TWM510468U - Lens carrying device - Google Patents

Lens carrying device Download PDF

Info

Publication number
TWM510468U
TWM510468U TW104205931U TW104205931U TWM510468U TW M510468 U TWM510468 U TW M510468U TW 104205931 U TW104205931 U TW 104205931U TW 104205931 U TW104205931 U TW 104205931U TW M510468 U TWM510468 U TW M510468U
Authority
TW
Taiwan
Prior art keywords
lens
base
circuit layer
hole
carrying device
Prior art date
Application number
TW104205931U
Other languages
Chinese (zh)
Inventor
Chao-Kuei Wu
Original Assignee
3D Circuit Taiwan Company Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3D Circuit Taiwan Company Ltd filed Critical 3D Circuit Taiwan Company Ltd
Priority to TW104205931U priority Critical patent/TWM510468U/en
Priority to CN201520283472.2U priority patent/CN204795265U/en
Priority to JP2015002259U priority patent/JP3198772U/en
Publication of TWM510468U publication Critical patent/TWM510468U/en

Links

Landscapes

  • Lens Barrels (AREA)
  • Structure Of Printed Boards (AREA)

Description

鏡頭承載裝置Lens carrier

本創作係揭露一種鏡頭承載裝置,特別是指一種利用雷射直接成型方式(Laser Direct Structuring, LDS)形成線路層之鏡頭承載裝置。The present invention discloses a lens carrying device, and more particularly to a lens carrying device for forming a circuit layer by using Laser Direct Structuring (LDS).

近年來,行動裝置產品朝向薄型化之趨勢發展,卻也因此肇生裝置空間受限之問題。其中,電子元件開發朝向微型化且均具整合之功能,進而符合產品趨勢,現行運用於行動裝置相機模組之音圈馬達(Voice Coil Motor, VCM)係電性設置於一貼附軟性印刷電路板(Flexible Printed Circuit)之基座,並與該軟性印刷電路板電性連結;惟,因該音圈馬達微型化將造成該軟性印刷電路板難以貼覆於該基座上。In recent years, mobile device products have been trending towards thinner, but they have also limited the space of the device. Among them, the development of electronic components is towards miniaturization and has the function of integration, which in turn conforms to the product trend. The current voice coil motor (VCM) used in the camera module of the mobile device is electrically disposed on a attached flexible printed circuit. The pedestal of the flexible printed circuit is electrically connected to the flexible printed circuit board; however, the miniaturization of the voice coil motor makes it difficult for the flexible printed circuit board to be attached to the pedestal.

經檢索中華民國專利公告號第I464477號「鏡頭模組及其組裝方法」,該鏡頭模組須使用一柔性電路板將第一感測器以及第二感測器貼合安裝於該柔性電路板上,增加了加工上之難度、時間以及成本。The lens module and the method of assembling the same are disclosed in the Chinese Patent Publication No. I464477, which is to be attached to the flexible circuit board by using a flexible circuit board to attach the first sensor and the second sensor to the flexible circuit board. This increases the difficulty, time and cost of processing.

故本新型之創作人有鑑於上述習知技術之缺失,乃亟思創作一種鏡頭承載裝置,其係透過雷射直接成型(Laser Direct Structuring, LDS)之方式直接於該基座上形成電路層,可有效解決該軟性印刷電路板貼附加工之難度、良率、工時以及組裝成本等問題,實為相對便利且低成本之創作。Therefore, in view of the lack of the above-mentioned prior art, the present creator has created a lens carrying device which forms a circuit layer directly on the pedestal by means of Laser Direct Structuring (LDS). It can effectively solve the problems of difficulty, yield, man-hour and assembly cost of attaching the flexible printed circuit board, which is relatively convenient and low-cost creation.

本創作之一目的係提供一種鏡頭承載裝置,透過直接使用雷射直接成型(Laser Direct Structuring, LDS)之方式形成線路層於基座上,來降低製造上之難度、時間以及成本。One of the purposes of this creation is to provide a lens carrying device that reduces the difficulty, time, and cost of manufacturing by directly forming a circuit layer on the pedestal by directly using Laser Direct Structuring (LDS).

