TWM521777U - Fingerprint recognition device - Google Patents
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一種指紋辨識裝置,尤指一種將指紋辨識裝置直接整合形成於觸控面板、彩色濾光片(Color Filter,CF)、薄膜電晶體(Thin-Film Transistor,TFT)、液晶模組(Liquid Crystal Module,LCM)其中任一上,進而提升指紋辨識精度的指紋辨識裝置。 A fingerprint identification device, in particular, a fingerprint recognition device directly integrated on a touch panel, a color filter (CF), a thin film transistor (TFT), a liquid crystal module (Liquid Crystal Module) , LCM), on any one of them, to improve the fingerprint identification accuracy of the fingerprint identification device.
隨著多媒體技術之蓬勃發展,行動電話、個人數位助理(Personal Digital Assistant,PDA)、數位相機、個人筆記型電腦或平板或穿戴式裝置等越來越多之智慧型便攜式電子裝置已經成為了人們生活中必備之工具。然而,這些便攜式電子裝置具有很強之個人化的特點。因此一旦這些便攜式電子裝置遭到盜用或是遺失,其內部存儲之資訊,例如電話簿、相片、資料等等都有可能被別人利用,而造成不必要之損失。 With the rapid development of multimedia technology, more and more smart portable electronic devices such as mobile phones, personal digital assistants (PDAs), digital cameras, personal notebook computers or tablets or wearable devices have become people. A must-have tool in life. However, these portable electronic devices are highly personal. Therefore, once these portable electronic devices are stolen or lost, the information stored therein, such as phone books, photos, materials, etc., may be used by others, causing unnecessary losses.
因此,這類產品需要搭配一定之身份認證及許可權管理,以確保使用者的隱私安全。而當前所採用之身份認證的主要方法係有密碼保護,使用者需先輸入正確的密碼至便攜式電子裝置,才能夠進入便攜式電子裝置的操控頁面。然而,密碼保護之安全性較低,原因在於密碼較容易被洩漏或遭到破解。而且假使當使用者忘記密碼的話,也很麻煩。因此,即有採用 指紋辨識之身份認證的便攜式電子裝置問市。由於每個人之指紋都是不同的,因此指紋具有唯一性之特點,使得採用指紋辨識之身份認證的安全性提高很多。並且,利用使用指紋辨識之身份認證的方法也相對方便,令使用者省去了記憶及輸入密碼之繁瑣。 Therefore, such products need to be matched with certain identity authentication and permission management to ensure the privacy of users. The main method of identity authentication currently used is password protection, and the user needs to input the correct password to the portable electronic device before entering the control page of the portable electronic device. However, password protection is less secure because passwords are more likely to be compromised or compromised. And if the user forgets the password, it is also very troublesome. Therefore, there is adoption Fingerprint identification identity authentication portable electronic device asked the market. Since each person's fingerprints are different, the unique characteristics of the fingerprints make the security of identity authentication using fingerprint recognition much improved. Moreover, the method of using identity authentication using fingerprint identification is relatively convenient, so that the user can save the cumbersome memory and password entry.
而現行指紋辨識系統廣泛應用於手持式裝置或行動裝置上,最為常見的指紋辨識裝置係獨立設計於例如筆記型電腦鍵盤之固定一側或手持式行動裝置之背側或一端底側的固定位置,並無法有效整合於手持行動裝置觸控螢幕上進而縮減手持式行動裝置之體積,並且習知指紋辨識晶片封裝模組主要包括基板、晶片以及模封體。晶片設置於基板上且與基板電性連接,而模封體覆蓋於基板的表面以及晶片上。 The current fingerprint identification system is widely used in handheld devices or mobile devices. The most common fingerprint identification devices are independently designed, for example, on a fixed side of a notebook computer keyboard or a fixed position on the back side or the bottom side of a hand-held mobile device. It cannot be effectively integrated on the touch screen of the handheld mobile device to reduce the volume of the handheld mobile device, and the conventional fingerprint identification chip package module mainly includes a substrate, a wafer and a mold body. The wafer is disposed on the substrate and electrically connected to the substrate, and the mold body covers the surface of the substrate and the wafer.
