TWM510467U - Lens module - Google Patents

Description

Lens module

The present invention discloses a lens module, in particular, a lens module that uses a Laser Direct Structuring (LDS) combined with an embedded molding method to form a circuit layer.

In recent years, mobile device products have been trending towards thinner, but they have also limited the space of the device. Among them, the development of electronic components is towards miniaturization and has the function of integration, which in turn conforms to the product trend. The current voice coil motor (VCM) used in the camera module of the mobile device is electrically disposed on a attached flexible printed circuit. The pedestal of the flexible printed circuit is electrically connected to the flexible printed circuit board; however, the miniaturization of the voice coil motor makes it difficult for the flexible printed circuit board to be attached to the pedestal.

After searching for the "Lens Module Positioning Structure" of the Republic of China Patent No. I476471, the lens module requires additional use of the frame and other components to fix the circuit board, which increases the difficulty, time and cost of processing.

Therefore, in view of the lack of the above-mentioned prior art, the present creator has created a lens module which is directly connected to the pedestal by means of Laser Direct Structuring (LDS) combined with embedded molding. The formation of the circuit layer can effectively solve the problems of difficulty, yield, man-hour and assembly cost of attaching the flexible printed circuit board, which is relatively convenient and low-cost creation.

One of the purposes of this creation is to provide a lens module that reduces the manufacturing process by directly forming a circuit layer on the upper surface and the side surface of the pedestal by directly using Laser Direct Structuring (LDS) in combination with embedded molding. Difficulty, time and cost.

In order to achieve the above and other objects, the present invention provides a lens module including at least a base having a first through hole, and a first circuit layer is formed on an upper surface of the base, and the The surface of a circuit layer is plated with a first metal layer, a side surface of the base is formed with a second circuit layer, and a surface of the second circuit layer is plated with a second metal layer; a plurality of electronic components are And being disposed on the pedestal and electrically connected to the first circuit layer through the first metal layer; and a lens carrier configured to have a second through hole corresponding to the pedestal The improvement is that the first circuit layer and the second circuit layer are respectively formed by Laser Direct Structuring (LDS) and embedded molding. The first through hole and the second through hole are circular hollow structures having the same size.

The material of the susceptor is thermosetting plastic diallyl phthalate (DAP; Diallyl Phthalate Plastics) and thermoplastic plastic polyphthalamide (PPA; Polyphthalamide), liquid crystal polymer polymerization (LCP; Liquid Crystal Polymer), Polyamide (PA; Polyamide), Polycarbonate (PC; Polycarbonate) or Polycarbonate Resin and Acrylic Butadiene-Styrene Copolymer (PC/ABS; Polycarbonate) /Acrylonitrile-Butadene-Stvrene) and the like; and the base is formed by injection molding or hot press forming.

The electronic components may be one of a Complementary Metal Oxide Semiconductor (CMOS) and a Charge Coupled Device (CCD).

The first metal layer and the second metal layer may be formed by a chemical deposition method or an electroplating method.

Compared with the prior art, a lens module has the following advantages and characteristics: different from the conventional need to electrically set the voice coil motor (VCM) to a base attached to the flexible printed circuit board, and A lens module electrically connected to the flexible printed circuit board. The creation of the first and the second circuit layer is directly formed on the pedestal by means of Laser Direct Structuring (LDS) combined with the embedded molding, and the flexible printed circuit board is attached to the base. It is a relatively convenient and low-cost creation when it is difficult to process, improve the yield, significantly reduce the required labor and assembly costs.

In order to fully understand the purpose, features and effects of this creation, the following specific examples, together with the attached drawings, provide a detailed description of the creation, as explained below:

Please refer to the first figure and the second figure, which are a three-dimensional exploded view of the inventive lens module and a three-dimensional assembly diagram of the created lens module. The present invention discloses a lens module 1 including at least a base 10, a plurality of electronic components 20, and a lens carrier 30.

