TWM500649U - Knife tool detection device - Google Patents

Knife tool detection device Download PDF

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Publication number
TWM500649U
TWM500649U TW104200096U TW104200096U TWM500649U TW M500649 U TWM500649 U TW M500649U TW 104200096 U TW104200096 U TW 104200096U TW 104200096 U TW104200096 U TW 104200096U TW M500649 U TWM500649 U TW M500649U
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Taiwan
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tool
detecting
detecting device
image
base
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TW104200096U
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Chinese (zh)
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Chi-En Li
Ming-Chang Cho
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Techmation Co Ltd
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Priority to TW104200096U priority Critical patent/TWM500649U/en
Publication of TWM500649U publication Critical patent/TWM500649U/en

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Description

刀具檢測裝置Tool detection device

本創作係有關於一種刀具檢測裝置,尤指一種能檢測正在運作之刀具之狀況的刀具檢測裝置。The present invention relates to a tool detecting device, and more particularly to a tool detecting device capable of detecting the condition of a working tool.

在金屬削切工藝中,刀具的狀態是影響產品品質與生產成本的主要關鍵,當刀具狀態不良(如,磨損斷裂等)則需更換刀具,過早更換刀具則會造成成本上的浪費,當刀具狀態嚴重不良時才更換刀具,則會造成產品不良的缺失。特別是,微銑削是超精密加工的重要方法,能靈活加工三維的微尺寸結構,故微銑刀是微銑削加工製程的關鍵工具。In the metal cutting process, the state of the tool is the main key affecting product quality and production cost. When the tool is in poor condition (such as wear and tear, etc.), the tool needs to be replaced. To replace the tool too early, it will cause cost waste. If the tool is changed in a bad state, the tool will be replaced, which will result in a defective product. In particular, micro-milling is an important method for ultra-precision machining, and it can flexibly machine three-dimensional micro-sized structures. Therefore, micro-milling cutters are the key tools for micro-milling processes.

對於刀具狀態的監測方法分為間接法與直接法兩種,間接法係透過使用刀具削切的過程中,削切時發出的聲音、削切時機台所發出的振動、削切後產品表面粗糙度與尺寸誤差等非刀具本身的磨損狀態推斷刀具磨損的狀態,而直接法顧名思義則是直接檢測刀具本身的狀態,舉例而言,以光源照射刀具觀察破損處,或測量刀具刀刃在體積或形狀上的改變,觀察監控刀具的磨損或破損的狀況。The monitoring method of the tool state is divided into indirect method and direct method. The indirect method uses the cutting process of the tool, the sound generated during the cutting, the vibration generated by the cutting machine, and the surface roughness of the product after cutting. The state of the tool wear is inferred from the wear state of the non-tool itself, such as the dimensional error. The direct method, as its name suggests, directly detects the state of the tool itself. For example, the light source illuminates the tool to observe the damage, or the tool blade is measured in volume or shape. Change to observe the condition of worn or broken tools.

相較於間接法,直接法能直接由刀具本身狀態判定刀 具狀況,不需藉由刀具磨損或破損而造成削切時發出的聲音或振動回推刀具的狀況。Compared with the indirect method, the direct method can directly determine the knife from the state of the tool itself. With the condition, there is no need to cause the sound or vibration generated during the cutting to push back the tool by the wear or tear of the tool.

然而,直接法必須於刀具停止運作時執行,因此,仍無法廣泛普及於工廠使用。However, the direct method must be executed when the tool is stopped, so it is still not widely available in the factory.

再者,現今所用的刀具形狀較為複雜,若使用直接法或間接法測量,則每一設備的參數條件皆不同,因此難以實施於檢測不同形狀的刀具。Furthermore, the shape of the tools used today is relatively complicated. If the direct or indirect method is used, the parameters of each device are different, so it is difficult to implement tools for detecting different shapes.

又,在進行微細銑削加工前,需確定刀具的長度和半徑偏置以便於對刀,目前常用雷射對刀具之遮擋進行判斷,但因微銑刀的尺寸極小,導致測量精度大幅降低,因此測量結果的重複性差,可靠性低。Also, before performing micro-milling, it is necessary to determine the length and radius offset of the tool to facilitate the tool setting. At present, the laser is used to judge the occlusion of the tool. However, since the size of the micro-milling tool is extremely small, the measurement accuracy is greatly reduced. The measurement results are poorly repeatable and have low reliability.

