TWM504244U - Specialized probe apparatus for the inspection of the repair material thickness - Google Patents
Specialized probe apparatus for the inspection of the repair material thickness Download PDFInfo
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- TWM504244U TWM504244U TW103221467U TW103221467U TWM504244U TW M504244 U TWM504244 U TW M504244U TW 103221467 U TW103221467 U TW 103221467U TW 103221467 U TW103221467 U TW 103221467U TW M504244 U TWM504244 U TW M504244U
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Description
本創作係為一種檢查補材厚度的專用探針裝置,尤指一種利用電訊號的導通與否判定上探針與下探針是否接觸,藉此進一步判斷電路板上的補材厚度是否正確無誤。This creation is a special probe device for checking the thickness of the material, especially whether the upper probe is in contact with the lower probe by using the conduction of the electric signal, thereby further judging whether the thickness of the material on the circuit board is correct or not. .
為因應電路板(尤其是軟性電路板)需要貼附於各項產品上的需求,電路板上往往需要貼設補材來加強其結構硬度;現有技術用來測定補材是否有漏貼或是重覆黏貼情形所使用的方法有兩種,一種為傳統以人工操作游標尺直接夾合電路板與補材以量測其厚度是否正確,另一種則以先進的電測系統測量感測器是否電導通,進而判斷補材的黏貼情形。In order to meet the needs of the circuit board (especially the flexible circuit board) to be attached to various products, the circuit board often needs to be attached with a material to strengthen the structural hardness; the prior art is used to determine whether the material is missing or There are two methods used for re-adhesive bonding. One is to manually measure the thickness of the board and the patch directly by manually operating the vernier scale, and the other is to measure whether the sensor is measured by an advanced electric measuring system. Electrical conduction, and then determine the adhesion of the supplement.
但前述以人工操作游標尺90直接測量電路板40厚度的方式如圖5所示,其在速度上極為緩慢,若一塊電路板40上黏貼有複數個補材,則需要一個個逐步測量,暨費工又耗時,而且若補材黏貼於大型電路板的中央,游標尺90無法伸入其中進行量測,則無法得知補材的黏貼情形。另外,操作人員對於游標尺90上的數據判讀容易產生誤差、錯誤而導致誤判的情形發生。However, the manner of directly measuring the thickness of the circuit board 40 by manually operating the vernier scale 90 is as shown in FIG. 5, which is extremely slow in speed. If a plurality of materials are adhered to a circuit board 40, a stepwise measurement is required. It takes a lot of time and labor, and if the patch is stuck in the center of a large circuit board and the vernier 90 cannot be inserted into it for measurement, the adhesion of the material cannot be known. In addition, the operator may easily generate an error or an error in the interpretation of the data on the vernier 90 to cause a false positive.
此外,前述另一種以電測方式判斷補材的黏貼情形,現有技術常因為電測探針於檢測時沾黏到補材黏膠,導致電測探針絕緣,造成系統誤判;另外,現有技術之電測系統對於是否有漏貼補材之情形的判斷較無問題,但對於重覆黏貼情形的檢測仍有其困難之處,因此該電測系統仍有其改良的必要。In addition, the other one is to determine the adhesion of the additive by means of electrical measurement. The prior art often causes the electrical probe to be insulated due to the adhesion of the electrical probe during the detection, resulting in system misjudgment; The electric measurement system has no problem in judging whether there is any leakage or repairing of the material, but there are still difficulties in the detection of the repeated adhesion, so the electric measurement system still has the need for improvement.
有鑑於現有技術的缺點以及不足,現階段需要一種能夠檢查電路板上之補材是否重覆黏貼的專用探針裝置,其不但可以解決且避免傳統以游標尺量測電路板與補材厚度的不方便與人為誤差,亦能同時克服現有技術之電測探針無法檢測補材重覆黏貼情形的問題,有效避免因為補材重覆黏貼所造成之出廠產品良率不齊的問題。In view of the shortcomings and shortcomings of the prior art, a special probe device capable of checking whether the refill on the circuit board is re-adhesive is needed at present, which can not only solve the problem but also avoid the traditional measurement of the circuit board and the thickness of the material by the vernier scale. Inconvenient and human error can also overcome the problem that the electrical probe of the prior art can not detect the repeated adhesion of the patch, and effectively avoid the problem of uneven yield of the manufactured products caused by the repeated adhesion of the patch.