The pedestal 10 has a first through hole 102, and the upper surface 104 of the pedestal 10 is formed with a first circuit layer 106 by laser direct structuring (LDS); the side of the pedestal 10 The surface 110 is formed by insert molding to form a second circuit layer 112, and the surface of the first circuit layer 106 and the second circuit layer 112 may be respectively plated with a first metal layer 108 by chemical deposition or electroplating. And a second metal layer 114. The material of the susceptor 10 is thermosetting plastic diallyl phthalate (DAP; Diallyl Phthalate Plastics) and thermoplastic plastic polyphthalamide (PPA; Polyphthalamide), liquid crystal polymer Polymer (LCP; Liquid Crystal Polymer), polyamine (PA; Polyamide), polycarbonate (PC; Polycarbonate) or polycarbonate resin and acrylonitrile-butadiene-styrene copolymer (PC/ABS; Polycarbonate/Acrylonitrile-Butadene-Stvrene) and the like; and the susceptor 10 can be formed by injection molding or hot press forming.

A plurality of electronic components 20 are disposed on the susceptor 10 and electrically connected to the first circuit layer 106 through the first metal layer 108. The electronic components 20 can be one of a Complementary Metal Oxide Semiconductor (CMOS) and a Charge Coupled Device (CCD).

The lens carrier 30 is configured to have a second through hole 302 corresponding to the base 10 . The first through hole 102 and the second through hole 302 are circular hollow structures having the same size.

When the lens module 1 receives the optical signal through the first through hole 102 and the second through hole 302, the lens module 1 converts the optical signal into an electrical signal by the electronic components 20. Then, according to the required focal length, the lens unit 40 is appropriately driven to perform telescopic movement to perform focusing, and the adjustment of the appropriate focal length is completed.

The present invention has been disclosed in the above preferred embodiments, and it should be understood by those skilled in the art that the present invention is only intended to depict the present invention and should not be construed as limiting the scope of the present invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention.

1‧‧‧ lens module
10‧‧‧ Pedestal
102‧‧‧First through hole
104‧‧‧ upper surface
106‧‧‧First circuit layer
108‧‧‧First metal layer
110‧‧‧ side surface
112‧‧‧Second circuit layer
114‧‧‧Second metal layer
20‧‧‧Electronic components
30‧‧‧Lens Vehicle
302‧‧‧Second through hole
40‧‧‧Lens unit

The first figure is a three-dimensional exploded view of the lens module. The second figure is a three-dimensional assembly diagram of the lens module.

1‧‧‧ lens module

10‧‧‧ Pedestal

102‧‧‧First through hole

104‧‧‧ upper surface

106‧‧‧First circuit layer

108‧‧‧First metal layer

110‧‧‧ side surface

112‧‧‧Second circuit layer

114‧‧‧Second metal layer

20‧‧‧Electronic components

30‧‧‧Lens Vehicle

302‧‧‧Second through hole

40‧‧‧Lens unit

Claims (6)

A lens module includes at least: a base having a first through hole, a first circuit layer is formed on an upper surface of the base, and a surface of the first circuit layer is plated with a first metal a second circuit layer is formed on a side surface of the base, and a surface of the second circuit layer is plated with a second metal layer; a plurality of electronic components are disposed on the base and pass through the first The metal layer is electrically connected to the first circuit layer; and a lens carrier is a structure having a second through hole correspondingly disposed on the base, and the improvement is that the first circuit layer is transmitted through Laser Direct Structuring (LDS) is formed by insert molding, and the lens carrier is formed by a lens of a voice coil motor (VCM). The unit is housed in it. The lens module of claim 1, wherein the material of the base is thermosetting plastic diallyl phthalate (DAP; Diallyl Phthalate Plastics) and thermoplastic plastic polyphthalate. Polyphthalamide (PPA; Polyphthalamide), Liquid Crystal Polymer (LCP), Polyamide (PA; Polyamide), Polycarbonate (PC; Polycarbonate) or Polycarbonate Resin and Acrylonitrile Materials such as styrene-styrene copolymer (PC/ABS; Polycarbonate/Acrylonitrile-Butadene-Stvrene). The lens module of claim 2, wherein the base is formed by injection molding or hot press forming. The lens module of claim 1, wherein the electronic components are Complementary Metal Oxide Semiconductor (CMOS) and Charge Coupled Device (Charge Coupled Device, One of the CCDs. The lens module of claim 1, wherein the first metal layer and the second metal layer are formed by chemical deposition or electroplating. The lens module of claim 1, wherein the first through hole and the second through hole are circular hollow structures having the same size.