TWM460401U - Sensor package module - Google Patents

Description

Sensor package module

The present invention relates to a sensor package module, and more particularly to a sensor package module formed by using a lead frame and a printing technique.

With the increasing demand for integrated circuit (IC) products, the electronic packaging industry has been booming. With the continuous development of electronic manufacturing technology, the current electronic products are demanding "light, thin, short, small, high-function", and the IC chip packaging technology is constantly being updated to meet the needs of electronic products.

All electronic products use "electricity" as the energy source. However, the transmission of power must be made through the connection of the line, so the IC package can achieve this function; after the line is connected, the signal transmission between the electronic components can naturally pass through these The line is transported. Another function of the electronic package is to remove the heat generated by the transfer of electrons between the lines by the heat conduction function of the package material to prevent the IC chip from being damaged by overheating. Finally, the IC package provides sufficient mechanical strength and proper protection for fragile wafers, and also avoids the possibility of contamination of delicate integrated circuits.

In the fabrication of an integrated circuit, a chip is completed by a process of fabricating a wafer, forming an integrated circuit, and wafer sawing. The wafer has an active surface that generally refers to the surface of the wafer that has an active element. After the integrated circuit inside the wafer is completed, the active surface of the wafer is further provided with a plurality of bonding pads, so that the wafers finally formed by the wafer cutting can be electrically connected to the outside through the pads. A carrier. The carrier is for example a leadframe. The wafers are connected to the carrier by wire bonding so that the pads of the wafer can be electrically connected to the contacts of the carrier to form a chip package structure.

For example, in the case of a light sensor, a light sensor has two components, a light-emitting diode die and an inductive chip, and the two components are wire bonding. The method is connected to the carrier; however, such a package structure is not only complicated in process, but also requires a lot of time and cost.

In order to solve the above mentioned problems, one of the main purposes of the present invention is to provide a sensor package module, in particular, a sensor package module formed by using a lead frame and a screen printing technology, so that the sensor of the present invention is made. Packaged modules can be manufactured in large quantities, reducing process costs and saving time.

According to the above object, the present invention provides a sensor package module, comprising: a lead frame comprising a first lead region and a second lead region, wherein the first lead region and the second lead region are respectively arranged in a plurality of longitudinal parallel directions And each of the metal pins has an inner pin and an outer pin, wherein: the first wire region is symmetric with each other, and the metal pin includes one of the first inner pins. And a second inner pin, wherein the first inner lead and the second inner lead respectively have a lower surface, and the first inner lead and the second inner lead are longitudinally bent to form a symmetrical folded portion, respectively a lower surface of the folded portion of the first inner lead and the plurality of second inner leads forms a first placement space, and the folded portions of the first inner lead are longitudinally bent to form a first outer portion a pin, and the first outer pin is bent in a direction opposite to the first inner pin, and the folded portion of the second inner pin is longitudinally bent to form a second outer pin, and the second outer pin is The bending direction is opposite to the second inner pin, and the first outer pin and the second inner pin form a mutual symmetrical configuration; the mutually symmetrical metal pins of the second lead region comprise a symmetrical one of the third inner lead and a fourth inner lead, and the third inner lead and the fourth inner lead respectively have a lower surface, The third inner lead and the fourth inner lead are longitudinally bent to form a symmetrical folded portion, and a plurality of third inner leads and a plurality of fourth inner leads are symmetrically formed on a lower surface of the folded portions a second placement space, the folded portion of the third inner lead is longitudinally bent to form a third outer lead, and the third outer lead is bent in a direction opposite to the third inner lead, and the fourth inner lead The folded portion of the foot is longitudinally bent to form a fourth outer lead, and the fourth outer lead is bent in a direction opposite to the fourth inner lead, and the third outer lead and the fourth inner lead are symmetric with each other. The second outer pin and the third outer pin are connected to each other to form a connecting pin; a light emitting element is disposed in the first placement space; and a light sensing element is disposed in the second placement space; a screen stamp covering the first outer lead, the fourth outer lead, and the upper surface of the connecting pin; , Web-based stamp height greater than a height equal to a first space and a second placement of the placement space.