而習知技術主要必須先將各感應電路及金屬走線或晶片設置於一矽晶圓所製成之基板上,整合製成一指紋辨識裝置後再與觸控面板或其他裝置結合使用,習知技術所提供之指紋辨識裝置整體厚度亦較厚也容易因厚度影響指紋辨識之精度以及因厚度之考量無法與較薄之裝置整合為一體。 In the prior art, the sensing circuit and the metal trace or the chip must be disposed on a substrate made of a single wafer, integrated into a fingerprint identification device, and then combined with a touch panel or other device. The overall thickness of the fingerprint identification device provided by the prior art is also relatively thick, and it is easy to integrate the thinner device due to the thickness affecting the accuracy of the fingerprint identification and the thickness consideration.
再者,一般來說當手指接觸晶片的感測區時,由於晶片外面覆蓋有多層膜,使得晶片封裝模組整體厚度較高,而晶片封裝模組靈敏度較低。 Furthermore, when the finger touches the sensing region of the wafer, the wafer package is covered with a multilayer film, so that the overall thickness of the chip package module is high, and the chip package module has low sensitivity.
此外,習知滑移式指紋辨識系統具有方向性,且辨識時間過久且必須獨立設置則無論是結構整合或使用便利性皆非常不佳。 In addition, the conventional slip fingerprint identification system has directionality, and the recognition time is too long and must be set independently, which is very poor in structural integration or ease of use.
爰此,為有效解決上述之問題,本創作之主要目的,係提供一種將指指紋辨識裝置直接整合形成於觸控面板、彩色濾光片(Color Filter,CF)、薄膜 電晶體(Thin-Film Transistor,TFT)、液晶模組(Liquid Crystal Module,LCM)其中任一上並成為一體的指紋辨識裝置。 Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a fingerprint recognition device directly integrated on a touch panel, a color filter (CF), a film. A fingerprint recognition device integrated into any one of a TFT (Thin-Film Transistor, TFT) and a Liquid Crystal Module (LCM).
為達上述目的本創作係提供一種指紋辨識裝置,係形成於一基部上;所述基部具有一上側及一下側,所述指指紋辨識裝置選擇設置於該上、下側其中任一。 In order to achieve the above object, the present invention provides a fingerprint identification device formed on a base; the base has an upper side and a lower side, and the fingerprint identification device is selectively disposed on either of the upper and lower sides.
所述指紋辨識裝置,係具有:一光阻層、一第一披覆層、一第一指紋辨識電極層、一第一保護層、一第二指紋辨識電極層、一第二保護層、一導線層、一軟性基板;所述光阻層選擇設於前述基部之上、下側其中任一;該第一披覆層設於該光阻層相反該基部之一側;所述第一指紋辨識電極層設於該第一披覆層相反該光阻層之一側,並具有複數第一指紋辨識電極;該第一保護層覆蓋前述第一指紋辨識電極層部分區域;所述第二指紋辨識電極層設於該保護層相反該第一指紋辨識電極層之一側,該第二指紋辨識電極層具有複數第二指紋辨識電極;該第二保護層覆蓋前述第二指紋辨識電極層部分區域;該導線層具有複數金屬導線,並該等金屬導線係選擇與前述第一、二指紋辨識電極層電性連接;該軟性基板電性連接前述第一、二指紋辨識電極層及該導線層。 The fingerprint identification device has a photoresist layer, a first cladding layer, a first fingerprint identifying electrode layer, a first protective layer, a second fingerprint identifying electrode layer, a second protective layer, and a first protective layer. a wire layer, a flexible substrate; the photoresist layer is selected to be disposed on any one of the base and the lower side; the first cladding layer is disposed on a side of the photoresist opposite to the base; the first fingerprint The identification electrode layer is disposed on a side of the first cladding layer opposite to the photoresist layer, and has a plurality of first fingerprint recognition electrodes; the first protection layer covers a portion of the first fingerprint identification electrode layer; the second fingerprint The identification electrode layer is disposed on a side of the first fingerprint identification electrode layer opposite to the protection layer, and the second fingerprint recognition electrode layer has a plurality of second fingerprint recognition electrodes; the second protection layer covers a portion of the second fingerprint identification electrode layer The wire layer has a plurality of metal wires, and the metal wires are electrically connected to the first and second fingerprint identifying electrode layers; the flexible substrate is electrically connected to the first and second fingerprint identifying electrode layers and the wire layer.