因此,如何克服上述習知技術之種種問題,實已成為目前業界亟待克服之難題。Therefore, how to overcome the various problems of the above-mentioned prior art has become a difficult problem to be overcome in the industry.

鑑於上述習知之缺失,本創作係提供一種刀具檢測裝置,係包括:基座,係具有檢測區;雷射檢測器,係設置於該基座上並以相對該檢測區之水平方向檢測該檢測區中之刀具;以及影像擷取器,係設置於該基座上並以相對該檢測區之垂直方向擷取該檢測區中之刀具之影像。In view of the above-mentioned deficiencies, the present invention provides a tool detecting device comprising: a base having a detection area; and a laser detector disposed on the base and detecting the detection in a horizontal direction relative to the detection area. a tool in the zone; and an image capture device disposed on the base and capturing an image of the tool in the detection zone in a direction perpendicular to the detection zone.

於一實施例中,該基座係具有容置空間以作為該檢測區。In an embodiment, the base has an accommodation space as the detection area.

於一實施例中,該雷射檢測器係包括一出光部與一光線投影部,以藉該出光部發出光線經該檢測區供該光線投影部接收。In one embodiment, the laser detector includes a light exiting portion and a light projection portion, and the light emitted by the light exiting portion is received by the light projection portion through the detection region.

於一實施例中,該影像擷取器係為電荷耦合元件(Charge-coupled Device,簡稱CCD)相機或顯微鏡。In one embodiment, the image capture device is a Charge-coupled Device (CCD) camera or a microscope.

於一實施例中,該影像擷取器包括一用以擷取該刀具輪廓之影像擷取單元、及一用以分析比對該刀具輪廓之影像分析單元。In one embodiment, the image capture device includes an image capture unit for capturing the contour of the tool, and an image analysis unit for analyzing the contour of the tool.

於一實施例中,復包括光學檢測器,係設於該基座上並以相對該檢測區之水平方向檢測該檢測區中之刀具。例如,該光學檢測器係包括用以擷取該刀具輪廓之影像擷取單元、以及用以分析比對該刀具輪廓之影像分析單元。In one embodiment, the optical detector is further included on the base and detects the tool in the detection zone in a horizontal direction relative to the detection zone. For example, the optical detector includes an image capturing unit for capturing the contour of the tool, and an image analyzing unit for analyzing the contour of the tool.

於一實施例中,復包括傳感器,係設於該基座上以偵測該檢測區中之刀具於運作時之傳動頻率。例如,該傳感器係為聲紋檢測器或震動檢測器。In an embodiment, the sensor is further disposed on the base to detect a transmission frequency of the tool in the detection zone during operation. For example, the sensor is a voiceprint detector or a vibration detector.

於一實施例中,復包括數據資料庫,係用以接收或提供該影像擷取器及/或該雷射檢測器之訊號數據。In one embodiment, the data database is included to receive or provide signal data of the image capture device and/or the laser detector.

由上可知,本創作之刀具檢測裝置係藉由影像擷取器與雷射檢測器在不需停機的條件下,直接監測刀具磨損與破壞之狀況,且同時具有兩個不同視角之監測,以全面監控刀具的磨損與破損狀況。It can be seen from the above that the tool detecting device of the present invention directly monitors the wear and damage of the tool by using the image picker and the laser detector without stopping the machine, and simultaneously has two different viewing angles to monitor Comprehensive monitoring of tool wear and damage.

