TWM502163U - 平板熱管結構 - Google Patents

平板熱管結構 Download PDF

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Publication number
TWM502163U
TWM502163U TW104200485U TW104200485U TWM502163U TW M502163 U TWM502163 U TW M502163U TW 104200485 U TW104200485 U TW 104200485U TW 104200485 U TW104200485 U TW 104200485U TW M502163 U TWM502163 U TW M502163U
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TW
Taiwan
Prior art keywords
heat pipe
capillary
capillary structure
disposed
flat heat
Prior art date
Application number
TW104200485U
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English (en)
Inventor
Kuo-Chun Hsieh
Original Assignee
Asia Vital Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Vital Components Co Ltd filed Critical Asia Vital Components Co Ltd
Priority to CN201520017214.XU priority Critical patent/CN204404871U/zh
Priority to TW104200485U priority patent/TWM502163U/zh
Priority to JP2015000226U priority patent/JP3197578U/ja
Priority to DE201520100693 priority patent/DE202015100693U1/de
Publication of TWM502163U publication Critical patent/TWM502163U/zh

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Description

平板熱管結構
一種平板熱管結構,尤指一種具有厚度極薄的平板熱管結構。
現行電子行動裝置係朝向極為輕薄為走向,新式電子行動裝置不僅輕薄其運算效能亦隨之提升,但隨運算效能之提升以及整體厚度縮減其內部容置電子元件之空間亦隨之受限,當運算效能提高時,相對的電子元件運算時所產生之熱量亦隨之增加,故需要散熱元件加以輔助各電子元件之散熱工作,又因該電子行動裝置因為薄化的條件下,其內部空間已極為狹窄難以設置風扇等散熱元件,故僅能設置銅薄片或鋁薄片作為增大散熱面積使用,但對於散熱效能之提升仍然不足。
習知技術中將熱管或均溫板製成薄型化時因整體採取薄型化,致使薄型熱管因薄型化後填粉燒結困難,難以實現極薄型化之結構,或填粉燒結後壓製成扁平狀結構時,熱管內部燒結粉末或其他毛細結構(網格體或纖維體)受到擠壓破壞而失能。
另外,習知均溫板為更微薄型化,省略內部之支撐結構令均溫板抽氣封口後,內部腔室容易變形,故習知薄型化熱管及均溫板內部之蒸汽通道容易被壓縮變小或甚至沒有蒸汽通道,影響內部整體汽液循環之效率,故如何改良薄型化後之均溫板及熱管內部之汽液循環結構即為當下必須改善 之目標。
爰此,為有效解決上述之問題,本創作之主要目的,係提供一種具有超薄結構之平板熱管結構,並於薄型化後仍保有蒸汽通道的平板熱管結構。
為達上述目的本創作係提供一種平板熱管結構,係包含:一本體;所述本體具有一第一板體及一第二板體及一第一毛細結構及一工作流體,所述第一、二板體相互疊合,該第一毛細結構係設置於該第一、二板體之間,並該第一毛細結構與該與第一、二板體共同界定至少一蒸汽通道。
透過本創作所提供之平板熱管結構係可令薄型化後之平板熱管仍可保有順暢之蒸汽通道,使薄型化之平板熱管內部工作流體仍可順利進行汽液循環者。
1‧‧‧本體
11‧‧‧第一板體
12‧‧‧第二板體
13‧‧‧第一毛細結構
131‧‧‧粉末燒結體
132‧‧‧網格體
14‧‧‧蒸汽通道
15‧‧‧第二毛細結構
151‧‧‧溝槽
16‧‧‧吸熱部
17‧‧‧散熱部
18‧‧‧彎曲部
2‧‧‧工作流體
Y‧‧‧徑向
X‧‧‧軸向
第1圖係為本創作之平板熱管結構之第一實施例之立體分解圖;第2圖係為本創作之平板熱管結構之第一實施例之組合圖剖視圖;第3圖係為本創作之平板熱管結構之第二實施例之組合剖視圖;第4圖係為本創作之平板熱管結構之第三實施例之組合剖視圖;第5圖係為本創作之平板熱管結構之第四實施例之組合剖視圖。
本創作之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。
請參閱第1、2圖,係為本創作之平板熱管結構之第一實施例之立體分解及組合圖剖視圖,如圖所示,本創作平板熱管結構,係包含:一本體1; 所述本體1具有一第一板體11及一第二板體12及一第一毛細結構13及一工作流體2(如第3圖所示),所述第一、二板體11、12相互疊合,該第一毛細結構13係設置於該第一、二板體11、12之間,並該第一毛細結構13與該與第一、二板體11、12共同界定至少一蒸汽通道14。
所述第一毛細結構13係為網格體或纖維體或線狀編織體或燒結粉末體其中任一,本實施例係以燒結粉末體作為說明實施例,但並不引以為限。所述第一、二板體厚度為0.01~0.15mm。
本實施例之所述第一毛細結構13係成對設置,所述蒸汽通道14形成於兩第一毛細結構13之間。
請參閱第3圖,係為本創作之平板熱管結構之第二實施例之組合剖視圖,如圖所示,本實施例部分結構技術特徵係與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之差異在於,所述本體1更具有一第二毛細結構15及一吸熱部16及一散熱部17,該第二毛細結構15可係為複數溝槽151或編織網其中任一,所述第二毛細結構15係設置於該吸熱部16,該等溝槽151係呈橫向及縱向交錯,所述第二毛細結構15係設置於該第二板體12相對該第一毛細結構13之一側,該等溝槽151因橫向及縱向相互交錯,故可令液態之工作流體2沿該本體1之徑向Y,相同也可以回水至該吸熱部16。
請參閱第4圖,係為本創作之平板熱管結構之第三實施例之組合剖視圖,如圖所示,本實施例部分結構技術特徵係與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之差異在於,該第一毛細結構13沿該本體1之軸向X延伸設置於該本體1中央處,所述蒸汽通道14設置於該第一毛細結構13之兩側。
請參閱第5圖,係為本創作之平板熱管結構之第四實施例之組合剖視 圖,如圖所示,本實施例部分結構技術特徵係與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之差異在於,本實施例之第一毛細結構13係為一種綜合型毛細結構,其中該本體1係具有一彎曲部18,該吸熱部16及該散熱部17連接該彎曲部18,設置於所述吸熱部16及該散熱部17之第一毛細結構13主要係選擇粉末燒結體131,而設置於該彎曲部之第一毛細結構13則係選擇網格體132,由於該本體1之第一板體11及第二板體12與該第一毛細結構13製造時係採疊層方式組合後再閉封閉其呈開放狀之側邊,故可將該第一、二板體11、12先製成彎曲狀後再於其中任一板體上設置該第一毛細結構13,進而可解決習知技術熱管成形後受彎曲加工破壞熱管內部毛細結構之缺失。
1‧‧‧本體
11‧‧‧第一板體
12‧‧‧第二板體
13‧‧‧第一毛細結構
14‧‧‧蒸汽通道
Y‧‧‧徑向
X‧‧‧軸向

