TWM524514U - Touch device with fingerprint identification - Google Patents

Description

Touch device with fingerprint identification

A touch device with fingerprint identification, in particular, a touch device with fingerprint identification that directly integrates the fingerprint recognition device on the touch device, thereby improving fingerprint identification accuracy and reducing manufacturing cost.

With the rapid development of multimedia technology, more and more smart portable electronic devices such as mobile phones, personal digital assistants (PDAs), digital cameras, personal notebook computers or tablets or wearable devices have become people. A must-have tool in life. However, these portable electronic devices are highly personal. Therefore, once these portable electronic devices are stolen or lost, the information stored therein, such as phone books, photos, materials, etc., may be used by others, causing unnecessary losses.

Therefore, such products need to be matched with certain identity authentication and permission management to ensure the privacy of users. The main method of identity authentication currently used is password protection, and the user needs to input the correct password to the portable electronic device before entering the control page of the portable electronic device. However, password protection is less secure because passwords are more likely to be compromised or compromised. And if the user forgets the password, it is also very troublesome. Therefore, there is a portable electronic device that uses fingerprint identification for identity authentication. Because everyone's fingerprints are different Therefore, the uniqueness of the fingerprint makes the security of fingerprint authentication using fingerprint recognition much improved. Moreover, the method of using identity authentication using fingerprint identification is relatively convenient, so that the user can save the cumbersome memory and password entry.

The current fingerprint identification system is widely used in handheld devices or mobile devices. The most common fingerprint identification devices are independently designed, for example, on a fixed side of a notebook computer keyboard or a fixed position on the back side or the bottom side of a hand-held mobile device. It cannot be effectively integrated on the touch screen of the handheld mobile device to reduce the volume of the handheld mobile device, and the conventional fingerprint identification chip package module mainly includes a substrate, a wafer and a mold body. The wafer is disposed on the substrate and electrically connected to the substrate, and the mold body covers the surface of the substrate and the wafer.

In the prior art, the sensing circuit and the metal trace or the chip must be disposed on a substrate made of a single wafer, integrated into a fingerprint identification unit, and then combined with a touch panel or other device. The overall thickness of the fingerprint identification unit provided by the known technology is also thick, and it is easy to integrate the thinner device due to the thickness affecting the accuracy of the fingerprint identification and the thickness consideration.

Furthermore, when the finger touches the sensing region of the wafer, the wafer package is covered with a multilayer film, so that the overall thickness of the chip package module is high, and the chip package module has low sensitivity.

In addition, the conventional slip fingerprint identification system has directionality, and the recognition time is too long and must be set independently, which is very poor in structural integration or ease of use.

Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a touch recognition device with fingerprint identification unit directly integrated with the touch device.

In order to achieve the above objective, the present invention provides a touch device with fingerprint recognition, which comprises: a touch device and a fingerprint recognition unit; The touch device defines a touch area and a non-touch area. The non-touch area is adjacent to the touch area and is disposed on the periphery of the touch area. The touch device has a first substrate. Having a first surface and a second surface, the first surface may be in the form of a plane or a curved surface; a shielding layer is selected from the non-touch area of any one of the first and second surfaces; The substrate has a third surface and a fourth surface; a touch electrode layer is disposed on the touch surface of the third surface of the second substrate, the touch electrode layer has a plurality of first touch electrodes and a plurality of second The electrodes and the plurality of metal traces are electrically connected to the metal traces; an insulating layer is disposed at the intersection of the first and second touch electrodes; and an optical adhesive layer Between the first substrate and the second substrate; a flexible substrate having a plurality of circuit traces and a touch chip, the circuit traces being electrically connected to the touch wafer and the metal traces The flexible substrate is selected from any of the third and fourth surfaces of the second substrate. A fingerprint identification unit is disposed in the non-touch area of the touch device.

In one implementation, the second substrate is selected to be either a glass or a PET material.

In one implementation, the fingerprint recognition unit further includes: a first cladding layer disposed on the third surface of the second substrate; and a first fingerprint identification electrode layer disposed on the first a first cladding layer having a plurality of first fingerprint identifying electrodes; a first protective layer covering a portion of the first fingerprint identifying electrode layer; and a second fingerprint identifying electrode layer disposed on the first protective layer opposite to the first layer a fingerprint identification electrode layer side, the second fingerprint identification electrode layer has a plurality of second fingerprint recognition electrodes; a second protective layer covering a portion of the second fingerprint identifying electrode layer; a wire layer having a plurality of metal wires, wherein the metal wires are electrically connected to the first and second fingerprint identifying electrode layers; and a fingerprint identification a non-touch area disposed on the third surface of the second substrate; a flexible circuit substrate having a plurality of electronic circuits connecting the first and second fingerprint identification electrode layers, the wire layer, and the fingerprint identification chip, The flexible substrate is selected from the non-touch regions of any one of the third and fourth surfaces of the second substrate.