1、2、3、4‧‧‧刀具檢測裝置1, 2, 3, 4‧‧‧ tool inspection device

10‧‧‧基座10‧‧‧ Pedestal

10a‧‧‧側部10a‧‧‧ side

10b‧‧‧底部10b‧‧‧ bottom

11‧‧‧雷射檢測器11‧‧‧Laser detector

110‧‧‧光線投影部110‧‧‧Light Projection Department

111‧‧‧出光部111‧‧‧Lighting Department

12‧‧‧影像擷取器12‧‧‧Image capture device

120‧‧‧影像分析單元120‧‧‧Image Analysis Unit

121‧‧‧影像擷取單元121‧‧‧Image capture unit

13‧‧‧光學檢測器13‧‧‧Optical detector

130‧‧‧背景單元130‧‧‧Background unit

131‧‧‧影像擷取單元131‧‧‧Image capture unit

132‧‧‧影像分析單元132‧‧‧Image Analysis Unit

14‧‧‧傳感器14‧‧‧ Sensor

15‧‧‧數據資料庫15‧‧‧Data Database

9‧‧‧加工機台9‧‧‧Processing machine

900‧‧‧支撐座900‧‧‧ support

911‧‧‧刀具911‧‧‧Tools

A‧‧‧檢測區A‧‧‧Detection area

第1圖係為本創作之刀具檢測裝置之第一實施例的側面示意圖;第2圖係為本創作之刀具檢測裝置之第二實施例的側面示意圖;第3圖係為本創作之刀具檢測裝置之第三實施例的側 面示意圖;以及第4圖係為本創作之刀具檢測裝置之第四實施例的側面示意圖。1 is a side view showing a first embodiment of the tool detecting device of the present invention; FIG. 2 is a side view showing a second embodiment of the tool detecting device of the present invention; and FIG. 3 is a tool detecting of the present invention. Side of the third embodiment of the device FIG. 4 is a side view showing a fourth embodiment of the tool detecting device of the present invention.

以下藉由特定的具體實施例說明本創作之實施方式,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本創作之其他優點及功效。The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can readily appreciate other advantages and functions of the present invention from the disclosure of the present disclosure.

須知,本說明書所附圖式所繪示之結構、比例、大小等,均僅用以配合說明書所揭示之內容,以供熟悉此技藝之人士之瞭解與閱讀,並非用以限定本創作可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本創作所能產生之功效及所能達成之目的下,均應仍落在本創作所揭示之技術內容得能涵蓋之範圍內。同時,本說明書中所引用之如“上”、“底”及“一”等之用語,亦僅為便於敘述之明瞭,而非用以限定本創作可實施之範圍,其相對關係之改變或調整,在無實質變更技術內容下,當亦視為本創作可實施之範疇。It is to be understood that the structure, the proportions, the size and the like of the drawings are only used in conjunction with the disclosure of the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effectiveness and the purpose of the creation. The technical content revealed by the creation can be covered. In the meantime, the terms "upper", "bottom" and "one" as used in this specification are for convenience of description only, and are not intended to limit the scope of the invention, the relative relationship may be changed or Adjustments, if there is no material change in the content of the technology, are also considered to be the scope of implementation of this creation.

第1圖係為本創作之刀具檢測裝置1之第一實施例的側面示意圖。Fig. 1 is a schematic side view showing the first embodiment of the tool detecting device 1 of the present invention.

如第1圖所示,所述之刀具檢測裝置1係用以檢測一加工機台9上的刀具911,該加工機台可例如為銑削或鑽孔機台,且於檢測時,該刀具911係呈現運作狀態並固接於該加工機台9之支撐座900上。As shown in Fig. 1, the tool detecting device 1 is used to detect a tool 911 on a processing machine 9, which can be, for example, a milling or drilling machine, and when detected, the tool 911 It is in an operational state and is fixed to the support base 900 of the processing machine 9.

於本實施例中,該刀具檢測裝置1係包括:一具有檢測區A之基座10、設於該基座10上之雷射檢測器11以及影像擷取器12。In the embodiment, the tool detecting device 1 includes a base 10 having a detection area A, a laser detector 11 disposed on the base 10, and an image capturing device 12.

所述之基座10係形成凹形輪廓結構,其由兩側部10a與一底部10b構成,且該些側部10a位於該底部10b上方,並使各該側部10a間形成一容置空間,令該容置空間作為檢測該刀具911的檢測區A。The base 10 is formed into a concave contour structure, which is formed by the two sides 10a and a bottom portion 10b, and the side portions 10a are located above the bottom portion 10b, and an accommodation space is formed between the side portions 10a. The accommodation space is used as the detection area A for detecting the cutter 911.

所述之雷射檢測器11係設於該基座10之側部10a中,以相對該檢測區A之水平方向檢測該檢測區A中之刀具911。The laser detector 11 is disposed in the side portion 10a of the base 10 to detect the tool 911 in the detection area A in a horizontal direction relative to the detection area A.