透過本創作係直接將指紋辨識裝置整合設置製造於觸控面板、彩色濾光片(Color Filter,CF)、薄膜電晶體(Thin-Film Transistor,TFT)、液晶模組(Liquid Crystal Module,LCM)或玻璃其中任一上,不僅可增加顯示裝置整體設計之彈性,並可令指紋辨識裝置因厚度減少進而提升該指紋辨識精度者。 Through the creation department, the fingerprint identification device is directly integrated and manufactured on a touch panel, a color filter (CF), a thin film transistor (TFT), a liquid crystal module (Liquid Crystal Module, LCM). Or any of the glasses can not only increase the flexibility of the overall design of the display device, but also increase the accuracy of the fingerprint identification device due to the reduction in thickness.
1‧‧‧指紋辨識裝置 1‧‧‧Fingerprint identification device
11‧‧‧光阻層 11‧‧‧Photoresist layer
12‧‧‧第一披覆層 12‧‧‧First coating
13‧‧‧第一指紋辨識電極層 13‧‧‧First fingerprint identification electrode layer
13a‧‧‧間距 13a‧‧‧ spacing
13b‧‧‧橫向寬度 13b‧‧‧ lateral width
131‧‧‧第一指紋辨識電極 131‧‧‧First fingerprint identification electrode
14‧‧‧第一保護層 14‧‧‧First protective layer
15‧‧‧第二指紋辨識電極層 15‧‧‧Second fingerprint identification electrode layer
15a‧‧‧間距 15a‧‧‧ spacing
151‧‧‧第二指紋辨識電極 151‧‧‧Second fingerprint recognition electrode
16‧‧‧第二保護層 16‧‧‧Second protective layer
17‧‧‧導線層 17‧‧‧Wire layer
171‧‧‧金屬導線 171‧‧‧Metal wire
18‧‧‧軟性基板 18‧‧‧Soft substrate
2‧‧‧基部 2‧‧‧ base
21‧‧‧上側 21‧‧‧ upper side
22‧‧‧下側 22‧‧‧ Lower side
23‧‧‧玻璃基板 23‧‧‧ glass substrate
231‧‧‧第一表面 231‧‧‧ first surface
2311‧‧‧觸控區 2311‧‧‧ touch area
2312‧‧‧非觸控區 2312‧‧‧ Non-touch area
232‧‧‧第二表面 232‧‧‧ second surface
24‧‧‧觸控電極層 24‧‧‧Touch electrode layer
25‧‧‧第一絕緣層 25‧‧‧First insulation
26‧‧‧第二絕緣層 26‧‧‧Second insulation
27‧‧‧第一觸控電極層 27‧‧‧First touch electrode layer
28‧‧‧第二觸控電極層 28‧‧‧Second touch electrode layer
29‧‧‧金屬走線層 29‧‧‧metal trace layer
3‧‧‧遮蔽層 3‧‧‧shading layer
第1圖係為本創作之指紋辨識裝置之第一實施例之立體分解圖;第1A圖係為本創作之指紋辨識裝置之第一實施例之局部放大圖;第1B圖係為本創作之指紋辨識裝置之第一實施例之局部放大圖;第1C圖係為本發明之指紋辨識裝置之第一實施例之局部放大圖;第2圖係為本創作之指紋辨識裝置之第一實施例之組合剖視圖;第3圖係為本創作之指紋辨識裝置之第二實施例之組合剖視圖;第4圖係為本創作之指紋辨識裝置之第一、二指紋辨識電極示意圖;第5圖係為本創作之指紋辨識裝置之第一、二指紋辨識電極另一示意圖。 1 is a perspective exploded view of a first embodiment of the fingerprint identification device of the present invention; FIG. 1A is a partial enlarged view of the first embodiment of the fingerprint identification device of the present invention; 1 is a partial enlarged view of a first embodiment of the fingerprint identification device of the present invention; and FIG. 2 is a first embodiment of the fingerprint identification device of the present invention. 3 is a sectional view of a second embodiment of the fingerprint identification device of the present invention; FIG. 4 is a schematic diagram of the first and second fingerprint recognition electrodes of the fingerprint identification device of the present invention; Another schematic diagram of the first and second fingerprint recognition electrodes of the fingerprint identification device of the present invention.
