TWM493158U - Flexible light-emitting module - Google Patents

Description

Flexible light module

The present invention provides a flexible light-emitting module, in particular, a flexible light-emitting module that provides multiple illumination angles of a light-emitting diode by utilizing a material flexible property.

Nowadays, people pay more and more attention to environmental protection and energy conservation. The use of LED lamps to replace traditional tungsten lamps has become a trend today. However, the light emitted by LED lamps is directional light and cannot provide a good light source.

The above problems have not been solved. In the industry, a mounting bracket having a plurality of faces is disposed in the LED lamp to mount the LEDs in the LED lamp on each surface of the mounting seat to provide illumination in multiple directions. angle. However, such a method of using the mounting seat is inconvenient to process, and it is required to be processed by mold opening, turning, milling, planing, drilling, grinding and stamping, so that the manufacturing process generates more waste and consumes more energy.

In addition, the heat generated by the LED lamp will also shorten the life of the product. In today's industry, aluminum extrusion blocks or ceramic blocks are often used to solve the heat dissipation problem. However, aluminum extruded blocks also have complicated processing problems, and the heat dissipation area of the aluminum extruded blocks is still insufficient to effectively dissipate the heat generated by the LED lamps. Out, the aluminum extruded block will also increase the weight of the luminaire.

In summary, the creator feels that the above-mentioned deficiencies can be improved. He has devoted himself to research and cooperates with the application of academics, and finally proposes a design that is reasonable in design and effective in improving the above-mentioned deficiencies.

In order to solve the problem that the foregoing LED lamp manufacturing method is complicated and the heat dissipation is not good, the present invention provides a flexible light-emitting module with good heat dissipation and reduced manufacturing process.

To achieve the above, the present invention provides a flexible lighting module, including A flexible insulating substrate, a heat dissipating conductive layer and a plurality of light emitting diodes. The heat dissipation conductive layer covers one side of the flexible insulating substrate, and the heat dissipation conductive layer is provided with a plurality of insulating grooves, and the plurality of insulating grooves separate the heat dissipation conductive layer into a plurality of metal pieces. Each of the light-emitting diodes spans one of the insulating grooves, and two ends of each of the light-emitting diodes are electrically connected to the metal sheets on both sides of the insulating groove. Wherein, the flexible insulating substrate portion is exposed to the insulating groove, and the width of the insulating groove is smaller than the width of the light emitting diode.

The beneficial effect of the present invention is that, by utilizing the flexible characteristics of the flexible insulating substrate and the heat-dissipating conductive layer, the flexible light-emitting module can bend the desired shape according to requirements, and provide different illumination angles of the light-emitting diode.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only for reference and description, and are not intended to limit the creation.

1‧‧‧Flexible lighting module

10‧‧‧Flexible insulating substrate

20‧‧‧ Thermal Conductive Layer

21‧‧‧Insulation slot

22‧‧‧metal pieces

30‧‧‧Lighting diode

40‧‧‧Side light department

50‧‧‧Top light department

60‧‧‧ Inner heat dissipation

70‧‧‧LED driver

8‧‧‧Power drive unit

9‧‧‧shade

FIG. 1 is a perspective view of the flexible light emitting module of the present invention.

FIG. 2 is a perspective view of another embodiment of the flexible light emitting module of the present invention.

FIG. 3 is a schematic diagram showing a flat state of a flexible light emitting module according to another embodiment of the present invention.

FIG. 4 is a schematic rear view of a flexible light emitting module according to another embodiment of the present invention.

FIG. 5 is a schematic diagram showing the steps of a method for manufacturing a flexible light emitting module according to the present invention.

FIG. 6 is a schematic diagram showing the steps of another embodiment of a method for manufacturing a flexible light emitting module.

As shown in FIG. 1 , the present invention provides a flexible light emitting module 1 . The flexible light-emitting module 1 includes a flexible insulating substrate 10, a heat-dissipating conductive layer 20, and a plurality of light-emitting diodes 30. The heat-dissipating conductive layer 20 covers one side of the flexible insulating substrate 10, and the light-emitting diode The body 30 is disposed on the heat dissipation conductive layer 20. The detailed structure is as follows.

