TWM505648U - Touch device with fingerprint identification - Google Patents

Touch device with fingerprint identification Download PDF

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Publication number
TWM505648U
TWM505648U TW104203852U TW104203852U TWM505648U TW M505648 U TWM505648 U TW M505648U TW 104203852 U TW104203852 U TW 104203852U TW 104203852 U TW104203852 U TW 104203852U TW M505648 U TWM505648 U TW M505648U
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Taiwan
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layer
disposed
fingerprint identification
fingerprint
touch area
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TW104203852U
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Chinese (zh)
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Chih-Chung Lin
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Chih-Chung Lin
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Priority to TW104203852U priority Critical patent/TWM505648U/en
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Description

具指紋辨識之觸控裝置Touch device with fingerprint identification

一種具指紋辨識之觸控裝置,將指紋辨識晶片整合於觸控面板上的指紋辨識之觸控裝置。A touch device with fingerprint recognition, which integrates a fingerprint recognition chip into a fingerprint recognition touch device on a touch panel.

隨著多媒體技術之蓬勃發展,行動電話、個人數位助理(Personal Digital Assistant,PDA)、數位相機、個人筆記型電腦或平板或穿戴式裝置等越來越多之智慧型便攜式電子裝置已經成為了人們生活中必備之工具。然而,這些便攜式電子裝置具有很強之個人化的特點。因此一旦這些便攜式電子裝置遭到遺失或是盜用,其內部存儲之資訊,例如電話簿、相片、資料等等都有可能被別人利用,而造成不必要之損失。With the rapid development of multimedia technology, more and more smart portable electronic devices such as mobile phones, personal digital assistants (PDAs), digital cameras, personal notebook computers or tablets or wearable devices have become people. A must-have tool in life. However, these portable electronic devices are highly personal. Therefore, once these portable electronic devices are lost or stolen, the information stored therein, such as phone books, photos, materials, etc., may be used by others, causing unnecessary losses.

因此,這類產品需要搭配一定之身份認證及許可權管理,以確保使用者的隱私安全。而當前所採用之身份認證的主要方法係有密碼保護,使用者需先輸入正確的密碼至便攜式電子裝置,才能夠進入便攜式電子裝置的操控頁面。然而,密碼保護之安全性較低,原因在於密碼較容易被洩漏或遭到破解。此外假使當使用者忘記密碼的話,也很麻煩。因此,即有採用指紋辨識之身份認證的便攜式電子裝置問市。由於每個人之指紋都是不同的,因此指紋可視為具有唯一性之特點,使得採用指紋辨識之身份認證的安全性提高很多。並且,利用使用指紋辨識之身份認證的方法也相對方便,令使用者省去了記憶及輸入密碼之繁瑣。Therefore, such products need to be matched with certain identity authentication and permission management to ensure the privacy of users. The main method of identity authentication currently used is password protection, and the user needs to input the correct password to the portable electronic device before entering the control page of the portable electronic device. However, password protection is less secure because passwords are more likely to be compromised or compromised. In addition, if the user forgets the password, it is also very troublesome. Therefore, there is a portable electronic device that uses fingerprint identification for identity authentication. Since each person's fingerprints are different, the fingerprint can be regarded as unique, which makes the security of identity authentication using fingerprint recognition much improved. Moreover, the method of using identity authentication using fingerprint identification is relatively convenient, so that the user can save the cumbersome memory and password entry.

而現行指紋辨識系統廣泛應用於手持式裝置或行動裝置上,最為常見的指紋辨識裝置係獨立設計於例如筆記型電腦鍵盤之固定一側或手持式行動裝置之背側或一端底側的固定位置,並無法有效整合於手持行動裝置觸控螢幕上進而縮減手持式行動裝置之體積,並且習知指紋辨識晶片封裝模組主要包括基板、晶片以及模封體。晶片設置於基板上且與基板電性連接,而模封體覆蓋於基板的表面以及晶片上。The current fingerprint identification system is widely used in handheld devices or mobile devices. The most common fingerprint identification devices are independently designed, for example, on a fixed side of a notebook computer keyboard or a fixed position on the back side or the bottom side of a hand-held mobile device. It cannot be effectively integrated on the touch screen of the handheld mobile device to reduce the volume of the handheld mobile device, and the conventional fingerprint identification chip package module mainly includes a substrate, a wafer and a mold body. The wafer is disposed on the substrate and electrically connected to the substrate, and the mold body covers the surface of the substrate and the wafer.

一般來說,當手指接觸晶片的感測區時,由於晶片外面覆蓋有多層膜,使得晶片封裝模組整體厚度較高,而晶片封裝模組靈敏度較低。Generally, when a finger touches a sensing area of a wafer, since the outer surface of the wafer is covered with a multilayer film, the overall thickness of the chip package module is high, and the chip package module has low sensitivity.

此外,習知滑移式指紋辨識系統因具有方向性,其辨識時間過久及辨識性不佳且必須獨立設置,則造成結構整合或使用便利性皆非常不佳。In addition, the conventional slip-type fingerprint identification system has a directionality, and the recognition time is too long and the recognition is not good and must be set independently, which results in poor structural integration or ease of use.

爰此,為有效解決上述之問題,本創作之主要目的,係提供一種將指紋辨識晶片與觸控面板整合為一體的具指紋辨識之觸控裝置。Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a fingerprint recognition touch device that integrates a fingerprint identification chip and a touch panel.

為達上述目的本創作係提供一種具指紋辨識之觸控裝置,係包含:一玻璃基板、一第一電極層、一絕緣層、一第二電極層、一走線層、一薄膜層、一指紋辨識感應層;In order to achieve the above object, the present invention provides a touch device with fingerprint identification, comprising: a glass substrate, a first electrode layer, an insulating layer, a second electrode layer, a trace layer, a film layer, and a film Fingerprint identification layer;

所述玻璃基板具有一第一平面及一第二平面,所述第一、二平面分設於該玻璃基板上、下兩側,於該第一平面定義一觸控區及一非觸控區,所述非觸控區相鄰該觸控區;該第一電極層設於該玻璃基板之第二平面,該第一電極層具有複數第一電極;該絕緣層覆蓋前述第一電極層;所述第二電極層設於該絕緣層相反該第一電極層之另一側,該第二電極層具有複數第二電極;該走線層具有複數導線設置於該非觸控區,並該等導線選擇與前述第一、二電極層電性連接;該薄膜層覆蓋前述第二電極層及該走線層;The glass substrate has a first plane and a second plane. The first and second planes are disposed on the upper and lower sides of the glass substrate, and a touch area and a non-touch area are defined on the first plane. The non-touch area is adjacent to the touch area; the first electrode layer is disposed on the second plane of the glass substrate, the first electrode layer has a plurality of first electrodes; the insulating layer covers the first electrode layer; The second electrode layer is disposed on the other side of the insulating layer opposite to the first electrode layer, the second electrode layer has a plurality of second electrodes; the wiring layer has a plurality of wires disposed in the non-touch area, and the The wire selection is electrically connected to the first and second electrode layers; the film layer covers the second electrode layer and the wiring layer;

該指紋辨識感應層設於前述薄膜層相反前述第二電極層之另一側,並具有複數指紋辨識晶片及複數傳輸導線,該等指紋辨識晶片係與該等傳輸導線電性連接。The fingerprint recognition sensing layer is disposed on the other side of the film layer opposite to the second electrode layer, and has a plurality of fingerprint identification chips and a plurality of transmission wires, and the fingerprint identification chips are electrically connected to the transmission wires.

透過將該指紋辨識晶片整合於觸控面板上,不僅可以節省製造成本外,更可提升觸控靈敏度及準確率。By integrating the fingerprint recognition chip on the touch panel, the manufacturing cost can be saved, and the touch sensitivity and accuracy can be improved.

