CN107766778A - Induction installation - Google Patents
Induction installation Download PDFInfo
- Publication number
- CN107766778A CN107766778A CN201610694148.9A CN201610694148A CN107766778A CN 107766778 A CN107766778 A CN 107766778A CN 201610694148 A CN201610694148 A CN 201610694148A CN 107766778 A CN107766778 A CN 107766778A
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- CN
- China
- Prior art keywords
- substrate
- receiving electrode
- electrode module
- insulation board
- induction installation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
Abstract
The present invention is on a kind of induction installation, including protection cap, emission electrode module, receiving electrode module and the substrate contacted with object.Receiving electrode module includes insulation board, receiving electrode layer and conductive circuit layer.Insulation board can isolate receiving electrode module and substrate or emission electrode module.Receiving electrode layer is arranged on insulation board, and conductive circuit layer is covered in receiving electrode layer and is electrically connected in receiving electrode layer and substrate.Induction installation of the present invention substitutes traditional wire and overcoat with conductive circuit layer so that the sensitivity of induction installation is able to elevated.
Description
Technical field
The present invention is on a kind of induction installation, in particular to the induction installation for the fingerprint that can sense user.
Background technology
In recent years, identification of fingerprint technology is applied in various electronic products, makes user to input the fingerprint of oneself in electricity
In sub- product and electronic product is allowed to achieve, user can input the fingerprint of oneself by identification of fingerprint module afterwards, to carry out electricity
The unblock of sub- product.The unlocking manner of password is manually entered than ever faster to unlock electronic product using identification of fingerprint technology
It is fast, more convenient, therefore favored by user, and the demand of the induction installation with finger print identification function also increases therewith.
Referring to Fig. 1, it is the structural representation of existing induction installation.Existing induction installation 1 includes protection cap 10, transmitting
Electrode module 11, receiving electrode module 12 and substrate 13, and receiving electrode module 12 includes overcoat 121, receiving electrode layer
122nd, insulation board 123 and wire 124.The stacking of those elements is sequentially from top to bottom protection cap 10, overcoat 121, received
Electrode layer 122, insulation board 123, substrate 13 and emission electrode module 11, wherein, wire 124 be located at receiving electrode layer 122 with
And the side of insulation board 123.Protection cap 10 is arranged at the top of receiving electrode module 12 and is revealed in outside induction installation 1, its
Receiving electrode module 12 can be protected and avoid it from sustaining damage, and the finger touching being available for users to.Emission electrode module 11 is set
It is placed on the lower surface of substrate 13, its function touches the surface of the finger of protection cap 10 with detecting to produce a detection signal, and
Detection signal is reflected by the surface of the finger in protection cap 10 to be converted to reflected signal.
Receiving electrode module 12 is arranged between protection cap 10 and substrate 13, and its function is reception reflected signal.Receive electricity
In pole module 12, insulation board 123 is arranged on the upper surface of substrate 13, and it can separate receiving electrode layer 122 and substrate 13.Connect
Electrode layer 122 is received to be arranged on the upper surface of insulation board 123, it can receive reflected signal, and wire 124 be electrically connected in
Receiving electrode layer 122 and substrate 13.Overcoat 121 is covered on receiving electrode layer 122, to protect receiving electrode layer 122 not
Damaged by external force.Wherein, insulation board 123 is made with Kynoar (Polyvinylidene fluoride, PVDF) material
It is with made by acryl material into, overcoat 121, and receiving electrode layer 122 is with conductive metal material or tin indium oxide
(Indium Tin Oxide, ITO) is made, and conductive metal material includes aluminum, aluminum alloy materials, copper product, copper alloy
Material, nickel material, golden material, alloy platinum material etc..As for substrate 13, it is arranged at receiving electrode module 12 and emission electrode module 11
Between, it can obtain the surface image of finger according to reflected signal.Wherein, substrate 13 is thin film transistor (TFT) (Thin-Film
Transistor, TFT) glass.
The above-mentioned structure for existing induction installation 1, its operation principles are：Finger is positioned in protection cap 10 in user
When, emission electrode module 11 produces detection signal, and detection signal is transferred to protection cap 10 with ultrasound modalities, is touched with detecting
Touch the surface of the finger of protection cap 10.Detection signal is reflected by the surface of the finger in protection cap 10, detection signal quilt now
It is defined as reflected signal.Reflected signal is transferred to receiving electrode layer 122 with ultrasound modalities, make receiving electrode layer 122 by
Wire 124 transmits reflected signal to substrate 13.In fact, substrate 13 is connected to a processor (not shown in the figures), work as substrate
13 when reflected signal is received, and the electric current that processor can calculate the surface of finger according to reflected signal is strong and weak, and can calculate
And obtain the surface image of finger.
