TWM504244U - Specialized probe apparatus for the inspection of the repair material thickness - Google Patents

Description

Special probe device for checking the thickness of the material

This creation is a special probe device for checking the thickness of the material, especially whether the upper probe is in contact with the lower probe by using the conduction of the electric signal, thereby further judging whether the thickness of the material on the circuit board is correct or not. .

In order to meet the needs of the circuit board (especially the flexible circuit board) to be attached to various products, the circuit board often needs to be attached with a material to strengthen the structural hardness; the prior art is used to determine whether the material is missing or There are two methods used for re-adhesive bonding. One is to manually measure the thickness of the board and the patch directly by manually operating the vernier scale, and the other is to measure whether the sensor is measured by an advanced electric measuring system. Electrical conduction, and then determine the adhesion of the supplement.

However, the manner of directly measuring the thickness of the circuit board 40 by manually operating the vernier scale 90 is as shown in FIG. 5, which is extremely slow in speed. If a plurality of materials are adhered to a circuit board 40, a stepwise measurement is required. It takes a lot of time and labor, and if the patch is stuck in the center of a large circuit board and the vernier 90 cannot be inserted into it for measurement, the adhesion of the material cannot be known. In addition, the operator may easily generate an error or an error in the interpretation of the data on the vernier 90 to cause a false positive.

In addition, the other one is to determine the adhesion of the additive by means of electrical measurement. The prior art often causes the electrical probe to be insulated due to the adhesion of the electrical probe during the detection, resulting in system misjudgment; The electric measurement system has no problem in judging whether there is any leakage or repairing of the material, but there are still difficulties in the detection of the repeated adhesion, so the electric measurement system still has the need for improvement.

In view of the shortcomings and shortcomings of the prior art, a special probe device capable of checking whether the refill on the circuit board is re-adhesive is needed at present, which can not only solve the problem but also avoid the traditional measurement of the circuit board and the thickness of the material by the vernier scale. Inconvenient and human error can also overcome the problem that the electrical probe of the prior art can not detect the repeated adhesion of the patch, and effectively avoid the problem of uneven yield of the manufactured products caused by the repeated adhesion of the patch.

In order to achieve the above-mentioned creative purpose, the technical means adopted by the present invention is to provide a special probe device for inspecting the thickness of the supplement, which comprises: an upper probe module; and a lower probe module; wherein the upper probe The module has an upper probe, the upper probe includes a flat portion and a protruding portion protruding from the planar portion toward the lower probe module, and forming a tip at an end of the protruding portion away from the planar portion The lower probe module has a carrier and a lower probe, wherein a top surface of the lower probe is flush with a top of the carrier, and a top surface of the lower probe is opposite to a tip end of the upper probe And selectively in contact with the upper probe.

The advantage of this creation is that the upper probe module can be relatively moved relative to the lower probe module, so that the flat portion of the upper probe is abutted on the feeding material, and the tip end portion of the upper probe can be used on the circuit board. The thickness of the patch layer is superimposed to change the thickness, so that the tip portion selectively contacts the lower probe, and the instrument determines whether the patch on the circuit board is repeatedly pasted.

Preferably, the upper probe is electrically connected to the lower probe. The technical means only uses the upper probe and the lower probe to be electrically connected in advance, and the length of the protruding portion of the probe is equal to the sum of the thickness of the circuit board and the single layer of the supplementary material, so that the circuit board is adhered to the single layer. When the material is replenished, the tip end portion of the upper probe contacts the lower probe to form an electrical conduction state; and if a plurality of layers of the material are pasted on the circuit board, the tip end portion of the upper probe does not contact the lower probe. The circuit is in an open state, and then the instrument determines whether the material on the circuit board is repeatedly pasted according to the electrical conduction state or the circuit breaking state.