為達到上述之創作目的,本創作所採用之技術手段為提供一種檢查補材厚度的專用探針裝置,其係包括: 一上探針模組;以及 一下探針模組; 其中該上探針模組具有一上探針,該上探針包括一平面部以及一突出部,該突出部係朝下探針模組方向突出於該平面部,並且於突出部遠離平面部的一端形成一尖端部;該下探針模組具有一承載台與一下探針,其中該下探針的頂面與承載台的頂部齊平,且該下探針的頂面與上探針的尖端部相對設置,並選擇性地與上探針相接觸。In order to achieve the above-mentioned creative purpose, the technical means adopted by the present invention is to provide a special probe device for inspecting the thickness of the supplement, which comprises: an upper probe module; and a lower probe module; wherein the upper probe The module has an upper probe, the upper probe includes a flat portion and a protruding portion protruding from the planar portion toward the lower probe module, and forming a tip at an end of the protruding portion away from the planar portion The lower probe module has a carrier and a lower probe, wherein a top surface of the lower probe is flush with a top of the carrier, and a top surface of the lower probe is opposite to a tip end of the upper probe And selectively in contact with the upper probe.
本創作之優點在於簡單利用上探針模組可相對於下探針模組相對移動,使上探針之平面部抵頂於補材上,而上探針之尖端部可藉由電路板上之補材層數所疊合形成的厚度改變,促使尖端部選擇性地與下探針相接觸,進而由儀器判斷電路板上之補材是否有重覆黏貼的情形。The advantage of this creation is that the upper probe module can be relatively moved relative to the lower probe module, so that the flat portion of the upper probe is abutted on the feeding material, and the tip end portion of the upper probe can be used on the circuit board. The thickness of the patch layer is superimposed to change the thickness, so that the tip portion selectively contacts the lower probe, and the instrument determines whether the patch on the circuit board is repeatedly pasted.
較佳的是,所述上探針與該下探針電性連接。此技術手段惟利用該上探針與該下探針預先電性連接,再搭配上探針之突出部的長度等於電路板與單層補材之厚度總和的設計,使電路板上黏貼單層補材時,上探針之尖端部會與下探針相接觸,形成電導通狀態;而若電路板上黏貼複數層補材時,上探針之尖端部不會與下探針相接觸,而形成電路斷路狀態,接著儀器再根據電導通狀態或電路斷路狀態判定電路板上之補材是否有重覆黏貼的情形。Preferably, the upper probe is electrically connected to the lower probe. The technical means only uses the upper probe and the lower probe to be electrically connected in advance, and the length of the protruding portion of the probe is equal to the sum of the thickness of the circuit board and the single layer of the supplementary material, so that the circuit board is adhered to the single layer. When the material is replenished, the tip end portion of the upper probe contacts the lower probe to form an electrical conduction state; and if a plurality of layers of the material are pasted on the circuit board, the tip end portion of the upper probe does not contact the lower probe. The circuit is in an open state, and then the instrument determines whether the material on the circuit board is repeatedly pasted according to the electrical conduction state or the circuit breaking state.