The sensor package module proposed by the present invention can be manufactured in a large amount, and the complicated process is omitted, thereby reducing the cost and shortening the process time.

In order to clarify the purpose, technical features and advantages of the present invention, the author can understand and implement the present invention, and the technical features and implementation manners of the present invention are explained in the following description in conjunction with the drawings. The description of the preferred embodiments is further illustrated, but the following description of the embodiments is not intended to limit the present invention, and the drawings in the following description are intended to be illustrative of the features of the present invention.

Please refer to FIG. 1A to FIG. 1D , which are cross-sectional views showing the packaging process of the sensor package module of the present invention. First, the present invention first provides a metal sheet, after a stamping process, forming a plurality of lead frames 1 in the metal sheet, each lead frame 1 comprising a first lead region 1' and a second lead region 1"; The material of the lead frame 1 may be a metal material such as iron nickel, alloy sheet, aluminum or copper. Next, referring to FIG. 1A, the first lead region 1' is formed by a plurality of metal pins arranged in a longitudinal direction and arranged symmetrically in a lateral direction, each metal pin having an inner lead 14 and an outer lead 16; The mutually symmetrical metal pins of the first wire region 1' include a first inner pin 141 and a second inner pin 143 which are symmetric, and have a lower surface 12a; a first inner pin 141 and a second inner pin 143, respectively. The symmetrical folded portions 1411 and 1431 are respectively formed by longitudinal bending, and the lower surface 12a of the symmetrical folded portions 1411 and 1431 of the plurality of first inner leads 141 and the plurality of second inner leads 143 form a first placement The space 15, that is, the first inner pin 141 group and the second inner pin 143 group lower surface 12a in the first placement space 15 have a first placement area 151; the first inner lead 141 is folded up 1411 is longitudinally bent to form a first outer lead 161, and the first outer lead 161 is bent in a direction opposite to the first inner lead 141; the folded portion 1431 of the second inner lead 143 is longitudinally bent. Forming a second outer lead 163, respectively, and the second outer lead 163 has a bending direction opposite to the second inner lead 143; A second outer pin 161 and the pin 163 is formed of mutually symmetrically arranged.

Similarly, the second lead region 1'' is formed by a plurality of metal pins arranged in a longitudinally parallel direction and symmetrically arranged laterally. Each metal pin has an inner lead 14 and an outer lead 16 and has respectively The lower surface 12b; the mutually symmetrical metal pins of the second wire region 1" include a symmetric third inner pin 145 and a fourth inner pin 147; the third inner pin 145 and the fourth inner pin 147 are longitudinally The bent portions respectively form symmetrical folded portions 1451, 1471, and the plurality of third inner leads 145 and the plurality of fourth inner leads 147 are symmetrically folded up portions 1451, 1471, and the lower surface 12b forms a second placement space 17 That is, the third inner pin 145 group and the fourth inner pin 147 group lower surface 12b in the second placement space 17 have a second placement area 171; the folded portion 1451 of the third inner lead 145 passes through The longitudinal bending forms a third outer lead 165, and the third outer lead 165 has a bending direction opposite to the third inner lead 145; the folded portion 1471 of the fourth inner lead 147 is formed by longitudinally bending. a fourth outer pin 167, and the fourth outer pin 167 has a bending direction opposite to the fourth inner pin 147; the third outer lead The foot 165 and the fourth inner pin 167 form a mutually symmetrical configuration.

The second outer lead 163 and the third outer lead 165 are connected to each other to form a connecting pin 169, and the second outer lead 163 and the third outer lead 165 are connected to each other. The second inner lead 143 connected to the outer lead 163 has a folded portion 1431, and the third inner lead 145 connected to the third outer lead 165 also has a folded portion 1451, so the two folded portions 1431 and 1451 A recess 18 is naturally formed with the connecting pin 169.