The flexible insulating substrate 10 is made of a material that is flexible and can withstand high temperatures, and is required to withstand the temperature released by the light-emitting diode 30 and the temperature of the fixed light-emitting diode 30, and is flexible after being subjected to high temperature. The insulating substrate 10 still needs to maintain its flexible properties. Generally The temperature of the flexible insulating substrate 10 should be above 90 degrees Celsius, even above 235 degrees Celsius, and the temperature requirements should be changed according to the fixing manner of the LEDs 30. Therefore, the material of the flexible insulating substrate 10 may be a material resistant to high temperature and bendability such as plastic, rubber, sponge or high temperature resistant paper.

The heat dissipation conductive layer 20 has a plurality of insulating grooves 21 extending through both sides of the heat dissipation conductive layer 20, so when the heat dissipation conductive layer 20 covers the flexible insulation substrate 10, the flexible insulation substrate 10 is Exposed to the insulating groove 21. The plurality of insulating grooves 21 divide the heat-dissipating conductive layer 20 into a plurality of metal sheets 22, that is, the heat-dissipating conductive layer 20 is partitioned into a plurality of unconnected sheet-like structures by the arrangement of the insulating grooves 21. As shown in FIG. 1, in the present embodiment, the metal sheets 22 are arranged side by side at intervals, and the space between the metal sheets 22 is the insulating groove 21. The shape of the heat dissipation conductive layer 20 is not limited, and the metal sheets 22 may be arranged in a concentric manner. The heat-dissipating conductive layer 20 is made of a flexible and electrically conductive metal, in particular, a metal that has good heat dissipation, such as copper, aluminum, etc., which has good ductility and good thermal conductivity. In addition, the opposite wall surfaces of the insulating groove 21 may have a concavo-convex shape in addition to a linear shape, and the concave portions and the convex portions of the opposite side walls of the opposite insulating grooves 21 cooperate with each other.

In the present embodiment, the heat dissipation conductive layer 20 is made of copper foil. The width of the insulating groove 21 is smaller than the width of the light-emitting diode 30. Generally, the width of the insulating groove 21 is extremely small, and the width of the insulating groove 21 only needs to make the metal pieces 22 not touch each other, so the area of the metal piece 22 is The area of the flexible insulating substrate 10 is substantially the same.

In the embodiment shown in FIG. 1, the heat-dissipating conductive layer 20 is covered on one side of the flexible insulating substrate. As shown in FIG. 2, in another embodiment of the present invention, the heat dissipation conductive layer 20 covers both sides of the flexible insulating substrate, and the heat dissipation conductive layer 20 is formed by extending one side of the flexible insulating substrate to the other side. This structure can increase the heat dissipation area.

As shown in FIG. 1 and FIG. 2, one of the light-emitting diodes 30 spans one of the insulating grooves 21, so that the two ends of the light-emitting diode 30 are electrically connected to two adjacent metal pieces 22, and one insulating groove 21 There may be multiple light-emitting diodes 30 spanning, meaning two A plurality of light emitting diodes 30 may be disposed on the adjacent metal strips 22, and each of the insulating slots 21 spans at least one of the light emitting diodes 30, so that all the metal strips 22 can be turned on, so that the current can smoothly pass through the light emitting diodes. Polar body 30 and all metal sheets 22. The light-emitting diodes 30 disposed on the same adjacent metal piece 22 are connected in series, and the light-emitting diodes 30 disposed on different adjacent metal pieces 22 are arranged in series, and the manufacturer can also arrange the light according to the demand for the light. Diode 30. The light-emitting diode 30 can be selected according to the needs of the manufacturer, and is not limited thereto. The light emitted by the LEDs 30 may be visible light or invisible light.

The manner in which the light-emitting diode 30 is fixed to the heat-dissipating conductive layer 20 may be a surface-adhesive technology (SMT). First, a portion of the heat-dissipating conductive layer 20 is coated with a solder paste, and then the light-emitting diode 30 is placed at a corresponding position. Then, the tin furnace (turbulence furnace) fixes the pins of the light-emitting diode 30, and generally the temperature of the tin furnace is 235 degrees Celsius or more. Therefore, if the fixing method of the light-emitting diode 30 is SMT, the material of the flexible insulating substrate 10 needs to be made of a material resistant to 235 degrees Celsius or higher. The light-emitting diode 30 can be fixed on the heat-dissipating conductive layer 20 by wire bonding or flip-chip bonding. The light-emitting diode 30 can also be fixed to the heat-dissipating conductive layer 20 by laser. If the light-emitting diode 30 is fixed by laser, the flexible insulating substrate 10 can have a temperature resistance of 90 degrees Celsius or higher.

