TWM485346U - Optoelectronic semiconductor lamp strip structure - Google Patents

Description

Photoelectric semiconductor light bar structure

The present invention relates to a light bar structure of an optoelectronic semiconductor, in particular to a light bar structure in which a long strip light bar has a double-sided light emitting function and effectively improves light extraction efficiency.

An LED module having a double-sided illumination function, such as Patent No. TW: M266547, discloses a package structure of an optoelectronic semiconductor, comprising: a substrate having a front side and a back side; and an optoelectronic semiconductor disposed on the front side or the back side of the substrate Above, a semiconductor structure with illuminating or light sensing capability; an outer frame device composed of an opaque material, disposed on the substrate and surrounding the optoelectronic semiconductor; and a polymer filling body capable of being transparent or transparent The light source is filled in the outer frame device. Wherein, in the embodiment of the present invention, when the substrate is a multi-layer material superposed structure, one end of the substrate is encapsulated by a polymer filling body, and the semiconductor of the other end of the substrate is encapsulated by a polymer material, since the case will The polymer filling body and the polymer material are respectively distinguished by different drawing numbers, so it can be reasonably inferred that the structure of the case adopts a secondary package to achieve a double-sided light-emitting module, and there are multiple packaging processes to increase the cost of the derivative package. And the actual situation of low package yield.

Furthermore, the package structure of the optoelectronic semiconductor is provided with an outer frame device at one end of the substrate to frame the optoelectronic semiconductor, thereby determining that the LED module is a granular small unit, which is connected in series by a plurality of LED modules. After the combination in parallel or in parallel, the overall color rendering property is low due to the limitation of the outer frame device.

遂 遂 , 研发 研发 研发 研发 研发 研发 研发 研发 研发 研发 研发 研发 研发 研发 研发 研发 CN CN CN CN 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The light emitting unit and the sealant layer covering the periphery of the light emitting unit; the substrate is arranged in an elongated strip structure; the light emitting unit comprises a plurality of blue light core sheets and red light arranged regularly on the substrate and connected in series chip. Wherein, the light emitting unit is disposed on both sides of the substrate. And in the specification thereof, when the two-phase side of the substrate is disposed away from the side of the light-emitting unit, the double-sided solid crystal wire bonding device process is adopted, and the specific implementation is as follows: “expanding→first surface solid crystal→first surface Baking→Second surface solid crystal→Second side baking→double-sided bonding wire.”

In the case of the above-mentioned second patent, when it is intended to achieve an LED lamp having a double-sided light-emitting function, its structure exists. When the substrate is in the last "double-sided bonding wire" operation of the double-sided solid-crystal bonding wire device process, it is easy to After the welding of the first metal wire is completed, during the process of inverting the welding of the second metal wire, the metal wire is crushed or broken after the first surface is completed due to human inadvertent operation, thereby causing an increase in the defect rate. .

In addition, when the height of the substrate is a relatively small size, such as a thin plate in the range of 0.1 to 0.3 mm, when the light-emitting unit composed of a plurality of light-emitting chips is disposed on both sides of the substrate, the substrate strength is easily Insufficient and slightly touched the shortcomings of distortion.

The main purpose of the present invention is to provide a light bar structure of an optoelectronic semiconductor having a double-sided light-emitting function, and the technical problem to be solved is that each of the two-layer substrates is provided with a light-emitting unit, and then merged and integrated into one body, thereby effectively reducing the conventionality. When the structure is bonded to the front and back sides of a single substrate, a problem of high defect rate is caused, and the function of reducing the production cost is achieved.

Another object of the present invention is to provide a light bar structure of an optoelectronic semiconductor, and a further technical problem to be solved is to achieve the function of structural strengthening by superimposing two layers of substrates.