Next, referring to FIG. 1B, a light-emitting element 20 is disposed on the first placement area 151 of the first lead region 1'. The light-emitting element 20 is connected to the first inner lead 141 by a plurality of bumps 201 (bump). The second inner lead 143 is disposed on the lower surface 12a; and the second sensing area 171 is disposed with a light sensing element 22, and the light sensing element 22 is also connected to the third inner lead 145 by a plurality of bumps 221 (bump). And the lower surface 12b of the fourth inner lead 147; the light-emitting element 20 and the photo-sensing element 22 of the present invention are connected to the first placement area 151 and the second placement area 171 by Flip-Chip. Below, the light-emitting element 20 and the light-sensing element 22 are housed in the first placement space 15 and the second placement space 17; wherein the light-emitting element 20 is, for example, an LED light source, and the light-sensing element 22 receives light from the outside. , that is, the light receiving wafer; therefore, there is a space between the first inner lead 141 and the second inner lead 143 connected to the light emitting element 20 to form an illumination hole 203, so that light energy can be emitted through the illumination hole 203; The third inner pin 145 and the fourth inner pin 147 connected to the photo sensing element 22 have a space between To a receiving hole 223 is formed, the light entering through the receiving hole 223.

Then, referring to FIG. 1C, the first outer lead 161, the fourth outer lead 167, and the upper surface 10a, 10b, 10c of the connecting pin 169 (see FIG. 1B) are covered with a screen stamp 30, the net The stamp 30 is formed by covering an engineering plastic (such as polyacetylene) on a mold by a printing process; thus, it can be known that the mold is designed according to the structure of the lead frame, so that the screen printing can be covered. The mold 30 surrounds the first placement space 15 and the second placement space 17; wherein, in order to prevent the light-emitting element 20 and the light-sensing element 22 from interfering with each other, the screen-printing mold 30 covered by the periphery thereof has opaque characteristics. The function of the recess 18 at the connection pin 169 also prevents the light-emitting element 20 and the light-sensing element 22 from interfering with each other.

Finally, referring to FIG. 1D, in a region of the first placement space 15 not covered by the screen stamp 30, a first sealant layer 40 is covered, and the first sealant layer 40 covers the light-emitting elements 20 in the first placement space 15. The first inner lead 141 and the second inner lead 143 fill the uncovered area of the screen stamp 30 to isolate the light emitting element 20 from the outside; in the area of the second placement space 17 not covered by the screen stamp 30 Covering a second sealant layer 42 , the second sealant layer 42 covers the photo sensing element 22 , the third inner lead 145 and the fourth inner lead 147 in the second placement space 17 , and the screen stamp 30 is The uncovered area is filled to isolate the light sensing element 22 from the outside. The first adhesive layer 40 and the second sealant layer 42 are made of a transparent epoxy resin, and are coated with an opaque paint on the periphery and the top; and the first sealant layer 40 at the corresponding position of the illumination hole 203 is left. The opaque coating is applied to the illuminating region 401, and the second encapsulating layer 42 corresponding to the receiving hole 223 is provided with a receiving penetration region 421 not coated with an opaque coating, the main purpose of which is to allow the illuminating element 20 to emit light and The light sensing element 22 is allowed to receive light; it is emphasized here that the heights of the light emitting element 20 and the light sensing element 22 are less than or equal to the heights of the first placement space 15 and the second placement space 17, and the height of the screen printing die 30 Is greater than or equal to the height of the first placement space 15 and the second placement space 17; thereby limiting the height of the light-emitting element 20, the light sensing element 22, the first placement space 15, the second placement space 17, and the screen impression 30 In order to make the overall sensor package module lighter and thinner, the package structure with flip chip technology can reduce the cost and shorten the process time because no wire bonding process is required. And the formation of screen printing technology The sensor package module enables the sensor package module of the present invention to be mass-produced, and the cost of the process can be reduced and the time can be saved. In addition, in the above process, the lead frame 1 is first A placement area 151 and a second placement area 171 face upward, and after covering the crystal, cover a substrate (not shown), and the screen stamp 30 is formed on the lead frame 1 and then the lead frame 1 is reversed. After the completion, the substrate (not shown) is removed to complete the chip package structure; in another preferred embodiment of the present invention, the screen stamp 30 may be formed outside the lead frame 1 and then the net The stamp 30 is combined with the lead frame 1 to complete the chip package structure.