More preferably, the upper probe module further includes an actuating lever, a spring, a stop block and an upper probe receiving frame, wherein a plane of the actuating lever and the upper probe is opposite to the protruding portion The side is connected, and the spring is disposed on a side of the plane portion to which the actuating rod is coupled. The spring is sleeved on the actuating rod, and one end thereof is in contact with the plane portion of the upper probe, and the actuating rod is away from the plane portion. The stop block is fixed to the actuating rod at one end; the upper probe receiving frame includes a stop block receiving space, an upper probe receiving space, a partition and a perforation. The stop block accommodating space is formed on an upper portion of the upper probe accommodating frame, and the upper probe accommodating space is formed at a lower portion of the upper probe accommodating frame, and the stop block accommodating space and the upper probe accommodating space The partition is disposed between the space, and the actuating rod extends through the stop receiving space, the upper probe receiving space and the partition, and the punching position is formed at the bottom of the upper probe receiving frame, Corresponding to the protrusion of the upper probe; wherein the stop block accommodates space The stopper, the probe accommodating space accommodates the flat portion on the probe, and a spring protruding portion, and the projecting portion projecting through the perforations in the probe receiving frame. The technical means only uses the actuating lever to control the movement of the upper probe module relative to the lower probe module, and limits the actuation range of the actuating lever and the movement of the upper probe by the arrangement of the stop block and the upper probe receiving frame. The distance is such that the thickness of the upper probe can be fixed, and the arrangement of the spring is used to make the upper probe act by the spring force of the spring, and the side of the flat portion facing the bottom of the upper probe receiving frame can be surely The upper probe receiving frame abuts against the top, ensuring that the length of the protrusion and the tip of the upper probe that protrudes exactly beyond the upper probe receiving frame reaches a maximum.

In the following, please cooperate with the drawings and the preferred embodiment of the present invention to further explain the technical means adopted by the present creation for the purpose of achieving the intended creation.

As shown in FIG. 1, the dedicated probe device for checking the thickness of the additive includes: an upper probe module 10 and a lower probe module 20.

The upper probe module 10 has an upper probe 11 , an actuating lever 12 , a spring 13 , a stop block 14 and an upper probe receiving frame 15 . The upper probe 11 includes a flat portion 111 and a protruding portion 112 protruding from the plane portion 111 toward the lower probe module 20 in the direction of the lower portion, and a tip portion 113 formed at an end of the protruding portion 112 away from the plane portion 111; the actuating rod 12 is coupled to one side of the flat portion 111 with respect to the protruding portion 112, and is disposed on a side to which the actuating lever 12 is coupled. The spring 13 is sleeved on the actuating lever 12, and one end thereof and the flat portion 111 The stop block 14 is disposed at an end of the actuating lever 12 away from the planar portion 111. The stop block 14 and the actuating lever 12 are fixed to each other, and the stop block 14 is not in contact with the spring 13. The upper probe receiving frame 15 includes a stop receiving space 151 , an upper probe receiving space 152 , and a through hole 153 . The stop receiving space 151 is formed in the upper probe receiving frame 15 . The upper portion of the upper probe receiving frame 15 is formed at a lower portion of the upper probe receiving frame 15 and a partition 154 is disposed between the stop receiving space 151 and the upper probe receiving space 152. The rod 12 extends through the stopper receiving space 151, the upper probe accommodating space 152, and the partition 154, and the through hole 153 is formed at the bottom of the upper probe accommodating frame 15 and protrudes from the upper probe 11 The portion 112 is correspondingly disposed. The stop block 151 accommodates the stop block 14 and limits the range of movement of the stop block 14 by the stop block receiving space 151, thereby limiting the operating range of the actuating lever 12, and detecting the range The upper probe housing space 152 accommodates the planar portion 111 of the upper probe 11, the partial protrusion 112, and the spring 13, and the protrusion 112 is selectively detachable via the through hole 153 The upper probe receiving space 152 is protruded.

The lower probe module 20 has a carrier 21 and a lower probe 22, wherein the top surface 221 of the lower probe 22 is flush with the top 211 of the carrier 21, and the top surface 221 of the lower probe 22 is The tip end portion 113 of the upper probe 11 is oppositely disposed, and the upper probe 11 is electrically connected to the lower probe 22; and the upper probe 11 can be vertically operated by the upper and lower sides of the actuating lever 12, relative to the lower The probe 22 is moved such that the tip end portion 113 of the upper probe 11 and the top surface 221 of the lower probe 22 are selectively in contact with each other.