本創作之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。 The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.
請參閱第1、1A、1B、1C、2圖,係為本創作之指紋辨識裝置之第一實施例之立體分解及局部放大圖及組合剖視圖,如圖所示,本創作指紋辨識裝置1,係形成於一基部2上,所述基部2係為彩色濾光片(Color Filter,CF)、薄膜電晶體(Thin-Film Transistor,TFT)、液晶模組(Liquid Crystal Module,LCM)、觸控面板其中任一。 Please refer to FIG. 1, 1A, 1B, 1C, and 2, which are perspective exploded, partially enlarged, and combined cross-sectional views of the first embodiment of the fingerprint identification device of the present invention. As shown in the figure, the present fingerprint identification device 1 is The system is formed on a base 2, which is a color filter (CF), a thin film transistor (TFT), a liquid crystal module (LCM), and a touch. Any of the panels.
該基部2具有一上側21及一下側22,本實施例基部2係以觸控面板作為說明實施例,但並不引以為限,所述指紋辨識裝置1係選擇設於前述上、下側21、22其中任一,所述觸控面板(基部2)係包含:一玻璃基板23、一觸控電極層24、一第一絕緣層25、一第二絕緣層26、一遮蔽層3;所述玻璃基板23具有一第一表面231及一第二表面232並於所述第一表面231定義一觸控區2311及一非觸控區2312,所述非觸控區2312相鄰該觸控區2311,該遮蔽層3選擇設於前述第一、二表面231、232的非觸控區2312 其中任一,所述觸控電極層24設於該玻璃基板23之第二表面232之觸控區2311;該觸控電極層24具有複數第一觸控電極241及複數第二觸控電極242及複數金屬走線243,所述第一、二觸控電極241、242係選擇與該等金屬走線243電性連接;所述第一絕緣層25覆蓋前述第一、二觸控電極241、242交接處;所述第二絕緣層26覆蓋前述觸控電極層24及該第一絕緣層25。 The base portion 2 has an upper side 21 and a lower side 22, and the base portion 2 of the embodiment is a touch panel as an illustrative embodiment, but is not limited thereto, and the fingerprint identification device 1 is selectively disposed on the upper and lower sides. 21, 22, the touch panel (base 2) comprises: a glass substrate 23, a touch electrode layer 24, a first insulating layer 25, a second insulating layer 26, a shielding layer 3; The glass substrate 23 has a first surface 231 and a second surface 232 and defines a touch area 2311 and a non-touch area 2312 on the first surface 231. The non-touch area 2312 is adjacent to the touch. In the control area 2311, the shielding layer 3 selects the non-touch area 2312 disposed on the first and second surfaces 231 and 232. The touch electrode layer 24 is disposed on the touch surface 2311 of the second surface 232 of the glass substrate 23; the touch electrode layer 24 has a plurality of first touch electrodes 241 and a plurality of second touch electrodes 242. And the plurality of metal traces 243, the first and second touch electrodes 241, 242 are selectively electrically connected to the metal traces 243; the first insulating layer 25 covers the first and second touch electrodes 241, The second insulating layer 26 covers the touch electrode layer 24 and the first insulating layer 25 .
所述指紋辨識裝置1,係具有:一光阻層11、一第一披覆層12、一第一指紋辨識電極層13、一第一保護層14、一第二指紋辨識電極層15、一第二保護層16、一導線層17、一軟性基板18;所述基部2具有一上側21及一下兩側22,所述基部2係為彩色濾光片(Color Filter,CF)、薄膜電晶體(Thin-Film Transistor,TFT)、液晶模組(Liquid Crystal Module,LCM)其中任一,本實施例係以觸控面板作為說明但並不引以為限。 The fingerprint identification device 1 has a photoresist layer 11, a first cladding layer 12, a first fingerprint identification electrode layer 13, a first protection layer 14, and a second fingerprint identification electrode layer 15, a second protective layer 16, a wire layer 17, a flexible substrate 18; the base 2 has an upper side 21 and a lower side 22, the base 2 is a color filter (CF), a thin film transistor (Thin-Film Transistor, TFT), Liquid Crystal Module (LCM), this embodiment uses a touch panel as an illustration, but is not limited.