Please refer to FIG. 2 , which is a flow chart of the method for packaging the sensor package module of the present invention. As shown in FIG. 2, the steps of the packaging method of the sensor package module are as follows:

Step 901, a lead frame 1 is provided, which has a first placement area 151 and a second placement area 171 open upward;

Step 902, a light-emitting element 20 and a light-sensing element 22 are provided, and the light-emitting element 20 and the light-sensing element 22 are respectively placed in the first placement area 151 and the second placement area 171 in a flip chip manner, and The substrate covers the first placement area 151 and the second placement area 171 which are open upward;

Step 903, the light-emitting element 20, the light-sensing element 22 and the lead frame 1 are reversed so that the substrate is located below;

Step 904, providing a screen printing film 30, disposed on the light-emitting element 20 of the first placement area 151 and the lead frame 1 next to the light sensing element 22 of the second placement area 171;

Step 905, a first sealing layer 40 and a second sealing layer 42 are respectively filled into the first placement area 151 and the second placement area 171 and cover the light emitting element 20 and the light sensing element 22 to make the light emitting element 20 and the light sensing element 22 is isolated from the outside;

At step 906, the substrate is removed.

Through the above steps, the sensor package module can be maintained at a good thickness, and the complicated process is omitted, thereby reducing the cost and shortening the process time; and the sensor formed by the lead frame and the screen printing technology The package module enables the sensor package module of the present invention to be mass-produced, which also reduces the cost of the process and saves time.

Although the present invention has been described above with reference to the preferred embodiments thereof, it is not intended to limit the present invention, and those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. The scope of patent protection of this creation is subject to the definition of the scope of the patent application attached to this specification.

1‧‧‧ lead frame

1’‧‧‧First lead area

1’’‧‧‧Second wire area

10a‧‧‧ upper surface

10b‧‧‧ upper surface

10c‧‧‧ upper surface

12a‧‧‧ lower surface

12b‧‧‧ lower surface

14‧‧‧Inside pin

141‧‧‧First inner pin

1411‧‧‧Folding Department

143‧‧‧Second inner pin

1431‧‧‧Folding

145‧‧‧The third inner pin

1451‧‧‧Folding

147‧‧‧4th inner pin

1471‧‧‧Folding

15‧‧‧First space

151‧‧‧First placement area

16‧‧‧External pin

161‧‧‧First outer lead

163‧‧‧Second outer pin

165‧‧‧Third outer pin

167‧‧‧fourth outer pin

169‧‧‧Connecting pins

17‧‧‧Second space

171‧‧‧Second placement area

18‧‧‧ Groove

20‧‧‧Lighting elements

201‧‧‧Bumps

203‧‧‧ illuminated holes

22‧‧‧Light sensing components

221‧‧‧Bumps

223‧‧‧ receiving hole

30‧‧‧Web impression

40‧‧‧First adhesive layer

401‧‧‧radiation penetration zone

42‧‧‧Second sealant

421‧‧‧ Receiving penetration zone

901, 902, 903, 904, 905, 906 ‧ ‧ steps

1A to 1D are cross-sectional views showing the packaging process of the sensor package module of the present invention;

FIG. 2 is a flow chart of the method for packaging the sensor package module of the present invention.