為達到上述目的以及其它目的,本創作係提供一種鏡頭承載裝置,其至少包含有:一基座,係具有一第一通孔,該基座之表面形成有一線路層,且該線路層之表面係鍍覆有一金屬層;複數個電子元件,係設置於該線路層上,並透過該金屬層與該線路層電性連接;以及一鏡頭載具,係為一具有一第二通孔之結構,對應設置於該基座之上,其改良在於,該線路層係透過雷射直接成型(LDS)之方式形成,且該鏡頭載具係可供音圈馬達(VCM)之鏡頭單元容置於其中。In order to achieve the above and other objects, the present invention provides a lens carrying device including at least a base having a first through hole, a surface of the base is formed with a circuit layer, and a surface of the circuit layer a metal layer is plated; a plurality of electronic components are disposed on the circuit layer and electrically connected to the circuit layer through the metal layer; and a lens carrier is a structure having a second through hole Correspondingly disposed on the pedestal, the improvement is that the circuit layer is formed by laser direct structuring (LDS), and the lens carrier is accommodated by a lens unit of a voice coil motor (VCM) among them.

其中,該基座之材料係為熱固型塑膠鄰苯二甲酸二烯丙酯(DAP;Diallyl Phthalate Plastics)及熱塑型塑膠聚鄰苯二甲醯胺(PPA;Polyphthalamide)、液晶高分子聚合物(LCP;Liquid Crystal Polymer)、聚醯胺(PA;Polyamide)、聚碳酸酯(PC;Polycarbonate)或聚碳酸酯樹脂和丙烯晴-丁二烯-苯乙烯共聚合物(PC/ABS;Polycarbonate/Acrylonitrile-Butadene-Stvrene)等材料;且該基座係採用射出成型抑或是熱壓成型之方式形成。The material of the susceptor is thermosetting plastic diallyl phthalate (DAP; Diallyl Phthalate Plastics) and thermoplastic plastic polyphthalamide (PPA; Polyphthalamide), liquid crystal polymer polymerization (LCP; Liquid Crystal Polymer), Polyamide (PA; Polyamide), Polycarbonate (PC; Polycarbonate) or Polycarbonate Resin and Acrylic Butadiene-Styrene Copolymer (PC/ABS; Polycarbonate) /Acrylonitrile-Butadene-Stvrene) and the like; and the base is formed by injection molding or hot press forming.

其中,該等電子元件係可為互補性金屬氧化物感測器(Complementary Metal Oxide Semiconductor, CMOS)以及電荷耦合組件感測器(Charge Coupled Device, CCD)之其中之一者。The electronic components may be one of a Complementary Metal Oxide Semiconductor (CMOS) and a Charge Coupled Device (CCD).

其中,該金屬層係可以化學沉積法或電鍍法形成。Wherein, the metal layer can be formed by a chemical deposition method or an electroplating method.

其中,該第一通孔以及該第二通孔係為具有相同大小之圓形中空結構。The first through hole and the second through hole are circular hollow structures having the same size.

與習知技術相較,本創作一種鏡頭承載裝置,具有下述之優點以及特性︰不同於習知須將音圈馬達(VCM)電性設置於一貼附軟性印刷電路板之基座,並與該軟性印刷電路板電性連結之鏡頭模組。本創作係透過雷射直接成型(Laser Direct Structuring, LDS)之方式直接於該基座上形成該電路層,可解決貼附該軟性印刷電路板於該基座上時進行加工之難度、有效提升良率、大幅降低所需消耗工時以及組裝成本等等問題,實為相對便利且低成本之創作。Compared with the prior art, the present invention provides a lens carrying device having the following advantages and characteristics: different from the conventional method, the voice coil motor (VCM) is electrically disposed on a base attached to the flexible printed circuit board, and A lens module electrically connected to the flexible printed circuit board. The creation of the circuit layer is directly formed on the pedestal by means of Laser Direct Structuring (LDS), which can solve the difficulty of processing the flexible printed circuit board on the pedestal and effectively improve the processing. The yield, the significant reduction in man-hours required, and the cost of assembly are relatively convenient and low-cost creations.