Claims (9)

  1. 一種平板熱管結構,係包含:一本體,具有一第一板體及一第二板體及一第一毛細結構及一工作流體,所述第一、二板體相互疊合,該第一毛細結構係設置於該第一、二板體之間,並該第一毛細結構與該與第一、二板體共同界定至少一蒸汽通道。
  2. 如申請專利範圍第1項所述之平板熱管結構,其中所述第一毛細結構係為網格體或纖維體或粉末燒結體或線狀編織體或燒結粉末體其中任一。
  3. 如申請專利範圍第1項所述之平板熱管結構,其中更具有一第二毛細結構,該第二毛細結構係為複數溝槽或編織網其中任一。
  4. 如申請專利範圍第3項所述之平板熱管結構,其中該等溝槽間係成橫向及縱向交錯。
  5. 如申請專利範圍第3項所述之平板熱管結構,其中所述本體更具有一吸熱部及一散熱部,所述第二毛細結構係設置於該吸熱部。
  6. 如申請專利範圍第1項所述之平板熱管結構,其中該第一毛細結構沿該本體之軸向延伸設置於該本體中央處,所述蒸汽通道設置於該第一毛細結構之兩側。
  7. 如申請專利範圍第1項所述之平板熱管結構,其中所述第一毛細結構係成對設置,所述蒸汽通道形成於兩第一毛細結構之間。
  8. 如申請專利範圍第1項所述之平板熱管結構,其中所述第一、二板體厚度為0.01~0.15mm。
  9. 如申請專利範圍第1項所述之平板熱管結構,其中所述本體更具有一吸熱部及一散熱部及一彎曲部,所述吸熱部及該散熱部連接該彎曲部,設置於該吸熱部及該散熱部之第一毛細結構主要係選擇粉末燒結體,而設 置於該彎曲部之第一毛細結構則係選擇網格體。
TW104200485U 2015-01-12 2015-01-12 平板熱管結構 TWM502163U (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201520017214.XU CN204404871U (zh) 2015-01-12 2015-01-12 平板热管结构
TW104200485U TWM502163U (zh) 2015-01-12 2015-01-12 平板熱管結構
JP2015000226U JP3197578U (ja) 2015-01-12 2015-01-21 平板熱管構造
DE201520100693 DE202015100693U1 (de) 2015-01-12 2015-02-12 Plattenförmiges Wärmerohr

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104200485U TWM502163U (zh) 2015-01-12 2015-01-12 平板熱管結構

Publications (1)

Publication Number Publication Date
TWM502163U true TWM502163U (zh) 2015-06-01

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ID=53936339

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TW104200485U TWM502163U (zh) 2015-01-12 2015-01-12 平板熱管結構

Country Status (4)

Country Link
JP (1) JP3197578U (zh)
CN (1) CN204404871U (zh)
DE (1) DE202015100693U1 (zh)
TW (1) TWM502163U (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105841531A (zh) * 2015-01-12 2016-08-10 奇鋐科技股份有限公司 平板热管结构
KR102583890B1 (ko) 2016-02-18 2023-10-05 삼성전자주식회사 열 수집/확산 구조를 가진 전자 장치
CN108332593A (zh) * 2018-03-27 2018-07-27 中山伟强科技有限公司 一种多通道回路型均温板
CN115060101B (zh) * 2022-06-29 2023-07-11 广州大学 基于毛细管阀的流体二极管结构的单向热管及其加工方法

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CN204404871U (zh) 2015-06-17
DE202015100693U1 (de) 2015-03-12
JP3197578U (ja) 2015-05-28

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