TWM512873U - Substrate structure of electronic elements - Google Patents

Description

Substrate structure of electronic components

The present invention relates to a substrate structure of an electronic component; and more particularly to a substrate structure of an electronic component that can be adapted for bending.

With the increasing precision of semiconductor technology, the substrate structure of electronic components (such as transistors or light-emitting diodes) is gradually moving toward light, thin, short, and small, and is gradually being used to improve human life. Taking the light-emitting diode as an example, in addition to having a display function, it can also be used as an illumination source, such as a lighting device for indoor/outdoor lamps, a lamp or a backlight module of a liquid crystal screen, which can achieve power saving and thinning. Long life and other advantages.

Among them, in order to meet the high brightness requirements of lighting applications, the light-emitting diode usually needs to work with a large current, and the increase of the current amount will increase the heat generation of the component, and in order to prevent the component from overheating and burning, the substrate structure of the conventional electronic component is usually adopted. The aluminum plate acts as a heat sink for instant heat dissipation.

However, the aluminum plate that can be used for heat dissipation is thick and has high hardness and is not easily deformed by bending, which makes it difficult to process and form related applications (for example, in combination with a lighting device, or directly forming a part of a product by bending a circuit board). The shape and the high cost of the aluminum plate increase the difficulty and cost of production, which is unfavorable to improve the economic benefits of mass production.

In view of this, it is necessary to improve the shortcomings of the prior art described above to meet practical needs and improve its practicability.

The present invention provides a substrate structure of an electronic component that can be easily bent and processed.

The present invention discloses a substrate structure of an electronic component, which may include: a steel layer; an insulating layer disposed on the steel layer; and a wiring layer disposed on the insulating layer, the wiring layer may be formed by a plurality of conductive materials to form a plurality of gaps .

The steel layer can be a galvanized steel sheet.

The steel layer may be a hot dip galvanized steel sheet, a galvanized steel sheet or a cold rolled steel sheet.

The steel layer may be formed into a bent shape.

The opposite surfaces of the steel layer may form a bonding surface and a mounting surface, the bonding surface is combined with the insulating layer, and the setting surface forms a curved surface.

The substrate structure may include a solder mask layer, and the solder mask layer may be filled in a gap of the wiring layer.

The opposite surfaces of the wiring layer may form a bonding surface and an exposed surface, the bonding surface may be joined to the insulating layer, and the soldering layer may be disposed on a portion of the exposed surface of the wiring layer, so that adjacent shielding layers The conductive material can be exposed.

The solder mask may extend from a gap of the wiring layer to a portion of the exposed surface.

The substrate structure may include a solder layer disposed on the conductive material exposed from the solder mask.

The insulating layer may be a resin film.

In addition to the advantages of good heat dissipation, low cost, and good metal strength, the substrate structure of the electronic component can achieve the effect of "easy bending and forming", and can improve the substrate structure of the conventional electronic component. The problem is applicable to various devices that require substrate processing, such as indoor/outdoor lamps, backlights for backlights or LCD screens.

1‧‧‧ steel layer

11‧‧‧ joint surface

12‧‧‧Setting surface

2‧‧‧Insulation

3‧‧‧ wiring layer

3a‧‧‧Electrical material

3b‧‧‧ gap

31‧‧‧ joint surface

32‧‧‧ exposed face

4‧‧‧shielding layer

5‧‧‧welding layer

Fig. 1 is a combined side view of a substrate construction embodiment of the present electronic component.

In order to make the above and other objects, features and advantages of the present invention more comprehensible, the embodiments of the present invention are described in detail below with reference to the accompanying drawings. Layout) refers to a planar pattern or a three-dimensional form formed on a circuit board by a conductive material for providing electronic components (eg, light-emitting diodes, etc.), such as a single-layer board for surface-mounting components (SMD) bonding. The planar wire pattern or the three-dimensional wire form of the multilayer board, etc., is not limited thereto, and can be understood by those having ordinary knowledge in the technical field of the present invention.

Referring to Fig. 1, there is shown a combined side view of a substrate construction embodiment of the present electronic component. The substrate structure embodiment of the electronic component may include a steel layer 1, an insulating layer 2, and a wiring layer 3; the insulating layer 2 may be disposed on the steel layer 1 for electrically insulating the steel layer 1 and the The wiring layer 3; the wiring layer 3 may be disposed on the insulating layer 2, and the wiring layer 3 may be formed by a plurality of conductive materials 3a to form a plurality of gaps 3b, and the conductive material 3a and the gap 3b may collectively form a layout.

In this embodiment, the steel layer 1 may be a galvanized steel sheet (SECC), such as: hot dip galvanized steel sheet (SGCC), galvanized steel sheet (SGLD) or cold rolled steel sheet (SPCC), etc., the steel layer 1 In addition to the advantages of good heat dissipation, low cost and good metal strength, the material properties can be easily bent and formed. For example, the steel layer 1 can be bent (for example, bent into a box shape, a groove shape or a step shape). And the opposite surfaces of the steel layer 1 form a bonding surface 11 and a setting surface 12, the bonding surface 11 may be combined with the insulating layer 2, and the setting surface 12 may form a curved surface (eg, concave, convex, etc.) or The surface is processed by stamping, etc., so as to be suitable for various devices that require substrate processing, such as indoor/outdoor lamps, backlights for backlights or liquid crystal screens, etc., but not limited thereto.