該光阻層11選擇設於前述基部2之上、下側21、22其中任一,本實施例係以設置於上側21(即玻璃基板23之第一表面231)作為說明但並不引以為限;所述第一披覆層12設於該光阻層11相反該基部2之一側。 The photoresist layer 11 is selected from the base portion 2 and the lower side 21, 22, and the embodiment is provided on the upper side 21 (ie, the first surface 231 of the glass substrate 23) as an illustration but is not The first cladding layer 12 is disposed on one side of the photoresist layer 11 opposite to the base portion 2.
該第一指紋辨識電極層13設於該第一披覆層12相反該光阻層11之一側,並具有複數第一指紋辨識電極131,所述第一保護層14覆蓋前述第一指紋辨識電極層13部分區域,令所述第一指紋辨識電極層13部分裸露於該第一保護層14外。 The first fingerprint electrode layer 13 is disposed on one side of the first cladding layer 12 opposite to the photoresist layer 11 and has a plurality of first fingerprint recognition electrodes 131. The first protection layer 14 covers the first fingerprint identification. A portion of the electrode layer 13 is partially exposed to the outside of the first protective layer 14 .
所述第二指紋辨識電極層15設於該第一保護層14相反該第一指紋辨識電極層13之一側,該第二指紋辨識電極層15具有複數第二指紋辨識電極151;該第二保護層16覆蓋前述第二指紋辨識電極層15部分區域,令所述第二指紋辨識電極層15部分裸露於該第二保護層16外。 The second fingerprint identifying electrode layer 15 is disposed on one side of the first protective layer 14 opposite to the first fingerprint identifying electrode layer 13 , and the second fingerprint identifying electrode layer 15 has a plurality of second fingerprint identifying electrodes 151 ; The protective layer 16 covers a portion of the second fingerprint identifying electrode layer 15 such that the second fingerprint identifying electrode layer 15 is partially exposed outside the second protective layer 16.
所述導線層17具有複數金屬導線171,並該等金屬導線171係選擇與前 述第一、二指紋辨識電極層13、15電性連接。 The wire layer 17 has a plurality of metal wires 171, and the metal wires 171 are selected before The first and second fingerprint identification electrode layers 13 and 15 are electrically connected.
所述軟性基板18電性連接前述第一、二指紋辨識電極層13、15及該導線層17,該軟性基板18係與該第一、二指紋辨識電極層13、15未被該第一、二保護層14、16覆蓋之部位以及該導線層17未被覆蓋之部位電性連接。 The flexible substrate 18 is electrically connected to the first and second fingerprint identifying electrode layers 13 and 15 and the wiring layer 17. The flexible substrate 18 and the first and second fingerprint identifying electrode layers 13 and 15 are not the first The portion covered by the two protective layers 14, 16 and the portion of the conductive layer 17 not covered are electrically connected.
所述第一、二指紋辨識電極層13、15間由第一保護層14進行絕緣,而該等第一指紋辨識電極131間係透過橋搭之方式進行連結,該等第二指紋辨識電極151間係透過橋搭之方式進行連結。 The first and second fingerprint identifying electrode layers 13 and 15 are insulated by the first protective layer 14 , and the first fingerprint identifying electrodes 131 are connected by a bridge. The second fingerprint identifying electrodes 151 are connected. The connection is made by means of bridges.
本創作主要係改善傳統習知指紋辨識裝置僅能獨立製造於矽晶圓上後再與觸控面板或其他裝置整合一體進行指紋辨識功能之缺失。 This creation is mainly to improve the traditional fingerprint identification device can only be independently fabricated on the silicon wafer and then integrated with the touch panel or other devices to complete the fingerprint identification function.