為充分瞭解本創作之目的、特徵及功效,茲藉由下述具體之實施例,並配合所附之圖式,對本創作做一詳細說明,說明如後:In order to fully understand the purpose, features and effects of this creation, the following specific examples, together with the attached drawings, provide a detailed description of the creation, as explained below:

請參考第一圖以及第二圖,其係為本創作鏡頭承載裝置之立體分解示意圖以及本創作鏡頭承載裝置之立體組裝示意圖。本創作係揭露一種鏡頭承載裝置1,其至少包含有:一基座10、複數個電子元件20以及一鏡頭載具30。Please refer to the first figure and the second figure, which are a three-dimensional exploded view of the creative lens carrying device and a three-dimensional assembly diagram of the creative lens carrying device. The present invention discloses a lens carrying device 1 comprising at least a base 10, a plurality of electronic components 20 and a lens carrier 30.

該基座10,係具有一第一通孔102,該基座10之表面係透過雷射直接成型(Laser Direct Structuring, LDS)方式形成有一線路層104,且該線路層104之表面係可以化學沉積法或電鍍法鍍覆有一金屬層106。其中,該基座10之材料係為熱固型塑膠鄰苯二甲酸二烯丙酯(DAP;Diallyl Phthalate Plastics)及熱塑型塑膠聚鄰苯二甲醯胺(PPA;Polyphthalamide)、液晶高分子聚合物(LCP;Liquid Crystal Polymer)、聚醯胺(PA;Polyamide)、聚碳酸酯(PC;Polycarbonate)或聚碳酸酯樹脂和丙烯晴-丁二烯-苯乙烯共聚合物(PC/ABS;Polycarbonate/Acrylonitrile-Butadene-Stvrene)等材料;且該基座10係可採用射出成型抑或是熱壓成型之方式形成。The pedestal 10 has a first through hole 102. The surface of the pedestal 10 is formed by a Laser Direct Structuring (LDS) method, and the surface layer of the circuit layer 104 can be chemically etched. A metal layer 106 is plated by deposition or electroplating. The material of the susceptor 10 is thermosetting plastic diallyl phthalate (DAP; Diallyl Phthalate Plastics) and thermoplastic plastic polyphthalamide (PPA; Polyphthalamide), liquid crystal polymer Polymer (LCP; Liquid Crystal Polymer), polyamine (PA; Polyamide), polycarbonate (PC; Polycarbonate) or polycarbonate resin and acrylonitrile-butadiene-styrene copolymer (PC/ABS; Polycarbonate/Acrylonitrile-Butadene-Stvrene) and the like; and the susceptor 10 can be formed by injection molding or hot press forming.

該複數個電子元件20,係設置於該線路層104上,並透過該金屬層106與該線路層104電性連接。其中,該等電子元件20係可為互補性金屬氧化物感測器(Complementary Metal Oxide Semiconductor, CMOS)以及電荷耦合組件感測器(Charge Coupled Device, CCD)之其中之一者。The plurality of electronic components 20 are disposed on the circuit layer 104 and electrically connected to the circuit layer 104 through the metal layer 106. The electronic components 20 can be one of a Complementary Metal Oxide Semiconductor (CMOS) and a Charge Coupled Device (CCD).

該鏡頭載具30,係為一具有一第二通孔302之結構,係對應設置於該基座10之上。其中該第一通孔102以及該第二通孔302係為具有相同大小之圓形中空結構。The lens carrier 30 is configured to have a second through hole 302 and is disposed on the base 10 . The first through hole 102 and the second through hole 302 are circular hollow structures having the same size.

當該鏡頭承載裝置1透過該第一通孔102以及該第二通孔302攝取到光信號後,會藉由該電子元件20將其轉變成電信號。而後根據所需焦距之大小,適當地帶動該鏡頭單元40進行伸縮移動而進行對焦,完成適當焦距之調校。When the lens carrier device 1 picks up the optical signal through the first through hole 102 and the second through hole 302, it converts the electrical signal into an electrical signal by the electronic component 20. Then, according to the required focal length, the lens unit 40 is appropriately driven to perform telescopic movement to perform focusing, and the adjustment of the appropriate focal length is completed.