The special probe device for checking the thickness of the additive in the present invention uses the actuating rod 12 to interlock the vertical movement of the probe module 10 in the first stage, so that the bottom of the upper probe receiving frame 15 is moved downward to abut. Then, the actuating rod 12 can further interlock the vertical movement of the upper probe 11 and the stop block 14 with respect to the upper probe receiving frame 15 in a second stage, so that the protruding portion 112 of the upper probe 11 is completely completed. The spring receiving portion 152 is disposed between the flat portion 111 and the partition plate 154, so that the upper probe 11 acts by the elastic force (restoring force) of the spring 13, and the flat portion 111 faces The side of the bottom of the upper probe receiving frame 15 can surely abut against the upper probe receiving frame 15, ensuring that the protruding portion 112 and the tip end portion 113 of the upper probe 11 reliably protrude to the upper probe receiving frame 15 The length of the outside reaches the maximum.

As shown in FIG. 2 and FIG. 3, the circuit board 40 of the present invention is first placed on the carrier 21 so that the bottom of the circuit board 40 is flat. It is attached to the top portion 211 of the carrying table 21, and the protruding portion 112 of the upper probe 11 and the extending direction of the lower probe 22 are aligned with the feeding hole 50 and the detecting hole 50 on the circuit board 40, and can be further seen from FIG. After the vertical displacement of the upper probe receiving frame 15 through the first stage, it abuts against the supplementary material 30, and then the vertical movement of the upper probe 11 and the stop block 14 is performed in the second stage, so that the upper probe 11 protrudes. The portion 112 completely protrudes from the upper probe receiving space 152, wherein the length L of the protruding portion 112 protruding from the upper probe receiving frame 15 is exactly equal to the total height H of the single layer of the supplementary material 30 and the circuit board 40, so The tip end portion 113 of the needle 11 can be inserted into the detecting hole 50 through the protrusion, and then contacted with the top surface 221 of the lower probe 22 to form an electrical conduction state. At this time, the instrument device displays an ON signal for the examiner to understand the circuit. Only a single layer of the filler 30 is adhered to the plate 40.

In addition, the state of the actual inspection circuit board 40 when the double-layered material 30 is adhered is as shown in FIG. 4, because the length L of the protruding portion 112 protruding from the upper probe receiving frame 15 is smaller than the double-layered material 30 and the circuit board. 40, the total height h of the probe 11, the tip end portion 113 of the upper probe 11 can not enter the detection hole 50 through the top surface 221 of the lower probe 22, forming a circuit open state, at this time the instrument device will display an OFF The signal is for the examiner to know that the plurality of layers 30 have been adhered to the circuit board 40.

In summary, the dedicated probe device for inspecting the thickness of the additive is configured by the structure in which the upper probe module 10 can be moved relative to the lower probe module 20, and the protruding portion 112 of the upper probe 11 protrudes. The length L of the protruding probe receiving frame 15 is equal to the sum total height H of the single layer of the supplementary material 30 and the circuit board 40, so that the tip of the upper probe 11 is created when the detecting circuit board 40 and the single layer of the supplementary material 30 are created. The portion 113 can be in contact with the top surface 221 of the lower probe 22 to form an electrical conduction state, and output a corresponding signal to indicate that the attachment of the filler 30 is correct; and the present invention is applied to the detection circuit board 40 and the plurality of layers 30 At this time, the tip end portion 113 of the upper probe 11 cannot contact the top surface 221 of the lower probe 22 to form an open circuit state, and a corresponding signal is output to represent the adhesive error of the filler 30, which needs to be reattached. In this way, the creation can effectively improve the yield of the product, and avoid the problem that the yield of the manufactured product is not uniform due to the repeated adhesion of the additive 30.

The above description is only a preferred embodiment of the present invention, and does not impose any form limitation on the present invention. Although the present invention has been disclosed above in the preferred embodiment, it is not intended to limit the present creation, and has any technical field. A person skilled in the art can make some modifications or modifications to equivalent embodiments by using the above-disclosed technical contents without departing from the technical scope of the present invention. The technical essence of the creation Any simple modification, equivalent change and modification of the above embodiments are still within the scope of the technical solution of the present invention.