In one implementation, the fingerprint recognition unit further includes: a first cladding layer disposed on the first side of the second substrate; and a first fingerprint identification electrode layer disposed on the first The first protective layer covers a portion of the first fingerprint identifying electrode layer; and a second fingerprint identifying electrode layer is disposed on the first protective layer opposite the first One side of the fingerprint identification electrode layer, the second fingerprint identification electrode layer has a plurality of second fingerprint identification electrodes; a second protection layer covering a portion of the second fingerprint identification electrode layer; a wire layer having a plurality of metal wires, and The metal wires are electrically connected to the first and second fingerprint identification electrode layers; a fingerprint identification chip is disposed on the third surface of the second substrate; and a flexible circuit substrate having a plurality of electrons The circuit connects the first and second fingerprint identification electrode layers and the wire layer and the fingerprint identification chip.

In one implementation, the first and second protective layers are any one of an OC protective film (OVER COAT) or a ceria film.

In one implementation, the first, second, and third coating layers are ruthenium dioxide films.

Through the creation of the fingerprint recognition unit directly integrated into the non-touch of the touch device In the area, the touch device can be prevented from being damaged by the slotted hole, and the manufacturing cost of the touch device can be reduced.

1‧‧‧Touching device with fingerprint identification

11‧‧‧Touch device

111‧‧‧ touch area

112‧‧‧ Non-touch area

113‧‧‧First substrate

113a‧‧‧ first surface

113b‧‧‧second surface

114‧‧‧Shielding layer

115‧‧‧second substrate

115a‧‧‧ third surface

115b‧‧‧ fourth surface

116‧‧‧Touch electrode layer

116a‧‧‧First touch electrode

116b‧‧‧Second touch electrode

116c‧‧‧Metal routing

117‧‧‧Insulation

118‧‧‧Optical adhesive layer

119‧‧‧Soft substrate

119a‧‧‧Circuit trace

119b‧‧‧ touch wafer

12‧‧‧Finger identification unit

121‧‧‧First coating

122‧‧‧First fingerprint identification electrode layer

122a‧‧‧First fingerprint identification electrode

123‧‧‧First protective layer

124‧‧‧Second fingerprint identification electrode layer

124a‧‧‧Second fingerprint recognition electrode

125‧‧‧Second protective layer

126‧‧‧ wire layer

126a‧‧‧Metal wire

127‧‧‧Fingerprinting chip

128‧‧‧Soft circuit board

128a‧‧‧Electronic circuit

2‧‧‧The touch device with fingerprint identification

21‧‧‧ touch device

211‧‧ ‧ touch area

212‧‧‧ Non-touch area

213‧‧‧First substrate

213a‧‧‧ first surface

213b‧‧‧ second surface

214‧‧‧shading layer

215‧‧‧second substrate

215a‧‧‧ third surface

215b‧‧‧ fourth surface

216‧‧‧Touch electrode layer

216a‧‧‧First touch electrode

216b‧‧‧second touch electrode

216c‧‧‧Metal routing

217‧‧‧Insulation

218‧‧‧Optical adhesive layer

219‧‧‧Soft substrate

219a‧‧‧Circuit trace

219b‧‧‧ touch wafer

22‧‧‧Finger identification unit

221‧‧‧First coating

222‧‧‧First fingerprint identification electrode layer

222a‧‧‧First fingerprint identification electrode

223‧‧‧Second coating

224‧‧‧Second fingerprint identification electrode layer

224a‧‧‧Second fingerprint recognition electrode

225‧‧‧ wire layer

225a‧‧‧Metal wire

226‧‧‧ Third coating

227‧‧‧Fingerprint Identification Wafer

228‧‧‧Soft circuit board

228a‧‧‧Electronic circuits

1 is a perspective exploded view of a first embodiment of a fingerprint device with fingerprint identification; FIG. 1A is a partial enlarged view of a first embodiment of a touch device with fingerprint recognition; 1B is a partial enlarged view of a first embodiment of a fingerprint device with fingerprint identification; FIG. 2 is a combined sectional view of a first embodiment of a fingerprint device with fingerprint identification; 3 is an exploded perspective view of a second embodiment of a fingerprint device with fingerprint identification; FIG. 3A is a partial enlarged view of a second embodiment of a touch device with fingerprint identification; 3B is a partial enlarged view of a second embodiment of the fingerprint device with fingerprint identification; FIG. 3C is a partial enlarged view of the second embodiment of the fingerprint device with fingerprint identification; 4 is a combined cross-sectional view of a second embodiment of the fingerprinting touch device of the present invention.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