本創作在上文中已以較佳實施例揭露,然熟習本創作者應理解的是,該實施例僅用於描繪本創作,而不應解讀為限制本創作之範圍。應注意的是,舉凡與該實施例等效之變化與置換,均應設為涵蓋於本創作之範疇內。The present invention has been disclosed in the above preferred embodiments, and it should be understood by those skilled in the art that the present invention is only intended to depict the present invention and should not be construed as limiting the scope of the present invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention.

1‧‧‧鏡頭承載裝置
10‧‧‧基座
102‧‧‧第一通孔
104‧‧‧線路層
106‧‧‧金屬層
20‧‧‧電子元件
30‧‧‧鏡頭載具
302‧‧‧第二通孔
40‧‧‧鏡頭單元
1‧‧‧Lens carrier
10‧‧‧ Pedestal
102‧‧‧First through hole
104‧‧‧Line layer
106‧‧‧metal layer
20‧‧‧Electronic components
30‧‧‧Lens Vehicle
302‧‧‧Second through hole
40‧‧‧Lens unit

第一圖 本創作鏡頭承載裝置之立體分解示意圖。 第二圖 本創作鏡頭承載裝置之立體組裝示意圖。The first figure is a three-dimensional exploded view of the creative lens carrying device. The second figure is a three-dimensional assembly diagram of the lens carrying device.

1‧‧‧鏡頭承載裝置 1‧‧‧Lens carrier

10‧‧‧基座 10‧‧‧ Pedestal

102‧‧‧第一通孔 102‧‧‧First through hole

104‧‧‧線路層 104‧‧‧Line layer

106‧‧‧金屬層 106‧‧‧metal layer

20‧‧‧電子元件 20‧‧‧Electronic components

30‧‧‧鏡頭載具 30‧‧‧Lens Vehicle

302‧‧‧第二通孔 302‧‧‧Second through hole

40‧‧‧鏡頭單元 40‧‧‧Lens unit

Claims (6)

一種鏡頭承載裝置,其至少包含有: 一基座,係具有一第一通孔,該基座之表面形成有一線路層,且該線路層之表面係鍍覆有一金屬層; 複數個電子元件,係設置於該線路層上,並透過該金屬層與該線路層電性連接;以及 一鏡頭載具,係為一具有一第二通孔之結構,對應設置於該基座之上,其改良在於,該線路層係透過雷射直接成型(Laser Direct Structuring, LDS)之方式形成,且該鏡頭載具係可供音圈馬達(Voice Coil Motor, VCM)之鏡頭單元容置於其中。A lens carrying device includes at least: a base having a first through hole, a surface of the base is formed with a circuit layer, and a surface of the circuit layer is plated with a metal layer; a plurality of electronic components, The device is disposed on the circuit layer and electrically connected to the circuit layer through the metal layer; and a lens carrier is a structure having a second through hole correspondingly disposed on the base, and the improved The circuit layer is formed by Laser Direct Structuring (LDS), and the lens carrier is accommodated in a lens unit of a Voice Coil Motor (VCM). 如申請專利範圍第1項所述之鏡頭承載裝置,其中該基座之材料係為熱固型塑膠鄰苯二甲酸二烯丙酯(DAP;Diallyl Phthalate Plastics)及熱塑型塑膠聚鄰苯二甲醯胺(PPA;Polyphthalamide)、液晶高分子聚合物(LCP;Liquid Crystal Polymer)、聚醯胺(PA;Polyamide)、聚碳酸酯(PC;Polycarbonate)或聚碳酸酯樹脂和丙烯晴-丁二烯-苯乙烯共聚合物 (PC/ABS; Polycarbonate / Acrylonitrile– Butadene–Stvrene) 等材料。The lens carrying device according to claim 1, wherein the material of the base is thermosetting plastic diallyl phthalate (DAP; Diallyl Phthalate Plastics) and thermoplastic plastic polyphthalate. Polyphthalamide (PPA; Polyphthalamide), Liquid Crystal Polymer (LCP), Polyamide (PA; Polyamide), Polycarbonate (PC; Polycarbonate) or Polycarbonate Resin and Acrylonitrile Materials such as styrene-styrene copolymer (PC/ABS; Polycarbonate / Acrylonitrile– Butadene–Stvrene). 如申請專利範圍第2項所述之鏡頭承載裝置,其中該基座係採用射出成型抑或是熱壓成型之方式形成。The lens carrying device according to claim 2, wherein the base is formed by injection molding or hot press forming. 如申請專利範圍第1項所述之鏡頭承載裝置,其中該等電子元件係可為互補性金屬氧化物感測器(Complementary Metal Oxide Semiconductor, CMOS)以及電荷耦合組件感測器(Charge Coupled Device, CCD)之其中之一者。The lens carrier device of claim 1, wherein the electronic components are Complementary Metal Oxide Semiconductor (CMOS) and Charge Coupled Device (Charge Coupled Device, One of the CCDs. 如申請專利範圍第1項所述之鏡頭承載裝置,其中該金屬層係可以化學沉積法或電鍍法形成。The lens carrying device of claim 1, wherein the metal layer is formed by a chemical deposition method or an electroplating method. 如申請專利範圍第1項所述之鏡頭承載裝置,其中該第一通孔以及該第二通孔係為具有相同大小之圓形中空結構。The lens bearing device of claim 1, wherein the first through hole and the second through hole are circular hollow structures having the same size.
TW104205931U 2015-04-17 2015-04-17 Lens carrying device TWM510468U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW104205931U TWM510468U (en) 2015-04-17 2015-04-17 Lens carrying device
CN201520283472.2U CN204795265U (en) 2015-04-17 2015-05-05 Lens bearing device
JP2015002259U JP3198772U (en) 2015-04-17 2015-05-08 Lens loading device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104205931U TWM510468U (en) 2015-04-17 2015-04-17 Lens carrying device