請參閱第3圖,係為本創作之指紋辨識裝置之第二實施例之組合圖剖視圖,如圖所示,本實施例部分結構技術特徵係與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之差異在於本實施例之所述觸控面板(基部2),係包含:一玻璃基板23、一第一觸控電極層27、一第一絕緣層25、一第二觸控電極層28、一第二絕緣層26、一金屬走線層29、一遮蔽層3;所述玻璃基板23具有一第一表面231及一第二表面232並於所述第一表面231定義一觸控區2311及一非觸控區2312,所述非觸控區2312相鄰該觸控區2311,該遮蔽層3選擇設於前述第一、二表面231、232的非觸控區2312其中任一;所述第一觸控電極層27設於該玻璃基板23之第二表面232,該第一觸控電極層27具有複數第一觸控電極271;所述第一絕緣層25覆蓋前述第一觸控電極層27;所述第二觸控電極層28設於該第一絕緣層25相反該第一觸控電極層27的一側,該第二觸控電極層28具有複數第二觸控電極281;所述第二絕緣層26覆蓋前述第二觸控電極層28;所述金屬走線層29係選擇與前述第一、二觸控電極層27、28電性連接。 Please refer to FIG. 3 , which is a sectional view of a combination of the second embodiment of the fingerprint identification device of the present invention. As shown in the figure, some structural features of the embodiment are the same as those of the first embodiment, and therefore will not be herein. The first embodiment differs from the first embodiment in that the touch panel (base 2) of the embodiment includes a glass substrate 23, a first touch electrode layer 27, and a first An insulating layer 25, a second touch electrode layer 28, a second insulating layer 26, a metal wiring layer 29, and a shielding layer 3; the glass substrate 23 has a first surface 231 and a second surface 232. A touch area 2311 and a non-touch area 2312 are defined on the first surface 231. The non-touch area 2312 is adjacent to the touch area 2311. The shielding layer 3 is selectively disposed on the first and second surfaces 231. The second touch electrode layer 27 is disposed on the second surface 232 of the glass substrate 23, the first touch electrode layer 27 has a plurality of first touch electrodes 271; The first insulating layer 25 covers the first touch electrode layer 27; the second touch electrode layer 28 is disposed on the first An insulating layer 25 is opposite to one side of the first touch electrode layer 27, the second touch electrode layer 28 has a plurality of second touch electrodes 281; and the second insulating layer 26 covers the second touch electrode layer 28 The metal trace layer 29 is selectively electrically connected to the first and second touch electrode layers 27 and 28 .
本創作之第一、二實施例中所述第一披覆層12係為二氧化矽薄膜,並由該二氧化矽薄膜提升整體各層沈積時之附著性;並該等第一、二指紋辨識電極131、151係可呈圓形、方形、三角形、梯形其中任一幾何圖形,該光阻層11係為白色或黑色或透明其中任一,該光阻層11係為一種耐高溫油墨,並至少可承受260度至300度之高溫;第一、二保護層係為一保護膜(OVER COAT)或二氧化矽(Si02)薄膜其中任一。 In the first and second embodiments of the present invention, the first cladding layer 12 is a ruthenium dioxide film, and the adhesion of the entire layer is improved by the ruthenium dioxide film; and the first and second fingerprints are recognized. The electrodes 131 and 151 may be in any one of a circular shape, a square shape, a triangular shape and a trapezoidal shape. The photoresist layer 11 is white or black or transparent. The photoresist layer 11 is a high temperature resistant ink. It can withstand at least 260 degrees to 300 degrees; the first and second protective layers are either a protective film (OVER COAT) or a cerium oxide (SiO 2 ) film.
請參閱第4圖,係為本創作之指紋辨識裝置之第一、二指紋辨識電極示意圖,如圖所示,該等第一指紋辨識電極131相互連結,該等第二指紋辨識電極151相互連結,並該等第一、二指紋辨識電極131、151之面積係為20um2~50um2;該等第一指紋辨識電極131沿(參閱第1圖之該基部2)縱向延伸,該等第一指紋辨識電極131之間間距13a為10um~40um,該等第一指紋辨識電極131之間間距最佳值為38um;該等第二指紋辨識電極151沿(參閱第1圖之該基部2)橫向延伸,該等第二指紋辨識電極151之間間距15a為10um~40um,該等第二指紋辨識電極151之間間距最佳值為38um;及該等第一、二指紋辨識電極131、151係為透明電極。 Please refer to FIG. 4 , which is a schematic diagram of the first and second fingerprint recognition electrodes of the fingerprint identification device of the present invention. As shown in the figure, the first fingerprint recognition electrodes 131 are connected to each other, and the second fingerprint recognition electrodes 151 are connected to each other. And the first and second fingerprint identifying electrodes 131, 151 have an area of 20 um 2 to 50 um 2 ; the first fingerprint identifying electrodes 131 extend longitudinally (see the base 2 of FIG. 1 ), the first The spacing 13a between the fingerprint recognition electrodes 131 is 10 um to 40 um, and the optimum spacing between the first fingerprint recognition electrodes 131 is 38 um; the second fingerprint recognition electrodes 151 are laterally (refer to the base 2 of FIG. 1). The distance between the second fingerprint recognition electrodes 151 is 10um~40um, and the spacing between the second fingerprint recognition electrodes 151 is 38um; and the first and second fingerprint recognition electrodes 131 and 151 are It is a transparent electrode.
請參閱第5圖,係為本創作之指紋辨識裝置之第一、二指紋辨識電極另一示意圖,如圖所示,該等第一指紋辨識電極12之橫向寬度係為10um~30um,該等第二指紋辨識電極縱向寬度係為10um~30um,該等第一指紋辨識電極13與該等第二指紋辨識電極15相互對應設置之處橫15b向寬度係為10um。 Please refer to FIG. 5 , which is another schematic diagram of the first and second fingerprint recognition electrodes of the fingerprint identification device of the present invention. As shown in the figure, the lateral width of the first fingerprint recognition electrodes 12 is 10 um to 30 um. The longitudinal width of the second fingerprint recognition electrode is 10 um to 30 um, and the first fingerprint recognition electrode 13 and the second fingerprint recognition electrode 15 are disposed corresponding to each other at a width of 15 b to a width of 10 um.
本創作之指紋辨識裝置1主要係透過直接製造整合於欲設置之觸控面板或其他顯示裝置之元件上,以薄型化該指紋辨識裝置之整體厚度,並省去以矽基板做為基底材料使用,進而提升該電容感應量提升整體指紋辨識之精度。 The fingerprint identification device 1 of the present invention is mainly used to directly integrate the components of the touch panel or other display device to be thinned, thereby thinning the overall thickness of the fingerprint identification device and eliminating the use of the germanium substrate as a base material. In turn, the capacitance sensing amount is improved to improve the accuracy of the overall fingerprint identification.
本創作之指紋辨識裝置1主要係先於該觸控面板(基部2)欲設置該指紋辨識裝置1之處或平面上,以印刷或濺鍍或鍍膜之方式先沈積一層光阻層,再透過濺鍍或鍍膜之方式沈積一層二氧化矽薄膜形成該第一披覆層12作為增加附著率使用,其後再沈積一層可作為指紋辨識感應電極使用之材料的薄膜於該第一披覆層12上,並再透過黃光蝕刻之方式將該等第一指紋辨識電極131完整布置於該第一披覆層12上並形成部分與該等第一指紋辨識電極131電性連接之複數金屬導線171,其後再沈積一層一第一保護層14保護膜(OVER COAT)覆蓋前述已成形的該等第一指紋辨識電極131上為絕緣使用,並再於該第一保護層14上沈積一層可作為指紋辨識感應電極使用之材料的薄膜於該第一保護層14上,並再透過黃光蝕刻之方式將該等第二指紋辨識電極151完整布置於該第一保護層14上,並形成部分與該等第二指紋辨識電極151電性連接之複數金屬導線171,最後再沈積一層第二保護層16保護膜(OVER COAT)覆蓋前述已成形的該等第二指紋辨識電極151及該等金屬導線171上作為封裝絕緣使用,並由於該該第一、二觸控電極131、151部分未被該第一、二保護層14、16所覆蓋,則該等部位即可與前述軟性基板電性連接。 The fingerprint identification device 1 of the present invention is mainly disposed on the surface of the touch panel (base 2) where the fingerprint identification device 1 is to be disposed, or a layer of photoresist layer is deposited by sputtering or sputtering or coating. Depositing or depositing a thin film of ruthenium dioxide to form the first cladding layer 12 for increasing adhesion rate, and then depositing a film which can be used as a material for fingerprint identification sensing electrodes on the first cladding layer 12 And aligning the first fingerprint recognition electrodes 131 on the first cladding layer 12 and forming a plurality of metal wires 171 electrically connected to the first fingerprint recognition electrodes 131. And then depositing a first protective layer 14 protective film (OVER COAT) covering the formed first fingerprint identifying electrodes 131 for insulation, and depositing a layer on the first protective layer 14 Fingerprinting the film of the material used for the sensing electrode on the first protective layer 14 and then completely arranging the second fingerprint identifying electrodes 151 on the first protective layer 14 by means of yellow etching, and forming a portion a plurality of metal wires 171 electrically connected to the second fingerprint electrode 151, and finally a second protective layer 16 protective film (OVER COAT) covering the formed second fingerprint electrodes 151 and the metal The wire 171 is used as a package insulation, and since the first and second touch electrodes 131 and 151 are not covered by the first and second protective layers 14 and 16, the portions can be electrically connected to the flexible substrate. connection.