Please refer to Figures 1, 1A, 1B and 2, which are perspective exploded, partially enlarged and combined cross-sectional views of the first embodiment of the fingerprint device with fingerprint identification. As shown in the figure, the creation has fingerprint identification. The touch device 1 includes a touch device 11 and a fingerprint recognition unit 12; the touch device 11 defines a touch area 111 and a non-touch area 112, and the non-touch area 112 is adjacent to each other. The touch area 111 is disposed on the periphery of the touch area 111. The fingerprint recognition unit 12 is disposed in the non-touch area 112.

The touch device 11 has a first substrate 113, a shielding layer 114, and a second substrate. 115, a touch electrode layer 116, an insulating layer 117, an optical adhesive layer 118, a flexible substrate 119; the first substrate 113 has a first surface 113a and a second surface 113b, the first surface 113a The surface of the first surface 113a may be a curved surface as a whole or a curved surface of the four sides (not shown).

The masking layer 114 is selected from any of the non-touch areas 112 of the first and second surfaces 113a and 113b. The non-touch area 112 of the second surface 113b is provided as an illustration but is not cited. To be limited, the shielding layer 114 is a black insulating ink.

The second substrate 115 has a third surface 115a and a fourth surface 115b. The touch electrode layer 116 is disposed on the touch surface 111 of the third surface 115a of the second substrate 115. The touch electrode layer 116 has The first touch electrodes 116a and the plurality of touch electrodes 116b and the plurality of metal traces 116c are electrically connected to the metal traces 116c. The wire 116c is partially extended to the non-touch area 112, the insulating layer 117 is disposed at the intersection of the first and second touch electrodes 116a, 116b, and the second substrate 115 is selected as one of a glass or a PET material. This embodiment is based on a glass material, but is not limited.

The optical adhesive layer 118 is disposed between the first substrate 113 and the second substrate 115 and covers the touch electrode layer 116 at the same time.

The flexible substrate 119 has a plurality of circuit traces 119a and a touch wafer 119b. The circuit traces 119a are electrically connected to the touch wafer 119b and the metal traces 116c. The flexible substrate 119 is selectively disposed on the circuit board 119a. Any of the third and fourth surfaces 115a, 115b of the second substrate 115.

The fingerprint recognition unit 12 is disposed in the non-touch area 112 of the touch device 11 .

The fingerprint recognition unit 12 further includes a first cladding layer 121, a first fingerprint identification electrode layer 122, a first protection layer 123, a second fingerprint identification electrode layer 124, a second protection layer 125, and a first protection layer 123. a wire layer 126, a fingerprint identification wafer 127, a flexible circuit substrate 128; The first cladding layer 121 is disposed on the non-touch region 112 of the third surface 115a of the second substrate 115. The first fingerprint electrode layer 122 is stacked on the first cladding layer 121. And having a plurality of first fingerprint identifying electrodes 122a; the first protective layer 123 covers a portion of the first fingerprint identifying electrode layer 122; the second fingerprint identifying electrode layer 124 is disposed on the first protective layer 123 opposite the first One side of the fingerprint identification electrode layer 122, the second fingerprint recognition electrode layer 124 has a plurality of second fingerprint recognition electrodes 124a; the second protection layer 125 covers a portion of the second fingerprint recognition electrode layer 124; the wire layer 126 A plurality of metal wires 126a are selected, and the metal wires 126a are selectively electrically connected to the first and second fingerprint electrode layers 122 and 124. The fingerprint identification chip 127 is selected to be disposed on the third substrate 115. The non-touch area 112 of any of the four surfaces 115a and 115b is not limited to the non-touch area 112 of the third surface 115a. The flexible circuit board 128 has a plurality of Before the electronic circuit 128a is connected The first and second fingerprint identification electrode layers 122 and 124 and the wire layer 126 and the fingerprint recognition wafer 127 are selected from the third and fourth surfaces 115a and 115b of the second substrate 115. The non-touch area 112 is disposed in the non-touch area 112 of the third surface 115a as an illustration, but is not limited thereto and is disposed corresponding to the fingerprint recognition wafer 127.