However, due to the setting of overcoat 121, although it can provide the function of protection receiving electrode layer 122, it is simultaneously
Cause receiving electrode layer 122 to receive the sensitivity decrease of reflected signal, and easily cause the error of identification of fingerprint.
The content of the invention
The technical problem to be solved in the present invention is, for deficiencies of the prior art, there is provided one kind can carry
Rise the induction installation of sensitivity.
The technical solution adopted for the present invention to solve the technical problems is to provide a kind of induction installation, to capture an object
A surface image, including protection cap, emission electrode module, receiving electrode module and substrate.The protection cap to the thing
Body contacts, and the emission electrode module detects a surface of the object to export a detection signal to the protection cap.The reception
Electrode module is arranged at the lower section of the protection cap, to receive by a reflected signal of the surface reflection of the object.The substrate
The lower section of the receiving electrode module is arranged at, to obtain the surface image of the object according to the reflected signal.Wherein, should
Receiving electrode module includes insulation board, receiving electrode layer and conductive circuit layer.The insulation board is arranged at the receiving electrode module
Bottom, to isolate the receiving electrode module and the substrate or the emission electrode module.It is exhausted that the receiving electrode layer is arranged at this
On listrium, to receive the reflected signal.The conductive circuit layer is covered in the receiving electrode layer and is electrically connected and connect in this
Electrode layer and the substrate are received, to establish the electric connection between the receiving electrode layer and the substrate.
It is preferred that the emission electrode module is arranged between the insulation board and the substrate, and the substrate is electrically connected at, and
The insulation board isolates the emission electrode module and the receiving electrode layer.
It is preferred that the emission electrode module is arranged at the lower section of the substrate, and the substrate is electrically connected at, and the insulation board
Isolate the substrate and the receiving electrode layer.
It is preferred that the receiving electrode layer is made by conductive metal material or tin indium oxide (ITO), the conductive circuit layer
It is to be printed in the upper surface of the receiving electrode layer and the upper surface of the substrate by ag material and formed, covers the conductive circuit layer
Cover the receiving electrode layer, the insulation board and the part substrate.
It is preferred that the insulation board is as made by Kynoar (PVDF) material, and the substrate is thin film transistor (TFT)
(TFT) glass.
The present invention also provides a kind of induction installation, to capture a surface image of an object, including protection cap, transmitting electricity
Pole module, receiving electrode module and substrate.The protection cap with the object to contact, and the emission electrode module is exporting one
Detection signal detects a surface of the object to the protection cap.The receiving electrode module is arranged at the lower section of the protection cap, uses
To receive the reflected signal reflected by the surface of the object.The substrate is arranged at the lower section of the receiving electrode module, to
The surface image of the object is obtained according to the reflected signal.Wherein, the receiving electrode module includes insulation board and conduction
Line layer.The insulation board is arranged at the bottom of the receiving electrode module, to isolate the receiving electrode module and the substrate or be somebody's turn to do
Emission electrode module.The conductive circuit layer is covered in the insulation board and is electrically connected at the substrate, receives the reflected signal and biography
The defeated reflected signal is to the substrate.
It is preferred that the emission electrode module is arranged between the insulation board and the substrate, and it is electrically connected at the substrate.
It is preferred that the emission electrode module is arranged at the lower section of the substrate, and it is electrically connected at the substrate.
It is preferred that the conductive circuit layer is the upper surface for the upper surface and substrate that the insulation board is printed in by ag material
And formed, the conductive circuit layer is covered the insulation board and the part substrate.
It is preferred that the insulation board is as made by polyvinylidene fluoride material, and the substrate is thin film transistor (TFT) glass.
Induction installation of the present invention substitutes existing wire and overcoat with the conductive circuit layer printed for stratiform so that sense
The overcoat that can reduce sensitivity need not be set by answering in device, in other words, the sensitivity of induction installation of the present invention is lifted.Separately
Outside, induction installation of the present invention also substitutes existing wire, overcoat and reception using printing for the conductive circuit layer of stratiform
Electrode layer, in this way, in addition to it can lift sensitivity, it can more reduce the thickness of induction installation.
Brief description of the drawings
Fig. 1 is the structural representation of existing induction installation.
Fig. 2 is structural representation of the induction installation of the present invention in the first preferred embodiment.
Fig. 3 is structural representation of the induction installation of the present invention in the second preferred embodiment.