Publications (1)

Publication Number Publication Date
TWM510468U true TWM510468U (en) 2015-10-11

Family

ID=53718255

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104205931U TWM510468U (en) 2015-04-17 2015-04-17 Lens carrying device

Country Status (3)

Country Link
JP (1) JP3198772U (en)
CN (1) CN204795265U (en)
TW (1) TWM510468U (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107529700A (en) * 2017-09-04 2018-01-02 信利光电股份有限公司 A kind of voice coil motor and camera module
CN111193346A (en) * 2018-11-15 2020-05-22 三赢科技(深圳)有限公司 Voice coil motor

Also Published As

Publication number Publication date
CN204795265U (en) 2015-11-18
JP3198772U (en) 2015-07-23

Similar Documents

Publication Publication Date Title
TWI622292B (en) Camera module
CN105187697B (en) Multi-lens camera module conjoined bracket, multi-lens camera module and application thereof
US8896749B2 (en) Lens holder driving device capable of preventing deformation due to heat
CN103097282B (en) Be configured for and be connected electrically to air cavity package body on printed circuit board (PCB) and its supplying method
CN103548334B (en) Camera module
TWI594059B (en) Camera module
US20170299839A1 (en) Camera lens module
US10268018B1 (en) Lens module
TWI579630B (en) Lens driving module
JP6699972B2 (en) Imager module for vehicle cameras and method of manufacturing same
JP2013214964A (en) Camera module with wafer substrate and manufacturing method of the same
US10816874B2 (en) Lens driving mechanism and electronic device having the same
US20180284385A1 (en) Lens driving module
TWI641873B (en) Camera device
CN104796588A (en) Camera module
CN108474999A (en) For camera model holding device assembly, have keep device assembly camera model and water-proof connector
US9225887B1 (en) Image capturing module for reducing assembly tilt
US11381147B2 (en) Driving mechanism
TW202111412A (en) Lens module and electronic device
TWM510468U (en) Lens carrying device
US20210109422A1 (en) Bracket with enhanced heat dissipation, lens module using the bracket, and electronic device using the lens module
TWI604258B (en) Multi-camera module assembly bracket and multi-lens camera module and their application
US8855480B2 (en) Camera module
TWM510467U (en) Lens module
KR101973656B1 (en) Camera Module

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees