TWM504424U - Plate edge mask device in the spray room - Google Patents

Description

Plate edge shielding device in spray booth

The invention relates to the shielding technology of the edge of the panel to be sprayed in the ink spray booth, and particularly relates to a panel covering device in the spray booth.

It is well known that in the manufacturing process, based on the requirements of customization such as aesthetics, rust prevention or soldering resistance, it is generally required to spray a layer of paint on the surface of the panel, which in the implementation may refer to inks and paints. Wait. Taking a printed circuit board (PCB) as an example, in the manufacturing process of the substrate, a layer of solder resist ink must be applied on the surface of the substrate. Not only this, but the substrate is only an example, and the plate member of the present invention not only summarizes the substrate, but also uses, for example, a grammar.

In order to avoid the problem of environmental pollution caused by splashing of the paint during the application of the solder resist ink, the substrate is generally moved along a transport path to a closed state by being carried by a transmission component such as a chain, a belt or a roller. Spraying the solder resist ink to the surface of the substrate through the spray gun disposed in the spray booth, and then transporting the substrate coated with the solder resist ink to the outside of the spray booth by using the transmission component, and then using the jaws and the like Holding the components one by one with the substrate coated with the solder resist ink is subjected to a drying operation.

Wherein, the substrate coated with the solder resist ink is usually reserved on both sides of the substrate in order to facilitate the clamping of the jaws or for other substrates for transferring the substrate (for example, a frame for carrying the substrate). A white surface area is provided, and the solder mask ink is not covered in the white area, so as to be a contact portion of the jaw contact or the bearing member contacts.

However, since the substrate is subjected to the application of the solder resist ink, the entire surface of the substrate (including the sprayed surface and the white area) must be exposed to the spray. The spraying path of the gun causes the soldering ink sprayed by the spray gun to be easily spilled into the white area, so that it is easy to stick to the white area when the substrate is clamped by the jaws or the substrate is supported by the carrier member. The solder mask ink inside, thus causing contamination of the jaws or carrier elements. When the jaws or the holding member are contaminated with the solder resist ink, it will affect the cleanliness of the subsequent holding or holding of the next substrate, and the yield when the substrate is overfilled is greatly reduced.

In order to improve the above problems, some companies have developed substrate edge technology. The fixed baffle is arranged on both sides of the conveying path, and the baffle is suspended to cover the both sides of the substrate. When the substrate enters the spray booth along the conveying path to receive the spray gun spray soldering ink, the block can be blocked. The shielding of the plate prevents the white surface of the two sides of the substrate from being contaminated by the solder resist ink.

However, the above fixed baffle can effectively avoid the retention of the substrate. The white surface is contaminated with solder resist ink, but the amount of solder resist ink accumulated by the baffle is too large, causing the solder resist ink to splash or overflow onto the substrate via the baffle, resulting in poor ink spray yield of the substrate. phenomenon. In addition, the fixed baffle is also not easy to remove and clean.

In view of this, the purpose of the present invention is to improve the problem that the conventional fixed baffle is easy to accumulate the solder resist ink and is not convenient for cleaning, and further provides a plate edge shielding device in the spray booth, and the technical means thereof include: a spray gun , disposed in the spray booth; at least one plate, receiving spray ink in the spray booth; a cover adjacent to the edge of the plate and located between the end of the plate and the spray gun; wherein the cover Move along the edge of the panel to shield the ink from spraying to the end of the panel.

In a further implementation, the present invention further includes: further comprising a wiping element disposed on the path of movement of the mask, the wiping element contacting the mask to remove ink on the mask.

The bottom of the wiping element is also disposed adjacent to an ink collection tank that collects the supersaturated ink accumulated on the wiper wiping tape.

The plate moves along a conveying path in the spray booth, and the cover moves The path includes a planar path that is parallel to the transport path of the panel.

The direction in which the plate moves in the conveying path is the same as the direction in which the tape moves along the planar path.

The direction in which the plates move in the conveying path is opposite to each other with respect to the direction in which the tape moves along the planar path.

The cover is suspended and adjacent to the end of the panel.

According to the above technical means, the present invention has the advantages that the masking of the mask can be avoided to prevent the white surface of the substrate from being sprayed onto the solder resist ink, and the mobility of the mask can be transmitted to prevent the solder resist ink from being accumulated on the mask. Indirectly, it splashes or overflows onto the substrate, so that the ink coating yield of the substrate can be effectively improved, and the ink accumulated on the movable mask is also easy to clean, and the loop is repeatedly used.

In addition, the relevant technical details that can be implemented by the present invention will be explained in the following embodiments and drawings.

10‧‧‧ boards

11‧‧‧ Spraying area

12‧‧‧White area

20‧‧‧ occlusion

21‧‧‧ Plane path

22‧‧‧Roller

23‧‧‧ Drive

30‧‧‧ spray gun

31‧‧‧Slide rails

40‧‧‧Transmission components

41‧‧‧Transportation path

50‧‧‧Wiping element

51‧‧‧ Ink tank

511‧‧‧ slot wall

60‧‧‧Ink collection tank

1 is a perspective view of the present invention; FIG. 2 is a partially enlarged cross-sectional view of FIG. 1; FIG. 3 is a perspective view of the wiping member of the present invention; Schematic diagram of the configuration of the embodiment; FIG. 5 is a schematic diagram of the configuration of the second embodiment of the mask in the present invention.