於本實施例中,該雷射檢測器11係包括一出光部111(如雷射機)與一光線投影部110(如投影幕),以藉該出光部111發出光學訊號供該光線投影部110接收。具體地,當該出光部111發出之雷射光線通過該檢測區A時,該刀具911會遮擋部分光線,使該光線投影部110上呈現該刀具911之黑影,藉以判斷該刀具911之影像是否有缺陷。In this embodiment, the laser detector 11 includes a light exiting portion 111 (such as a laser projector) and a light projection portion 110 (such as a projection screen) to emit an optical signal from the light exiting portion 111 for the light projection portion. 110 received. Specifically, when the laser beam emitted by the light exiting portion 111 passes through the detection area A, the tool 911 blocks part of the light, so that the light projection portion 110 presents a black shadow of the tool 911, thereby determining the image of the tool 911. Is there a defect?

所述之影像擷取器12係嵌埋於該基座10之底部10b中,以相對該檢測區A之垂直方向擷取該檢測區A中之刀具911之影像。The image capturing device 12 is embedded in the bottom portion 10b of the base 10 to capture an image of the tool 911 in the detecting area A in a direction perpendicular to the detecting area A.

於本實施例中,該影像擷取器12係為電荷耦合元件(Charge-coupled Device,簡稱CCD)相機或顯微鏡,且該影像擷取器12包括一用以擷取刀具911輪廓之影像擷取單元121、及一用以分析比對刀具911輪廓之影像分析單元120,藉以判斷刀具911的磨損或缺損狀況。In this embodiment, the image capturing device 12 is a Charge-coupled Device (CCD) camera or a microscope, and the image capturing device 12 includes an image capturing device for capturing the contour of the tool 911. The unit 121 and an image analyzing unit 120 for analyzing the contour of the matching tool 911 are used to determine the wear or defect condition of the tool 911.

第2圖係為本創作之刀具檢測裝置2的第二實施例之側面示意圖。本實施例與第一實施例之差異在於新增光學檢測器13。Fig. 2 is a side view showing the second embodiment of the tool detecting device 2 of the present invention. The difference between this embodiment and the first embodiment is that an optical detector 13 is added.

如第2圖所示,所述之光學檢測器13係設於該基座10之側部10a中,以相對該檢測區A之水平方向檢測該檢測區A中之刀具(圖略)。As shown in FIG. 2, the optical detector 13 is disposed in the side portion 10a of the susceptor 10, and detects a tool (not shown) in the detection area A in a horizontal direction with respect to the detection area A.

於本實施例中,該光學檢測器13係包括一背景單元130、用以擷取刀具輪廓之影像擷取單元131、以及用以分析比對該刀具輪廓之影像分析單元132。具體地,該影像擷取單元131可為CCD相機、錄影機、雷射機台等,且若該影像擷取單元131為CCD相機或錄影機時,該背景單元130用以輔助補足該影像擷取單元131擷取刀具外觀輪廓時所需的光,確保該影像擷取單元131所擷取之刀具外觀輪廓為清晰者。若該影像擷取單元131為雷射機台時,該背景單元130則為光線投影幕。In the embodiment, the optical detector 13 includes a background unit 130, an image capturing unit 131 for extracting a tool contour, and an image analyzing unit 132 for analyzing the contour of the tool. Specifically, the image capturing unit 131 can be a CCD camera, a video recorder, a laser machine, etc., and if the image capturing unit 131 is a CCD camera or a video recorder, the background unit 130 is used to complement the image. The taking unit 131 captures the light required for the outline of the tool, and ensures that the outline of the tool captured by the image capturing unit 131 is clear. If the image capturing unit 131 is a laser machine, the background unit 130 is a light projection screen.

第3圖係為本創作之刀具檢測裝置3的第三實施例之側面示意圖。本實施例與第一實施例之差異在於新增傳感器14。Fig. 3 is a side view showing the third embodiment of the tool detecting device 3 of the present invention. The difference between this embodiment and the first embodiment is that the sensor 14 is newly added.

如第3圖所示,所述之傳感器14係設於該基座10之側部10a中或底部10b上,以偵測該檢測區A中之刀具(圖略)於運作時之傳動頻率。As shown in FIG. 3, the sensor 14 is disposed in the side portion 10a of the base 10 or on the bottom portion 10b to detect the transmission frequency of the tool (not shown) in the detection area A during operation.