The arrangement is such that the heat generated by the LEDs 30 during operation can be conducted to the heat dissipation conductive layer 20, and the heat dissipation conductive layer 20 has a large heat dissipation area, so that it is better than the conventional aluminum extrusion type heat dissipation block. Cooling effect.

As shown in FIG. 1 , the heat-dissipating conductive layer 20 can also be provided with an LED driving device 70 for forming a desired driving circuit on the flexible insulating substrate 10 by using the etch-dissipating conductive layer 20 and driving the heat-dissipating layer 20 . The required components, such as transformers, resistors, capacitors, etc., allow the flexible insulating substrate 10 to be the circuit board of the LED driver 70 at the same time to reduce the space required for the other board.

Referring to FIG. 3 and FIG. 4, another embodiment of the present invention is shown. In this embodiment, the heat dissipation conductive layer 20 and the insulating substrate 10 are arranged in a radial shape, and each of the radial portions can be bent into a three-dimensional shape. Type. Figure 3 shows the heat dissipation conductive layer of this embodiment. 20 is not bent, showing a flat state, in the state shown, the heat-dissipating conductive layer 20 is covered on the flexible insulating substrate 10, and after the plurality of light-emitting diodes 30 are disposed on the heat-dissipating conductive layer 20, The heat dissipation conductive layer 20 and the flexible insulating substrate 10 have a flat shape. The flexible insulating substrate 10 and the heat-dissipating conductive layer 20 are bent by the flexibility of the flexible insulating substrate 10 and the heat-dissipating conductive layer 20, so that the irradiation angle of each of the light-emitting diodes 30 is different. In particular, the flat schematic view of the flexible light-emitting module 1 shown in FIG. 3 is not identical to the folded schematic view of the flexible light-emitting module 1 shown in FIG. In order to make the picture clear, the number of folds of the two is not the same.

As shown in FIG. 3, the flexible insulating substrate 10 and the heat-dissipating conductive layer 20 can form at least one side light-emitting portion 40, a plurality of top surface light-emitting portions 50, and a plurality of inner-layer heat-dissipating portions 60, and the side light-emitting portions 40 are connected to each other. On one side of the top surface light-emitting portion 50, the other side of the top surface light-emitting portion 50 is connected to the inner layer heat-dissipating portion 60, and both sides of the partial top surface light-emitting portion 50 are connected to the inner layer heat-dissipating portion 60. It should be noted that in the embodiment, the flexible insulating substrate 10 and the heat dissipation conductive layer 20 are arranged in a radial state, and therefore the side light emitting portion 40, the top surface light emitting portion 50, and the inner layer heat radiating portion 60 are concentrically shaped. Arranged at intervals, however. However, the flexible insulating substrate 10 and the heat-dissipating conductive layer 20 are not limited to the radial arrangement shape of the embodiment, and if they are other shapes (such as a rectangle), the same can be applied to the embodiment. A three-dimensional folded structure formed by the bendable side light-emitting portion 40, the top surface light-emitting portion 50, and the inner layer heat-dissipating portion 60. As shown in FIG. 4, after being folded, the inner layer heat dissipating portion 60 is disposed opposite to the surface. Preferably, the inner layer heat dissipating portion 60 is disposed opposite to the ground so that the heat dissipating area of the heat dissipating conductive layer 20 is larger.

As shown in FIG. 4 , the side light emitting portions 40 , the top surface light emitting portions 50 , and the inner heat radiating portions 60 are bendably connected to each other, and the side light emitting portions 40 and the top surface light emitting portions 50 . The inner heat dissipation portions 60 are bent to the outside of the side light emitting portions 40. The inner heat dissipation portions 60 are located on the inner side and face each other, and the top surface light emitting portions 50 are connected to the side light emitting portions. The light emitting diodes 30 are disposed on the side light emitting portion 40 and the top surface light emitting portions 50.

