | 2018-11-23 | 深圳市晓控通信科技有限公司 | A kind of laser cutting machine with safeguard function |
| CN109494148A (en) * | 2018-12-28 | 2019-03-19 | 苏州邱伦智能科技有限公司 | A kind of wafer scraping machine and its application method |
| CN210908586U (en) * | 2019-08-26 | 2020-07-03 | 长春森格睿科技有限公司 | Laser cutting protector |
| CN211305240U (en) * | 2019-12-24 | 2020-08-21 | 青岛路而得电气有限公司 | Laser cutting machine |
| CN212634687U (en) * | 2020-04-10 | 2021-03-02 | 厦门三安光电有限公司 | Wafer laser edge scraping machine |
| CN212885747U (en) * | 2020-06-10 | 2021-04-06 | 昆山逊联融金属制品有限公司 | Cutting probe for metal plate laser cutting machine |
| CN112207435A (en) * | 2020-09-30 | 2021-01-12 | 吉安持凡电子科技有限公司 | Multifunctional automatic laser cutting equipment |
| CN214264327U (en) * | 2020-12-09 | 2021-09-24 | 太仓靓特金属制品有限公司 | Laser plate cutting device for iron display rack |
| CN214602518U (en) * | 2021-04-07 | 2021-11-05 | 青岛松瑞和机械制造有限公司 | Dust collector for laser cutting machine |
| CN216066044U (en) * | 2021-09-09 | 2022-03-18 | 江苏龙海汇鑫智能科技有限公司 | Dust excluding hood for magnetic material laser cutting processing |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116551210A (en) * | 2023-06-06 | 2023-08-08 | 江苏铭扬激光科技有限公司 | Realize laser cutting machine of pipelined vision location continuous cutting production |
| CN116551210B (en) * | 2023-06-06 | 2024-01-23 | 江苏铭扬激光科技有限公司 | Realize laser cutting machine of pipelined vision location continuous cutting production |
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