於本實施例中,該傳感器14係為聲紋檢測器(如聲音感測器)以偵測刀具運作時所產生的聲音頻率變化值;或者,該傳感器14係為震動檢測器(如壓電式振動感測器) 以偵測刀具運作時所產生的震動變化值。In this embodiment, the sensor 14 is a voiceprint detector (such as a sound sensor) to detect a change in the frequency of the sound generated when the tool operates; or the sensor 14 is a vibration detector (such as a piezoelectric device). Vibration sensor) To detect the change in vibration generated when the tool is operating.

第4圖係為本創作之刀具檢測裝置4的第四實施例之側面示意圖。本實施例與第一至第三實施例之差異在於新增數據資料庫15。Fig. 4 is a side view showing the fourth embodiment of the tool detecting device 4 of the present invention. The difference between this embodiment and the first to third embodiments lies in the addition of the data repository 15.

如第4圖所示,所述之數據資料庫15係用以接收或提供該影像擷取器12、光學檢測器13、傳感器14及/或雷射檢測器11之訊號數據。As shown in FIG. 4, the data database 15 is used to receive or provide signal data of the image capture device 12, the optical detector 13, the sensor 14, and/or the laser detector 11.

於本實施例中,藉由該數據資料庫15彙整所測得之數據,亦可用於比對刀具原本狀態與磨損後狀態,以提升比對效益。In the embodiment, the measured data is collected by the data database 15 and can also be used to compare the original state of the tool with the post-wear state to improve the comparison efficiency.

綜上所述,本創作之刀具檢測裝置1,2,3,4係藉由該雷射檢測器11及影像擷取器12於不同方向上監控該刀具911磨損的狀況,且能提供兩種不同的檢測參數供使用者做參考,以提升判斷該刀具911磨損、破損狀況之精準度。In summary, the tool detecting device 1, 2, 3, 4 of the present invention monitors the wear condition of the tool 911 in different directions by the laser detector 11 and the image picker 12, and can provide two kinds of conditions. Different test parameters are provided for reference by the user to improve the accuracy of judging the wear and tear of the tool 911.

此外,可藉由光學檢測器13或傳感器14等獲取更多該刀具911之各個角度磨損或缺損的狀況及檢測參數,以提升判斷該刀具911磨損、破損狀況之精準度。In addition, more conditions and detection parameters of the wear or defect of the tool 911 can be obtained by the optical detector 13 or the sensor 14 or the like to improve the accuracy of determining the wear and breakage of the tool 911.

上述實施例係用以例示性說明本創作之原理及其功效,而非用於限制本創作。任何熟習此項技藝之人士均可在不違背本創作之精神及範疇下,對上述實施例進行修改。因此本創作之權利保護範圍,應如後述之申請專利範圍所列。The above embodiments are intended to illustrate the principles of the present invention and its effects, and are not intended to limit the present invention. Anyone who is familiar with the art may modify the above embodiments without departing from the spirit and scope of the creation. Therefore, the scope of protection of this creation should be as listed in the scope of patent application described later.

1‧‧‧刀具檢測裝置1‧‧‧Tool detection device

10‧‧‧基座10‧‧‧ Pedestal

10a‧‧‧側部10a‧‧‧ side

10b‧‧‧底部10b‧‧‧ bottom

11‧‧‧雷射檢測器11‧‧‧Laser detector

110‧‧‧光線投影部110‧‧‧Light Projection Department

111‧‧‧出光部111‧‧‧Lighting Department

12‧‧‧影像擷取器12‧‧‧Image capture device

120‧‧‧影像分析單元120‧‧‧Image Analysis Unit

121‧‧‧影像擷取單元121‧‧‧Image capture unit

9‧‧‧加工機台9‧‧‧Processing machine

900‧‧‧支撐座900‧‧‧ support

911‧‧‧刀具911‧‧‧Tools

A‧‧‧檢測區A‧‧‧Detection area

Claims (10)