1‧‧‧具指紋辨識之觸控裝置1‧‧‧Touching device with fingerprint identification

11‧‧‧玻璃基板11‧‧‧ glass substrate

11a‧‧‧觸控區11a‧‧‧ touch area

11b‧‧‧非觸控區11b‧‧‧ non-touch area

111‧‧‧第一平面111‧‧‧ first plane

112‧‧‧第二平面112‧‧‧ second plane

12‧‧‧第一電極層12‧‧‧First electrode layer

121‧‧‧第一電極121‧‧‧First electrode

13‧‧‧絕緣層13‧‧‧Insulation

14‧‧‧第二電極層14‧‧‧Second electrode layer

141‧‧‧第二電極141‧‧‧second electrode

15‧‧‧走線層15‧‧‧Line layer

151‧‧‧導線151‧‧‧Wire

16‧‧‧薄膜層16‧‧‧film layer

17‧‧‧指紋辨識感應層17‧‧‧Fingerprint sensing layer

171‧‧‧指紋辨識晶片171‧‧‧Fingerprint identification chip

172‧‧‧傳輸導線172‧‧‧Transmission wire

173‧‧‧金屬導線173‧‧‧Metal wire

18‧‧‧遮蔽層18‧‧‧Shielding layer

19‧‧‧保護層19‧‧‧Protective layer

第1圖係為本創作之具指紋辨識之觸控裝置第一實施例之立體分解圖;1 is an exploded perspective view of a first embodiment of a fingerprint device with fingerprint recognition;

第2圖係為本創作之具指紋辨識之觸控裝置第一實施例之組合剖視圖;2 is a combined cross-sectional view of a first embodiment of a fingerprint device with fingerprint identification;

第3圖係為本創作之具指紋辨識之觸控裝置之第二實施例之組合圖剖視圖;Figure 3 is a cross-sectional view of the combination of the second embodiment of the fingerprint device of the present invention;

第4圖係為本創作之具指紋辨識之觸控裝置之第三實施例之組合圖剖視圖;Figure 4 is a cross-sectional view of the combination of the third embodiment of the fingerprint device of the present invention;

第5圖係為本創作之具指紋辨識之觸控裝置之第四實施例之指紋辨識層之俯視圖;Figure 5 is a plan view of the fingerprint identification layer of the fourth embodiment of the fingerprint device with fingerprint identification;

第5a圖係為本創作之具指紋辨識之觸控裝置之第四實施例之指紋辨識層局部放大圖;Figure 5a is a partial enlarged view of the fingerprint identification layer of the fourth embodiment of the fingerprint device with fingerprint identification;

第6圖係為本創作之具指紋辨識之觸控裝置之第五實施例之組合圖剖視圖。Figure 6 is a cross-sectional view of the combination of the fifth embodiment of the fingerprint device of the present invention.

本創作之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

請參閱第1、2圖,係為本創作之具指紋辨識之觸控裝置第一實施例之立體分解及組合剖視圖,如圖所示,本創作具指紋辨識之觸控裝置1,係包含:一玻璃基板11、一第一電極層12、一絕緣層13、一第二電極層14、一走線層15、一薄膜層16、一指紋辨識感應層17;Please refer to FIG. 1 and FIG. 2 for a perspective exploded view and a combined cross-sectional view of the first embodiment of the touch device with fingerprint identification. As shown in the figure, the touch device 1 with fingerprint identification includes: a glass substrate 11, a first electrode layer 12, an insulating layer 13, a second electrode layer 14, a trace layer 15, a film layer 16, a fingerprint identification layer 17;

所述玻璃基板11具有一第一平面111及一第二平面112,所述第一、二平面111、112分設於該玻璃基板11上、下兩側,於該第一平面111定義一觸控區11a及一非觸控區11b,所述非觸控區11b係相鄰該觸控區11a,亦即所述非觸控區11b設於該觸控區11a外側。The glass substrate 11 has a first plane 111 and a second plane 112. The first and second planes 111 and 112 are disposed on the upper and lower sides of the glass substrate 11 to define a touch on the first plane 111. The control area 11a and the non-touch area 11b are adjacent to the touch area 11a, that is, the non-touch area 11b is disposed outside the touch area 11a.