Please refer to the figures 3, 3A, 3B, 3C and 4, which are perspective exploded and partially enlarged views and combined sectional views of the second embodiment of the fingerprint device with fingerprint identification as shown in the figure. The touch device 2 includes a touch device 21 and a fingerprint recognition unit 22; the touch device 21 defines a touch area 211 and a non-touch area 212, and the non-touch The adjacent touch area 211 of the area 212 is disposed on the periphery of the touch area 211. The fingerprint recognition unit 22 is disposed in the non-touch area 212.

The touch device 21 has a first substrate 213, a shielding layer 214, a second substrate 215, a touch electrode layer 216, an insulating layer 217, an optical adhesive layer 218, and a flexible substrate 219. The first substrate 213 has a first surface 213a and a second surface 213b, the first surface The 213a can be either a flat surface or a curved surface.

The masking layer 214 is selected from the non-touch area 212 of the first surface and the second surface 213a, 213b. The non-touch area 212 of the second surface 213b is provided as an illustration but is not cited. To be limited.

The second substrate 215 has a third surface 215a and a fourth surface 215b. The touch electrode layer 216 is disposed on the touch surface 211 of the third surface 215a of the second substrate 215. The touch electrode layer 216 has The first touch electrodes 216a and the plurality of second touch electrodes 216b and the plurality of metal traces 216c are electrically connected to the metal traces 216c, and the metal traces are The wire 216c is partially extended to the non-touch area 212, the insulating layer 217 is disposed at the intersection of the first and second touch electrodes 216a, 216b, and the second substrate 215 is selected as one of a glass or a PET material. This embodiment is based on the PET material as a description but is not limited.

The optical adhesive layer 218 is disposed between the first substrate 213 and the second substrate 215 and covers the touch electrode layer 216 at the same time.

The flexible substrate 219 has a plurality of circuit traces 219a and a touch wafer 219b. The circuit traces 219a are electrically connected to the touch wafer 219b and the metal traces 216c. The flexible substrate 219 is selected. In the non-touch area 212 of the third surface 215a, 215b of the second substrate 215, the non-touch area 212 of the third surface 215a is used as an illustration but is not taken as an illustration. limit.

The fingerprint recognition unit 22 is disposed in the non-touch area 212 of the touch device 21 .

The fingerprint recognition unit 22 further includes: a first cladding layer 221, a first fingerprint identification electrode layer 222, a second cladding layer 223, a second fingerprint identification electrode layer 224, a wire layer 225, and a first a three-clad layer 226, a fingerprint identification wafer 227, and a flexible circuit substrate 228; the first cladding layer 221 is disposed on the third surface 215a of the second substrate 215. The first fingerprint recognition electrode layer 222 is laminated on the first cladding layer 221, the first fingerprint recognition electrode layer 222 has a plurality of first fingerprint recognition electrodes 222a; and the second cladding layer 223 is covered. Part of the aforementioned first fingerprint recognition electrode layer 222.

The second fingerprint recognition electrode layer 224 is disposed on a side of the second cladding layer 223 opposite to the first fingerprint recognition electrode layer 222, and the second fingerprint identification electrode layer 224 has a plurality of second fingerprint recognition electrodes 224a; The layer 225 has a plurality of metal wires 225a, and the metal wires 225a are selectively electrically connected to the first and second fingerprint electrode layers 222 and 224; the third cladding layer 226 covers the second fingerprint electrode layer 224. And a portion of the wire layer 225.

The non-touch area 212 is disposed on the third surface 215a of the second substrate 215. The non-touch area is disposed on the third surface 215a of the second substrate 215. The flexible circuit board 228 has a plurality of electronic circuits 228a electrically connected to the first and second fingerprint identifying electrode layers 222 and 224, the wiring layer 225, and the fingerprint identifying wafer 227, and is not limited thereto. The flexible substrate 228 is selected from the non-touch area 212 of the third surface 215a, 215b of the second substrate 215. The embodiment is disposed in the non-touch area 212 of the third surface 215a. The description is not limited and is provided corresponding to the fingerprint identification wafer 227 described above.

The first and second protective layers 123, 125 are any one of an OC protective film (OVER COAT) or a ceria film; the first, second, and third cladding layers 121, 221, 223, and 226 are Ceria film.

The fingerprint recognition unit is directly disposed in the non-touch area of the touch device through the present invention, and the fingerprint identification unit is disposed in the non-touch area of the touch device by direct wiring, thereby eliminating the need for In addition, the hole or the groove is formed in the touch device to avoid damage to the structural strength of the touch device, and further, the manufacturing cost can be further reduced.