透過本創作之指紋辨識裝置1係可將指紋辨識裝置1設置於任何想設置之處,並無須再透過以矽晶圓作為底材不僅大幅節省製造成本,更可薄型化該指紋辨識裝置1,以及縮減該等感應電極之間間距,藉此提升該指紋辨識之精度。 Through the fingerprint identification device 1 of the present invention, the fingerprint identification device 1 can be placed at any place where it is desired to be installed, and it is not necessary to further reduce the manufacturing cost by using the silicon wafer as a substrate, and the fingerprint identification device 1 can be thinned. And reducing the spacing between the sensing electrodes, thereby improving the accuracy of the fingerprint identification.
1‧‧‧指紋辨識裝置 1‧‧‧Fingerprint identification device
11‧‧‧光阻層 11‧‧‧Photoresist layer
12‧‧‧第一披覆層 12‧‧‧First coating
13‧‧‧第一指紋辨識電極層 13‧‧‧First fingerprint identification electrode layer
131‧‧‧第一指紋辨識電極 131‧‧‧First fingerprint identification electrode
14‧‧‧第一保護層 14‧‧‧First protective layer
15‧‧‧第二指紋辨識電極層 15‧‧‧Second fingerprint identification electrode layer
151‧‧‧第二指紋辨識電極 151‧‧‧Second fingerprint recognition electrode
16‧‧‧第二保護層 16‧‧‧Second protective layer
17‧‧‧導線層 17‧‧‧Wire layer
171‧‧‧金屬導線 171‧‧‧Metal wire
18‧‧‧軟性基板 18‧‧‧Soft substrate
2‧‧‧基部 2‧‧‧ base
21‧‧‧上側 21‧‧‧ upper side
22‧‧‧下側 22‧‧‧ Lower side
23‧‧‧玻璃基板 23‧‧‧ glass substrate
231‧‧‧第一表面 231‧‧‧ first surface
2311‧‧‧觸控區 2311‧‧‧ touch area
2312‧‧‧非觸控區 2312‧‧‧ Non-touch area
232‧‧‧第二表面 232‧‧‧ second surface
24‧‧‧觸控電極層 24‧‧‧Touch electrode layer
25‧‧‧第一絕緣層 25‧‧‧First insulation
26‧‧‧第二絕緣層 26‧‧‧Second insulation
3‧‧‧遮蔽層 3‧‧‧shading layer
Claims (12)
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TW104217988U TWM521777U (en) | 2015-11-10 | 2015-11-10 | Fingerprint recognition device |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI596357B (en) * | 2016-08-19 | 2017-08-21 | Primax Electronics Ltd | Sensing device |
CN107766778A (en) * | 2016-08-19 | 2018-03-06 | 致伸科技股份有限公司 | Induction installation |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI596357B (en) * | 2016-08-19 | 2017-08-21 | Primax Electronics Ltd | Sensing device |
CN107766778A (en) * | 2016-08-19 | 2018-03-06 | 致伸科技股份有限公司 | Induction installation |
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