所述第一電極層12設於該玻璃基板11之第二平面112,該第一電極層12具有複數第一電極121,該等第一電極121設置於前述觸控區11a,並部分延伸至所述非觸控區11b。The first electrode layer 12 is disposed on the second plane 112 of the glass substrate 11. The first electrode layer 12 has a plurality of first electrodes 121 disposed on the touch area 11a and partially extended to The non-touch area 11b.

所述絕緣層13覆蓋前述第一電極層12。The insulating layer 13 covers the first electrode layer 12 described above.

所述第二電極層14設於該絕緣層13相反該第一電極層12之另一側,該第二電極層14具有複數第二電極141,所述第二電極層14亦對應設置於該觸控區11a,並部分延伸至所述非觸控區11b。The second electrode layer 14 is disposed on the other side of the first electrode layer 12 opposite to the insulating layer 13. The second electrode layer 14 has a plurality of second electrodes 141. The second electrode layer 14 is also disposed corresponding to the second electrode layer 14 The touch area 11a extends partially to the non-touch area 11b.

所述走線層15具有複數導線151,並設置於該非觸控區11b,並該等導線151選擇與前述第一、二電極層12、14電性連接;所述薄膜層16覆蓋前述第二電極層14及該走線層15。The wiring layer 15 has a plurality of wires 151 disposed on the non-touch region 11b, and the wires 151 are selectively electrically connected to the first and second electrode layers 12 and 14; the film layer 16 covers the second layer. Electrode layer 14 and the wiring layer 15.

所述指紋辨識感應層17設於前述薄膜層16相反前述第二電極層14之另一側,並具有複數指紋辨識晶片171及複數傳輸導線172,該等指紋辨識晶片171係與該等傳輸導線172電性連接。The fingerprint recognition sensing layer 17 is disposed on the other side of the film layer 16 opposite to the second electrode layer 14 and has a plurality of fingerprint identification chips 171 and a plurality of transmission wires 172, and the fingerprint identification chips 171 are connected to the transmission wires. 172 electrical connection.

本創作主要係將指紋辨識感應層17中之複數指紋辨識晶片171與該第一、二電極層12、14相同整合於該觸控區11a中,藉以達到提升觸控準確率及節省製造成本者。The present invention mainly integrates the plurality of fingerprint identification chips 171 in the fingerprint recognition sensing layer 17 with the first and second electrode layers 12 and 14 in the touch area 11a, thereby improving the touch accuracy and saving manufacturing costs. .

請參閱第3圖,係為本創作之具指紋辨識之觸控裝置之第二實施例之組合圖剖視圖,如圖所示,本實施例部分結構技術特徵係與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之差異在於所述具指紋辨識之觸控裝置1更具有一遮蔽層18,所述遮蔽層18係設於玻璃基板11的該第二平面112之非觸控區11b,並所述遮蔽層18設於該玻璃基板11及該走線層15之間,並透過該遮蔽層18係可遮蔽該走線層15避免暴露於外。Please refer to FIG. 3 , which is a sectional view of a combination of the second embodiment of the fingerprint device with fingerprint identification. As shown in the figure, some structural features of the embodiment are the same as those of the first embodiment. The difference between the present embodiment and the foregoing first embodiment is that the fingerprint device 1 has a shielding layer 18, and the shielding layer 18 is disposed on the glass substrate 11. The non-touch area 11b of the second plane 112, and the shielding layer 18 is disposed between the glass substrate 11 and the wiring layer 15, and the shielding layer 18 can shield the wiring layer 15 from exposure to the outside. .