一種刀具檢測裝置,係包括:基座,係具有檢測區;雷射檢測器,係設置於該基座上並以相對該檢測區之水平方向檢測該檢測區中之刀具;以及影像擷取器,係設置於該基座上並以相對該檢測區之垂直方向擷取該檢測區中之刀具之影像。A tool detecting device includes: a base having a detecting area; a laser detector disposed on the base and detecting a tool in the detecting area in a horizontal direction relative to the detecting area; and an image picker And being disposed on the base and capturing an image of the tool in the detection area in a vertical direction relative to the detection area. 如申請專利範圍第1項所述之刀具檢測裝置,其中,該基座係具有容置空間以作為該檢測區。The tool detecting device according to claim 1, wherein the base has an accommodation space as the detection area. 如申請專利範圍第1項所述之刀具檢測裝置,其中,該雷射檢測器係包括一出光部與一光線投影部,以藉該出光部發出光線經該檢測區供該光線投影部接收。The tool detecting device of claim 1, wherein the laser detector comprises a light exiting portion and a light projecting portion, wherein the light emitting portion emits light through the detecting portion for the light projecting portion to receive. 如申請專利範圍第1項所述之刀具檢測裝置,其中,該影像擷取器係為電荷耦合元件(Charge-coupled Device,簡稱CCD)相機或顯微鏡。The tool detecting device according to claim 1, wherein the image capturing device is a Charge-coupled Device (CCD) camera or a microscope. 如申請專利範圍第1項所述之刀具檢測裝置,其中,該影像擷取器包括一用以擷取該刀具輪廓之影像擷取單元、及一用以分析比對該刀具輪廓之影像分析單元。The tool detecting device of claim 1, wherein the image capturing device comprises an image capturing unit for capturing the contour of the tool, and an image analyzing unit for analyzing the contour of the tool. . 如申請專利範圍第1項所述之刀具檢測裝置,復包括光學檢測器,係設於該基座上並以相對該檢測區之水平方向檢測該檢測區中之刀具。The tool detecting device according to claim 1, further comprising an optical detector disposed on the base and detecting the tool in the detecting area in a horizontal direction with respect to the detecting area. 如申請專利範圍第6項所述之刀具檢測裝置,其中,該光學檢測器係包括用以擷取該刀具輪廓之影像擷取單元、以及用以分析比對該刀具輪廓之影像分析單元。The tool detecting device of claim 6, wherein the optical detector comprises an image capturing unit for capturing the contour of the tool, and an image analyzing unit for analyzing the contour of the tool. 如申請專利範圍第1項所述之刀具檢測裝置,復包括傳感器,係設於該基座上以偵測該檢測區中之刀具於運作時之傳動頻率。The tool detecting device of claim 1, further comprising a sensor disposed on the base to detect a transmission frequency of the tool in the detection zone during operation. 如申請專利範圍第8項所述之刀具檢測裝置,其中,該傳感器係為聲紋檢測器或震動檢測器。The tool detecting device of claim 8, wherein the sensor is a voiceprint detector or a vibration detector. 如申請專利範圍第1項所述之刀具檢測裝置,復包括數據資料庫,係用以接收或提供該影像擷取器及/或該雷射檢測器之訊號數據。The tool detecting device of claim 1, further comprising a data database for receiving or providing signal data of the image picker and/or the laser detector.
TW104200096U 2015-01-06 2015-01-06 Knife tool detection device TWM500649U (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI648123B (en) * 2017-02-16 2019-01-21 台本機械有限公司 Detection system
TWI670138B (en) * 2018-11-22 2019-09-01 國立臺灣科技大學 Method for predicting tool wear in an automatic processing machine
TWI745121B (en) * 2020-10-15 2021-11-01 恩德科技股份有限公司 Detection system and detection method
CN113752087A (en) * 2021-08-30 2021-12-07 长春汽车工业高等专科学校 Method for monitoring abrasion of numerical control cutter

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI648123B (en) * 2017-02-16 2019-01-21 台本機械有限公司 Detection system
TWI670138B (en) * 2018-11-22 2019-09-01 國立臺灣科技大學 Method for predicting tool wear in an automatic processing machine
TWI745121B (en) * 2020-10-15 2021-11-01 恩德科技股份有限公司 Detection system and detection method
CN113752087A (en) * 2021-08-30 2021-12-07 长春汽车工业高等专科学校 Method for monitoring abrasion of numerical control cutter

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