In addition, the insulating layer 2 may be a resin film (such as an epoxy resin (Epoxy) film or a polyimide (PI) film, etc., and the resin film may contain glass fiber, glass fiber cloth, etc. a filler for improving mechanical strength, adjusting insulation and thermal conductivity, and reducing thermal expansion rate, but not limited thereto; The electrical material may be connected by a conductive metal material (such as copper) to form the electronic circuit for connecting the electronic component to form a special function. For example, the opposite surfaces of the wiring layer 3 may form a joint surface 31 and an exposed surface. The surface 32 can be joined to the insulating layer 2, but not limited thereto.

Referring to FIG. 1 again, the substrate structure embodiment of the electronic component may further include a solder mask layer 4 and a solder layer 5, and the solder mask layer 4 may be disposed on the exposed surface 32 of the wiring layer 3, or The soldering layer 4 may also be filled in the gap 3b of the wiring layer 3. For example, the soldering layer 4 may extend from the gap 3b of the wiring layer 3 to a portion of the exposed surface 32, etc. The practical application is changed so that the conductive material 3a can be exposed between the adjacent soldering layers 4 to define a portion of the wiring layer 3 where the electronic component is to be disposed (for example, a solder cloth for the surface adhesive component to be attached to the wiring layer 3) The soldering layer 5 may be disposed on the exposed surface of the wiring layer 3, but the bonding layer 5 may be disposed on the exposed surface 32 of the wiring layer 3, but not limited thereto.

In this embodiment, the solder mask layer 4 can form a masking pattern (not shown), which can be changed according to an actual application (eg, layout), which can be understood by those having ordinary knowledge in the technical field. It is not mentioned here; the solder layer 5 can be made of nickel metal (ENIG), tin (Immersion Tin), spray tin (HASL), silver (Immersion Silver), electroplated nickel gold (E-Ni/Au) Formed by means of Ag plating or organic soldering agent (OSP) to produce a metal finish to protect the surface of the conductive material exposed from the soldering layer 4, so that the surface of the conductive material Slow oxidation and ensure solderability, but not limited to this.

The main features of the substrate structure embodiment of the present electronic component are as follows: the substrate structure embodiment includes the steel layer 1; the insulating layer 2 can be disposed on the steel layer 1; and the wiring layer 3 may be provided on the insulating layer 2, and the wiring layer 2 is provided with a layout in which conductive materials are connected. Wherein, the steel layer 1 can be formed into a curved shape or a curved surface.

Therefore, the substrate structure embodiment of the electronic component of the present invention has the advantages of good heat dissipation, low cost, and good metal strength, and the "easy bend forming" effect can be achieved, and the substrate structure of the conventional electronic component can be improved. It is not easy to bend and deform, so it can be applied to various Devices that require substrate processing, such as lighting fixtures for indoor/outdoor lighting, headlights, or backlight modules for LCD screens.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and it is still within the spirit and scope of the present invention to make various changes and modifications to the above embodiments. The technical scope of protection, therefore, the scope of protection of this creation is subject to the definition of the scope of the patent application attached.

1‧‧‧ steel layer

11‧‧‧ joint surface

12‧‧‧Setting surface

2‧‧‧Insulation

3‧‧‧ wiring layer

3a‧‧‧Electrical material

3b‧‧‧ gap

31‧‧‧ joint surface

32‧‧‧ exposed face

4‧‧‧shielding layer

5‧‧‧welding layer

Claims (10)

A substrate structure of an electronic component, comprising: a steel layer; an insulating layer disposed on the steel layer; and a wiring layer disposed on the insulating layer, wherein the wiring layer is formed by a plurality of conductive materials to form a plurality of gaps. The substrate structure of the electronic component according to claim 1, wherein the steel layer is a galvanized steel sheet. The substrate structure of the electronic component according to claim 1, wherein the steel layer is a hot dip galvanized steel sheet, a galvanized steel sheet or a cold rolled steel sheet. The substrate structure of the electronic component according to claim 1, wherein the steel layer is formed in a bent shape. The substrate structure of the electronic component according to claim 1, wherein the opposite surfaces of the steel layer form a bonding surface and a mounting surface, the bonding surface is combined with the insulating layer, and the mounting surface forms a curved surface. The substrate structure of the electronic component according to claim 1, further comprising a solder mask layer, the solder mask layer being filled in a gap of the wiring layer. The substrate structure of the electronic component according to claim 1, wherein the opposite surfaces of the wiring layer form a bonding surface and an exposed surface, the bonding surface bonding the insulating layer, and the soldering layer is disposed on the wiring layer The exposed portion of the surface exposes the conductive material between adjacent solder mask layers. The substrate structure of an electronic component according to claim 7, wherein the solder resist layer extends from a gap of the wiring layer to a portion of the exposed surface. The substrate structure of the electronic component according to claim 7, further comprising a soldering layer provided on the conductive material exposed from the soldering layer. The substrate structure of an electronic component according to claim 1, wherein the insulating layer is a resin film.