The side light emitting part 40 and the top surface light emitting part 50 are provided with the light emitting diodes 30, and all of the light emitting diodes 30 are not required to be disposed, and may be partially disposed, and the manufacturer can design the light emitting diodes 30 according to the required light characteristics. Distribution location.

The flexible light-emitting module 1 can be connected to the power supply device 8 and installed in the lamp cover 9. As shown in FIG. 4, the flexible light-emitting module 1 can be made into a spherical bulb or a fluorescent lamp. , advertising billboards and lights, etc., the appearance should not be limited. The flexible light-emitting module 1 provided by the present invention can be formed according to the shape of different lamps.

As shown in FIG. 5 and FIG. 6, the manufacturing method of the flexible light-emitting module 1 can be divided into two types. A manufacturing method will be described in detail below. Referring to FIG. 1 and FIG. 5, the steps are as follows:

S1: A flexible insulating substrate 10 is provided, and the material of the flexible insulating substrate 10 is as described above.

S2: covering the heat dissipation conductive layer 20 on the flexible insulating substrate 10. The heat-dissipating conductive layer 20 can be adhered to the flexible insulating substrate 10 after being coated with the adhesive, and the heat-dissipating conductive layer 20 can also be covered by the method of coating, plating, sputtering, painting, printing, transfer and pad printing. Insulating substrate 10 .

S3: forming a plurality of insulating grooves 21 on the heat dissipation conductive layer 20 to form a plurality of unconnected metal pieces 22, and the flexible insulating substrate 10 is exposed to the insulating groove 21. The manner of forming the insulating groove 21 may be a method such as milling, laser, and etching.

S4: a plurality of light-emitting diodes 30 are disposed on the heat-dissipating conductive layer 20, and each of the light-emitting diodes 30 is disposed across one of the insulating grooves 21, so that the two ends of the light-emitting diode 30 are electrically connected to the two phases. Adjacent metal sheet 22. The connection manner of the light-emitting diodes 30 can be as follows: wire bonding, SMT, laser, conductive adhesive, ultrasonic welding, heat conduction welding.

Referring to Figure 1 and Figure 6, the steps of another manufacturing method are as follows:

S1': A heat dissipation conductive layer 20 is provided. In this method, the material of the heat-dissipating conductive layer 20 should be a sheet-like structure of copper foil or aluminum foil.

S2': forming a plurality of insulating grooves 21 penetrating both sides of the heat-dissipating conductive layer 20, and at this time, the heat-dissipating conductive layer 20 has not been separated into a plurality of unconnected gold by the heat-dissipating conductive layer 20. Is a piece 22. The formation method is as described above.

S3': The heat dissipation conductive layer 20 is covered on the flexible insulating substrate 10, and the flexible insulating substrate 10 is exposed to the insulating groove 21.

S4': The heat dissipation conductive layer 20 is separated into a plurality of metal sheets 22 by the insulating grooves 21. The method of isolating the plurality of unconnected metal sheets 22 is to cut the edges of the flexible insulating substrate 10 and the heat-dissipating conductive layer 20, that is, the portions of the original metal sheets 22 are cut off.

S5': a plurality of light-emitting diodes 30 are disposed on the heat-dissipating conductive layer 20, and each of the light-emitting diodes 30 spans one of the insulating grooves 21, so that the two ends of the light-emitting diode 30 are electrically connected to the two ends respectively. Adjacent metal sheets 22. The manner in which the light-emitting diodes 30 are connected is as described above.

Referring to FIG. 1, FIG. 3, FIG. 4, FIG. 5 and FIG. 6, after the two different manufacturing method steps, the flexible light-emitting module 1 is still flat, and when the manufacturer designs the required light characteristics, , you can perform the following steps.

S5 (S6'): The flexible insulating substrate 10 and the heat-dissipating conductive layer 20 are bent so that each of the light-emitting diodes 30 has a different irradiation angle. Generally, the flexible insulating substrate 10 and the heat dissipation conductive layer 20 are bent to form a side light emitting portion 40, a plurality of top surface light emitting portions 50, and a plurality of inner heat radiating portions 60, so that the light emitting diodes 30 can be sideways. It can be exposed to the outside and can be placed on the top to face the other direction.