請參閱第4圖,係為本創作之具指紋辨識之觸控裝置之第三實施例之組合圖剖視圖,如圖所示,本實施例部分結構技術特徵係與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之差異在於所述具指紋辨識之觸控裝置1更具有一保護層19,覆蓋前述指紋辨識感應層17,並所述保護層19係為選自環氧樹脂或壓克力樹脂或矽膠其中任一,並所述保護層19係防止該等指紋辨識晶片層17背側裸露於外部。Please refer to FIG. 4 , which is a cross-sectional view of a combination of the third embodiment of the fingerprint device with fingerprint identification. As shown in the figure, some structural features of the embodiment are the same as those of the first embodiment. The difference between the present embodiment and the foregoing first embodiment is that the fingerprint device 1 has a protective layer 19 covering the fingerprint sensing layer 17 and the protective layer. The 19 series is selected from any one of epoxy resin or acrylic resin or silicone, and the protective layer 19 prevents the back side of the fingerprint identification wafer layer 17 from being exposed to the outside.

請參閱第5、5a圖,係為本創作之具指紋辨識之觸控裝置之第四實施例之指紋辨識層之俯視圖及局部放大圖,如圖所示,本實施例部分結構技術特徵係與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之差異在於所述指紋辨識感應層17更具複數金屬導線173,所述金屬導線173係呈透明並與該等指紋辨識晶片171相鄰設置,所述金屬導線173之設置主要係提升指紋辨識晶片171進行指紋辨識之辨識率。Please refer to FIG. 5 and FIG. 5a, which are top view and partial enlarged view of the fingerprint identification layer of the fourth embodiment of the fingerprint device with fingerprint identification. As shown in the figure, some structural technical features of the embodiment are The foregoing first embodiment is the same, and therefore will not be described herein again. However, the difference between the present embodiment and the foregoing first embodiment is that the fingerprint identification sensing layer 17 has a plurality of metal wires 173, and the metal wires 173 are transparent. And disposed adjacent to the fingerprint identification wafer 171, the metal wire 173 is disposed mainly to enhance the recognition rate of the fingerprint recognition chip 171 for fingerprint recognition.

請參閱第6圖,係為本創作之具指紋辨識之觸控裝置之第五實施例之組合圖剖視圖,如圖所示,本實施例部分結構技術特徵係與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之差異在於所述指紋辨識感應層17係設置於玻璃基板11之第一平面111。Please refer to FIG. 6 , which is a sectional view of a combination of the fifth embodiment of the fingerprint device with fingerprint identification. As shown in the figure, the structural features of the embodiment are the same as those of the first embodiment. The difference between the present embodiment and the foregoing first embodiment is that the fingerprint recognition sensing layer 17 is disposed on the first plane 111 of the glass substrate 11.

1‧‧‧具指紋辨識之觸控裝置 1‧‧‧Touching device with fingerprint identification

11‧‧‧玻璃基板 11‧‧‧ glass substrate

11a‧‧‧觸控區 11a‧‧‧ touch area

11b‧‧‧非觸控區 11b‧‧‧ non-touch area

111‧‧‧第一平面 111‧‧‧ first plane

112‧‧‧第二平面 112‧‧‧ second plane

12‧‧‧第一電極層 12‧‧‧First electrode layer

121‧‧‧第一電極 121‧‧‧First electrode

13‧‧‧絕緣層 13‧‧‧Insulation

14‧‧‧第二電極層 14‧‧‧Second electrode layer

141‧‧‧第二電極 141‧‧‧second electrode

15‧‧‧走線層 15‧‧‧Line layer

151‧‧‧導線 151‧‧‧Wire

16‧‧‧薄膜層 16‧‧‧film layer

17‧‧‧指紋辨識感應層 17‧‧‧Fingerprint sensing layer

171‧‧‧指紋辨識晶片 171‧‧‧Fingerprint identification chip

172‧‧‧傳輸導線 172‧‧‧Transmission wire

Claims (5)