更佳的是,該上探針模組進一步包括一作動桿、一彈簧、一止擋塊以及一上探針容置框架,其中該作動桿與上探針之平面部相對於突出部的一側相連結,並於平面部連結有作動桿的一側設有該彈簧,該彈簧套設於作動桿上,並且其一端與上探針的平面部相接觸,而於作動桿遠離平面部的一端設有該止擋塊,該止檔塊與作動桿相互固定;另該上探針容置框架包括一止擋塊容置空間、一上探針容置空間、一隔板以及一穿孔,其中該止擋塊容置空間形成於上探針容置框架的上部,該上探針容置空間形成於上探針容置框架的下部,並且於止擋塊容置空間與上探針容置空間之間設有該隔板,而前述作動桿貫穿所述止擋塊容置空間、上探針容置空間以及隔板,而該穿孔位置形成於上探針容置框架的底部,其與上探針的突出部相對應;其中該止擋塊容置空間容置有所述止擋塊,該上探針容置空間容置有上探針的平面部、突出部以及彈簧,並且該突出部經由所述穿孔突出於上探針容置框架。此技術手段惟利用作動桿控制上探針模組相對於下探針模組移動,並藉由止擋塊以及上探針容置框架的設置,限制作動桿的作動範圍以及上探針的移動距離,使上探針所能檢測的厚度固定,並且再利用彈簧的設置,使上探針藉由彈簧的彈力作用,其平面部朝向上探針容置框架之底部的一側可以確實地與上探針容置框架相抵頂,確保上探針的突出部與尖端部確實地突伸至上探針容置框架外部的長度達到最大值。More preferably, the upper probe module further includes an actuating lever, a spring, a stop block and an upper probe receiving frame, wherein a plane of the actuating lever and the upper probe is opposite to the protruding portion The side is connected, and the spring is disposed on a side of the plane portion to which the actuating rod is coupled. The spring is sleeved on the actuating rod, and one end thereof is in contact with the plane portion of the upper probe, and the actuating rod is away from the plane portion. The stop block is fixed to the actuating rod at one end; the upper probe receiving frame includes a stop block receiving space, an upper probe receiving space, a partition and a perforation. The stop block accommodating space is formed on an upper portion of the upper probe accommodating frame, and the upper probe accommodating space is formed at a lower portion of the upper probe accommodating frame, and the stop block accommodating space and the upper probe accommodating space The partition is disposed between the space, and the actuating rod extends through the stop receiving space, the upper probe receiving space and the partition, and the punching position is formed at the bottom of the upper probe receiving frame, Corresponding to the protrusion of the upper probe; wherein the stop block accommodates space The stopper, the probe accommodating space accommodates the flat portion on the probe, and a spring protruding portion, and the projecting portion projecting through the perforations in the probe receiving frame. The technical means only uses the actuating lever to control the movement of the upper probe module relative to the lower probe module, and limits the actuation range of the actuating lever and the movement of the upper probe by the arrangement of the stop block and the upper probe receiving frame. The distance is such that the thickness of the upper probe can be fixed, and the arrangement of the spring is used to make the upper probe act by the spring force of the spring, and the side of the flat portion facing the bottom of the upper probe receiving frame can be surely The upper probe receiving frame abuts against the top, ensuring that the length of the protrusion and the tip of the upper probe that protrudes exactly beyond the upper probe receiving frame reaches a maximum.
以下請配合圖式及本創作之較佳實施例,進一步闡述本創作為達成預定創作目的所採取的技術手段。In the following, please cooperate with the drawings and the preferred embodiment of the present invention to further explain the technical means adopted by the present creation for the purpose of achieving the intended creation.
如圖1所示,本創作之檢查補材厚度的專用探針裝置係包括:一一上探針模組10以及一下探針模組20。As shown in FIG. 1, the dedicated probe device for checking the thickness of the additive includes: an upper probe module 10 and a lower probe module 20.
其中該上探針模組10具有一上探針11、一作動桿12、一彈簧13、一止擋塊14以及一上探針容置框架15,該上探針11包括一平面部111以及一突出部112,該突出部112係由平面部111朝向下探針模組20的方向突出於該平面部111,並且於突出部112遠離平面部111的一端形成一尖端部113;該作動桿12與平面部111相對於突出部112的一側相連結,並於連結有作動桿12的一側設有該彈簧13,該彈簧13套設於作動桿12上,並且其一端與平面部111相接觸;另於作動桿12遠離平面部111的一端設有該止擋塊14,該止檔塊14與作動桿12相互固定,並且該止檔塊14不與彈簧13相接觸。而該上探針容置框架15包括一止擋塊容置空間151、一上探針容置空間152以及一穿孔153,其中該止擋塊容置空間151形成於上探針容置框架15的上部,該上探針容置空間152形成於上探針容置框架15的下部,並且於止擋塊容置空間151與上探針容置空間152之間設有一隔板154,前述作動桿12貫穿所述止擋塊容置空間151、上探針容置空間152以及隔板154,而該穿孔153位置形成於上探針容置框架15的底部,並與上探針11的突出部112相對應設置。其中該止擋塊容置空間151容置有所述止擋塊14,並藉由止擋塊容置空間151限制止擋塊14的移動範圍,進而限制作動桿12的作動範圍,以及上探針11的移動距離;而該上探針容置空間152容置有上探針11的平面部111、部分突出部112以及彈簧13,並且該突出部112可選擇性地經由所述穿孔153完全突伸出上探針容置空間152。The upper probe module 10 has an upper probe 11 , an actuating lever 12 , a spring 13 , a stop block 14 and an upper probe receiving frame 15 . The upper probe 11 includes a flat portion 111 and a protruding portion 112 protruding from the plane portion 111 toward the lower probe module 20 in the direction of the lower portion, and a tip portion 113 formed at an end of the protruding portion 112 away from the plane portion 111; the actuating rod 12 is coupled to one side of the flat portion 111 with respect to the protruding portion 112, and is disposed on a side to which the actuating lever 12 is coupled. The spring 13 is sleeved on the actuating lever 12, and one end thereof and the flat portion 111 The stop block 14 is disposed at an end of the actuating lever 12 away from the planar portion 111. The stop block 14 and the actuating lever 12 are fixed to each other, and the stop block 14 is not in contact with the spring 13. The upper probe receiving frame 15 includes a stop receiving space 151 , an upper probe receiving space 152 , and a through hole 153 . The stop receiving space 151 is formed in the upper probe receiving frame 15 . The upper portion of the upper probe receiving frame 15 is formed at a lower portion of the upper probe receiving frame 15 and a partition 154 is disposed between the stop receiving space 151 and the upper probe receiving space 152. The rod 12 extends through the stopper receiving space 151, the upper probe accommodating space 152, and the partition 154, and the through hole 153 is formed at the bottom of the upper probe accommodating frame 15 and protrudes from the upper probe 11 The portion 112 is correspondingly disposed. The stop block 151 accommodates the stop block 14 and limits the range of movement of the stop block 14 by the stop block receiving space 151, thereby limiting the operating range of the actuating lever 12, and detecting the range The upper probe housing space 152 accommodates the planar portion 111 of the upper probe 11, the partial protrusion 112, and the spring 13, and the protrusion 112 is selectively detachable via the through hole 153 The upper probe receiving space 152 is protruded.
另該下探針模組20具有一承載台21與一下探針22,其中該下探針22的頂面221與承載台21的頂部211齊平,且該下探針22的頂面221與上探針11的尖端部113相對設置,並且使該上探針11與該下探針22電性連接;而該上探針11可藉由作動桿12的上、下垂直作動,相對於下探針22移動,使上探針11的尖端部113與下探針22的頂面221可選擇性地相互接觸。The lower probe module 20 has a carrier 21 and a lower probe 22, wherein the top surface 221 of the lower probe 22 is flush with the top 211 of the carrier 21, and the top surface 221 of the lower probe 22 is The tip end portion 113 of the upper probe 11 is oppositely disposed, and the upper probe 11 is electrically connected to the lower probe 22; and the upper probe 11 can be vertically operated by the upper and lower sides of the actuating lever 12, relative to the lower The probe 22 is moved such that the tip end portion 113 of the upper probe 11 and the top surface 221 of the lower probe 22 are selectively in contact with each other.
本創作之檢查補材厚度的專用探針裝置係利用作動桿12連動上探針模組10做第一階段的垂直移動,使上探針容置框架15的底部向下移動至抵靠住補材30為止;接著,作動桿12可再進一步連動上探針11與止擋塊14相對於上探針容置框架15做第二階段的垂直移動,進而使上探針11的突出部112完全突伸出上探針容置空間152;而該彈簧13裝設於平面部111與隔板154之間,使上探針11藉由彈簧13的彈力(回復力)作用,其平面部111朝向上探針容置框架15之底部的一側可以確實地與上探針容置框架15相抵頂,確保上探針11的突出部112與尖端部113確實地突伸至上探針容置框架15外部的長度達到最大值。The special probe device for checking the thickness of the additive in the present invention uses the actuating rod 12 to interlock the vertical movement of the probe module 10 in the first stage, so that the bottom of the upper probe receiving frame 15 is moved downward to abut. Then, the actuating rod 12 can further interlock the vertical movement of the upper probe 11 and the stop block 14 with respect to the upper probe receiving frame 15 in a second stage, so that the protruding portion 112 of the upper probe 11 is completely completed. The spring receiving portion 152 is disposed between the flat portion 111 and the partition plate 154, so that the upper probe 11 acts by the elastic force (restoring force) of the spring 13, and the flat portion 111 faces The side of the bottom of the upper probe receiving frame 15 can surely abut against the upper probe receiving frame 15, ensuring that the protruding portion 112 and the tip end portion 113 of the upper probe 11 reliably protrude to the upper probe receiving frame 15 The length of the outside reaches the maximum.
本創作實際檢查電路板40黏貼單層補材30時如圖2及圖3所示,首先將一黏貼有單層補材30的電路板40放置於承載台21上,使電路板40底部平貼於承載台21的頂部211,並使上探針11的突出部112與下探針22的延伸方向對準補材30與電路板40上的檢測孔50,並由圖3可以進一步明顯看出上探針容置框架15經由第一階段的垂直移動後抵頂於補材30上,接著使上探針11與止擋塊14做第二階段的垂直移動,使上探針11之突出部112完全突伸出上探針容置空間152,其中突出部112突伸出上探針容置框架15的長度L恰好等於單層補材30與電路板40的總和高度H,故上探針11的尖端部113可經由突伸進入檢測孔50中,進而與下探針22的頂面221相接觸,形成電導通狀態,此時儀器設備會顯示一ON的訊號供檢測者了解該電路板40上僅黏貼有單層補材30。As shown in FIG. 2 and FIG. 3, the circuit board 40 of the present invention is first placed on the carrier 21 so that the bottom of the circuit board 40 is flat. It is attached to the top portion 211 of the carrying table 21, and the protruding portion 112 of the upper probe 11 and the extending direction of the lower probe 22 are aligned with the feeding hole 50 and the detecting hole 50 on the circuit board 40, and can be further seen from FIG. After the vertical displacement of the upper probe receiving frame 15 through the first stage, it abuts against the supplementary material 30, and then the vertical movement of the upper probe 11 and the stop block 14 is performed in the second stage, so that the upper probe 11 protrudes. The portion 112 completely protrudes from the upper probe receiving space 152, wherein the length L of the protruding portion 112 protruding from the upper probe receiving frame 15 is exactly equal to the total height H of the single layer of the supplementary material 30 and the circuit board 40, so The tip end portion 113 of the needle 11 can be inserted into the detecting hole 50 through the protrusion, and then contacted with the top surface 221 of the lower probe 22 to form an electrical conduction state. At this time, the instrument device displays an ON signal for the examiner to understand the circuit. Only a single layer of the filler 30 is adhered to the plate 40.
另本創作實際檢查電路板40上黏貼雙層補材30時的狀態如圖4所示,由於突出部112突伸出上探針容置框架15的長度L小於雙層補材30與電路板40的總和高度h,故上探針11的尖端部113無法經由突伸進入檢測孔50中與下探針22的頂面221相接觸,形成電路斷路狀態,此時儀器設備會顯示一OFF的訊號供檢測者了解該電路板40上已黏貼有複數層的補材30。In addition, the state of the actual inspection circuit board 40 when the double-layered material 30 is adhered is as shown in FIG. 4, because the length L of the protruding portion 112 protruding from the upper probe receiving frame 15 is smaller than the double-layered material 30 and the circuit board. 40, the total height h of the probe 11, the tip end portion 113 of the upper probe 11 can not enter the detection hole 50 through the top surface 221 of the lower probe 22, forming a circuit open state, at this time the instrument device will display an OFF The signal is for the examiner to know that the plurality of layers 30 have been adhered to the circuit board 40.
綜上所述,本創作之檢查補材厚度的專用探針裝置,其利用上探針模組10可以相對於下探針模組20移動的結構設置,以及上探針11之突出部112突伸出上探針容置框架15的長度L等於單層補材30與電路板40的總和高度H設計,使本創作於檢測電路板40與單層補材30時,上探針11之尖端部113可與下探針22的頂面221相接觸而形成一電導通狀態,並輸出一個對應的訊號代表補材30的黏貼正確無誤;而本創作於檢測電路板40與複數層補材30時,上探針11之尖端部113無法與下探針22的頂面221相接觸而形成一電路斷路狀態,並輸出一個對應的訊號代表補材30的黏貼錯誤,需重新黏貼。藉此,本創作可以有效提升產品的良率,避免補材30的重覆黏貼導致出廠的產品良率不齊的問題。In summary, the dedicated probe device for inspecting the thickness of the additive is configured by the structure in which the upper probe module 10 can be moved relative to the lower probe module 20, and the protruding portion 112 of the upper probe 11 protrudes. The length L of the protruding probe receiving frame 15 is equal to the sum total height H of the single layer of the supplementary material 30 and the circuit board 40, so that the tip of the upper probe 11 is created when the detecting circuit board 40 and the single layer of the supplementary material 30 are created. The portion 113 can be in contact with the top surface 221 of the lower probe 22 to form an electrical conduction state, and output a corresponding signal to indicate that the attachment of the filler 30 is correct; and the present invention is applied to the detection circuit board 40 and the plurality of layers 30 At this time, the tip end portion 113 of the upper probe 11 cannot contact the top surface 221 of the lower probe 22 to form an open circuit state, and a corresponding signal is output to represent the adhesive error of the filler 30, which needs to be reattached. In this way, the creation can effectively improve the yield of the product, and avoid the problem that the yield of the manufactured product is not uniform due to the repeated adhesion of the additive 30.
以上所述僅是本創作的較佳實施例而已,並非對本創作做任何形式上的限制,雖然本創作已以較佳實施例揭露如上,然而並非用以限定本創作,任何所屬技術領域中具有通常知識者,在不脫離本創作技術方案的範圍內,當可利用上述揭示的技術內容作出些許更動或修飾為等同變化的等效實施例,但凡是未脫離本創作技術方案的內容,依據本創作的技術實質對以上實施例所作的任何簡單修改、等同變化與修飾,均仍屬於本創作技術方案的範圍內。The above description is only a preferred embodiment of the present invention, and does not impose any form limitation on the present invention. Although the present invention has been disclosed above in the preferred embodiment, it is not intended to limit the present creation, and has any technical field. A person skilled in the art can make some modifications or modifications to equivalent embodiments by using the above-disclosed technical contents without departing from the technical scope of the present invention. The technical essence of the creation Any simple modification, equivalent change and modification of the above embodiments are still within the scope of the technical solution of the present invention.
10‧‧‧上探針模組
11‧‧‧上探針
111‧‧‧平面部
112‧‧‧突出部
113‧‧‧尖端部
12‧‧‧作動桿
13‧‧‧彈簧
14‧‧‧止擋塊
15‧‧‧上探針容置框架
151‧‧‧止擋塊容置空間
152‧‧‧上探針容置空間
153‧‧‧穿孔
154‧‧‧隔板
20‧‧‧下探針模組
21‧‧‧承載台
211‧‧‧頂部
22‧‧‧下探針
221‧‧‧頂面
30‧‧‧補材
40‧‧‧電路板
50‧‧‧檢測孔
L‧‧‧突出部突伸出上探針容置框架的長度
H‧‧‧單層補材與電路板的總和高度
h‧‧‧雙層補材與電路板的總和高度
90‧‧‧游標尺10‧‧‧Upper probe module
11‧‧‧Upper probe
111‧‧‧Flat Department
112‧‧‧Protruding
113‧‧‧ tip
12‧‧‧Action rod
13‧‧‧ Spring
14‧‧‧stop block
15‧‧‧Upper probe housing frame
151‧‧‧ Stop block accommodation space
152‧‧‧Upper probe housing space
153‧‧‧Perforation
154‧‧ ‧ partition
20‧‧‧Lower probe module
21‧‧‧Loading station
211‧‧‧ top
22‧‧‧Lower probe
221‧‧‧ top surface
30‧‧‧Replenishment
40‧‧‧ boards
50‧‧‧Detection hole
L‧‧‧The protrusion protrudes from the length of the probe receiving frame
H‧‧‧Maximum height of single layer laminate and board
h‧‧‧The sum of the height of the double-layer and the board
90‧‧‧ vernier ruler
圖1係本創作之平面示意圖。 圖2係本創作之電路板黏貼單層補材的電測導通示意圖。 圖3係本創作之電路板黏貼單層補材的電測導通局部示意圖。 圖4係本創作之電路板黏貼雙層補材的電測未導通示意圖。 圖5係現有技術以游標尺量測電路板厚度的示意圖。Figure 1 is a schematic plan view of the creation. FIG. 2 is a schematic diagram of electrical measurement conduction of a single-layer composite material adhered to the circuit board of the present invention. Fig. 3 is a partial schematic view showing the electrical conduction conduction of the single-layer composite material of the circuit board of the present invention. Fig. 4 is a schematic diagram showing the electrical measurement of the double-layered material of the circuit board of the present invention. FIG. 5 is a schematic diagram of measuring the thickness of a circuit board with a vernier in the prior art.
10‧‧‧上探針模組10‧‧‧Upper probe module
11‧‧‧上探針11‧‧‧Upper probe
111‧‧‧平面部111‧‧‧Flat Department
112‧‧‧突出部112‧‧‧Protruding
113‧‧‧尖端部113‧‧‧ tip
12‧‧‧作動桿12‧‧‧Action rod
13‧‧‧彈簧13‧‧‧ Spring
14‧‧‧止擋塊14‧‧‧stop block
15‧‧‧上探針容置框架15‧‧‧Upper probe housing frame
151‧‧‧止擋塊容置空間151‧‧‧ Stop block accommodation space
152‧‧‧上探針容置空間152‧‧‧Upper probe housing space
153‧‧‧穿孔153‧‧‧Perforation
154‧‧‧隔板154‧‧ ‧ partition
20‧‧‧下探針模組20‧‧‧Lower probe module
21‧‧‧承載台21‧‧‧Loading station
211‧‧‧頂部211‧‧‧ top
22‧‧‧下探針22‧‧‧Lower probe
221‧‧‧頂面221‧‧‧ top surface
30‧‧‧補材30‧‧‧Replenishment
40‧‧‧電路板40‧‧‧ boards
50‧‧‧檢測孔50‧‧‧Detection hole
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW103221467U TWM504244U (en) | 2014-12-04 | 2014-12-04 | Specialized probe apparatus for the inspection of the repair material thickness |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103221467U TWM504244U (en) | 2014-12-04 | 2014-12-04 | Specialized probe apparatus for the inspection of the repair material thickness |
Publications (1)
Publication Number | Publication Date |
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TWM504244U true TWM504244U (en) | 2015-07-01 |
Family
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Family Applications (1)
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Country Status (1)
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115184654A (en) * | 2022-07-20 | 2022-10-14 | 燕麦(杭州)智能制造有限公司 | Test pin die, test method, and storage medium |
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2014
- 2014-12-04 TW TW103221467U patent/TWM504244U/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115184654A (en) * | 2022-07-20 | 2022-10-14 | 燕麦(杭州)智能制造有限公司 | Test pin die, test method, and storage medium |
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