First, please refer to FIG. 1 and FIG. 2 together to disclose a preferred embodiment of the present invention, and illustrate a panel edge shielding device in the spray booth provided by the present invention, including a spray gun 30, at least one panel 10, and A cover tape 20. Wherein: the spray gun 30 is suspended in a spray booth (not shown). Further, the spray gun 30 is suspended in the spray booth via a slide rail 31, and the spray gun 30 can be horizontally oriented along the slide rail 31. The movement. Furthermore, the spray booth is equipped with A transmission element 40 is disposed. The transmission element 40 can be a chain, a belt or a roller. The transmission element 40 can be constructed to form a conveying path 41. The conveying path 41 is implemented through the lower side of the spray gun 30, and the conveying path is provided. 41 is perpendicular to the direction when the spray gun 30 is horizontally moved.

The plate member 10 may be implemented as a printed circuit board (PCB), which is sprayed with a spray gun 30 in the spray booth to spray solder resist ink. Further, the number of the plate members 10 may be one or a plurality of implementations, and the plate member 10 can be carried by a transmission member 40 and moved one by one along the conveying path 41 into the spray booth. When the plate member 10 is carried by the transmission member 40 and moves along the conveying path 41 into the spray booth, the spray gun 30 can be suspended above the conveying path, and the solder resist ink is sprayed on the surface of the plate member 10 to form the surface of the plate member 10. There is a sprayed surface 11 coated with a solder resist ink and a white area 12 without a solder-proof ink coating.

The cover tape 20 is disposed above the end edge of the plate member 10 and is disposed between the end of the plate member 10 and the spray gun 30, so that the cover tape 20 can block the spraying of the solder resist ink to the end of the plate member 10. That is, the white area 12 is left. Further, the cover tape 20 may be a belt body having a shielding effect such as a bendable belt or a steel belt. The cover tape 20 is implemented to be mounted between the plurality of rollers 22, and the roller 22 is connected with a driver 23. The driver 23 can be implemented as a motor. The mask 20 can be driven by the driver 23 to perform a loop-type movement via the roller 22. The slidability of the mask 20 prevents the solder resist ink from being accumulated on the mask. 20, and helps to remove the solder resist ink on the mask 20.

The mask 20 includes a planar path 21 in the path of the loop movement, which is implemented in parallel with the transport path 41 of the panel 10, and is blocked by the cover 20 moving on the planar path 21. The end of the plate member 10 under the cover tape 20 can effectively block the spraying of the solder resist ink to the end of the plate member 10. Further, the direction in which the plate member 10 moves along the conveying path 41 may be the same or opposite to the direction in which the cover tape 20 moves along the planar path 21.

Referring to FIG. 3, the configuration is performed on the path in which the cover tape 20 is moved. There is a wiping element 50 that is capable of removing the solder resist ink attached to the mask 20 via contact with the mask 20. Further, the wiping member 50 is recessed in practice to form a deinking groove 51 having a U-shaped shape. The deinking groove 51 has two mutually parallel groove walls 511, and the cover tape 20 passes through the deinking groove 51 to make two The groove wall 511 is in contact with the mask 20 to scrape off the solder resist ink attached to the mask 20 to prevent the solder resist ink from being accumulated on the mask 20, resulting in cleaning convenience and masking after the ink is scraped off. The belt 20 is also used in a recirculating cycle of the loop type. Furthermore, the bottom of the wiping member 50 is disposed adjacent to an ink collecting groove 60 for collecting the solder resist ink accumulated on the wiping tape 20 by the wiping member 50.

Please refer to FIG. 4 and FIG. 5 together to illustrate the implementation of the cover tape 20 In addition to being integrally located above the end edge of the panel 10 (as shown in FIG. 4), it is also possible that only the region of the planar path 21 is located above the end edge of the panel 10 (as shown in FIG. 5). The embodiment can produce an occlusion effect on the end edge of the panel 10.

The above embodiments are merely illustrative of the preferred embodiments of the present invention, but are not to be construed as limiting the scope of the present invention. Therefore, the present invention is subject to the content of the claims defined in the scope of the patent application.

10‧‧‧ boards

20‧‧‧ occlusion

21‧‧‧ Plane path

22‧‧‧Roller

23‧‧‧ Drive

30‧‧‧ spray gun

31‧‧‧Slide rails

40‧‧‧Transmission components

41‧‧‧Transportation path

Claims (7)

A panel edge shielding device in a spray booth, comprising: a spray gun disposed in the spray booth; at least one plate member receiving a spray gun ink in the spray booth; a cover tape disposed adjacent to the edge of the plate member, and Located between the end of the plate and the spray gun; wherein the cover moves along the edge of the plate to block ink from being sprayed to the end of the plate. The panel edge shielding device in the spray booth according to the first aspect of the invention, further comprising a wiping element disposed on the path of movement of the mask, the wiping member contacting the mask to clear the mask Ink. The plate edge shielding device in the spray booth according to the second aspect of the invention, wherein the bottom of the wiping member is further disposed adjacent to an ink collecting groove, and the collecting groove collects the supersaturated ink accumulated on the wiper wiping tape. The plate edge shielding device in the spray booth according to the first or second aspect of the invention, wherein the plate member moves along a conveying path in the spray booth, and the path of the mask movement includes a plane path, and the plane path and The conveying paths of the plates are parallel to each other. The panel edge shielding device in the spray booth according to claim 4, wherein the direction in which the panel moves along the conveying path is the same as the direction in which the mask moves along the planar path. The panel edge shielding device in the spray booth according to the fourth aspect of the invention, wherein the direction in which the panel moves along the conveying path is opposite to the direction in which the mask moves along the planar path. The panel edge shielding device in the spray booth according to claim 1 or 2, wherein the mask is suspended and adjacent to an end edge of the panel.