Embodiment
The present invention provides a kind of induction installation, to solve the problems, such as that prior art is present.Referring to Fig. 2, it is the present invention
Structural representation of the induction installation in the first preferred embodiment.The table of the fechtable object (not shown in the figures) of induction installation 2
Face picture, it includes protection cap 20, emission electrode module 21, receiving electrode module 22 and substrate 23, and receiving electrode module
22 include receiving electrode layer 221, insulation board 222 and conductive circuit layer 223.The stacking of those elements is sequentially from top to bottom to protect
Protecting cover 20, conductive circuit layer 223, receiving electrode layer 221, insulation board 222, substrate 23 and emission electrode module 21, wherein, lead
Electric line layer 223 covers receiving electrode layer 221, insulation board 222 and partial substrates 23.In this preferred embodiment, the object
For the finger of user.
Protection cap 20 is located at the superiors of induction installation 2, and it is revealed in outside induction installation 2, and can be contacted with object.Hair
Electrode module 21 to be penetrated to be arranged on the lower surface of substrate 23 and be electrically connected at substrate 23, its function is one detection signal of generation,
With the surface of the object of detecting touching protection cap 20, and detection signal is reflected by the surface of the object in protection cap 20, wherein, it is fixed
The detection signal that justice is reflected is reflected signal.Receiving electrode module 22 is arranged at the lower section of protection cap 20 and positioned at substrate 23
Top, the reflected signal that its function is reflected for reception by the surface of object.Substrate 23 is arranged at the lower section of receiving electrode module 22
And positioned at the top of emission electrode module 21, its function is obtains the surface image of object according to reflected signal.In this preferably
In embodiment, substrate 23 is thin film transistor (TFT) (TFT) glass.
In receiving electrode module 22, insulation board 222 is arranged on the upper surface of substrate 23, and it can separate receiving electrode layer
221 and substrate 23.Receiving electrode layer 221 is arranged on the upper surface of insulation board 222, and it can receive reflected signal, and conductive
Line layer 223 is covered in receiving electrode layer 221 and partial substrate 23, and be electrically connected in receiving electrode layer 221 with
And substrate 23.The function of conductive circuit layer 223 has two：First, establish electrically connecting between receiving electrode layer 221 and substrate 23
Connect；Second, protect receiving electrode layer 221 not damaged by external force.In this preferred embodiment, receiving electrode layer 221 is with metal
Conductive material or tin indium oxide (ITO) are made, and conductive circuit layer 223 is to be printed in the upper of receiving electrode layer 221 by ag material
Surface and the upper surface of substrate 23 and formed, conductive circuit layer 223 is covered receiving electrode layer 221, insulation board 222 and portion
Divide substrate 23, wherein conductive circuit layer 223 is presented with stepped-style.And insulation board 222 is then with Kynoar (PVDF) material
Made by material.
As for the running on the surface of object of the detecting of induction installation 2 in the protection cap 20, be with prior art similarly, therefore
Repeat no more.The surface image of object can be obtained by the running of induction installation 2.Specifically have two, first, this hair
Bright induction installation 2 substitutes existing wire and overcoat with the conductive circuit layer 223 printed for stratiform, due to induction installation 2
In be not provided with overcoat so that receiving electrode layer 221 receive reflected signal sensitivity it is unaffected.In other words, it is of the invention
The sensitivity of induction installation can be elevated.Second, emission electrode module 21 is arranged under substrate 23 in this preferred embodiment
On surface, it is only that illustration is used, rather than as limit.In another preferred embodiment, also can be set emission electrode module in
The upper surface of substrate, that is, emission electrode module is set between receiving electrode layer and substrate.Now, insulation board isolation connects
Receive electrode module and emission electrode module.
In addition, the present invention more provides second preferred embodiment different from above-mentioned way.Referring to Fig. 3, it is the present invention
Structural representation of the induction installation in the second preferred embodiment.Induction installation 3 include protection cap 30, emission electrode module 31,
Receiving electrode module 32 and substrate 33, and receiving electrode module 32 includes insulation board 321 and conductive circuit layer 322.Those
The stacking of element is sequentially from top to bottom protection cap 30, conductive circuit layer 322, insulation board 321, substrate 33 and emission electrode mould
Block 31, wherein, conductive circuit layer 322 covers insulation board 321 and partial substrates 33.The induction installation 3 of this preferred embodiment with
First preferred embodiment difference is, removes the receiving electrode layer 221 in the first preferred embodiment, and with conductive circuit layer
322 substitutions.
It can be seen from Fig. 3, insulation board 321 is arranged at the bottom of receiving electrode module 32, and it can isolate receiving electrode module
32 and substrate 33.And conductive circuit layer 322 is the part for the upper surface and substrate 33 that insulation board 321 is printed in by ag material
Upper surface and formed so that conductive circuit layer 322 covers insulation board 321 and part substrate 33, and can be electrically connected at substrate
33.Compared with the first preferred embodiment, receiving electrode layer 221 is substituted with conductive circuit layer 322 in this preferred embodiment, thus this compared with
The thickness of the receiving electrode module 32 of good embodiment is relatively low, and can be more lightening.
Understood according to above-mentioned, induction installation of the present invention with the conductive circuit layer printed for stratiform substitute existing wire and
Overcoat so that can be not provided with reducing the overcoat of sensitivity in induction installation.In other words, induction installation of the present invention is sensitive
Degree can be elevated.In a preferable way, the present invention more using printing for the conductive circuit layer of stratiform substitute existing wire,
Overcoat and receiving electrode layer, in addition to it can lift sensitivity, it can more reduce the thickness of induction installation.
Presently preferred embodiments of the present invention is the foregoing is only, is not limited to scope of the presently claimed invention, therefore
It is all other without departing from the equivalent change or modification completed under disclosed spirit, it is intended to be limited solely by patent of the invention
In protection domain.
Claims (10)
- A kind of 1. induction installation, to capture a surface image of an object, it is characterised in that including：Protection cap, to be contacted with the object；Emission electrode module, to export a detection signal to the protection cap, and detect a surface of the object；Receiving electrode module, the lower section of the protection cap is arranged at, to receive by a reflection letter of the surface reflection of the object Number；AndSubstrate, the lower section of the receiving electrode module is arranged at, to obtain the surface shadow of the object according to the reflected signal Picture；Wherein, the receiving electrode module includes：Insulation board, the bottom of the receiving electrode module is arranged at, to isolate the receiving electrode module and the substrate or the transmitting Electrode module；Receiving electrode layer, it is arranged on the insulation board, to receive the reflected signal；AndConductive circuit layer, it is covered in the receiving electrode layer and is electrically connected in the receiving electrode layer and the substrate, to The electric connection established between the receiving electrode layer and the substrate.
- 2. induction installation as claimed in claim 1, it is characterised in that the emission electrode module is arranged at the insulation board and the base Between plate, and the substrate is electrically connected at, and the insulation board isolates the emission electrode module and the receiving electrode layer.
- 3. induction installation as claimed in claim 1, it is characterised in that the emission electrode module is arranged at the lower section of the substrate, And the substrate is electrically connected at, and the insulation board isolates the substrate and the receiving electrode layer.
- 4. induction installation as claimed in claim 1, it is characterised in that the receiving electrode layer is by conductive metal material or oxidation Made by indium tin, the conductive circuit layer is the upper surface for the upper surface and substrate that the receiving electrode layer is printed in by ag material And formed, the conductive circuit layer is covered the receiving electrode layer, the insulation board and the part substrate.
- 5. induction installation as claimed in claim 1, it is characterised in that the insulation board be as made by polyvinylidene fluoride material, And the substrate is thin film transistor (TFT) glass.
- A kind of 6. induction installation, to capture a surface image of an object, it is characterised in that including：Protection cap, to be contacted with the object；Emission electrode module, to export a detection signal to the protection cap, and detect a surface of the object；Receiving electrode module, the lower section of the protection cap is arranged at, to receive by a reflection letter of the surface reflection of the object Number；AndSubstrate, the lower section of the receiving electrode module is arranged at, to obtain the surface shadow of the object according to the reflected signal Picture；Wherein, the receiving electrode module includes：Insulation board, the bottom of the receiving electrode module is arranged at, to isolate the receiving electrode module and the substrate or the transmitting Electrode module；AndConductive circuit layer, it is covered in the insulation board and is electrically connected at the substrate, receives the reflected signal and transmit reflection letter Number to the substrate.
- 7. induction installation as claimed in claim 6, it is characterised in that the emission electrode module is arranged at the insulation board and the base Between plate, and it is electrically connected at the substrate.
- 8. induction installation as claimed in claim 6, it is characterised in that the emission electrode module is arranged at the lower section of the substrate, And it is electrically connected at the substrate.
- 9. induction installation as claimed in claim 6, it is characterised in that the conductive circuit layer is to be printed in the insulation by ag material The upper surface of plate and the upper surface of the substrate and formed, make the conductive circuit layer cover the insulation board and part the substrate.
- 10. induction installation as claimed in claim 6, it is characterised in that the insulation board be as made by polyvinylidene fluoride material, And the substrate is thin film transistor (TFT) glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610694148.9A CN107766778A (en) | 2016-08-19 | 2016-08-19 | Induction installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610694148.9A CN107766778A (en) | 2016-08-19 | 2016-08-19 | Induction installation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107766778A true CN107766778A (en) | 2018-03-06 |
Family
ID=61262171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610694148.9A Pending CN107766778A (en) | 2016-08-19 | 2016-08-19 | Induction installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107766778A (en) |
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Application publication date: 20180306 |
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