In order to achieve the above object, the present invention provides a light strip structure of an optoelectronic semiconductor, comprising: a first substrate having a front side and a back side, a front side of the first substrate and a second substrate having a front side and a back side, and a front side having a light emitting unit. The first substrate and the second substrate are overlapped with respect to the opposite side, an adhesive layer is coated on the first substrate and the light emitting unit thereof, a second substrate and the light emitting unit thereof, and the first substrate and the second substrate are a symmetric electrode lead extending from the sealant layer is disposed on the opposite outer side of the substrate; the first substrate and the second substrate are elongated; the light emitting unit comprises a row or more in a series array or a parallel array. The plurality of light-emitting chips are arranged in any one or more of a blue light chip, a red light chip, a green light chip, and a yellow light chip.

In a preferred embodiment of the present invention, a symmetric concave portion is disposed on an outer side of the first substrate along the longitudinal direction; a symmetric convex portion is disposed on an outer side of the second substrate along a longitudinal direction, the symmetric convex portion The symmetrical recesses can be engaged with each other to superimpose the first substrate and the second substrate to obtain a better unbonding effect.

The sealing layer of the preferred embodiment of the present invention is a resin-based transparent rubber material or a non-resin-based transparent rubber material.

In a preferred embodiment of the present invention, any one of a diffusion powder or a brightening agent or a phosphor powder is added to the sealant layer.

The preferred embodiment of the present invention further includes an adhesive layer on the opposite side of the opposite side of the first substrate and the second substrate; the adhesive layer is an insulating rubber material, a non-insulating rubber material, and a metal layer. Any one of the materials, the insulating rubber material is an epoxy resin (EPOXY) or a rubber material having the same function; the non-insulating rubber material is a silver rubber material or a rubber material having the same function; the metal The material is a solder paste or a material having the same function.

10‧‧‧First substrate

11‧‧‧ positive

12‧‧‧n

13‧‧‧Electrode pins

14‧‧‧ recess

20‧‧‧second substrate

21‧‧‧ positive

22‧‧‧n

23‧‧‧Electrode pins

24‧‧‧ convex

30‧‧‧Lighting unit

31‧‧‧Lighting chip

40‧‧‧ Sealing layer

50‧‧‧Next layer

The first figure is a combined perspective view of the first embodiment of the present creation.

The second drawing is an exploded perspective view of the unsealed layer of the first embodiment of the present invention.

The third drawing is a combined sectional view of the first embodiment of the present creation.

The fourth figure is a schematic diagram of the illumination of the first embodiment of the present creation.

The fifth drawing is a combined perspective view of the second embodiment of the present creation.

The sixth drawing is an exploded perspective view of the unsealed layer of the second embodiment of the present invention.

The seventh drawing is a combined sectional view of the second embodiment of the present creation.

The eighth figure is a combined perspective view of the third embodiment of the present creation.

The ninth drawing is an exploded perspective view of the unsealed layer of the third embodiment of the present invention.

The tenth drawing is a combined sectional view of the third embodiment of the present creation.

In order to give your reviewers a better understanding of the features and technical content of this creation, please refer to the following detailed description and drawings of the creation. However, the drawings are only for reference and illustration, and are not intended to limit the creation. .

Please refer to the first embodiment of the present invention. The first embodiment of the present invention includes a first substrate 10, a second substrate 20, a light emitting unit 30, and a sealant layer 40.

The first substrate 10 and the second substrate 20 are symmetrically elongated. The first substrate 10 has a front surface 11 and a reverse surface 12, and the front surface of the first substrate 10 is provided with a light emitting unit 30, and the second substrate 20 The front surface 21 of the second substrate 20 is provided with a light emitting unit 30, and the reverse surface 12 of the first substrate 10 and the reverse surface 22 of the second substrate 20 are in a corresponding overlapping state; the light emitting unit 30 The plurality of light-emitting chips 31 are arranged in a row array or a parallel array, and the plurality of light-emitting chips 31 are arranged in any one or more of a blue chip, a red light chip, a green light chip, and a yellow light chip; The glue layer 40 coats the first substrate 10 and the light emitting unit 30 disposed on the front surface 11 thereof, and the second substrate 20 and the light emitting unit 30 disposed on the front plate 21 thereof, and the The first substrate 10 and the second substrate 20 are provided with symmetric electrode pins 13 and 23 extending from the sealant layer 40 respectively on opposite outer sides of the longitudinal direction, so that the first substrate 10 and the second substrate 20 are respectively provided with light. Unit 30, and then merge and join the integrated structure to achieve It reduces the defect rate generated during the processing of the bonded wire and has the function of double-sided illumination.