161‧‧‧First outer lead

167‧‧‧fourth outer pin

169‧‧‧Connecting pins

20‧‧‧Lighting elements

203‧‧‧ illuminated holes

22‧‧‧Light sensing components

223‧‧‧ receiving hole

30‧‧‧Web impression

40‧‧‧First adhesive layer

401‧‧‧radiation penetration zone

42‧‧‧Second sealant

421‧‧‧ Receiving penetration zone

Claims (7)

A sensor package module includes:
a lead frame comprising a first lead region and a second lead region, wherein the first lead region and the second lead region are respectively formed by a plurality of metal pins arranged in a longitudinal direction and symmetrically arranged in a lateral direction, each of the The metal pin has an inner pin and an outer pin, wherein:
The mutually symmetrical metal pins of the first wire region respectively comprise a first inner pin and a second inner pin, wherein the first inner pin and the second inner pin respectively have a lower surface The first inner lead and the second inner lead are longitudinally bent to form a symmetrical folded portion, and the plurality of the first inner lead and the plurality of the second inner lead lower surface and the symmetry The folded portions together form a first placement space, the folded portion of the first inner lead is longitudinally bent to form a first outer lead, and the first outer lead is bent in a direction opposite to the first An inner lead, the folded portion of the second inner lead is longitudinally bent to form a second outer lead, and the second outer lead is bent in a direction opposite to the second inner lead, the first An outer pin and the second outer pin form a mutually symmetrical configuration;
The mutually symmetrical metal pins of the second lead region respectively comprise a symmetrical one third inner lead and a fourth inner lead, wherein the third inner lead and the fourth inner lead respectively have a lower surface The third inner lead and the fourth inner lead are longitudinally bent to form a symmetrical folded portion, and the plurality of the third inner lead and the plurality of lower inner surfaces of the fourth inner lead are symmetric with each other The folded portions together form a second placement space, the folded portion of the third inner lead is longitudinally bent to form a third outer lead, and the third outer lead is bent in a direction opposite to the first a third inner lead, the folded portion of the fourth inner lead is longitudinally bent to form a fourth outer lead, and the fourth outer lead has a bending direction opposite to the fourth inner lead, the first The three outer pins and the fourth outer lead form a mutually symmetrical configuration;
The second outer pin and the third outer pin are connected to each other to form a connecting pin;
a light emitting element disposed in the first placement space;
a light sensing component is disposed in the second placement space;
a screen stamp covering the first outer lead, the fourth outer lead, and an upper surface of the connecting pin;
The height of the screen impression is greater than or equal to the height of the first placement space and the second placement space. The sensor package module of claim 1, wherein the light-emitting element and the light-sensing element are further configured with a plurality of bumps for connecting the light-emitting element to the first inner lead The lower surface and the lower surface of the second inner lead and the lower surface of the lower inner lead and the fourth inner lead are connected to the light sensing element. The sensor package module of claim 1, wherein the first inner lead and the second inner lead have an interval therebetween to form an illumination hole, the third inner lead and the There is a space between the fourth inner leads to form a receiving hole. The sensor package module of claim 3, wherein the sensor package module further comprises:
a first sealing layer for covering the light emitting element, the first inner lead and the second inner lead; and a second sealing layer for covering the light sensing element, the third inner lead The foot and the fourth inner pin. The sensor package module of claim 4, wherein the height of the first sealant layer and the second sealant layer is less than or equal to the height of the screen stamp. The sensor package module of claim 4, wherein the first sealant layer and the second sealant layer are transparent epoxy resins. According to the sensor package module of claim 6, wherein the surface of the first sealant layer does not correspond to the illumination hole and the surface of the second sealant layer does not correspond to the receiving hole. Whereas, each has an opaque coating such that the surface of the first encapsulant layer forms an illumination penetration region and the surface of the second encapsulation layer forms a receiving exit region.