In addition, the heat-dissipating conductive layer 20 can be etched to form a required driving circuit on the flexible insulating substrate 10, and the components required for driving are disposed on the heat-dissipating layer 20, and an LED driving device 70 is disposed on the heat-dissipating conductive layer 20. The heat conductive layer 20 is cooled.

The machining method of the manufacturing method is simpler than the processing of the conventional aluminum extrusion type light-emitting diode 30 lamp, and does not undergo complicated processing, so that the energy consumed and the waste generated are less, so that it can provide more energy-saving and environmental protection. Production method.

In summary, the advantages of the flexible lighting module 1 provided by the present invention are as follows. By utilizing the flexible characteristics of the flexible insulating substrate 10 and the heat-dissipating conductive layer 20, the flexible light-emitting module 1 can bend the desired shape according to requirements, and provide the light-emitting two The radiation body 20 has a different irradiation angle; the area of the heat dissipation conductive layer 20 is substantially the same as the area of the flexible insulation substrate 10, and the large heat dissipation area of the flexible light-emitting module 1 is provided; and the heat dissipation conductive layer 20 is provided with an insulation groove. 21 is separated into a plurality of non-adjacent metal pieces 22 so that the light-emitting diodes 30 can be disposed on the heat-dissipating conductive layer 20 and can be turned on.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of the patents, and the equivalent technical changes that are made by using the present specification and the illustrated contents are included in the scope of the present invention.

1‧‧‧Flexible lighting module

10‧‧‧Flexible insulating substrate

20‧‧‧ Thermal Conductive Layer

21‧‧‧Insulation slot

22‧‧‧metal pieces

30‧‧‧Lighting diode

70‧‧‧LED driver

Claims (10)

A flexible light-emitting module includes: a flexible insulating substrate; a heat-dissipating conductive layer covering one side of the flexible insulating substrate, the heat-dissipating conductive layer is provided with a plurality of insulating grooves, and the insulating grooves Separating the heat-dissipating conductive layer into a plurality of metal sheets: and a plurality of light-emitting diodes, each of the light-emitting diodes spanning one of the insulating grooves, and the two ends of each of the light-emitting diodes are electrically connected to the insulating layer a metal sheet on both sides of the groove; wherein the flexible insulating substrate portion is exposed to the insulating groove, and the width of the insulating groove is smaller than a width of the light emitting diode. The flexible light-emitting module of claim 1, wherein the flexible insulating substrate is made of a material having a melting point exceeding 235 degrees Celsius. The flexible light-emitting module of claim 1, wherein the flexible insulating substrate is made of a material having a melting point of more than 90 degrees Celsius. The flexible light-emitting module of claim 1, wherein the opposite wall surfaces of the insulating groove have a concavo-convex shape, and the concave portion and the convex portion cooperate with each other. The flexible light-emitting module of claim 1, wherein the flexible insulating substrate and the heat-dissipating conductive layer have a plurality of side light-emitting portions, a plurality of top surface light-emitting portions, and a plurality of inner heat-dissipating portions. The side light emitting portions, the top surface light emitting portions, and the inner layer heat radiating portions are bendably connected to each other, and the side light emitting portions, the top surface light emitting portions, and the inner layer heat radiating portions are bendable into the The side light-emitting portions are located on the outer side, the inner-layer heat-dissipating portions are located on the inner side and are disposed to face each other, and the top-surface light-emitting portions are connected to the top ends of the side light-emitting portions and the inner layer heat-dissipating portion, and the light-emitting diodes are disposed on the side a side light emitting portion and the top surface light emitting portions. The flexible light emitting module of claim 5, wherein the inner heat dissipation portions are disposed apart from each other. The flexible light-emitting module of claim 1, wherein the other surface of the flexible insulating substrate is covered with another heat-dissipating conductive layer. The flexible light-emitting module of claim 7, wherein the heat-dissipating conductive layer is extended from one side of the flexible insulating substrate to the other side of the flexible insulating substrate. The flexible light emitting module of claim 1, wherein the heat dissipation conductive layer is made of copper foil. The flexible light emitting module of claim 1, wherein the heat dissipation conductive layer is provided with an LED driving circuit.