【第1項】[Item 1] 一種具指紋辨識之觸控裝置,係包含:
一玻璃基板,具有一第一平面及一第二平面,所述第一、二平面分設於該玻璃基板上、下兩側,於該第一平面定義一觸控區及一非觸控區,所述非觸控區相鄰該觸控區;
一第一電極層,設於該玻璃基板之第二平面,該第一電極層具有複數第一電極;
一絕緣層,覆蓋前述第一電極層;
一第二電極層,設於該絕緣層相反該第一電極層之另一側,該第二電極層具有複數第二電極;
一走線層,具有複數導線,並設置於該非觸控區,並該等導線選擇與前述第一、二電極層電性連接;
一薄膜層,覆蓋前述第二電極層及該走線層;
一指紋辨識感應層,係選擇設於前述薄膜層相反前述第二電極層之另一側或前述玻璃基板之第一平面其中任一,並具有複數指紋辨識晶片及複數傳輸導線,該等指紋辨識晶片係與該等傳輸導線電性連接。
A touch device with fingerprint identification, comprising:
a glass substrate having a first plane and a second plane, wherein the first and second planes are disposed on the upper and lower sides of the glass substrate, and a touch area and a non-touch area are defined on the first plane The non-touch area is adjacent to the touch area;
a first electrode layer is disposed on the second plane of the glass substrate, the first electrode layer having a plurality of first electrodes;
An insulating layer covering the first electrode layer;
a second electrode layer is disposed on the other side of the first electrode layer opposite to the insulating layer, the second electrode layer has a plurality of second electrodes;
a wiring layer having a plurality of wires disposed in the non-touch area, and the wires are electrically connected to the first and second electrode layers;
a film layer covering the second electrode layer and the wiring layer;
a fingerprint identification sensing layer is disposed on the other side of the film layer opposite to the second electrode layer or the first plane of the glass substrate, and has a plurality of fingerprint identification chips and a plurality of transmission lines, and the fingerprint identification The wafer system is electrically connected to the transmission wires.
【第2項】[Item 2] 如申請專利範圍第1項所述之具指紋辨識之觸控裝置,其中更具有一遮蔽層,所述遮蔽層係設於該玻璃基板的該第二平面之非觸控區,並所述遮蔽層設於該玻璃基板及該走線層之間。The touch device with fingerprint identification according to claim 1, wherein the masking layer is further provided with a shielding layer, and the shielding layer is disposed on the non-touch area of the second plane of the glass substrate, and the shielding The layer is disposed between the glass substrate and the wiring layer. 【第3項】[Item 3] 如申請專利範圍第1項所述之具指紋辨識之觸控裝置,其中更具有一保護層,覆蓋前述指紋辨識感應層,並所述保護層係為選自環氧樹脂或壓克力樹脂或矽膠其中任一。The touch device with fingerprint identification as described in claim 1, wherein a protective layer is further disposed to cover the fingerprint sensing layer, and the protective layer is selected from epoxy resin or acrylic resin or Any of the silicones. 【第4項】[Item 4] 如申請專利範圍第1項所述之具指紋辨識之觸控裝置,其中所述指紋辨識感應層更具複數金屬導線,所述金屬導線係呈透明並與該等指紋辨識晶片相鄰設置。The touch-sensitive device of claim 1, wherein the fingerprint-sensing layer has a plurality of metal wires, and the metal wires are transparent and disposed adjacent to the fingerprint-identifying wafers. 【第5項】[Item 5] 如申請專利範圍第1項所述之具指紋辨識之觸控裝置,其中所述非觸控區設於該觸控區外側。
The touch device with fingerprint identification as described in claim 1, wherein the non-touch area is disposed outside the touch area.
TW104203852U 2015-03-16 2015-03-16 Touch device with fingerprint identification TWM505648U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI566156B (en) * 2015-06-10 2017-01-11 宸鴻科技(廈門)有限公司 Touch device with fingerprint identification function
TWI594195B (en) * 2015-11-16 2017-08-01 速博思股份有限公司 Fingerprint identification device and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI566156B (en) * 2015-06-10 2017-01-11 宸鴻科技(廈門)有限公司 Touch device with fingerprint identification function
TWI594195B (en) * 2015-11-16 2017-08-01 速博思股份有限公司 Fingerprint identification device and method

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