1‧‧‧Touching device with fingerprint identification

11‧‧‧Touch device

111‧‧‧ touch area

112‧‧‧ Non-touch area

113‧‧‧First substrate

113a‧‧‧ first surface

113b‧‧‧second surface

114‧‧‧Shielding layer

115‧‧‧second substrate

115a‧‧‧ third surface

115b‧‧‧ fourth surface

116‧‧‧Touch electrode layer

116a‧‧‧First touch electrode

116b‧‧‧Second touch electrode

116c‧‧‧Metal routing

117‧‧‧Insulation

118‧‧‧Optical adhesive layer

119‧‧‧Soft substrate

119a‧‧‧Circuit trace

119b‧‧‧ touch wafer

12‧‧‧Finger identification unit

121‧‧‧First coating

122‧‧‧First fingerprint identification electrode layer

122a‧‧‧First fingerprint identification electrode

123‧‧‧First protective layer

124‧‧‧Second fingerprint identification electrode layer

124a‧‧‧Second fingerprint recognition electrode

125‧‧‧Second protective layer

126‧‧‧ wire layer

126a‧‧‧Metal wire

127‧‧‧Fingerprinting chip

128‧‧‧Soft circuit board

128a‧‧‧Electronic circuit

Claims (6)

A touch-sensing device includes: a touch device defining a touch area and a non-touch area, wherein the non-touch area is adjacent to the touch area and disposed on the periphery of the touch area; The touch device has a first substrate having a first surface and a second surface, wherein the first surface can be any one of a plane or a curved surface; and a shielding layer is disposed on the first surface and the second surface. a non-touch area; a second substrate having a third surface and a fourth surface; a touch electrode layer disposed on the touch surface of the third surface of the second substrate, the touch electrode layer The first and second touch electrodes are electrically connected to the metal traces; the first and second touch electrodes are electrically connected to the metal traces; and an insulating layer is disposed on the first and second a touch screen electrode; an optical adhesive layer disposed between the first substrate and the second substrate; a flexible substrate having a plurality of circuit traces and a touch wafer, the circuit traces and the touch wafer And electrically connecting the metal traces, wherein the flexible substrate is selected to be disposed in the second Plates of the third and fourth surface either; a fingerprint recognition unit, provided in the non-touch area of the touch device. The touch device with fingerprint identification according to claim 1, wherein the second substrate is selected from any of glass or PET materials. The fingerprint device of claim 1, wherein the fingerprint recognition unit further comprises: a first cladding layer disposed on the third surface of the second substrate; a first fingerprint identification electrode layer, laminated on the first cladding layer, and having a plurality of first fingerprint recognition electrodes; a first protective layer covering a portion of the first fingerprint identifying electrode layer; a second fingerprint identifying electrode layer disposed on a side of the first protective layer opposite to the first fingerprint identifying electrode layer, the second fingerprint identifying electrode The layer has a plurality of second fingerprint identifying electrodes; a second protective layer covering the second fingerprint identifying electrode layer portion; a wire layer having a plurality of metal wires, and the metal wire system selection and the first and second fingerprint identifications The electrode layer is electrically connected; a fingerprint identification chip is selected as a non-touch area disposed on any one of the third and fourth surfaces of the second substrate; a flexible circuit substrate having a plurality of electronic circuits connecting the first and second fingerprints And identifying the electrode layer and the wire layer and the fingerprint identification chip, wherein the flexible substrate is selected to be disposed on any one of the third and fourth surfaces of the second substrate. The fingerprint device of claim 1, wherein the fingerprint recognition unit further comprises: a first cladding layer disposed on the third surface of the second substrate; a first fingerprint identification electrode layer is laminated on the first cladding layer, the first fingerprint identification electrode layer has a plurality of first fingerprint recognition electrodes, and a second cladding layer covers a portion of the first fingerprint identification An electrode layer; a second fingerprint identifying electrode layer disposed on a side of the second cladding layer opposite to the first fingerprint identifying electrode layer, the second fingerprint identifying electrode layer having a plurality of second fingerprint identifying electrodes; a wire layer, The plurality of metal wires are electrically connected to the first and second fingerprint identification electrode layers; the third cladding layer covers the second fingerprint identification electrode layer and a portion of the wire layer; and a fingerprint identification chip a non-touch area disposed on the third surface of the second substrate; a flexible circuit substrate having a plurality of electronic circuits electrically connected to the first and second fingerprint identification The pole layer and the wire layer and the fingerprint identification chip are selected from any one of the third and fourth surfaces of the second substrate. The touch device with fingerprint identification according to claim 3, wherein the first and second protective layers are any one of an OC protective film (OVER COAT) or a ceria film. The touch device with fingerprint identification according to claim 4, wherein the first, second and third coating layers are ruthenium dioxide films.