10‧‧‧Upper probe module
11‧‧‧Upper probe
111‧‧‧Flat Department
112‧‧‧Protruding
113‧‧‧ tip
12‧‧‧Action rod
13‧‧‧ Spring
14‧‧‧stop block
15‧‧‧Upper probe housing frame
151‧‧‧ Stop block accommodation space
152‧‧‧Upper probe housing space
153‧‧‧Perforation
154‧‧ ‧ partition
20‧‧‧Lower probe module
21‧‧‧Loading station
211‧‧‧ top
22‧‧‧Lower probe
221‧‧‧ top surface
30‧‧‧Replenishment
40‧‧‧ boards
50‧‧‧Detection hole
L‧‧‧The protrusion protrudes from the length of the probe receiving frame
H‧‧‧Maximum height of single layer laminate and board
h‧‧‧The sum of the height of the double-layer and the board
90‧‧‧ vernier ruler

Figure 1 is a schematic plan view of the creation. FIG. 2 is a schematic diagram of electrical measurement conduction of a single-layer composite material adhered to the circuit board of the present invention. Fig. 3 is a partial schematic view showing the electrical conduction conduction of the single-layer composite material of the circuit board of the present invention. Fig. 4 is a schematic diagram showing the electrical measurement of the double-layered material of the circuit board of the present invention. FIG. 5 is a schematic diagram of measuring the thickness of a circuit board with a vernier in the prior art.

10‧‧‧Upper probe module

11‧‧‧Upper probe

111‧‧‧Flat Department

112‧‧‧Protruding

113‧‧‧ tip

12‧‧‧Action rod

13‧‧‧ Spring

14‧‧‧stop block

15‧‧‧Upper probe housing frame

151‧‧‧ Stop block accommodation space

152‧‧‧Upper probe housing space

153‧‧‧Perforation

154‧‧ ‧ partition

20‧‧‧Lower probe module

21‧‧‧Loading station

211‧‧‧ top

22‧‧‧Lower probe

221‧‧‧ top surface

30‧‧‧Replenishment

40‧‧‧ boards

50‧‧‧Detection hole

Claims (3)

A special probe device for inspecting a thickness of a supplement, comprising: an upper probe module; and a lower probe module; wherein the upper probe module has an upper probe, and the upper probe includes a flat portion And a protruding portion protruding from the planar portion toward the lower probe module, and forming a tip end at an end of the protruding portion away from the planar portion; and the lower probe module has a carrying platform and a lower probe a needle, wherein a top surface of the lower probe is flush with a top of the carrier, and a top surface of the lower probe is disposed opposite the tip end portion of the upper probe and selectively contacts the upper probe. A dedicated probe device for inspecting the thickness of a supplement as described in claim 1, wherein the upper probe is electrically connected to the lower probe. The special probe device for inspecting the thickness of the supplement according to claim 1 or 2, wherein the upper probe module further comprises an actuating lever, a spring, a stop block and an upper probe receiving frame, wherein The movable rod and the flat portion of the upper probe are coupled to one side of the protruding portion, and the spring is disposed on a side of the planar portion to which the actuating rod is coupled, the spring is sleeved on the actuating rod, and one end thereof and the upper probe The flat portion of the needle is in contact with the stop block, and the stop block is fixed to the end of the actuating rod, the stop block and the actuating rod are fixed to each other; and the upper probe receiving frame includes a stop block receiving space, An upper probe receiving space, a partition plate and a through hole, wherein the stop block receiving space is formed on an upper portion of the upper probe receiving frame, and the upper probe receiving space is formed on the upper probe receiving frame a lower portion, and the partition plate is disposed between the stopper receiving space and the upper probe receiving space, and the actuating rod penetrates the stopping block receiving space, the upper probe receiving space, and the partition plate, and The perforation position is formed at the bottom of the upper probe receiving frame, and the upper probe Corresponding to the protrusion; wherein the stop receiving space accommodates the stop block, the upper probe receiving space accommodating the flat portion of the upper probe, the protrusion and the spring, and the protrusion passes through the The perforations protrude from the upper probe receiving frame.