Referring to FIG. 5 to FIG. 7 , a second embodiment of the light bar structure of the photo-electric semiconductor is obtained. In order to increase the adhesion between the first substrate 10 and the second substrate 20 , better compactness and tightness are obtained. Symmetrical concave portions 14 are disposed on opposite outer sides of the first substrate 10 along the longitudinal direction; symmetric protrusions 24 are disposed on opposite outer sides of the second substrate 20 along the longitudinal direction, and the symmetric convex portions 24 are The symmetrical recesses 14 are closely engaged with each other to provide a better unbonding effect after the first substrate 10 and the second substrate 20 are stacked.

Referring to the eighth to tenth drawings, a third embodiment of the light-emitting diode structure of the present invention, the first substrate 10 and a second substrate 20 are provided on the opposite side of the opposite layer is provided with an adhesive layer 50; The adhesive layer 50 is any one of an insulating rubber material, a non-insulating rubber material and a metal material, and the insulating rubber material is an epoxy resin (EPOXY) or a rubber material having the same function; the non-insulating material The glue material is a silver glue material or a glue material having the same function; the metal material is a solder paste or a material having the same function.

The structure of the optoelectronic semiconductor of the preferred embodiment of the present invention, wherein the encapsulating layer 30 is a resin-based transparent rubber material or a non-resin-based transparent rubber material; the sealing layer 30 is in the cross section of the preferred embodiment. The shape of the appearance is a circle.

The structure of the optoelectronic semiconductor of the preferred embodiment of the present invention, wherein the encapsulant layer 30 is added with any one of a diffusion powder or a brightening agent or a phosphor powder.

In summary, it is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the equivalent variation and modification of the patent application scope of the present invention is the scope of the creation patent. Covered.

10‧‧‧First substrate

11‧‧‧ positive

12‧‧‧n

13‧‧‧Electrode pins

20‧‧‧second substrate

21‧‧‧ positive

22‧‧‧n

23‧‧‧Electrode pins

30‧‧‧Lighting unit

31‧‧‧Lighting chip

40‧‧‧ Sealing layer

Claims (5)

The invention relates to a light bar structure of an optoelectronic semiconductor, comprising: a first substrate having a front side and a back side, a front side of the first substrate and a second substrate having a front side and a back side, the front side of which is provided with a light emitting unit, the first substrate and the second substrate a first adhesive layer is coated on the first substrate and the light emitting unit thereof, and a second substrate and a light emitting unit thereof; the first substrate and the second substrate are elongated, and the first substrate and the second substrate are elongated The first substrate and the second substrate are provided with symmetric electrode pins extending from the sealant layer on opposite sides of the longitudinal direction; the light-emitting unit includes a plurality of light-emitting chips in a row or more in a series array or a parallel array, and the plurality of light-emitting chips It is arranged in any one or more of a blue chip, a red light chip, a green light chip, and a yellow light chip. The illuminating structure of the optoelectronic semiconductor according to claim 1, wherein the first substrate is provided with a symmetrical concave portion on the opposite outer side in the longitudinal direction; the second substrate is provided with a symmetrical convex portion on the opposite outer side in the longitudinal direction. The symmetrical protrusions can be engaged with the symmetrical recesses. The light bar structure of the optoelectronic semiconductor according to claim 1, wherein the sealant layer is a resin-based transparent adhesive material or a non-resin-based transparent adhesive material. The light bar structure of the optoelectronic semiconductor according to claim 1, wherein the sealant layer is added with any one of a diffusion powder or a brightener or a phosphor powder. The light bar structure of the optoelectronic semiconductor of claim 1, wherein an opposite layer of the first substrate and the second substrate is provided with an adhesive layer; the adhesive layer is an insulating rubber material, a non-insulating rubber material, Any of the metal materials.