TWI606562B - Electronic package structure - Google Patents

Description

Electronic package structure

The invention relates to an electronic package structure, in particular to an electronic package structure and a conductive structure which can be thinned.

With the development of the electronics industry, today's electronic products have been designed in a light, short, and versatile manner, and semiconductor packaging technologies have also developed different packaging types.

Most of the electronic components currently used in sensor components or camera lenses are still in the wire bonding package type or the Chip On Board (COB) type.

As shown in FIG. 1A, the conventional wire-type package structure 1 includes a substrate 10, an electronic component 13, and an encapsulant 18.

The substrate 10 is provided with a first circuit layer 11 and a second circuit layer 12 on the upper and lower sides, and is electrically connected to the first and second through a via hole or a blind via type conductor 14 formed therein. The circuit layers 11, 12 are formed with a first insulating protective layer 16 and a second insulating protective layer 17 on the upper and lower sides to expose portions of the first and second circuit layers 11, 12 to the first and second insulating layers. The layers 16, 17 are protected and a plurality of conductive elements 15 are formed on the second wiring layer 12.

The electronic component 13 is a sensor component formed on the upper side of the substrate 10 and electrically connected to the first circuit layer 11 by a plurality of gold wires 130, and the upper surface of the electronic component 13 has a sensing area. 131 for use as fingerprint identification.

The encapsulant 18 is formed on the upper side of the substrate 10 and covers the electronic component 13 and the gold wires 130.

In the conventional wire-type package structure 1, the thickness d of the effective sensing of the encapsulant 18 covering the sensing region 131 needs to be extremely thin (otherwise, it cannot be sensed), and thus requires extremely high precision.

However, the gold wire 130 has a certain height of the arc, and the molding process needs to have a height sufficient to uniformly cover the electronic component 13 by the encapsulant 18, which makes it difficult to control the extremely thin thickness of the encapsulant 18, so that The wire-type package structure 1 cannot meet the demand for thinning.

Fig. 1B is a schematic cross-sectional view showing a conventional COB type package structure 1'. As shown in FIG. 1B, the COB type package structure 1' includes: a substrate 10', an IC electronic component 13 of a camera lens, a light transmissive member 19, and an encapsulant 18, and the substrate 10' is referenced. The structure shown in Fig. 1A.

The electronic component 13 is formed on the upper side of the substrate 10' and electrically connected to the substrate 10' by a plurality of gold wires 130. The upper surface of the electronic component 13 has a sensing region 131 for light sensing.

The light transmissive member 19 is formed on the upper surface of the electronic component 13 by a plurality of support members 190 and covers the sensing region 131.

The encapsulant 18 is a non-transparent material, and is formed on the upper side of the substrate 10 and covers the transparent member 19, the electronic component 13 and the gold wires 130. The upper surface of the light transmissive member 19 is exposed to the encapsulant 18 .

In the conventional COB type package structure 1', the camera lens needs to be thinned. The electronic component 13 is to be adhered to the substrate 10 ′, and the transparent component 19 is disposed on the electronic component 13 by the support member 190 , so that the overall thickness of the COB package structure 1 ′ is not easy to be thin. Chemical.

In order to solve the above problems, there is a semiconductor silicon-on-silicon (Through Silicon Via, TSV) technology for packaging. As shown in Fig. 1C, the conventional photo-sensing package structure 1" includes a substrate 10" and a light-transmissive member 19'.

The first substrate layer 11 and the second circuit layer 12 are disposed on the upper and lower sides, and the first circuit layer 11 and the second layer are electrically connected by the conductive germanium through holes 100 formed therein. The circuit layer 12 has a sensing region 131 formed on the upper side, and an insulating protective layer 17' is formed on the lower side to expose a portion of the second wiring layer 12 to the insulating protective layer 17', and the plurality of conductive elements 15 are formed in the first layer The two circuit layers 12 are exposed on the surface.

The light transmissive member 19' is formed on the upper side of the crucible substrate 10" by an adhesive layer 190' and covers the sensing region 131.

However, in the conventional light-sensing package structure 1", the cost of manufacturing the conductive perforation 100 is expensive, the integration difficulty is high, and the technical difficulty is high, especially the electronic components applied to the sensor element or the camera lens are high in cost.

Therefore, how to overcome the various problems of the above-mentioned prior art has become a difficult problem to be overcome in the industry.

In view of the above-mentioned various deficiencies of the prior art, the present invention provides an electric The sub-package structure includes: an insulator having opposite first and second surfaces; an electronic component embedded in the insulator from the first surface and having at least one sensing exposed on the first surface And a conductive structure disposed on the first surface of the insulator and electrically connected to the electronic component, and the conductive structure does not cover the sensing region.

The present invention further provides an electronic package structure comprising: an insulator having opposite first and second surfaces; an electronic component embedded in the insulator from the first surface and protruding first of the insulator a surface having at least one sensing region exposed on the first surface; and a conductive structure having a height difference, disposed on the first surface of the insulator and electrically connecting the electronic component, and the conductive structure does not cover the Sensing area.

In the above two electronic package structures, the insulator has a line structure that communicates with the first surface and is electrically connected to the conductive structure.

In the above two electronic package structures, the conductive structure is disposed on the first surface of the insulator through a bonding layer, and the bonding layer does not cover the sensing region.

In the above two electronic package structures, the conductive structure is a lead frame, and the electronic component or another electronic component is connected by a plurality of conductive bumps.

In the above two electronic package structures, the conductive structure includes a lead frame having a plurality of openings and a plurality of conductive bumps disposed in the openings, and the conductive bumps are electrically connected to the electronic component .

In the above two electronic package structures, the conductive structure has a plurality of protruding contacts, and the protruding contacts are electrically connected to the electronic component

In the foregoing two electronic package structures, the complex includes the insulator formed on the insulator a plurality of conductive elements on the second surface.

In the above two electronic package structures, the first surface of the insulator has at least one recess for arranging the electronic component.

In the two electronic package structures described above, the electronic component protrudes from the first surface of the insulator.

In the foregoing two electronic package structures, the cover layer covers one of the sensing regions.

In the above two electronic package structures, the conductive structure is stepped.

In the foregoing two electronic package structures, another electronic component coupled to the insulator is included, for example, the other electronic component is an active component, a passive component, or a combination thereof. For example, the other electronic component is partially disposed in the insulator and partially protrudes from the first surface, and the other electronic component is electrically connected to the conductive pillar; or the other electronic component is completely disposed. In the insulator; or the other electronic component is all disposed on the first surface.

In the foregoing two electronic package structures, a light transmissive member for covering the sensing region is further included.

In the foregoing two electronic package structures, the plurality of conductive pillars are embedded in the insulating layer and electrically connected to the conductive structure.

As can be seen from the above, the electronic package structure of the present invention mainly reduces the thickness of the overall structure by embedding the electronic component in the insulator.

1‧‧‧Wire type package structure

1'‧‧‧COB type package structure

1”‧‧‧Light-sensing package structure

10,10’‧‧‧substrate

10"‧‧‧矽 substrate

100‧‧‧ Conductive piercing

11‧‧‧First line layer

12‧‧‧Second circuit layer

13,23,26,40‧‧‧Electronic components

130‧‧‧ Gold wire

131,231‧‧‧sensing area

14‧‧‧through hole or blind via conductor

15,25‧‧‧ conductive elements

16‧‧‧First insulation protection layer

17‧‧‧Second insulation protection layer

17'‧‧‧Insulating protective layer

18‧‧‧Package colloid

19,19’, 50‧‧‧Lighting parts

190‧‧‧Support

190’, 33‧‧‧ adhesive layer

2a-2d, 2a'-2d', 3, 3', 4, 4', 5, 5' ‧ ‧ electronic package structure

20‧‧‧Insulator

20a‧‧‧ first surface

20b‧‧‧second surface

21, 21’, 21”, 31‧‧ Cover

22‧‧‧Line layer

220,240‧‧‧Electrical contact pads

23a‧‧‧Action surface

23b‧‧‧Non-active surface

230‧‧‧electrode pads

24‧‧‧Electrical cylinder

27‧‧‧Line structure

28a-28d, 38a-38d‧‧‧ conductive structure

28‧‧‧Lead frame

280,280',283‧‧‧conductive bumps

281‧‧‧ openings

282‧‧‧ convex joints

284‧‧‧Adhesive

29, 39‧‧‧ bonding layer

300‧‧‧ recess

D‧‧‧thickness

1A is a schematic cross-sectional view of a conventional wire-type package structure; FIG. 1B is a schematic cross-sectional view of a conventional COB-type package structure; 1C is a schematic cross-sectional view of a conventional photo-sensing package structure; and FIGS. 2-1 to 2-4 are cross-sectional views showing various embodiments of the conductive structure of the electronic package structure of the present invention; FIGS. 2A to 2D are A schematic cross-sectional view of a first embodiment of an electronic package structure of the present invention; wherein the 2A' to 2D' views are another aspect of the 2A to 2D drawings; and the 3rd and 3' drawings are the electronic package of the present invention. A cross-sectional view of a second embodiment of the structure; wherein, FIGS. 3A to 3C are other aspects of the conductive structure of FIG. 3; and FIGS. 4, 4' and 4" are the first embodiment of the electronic package structure of the present invention. 3 is a schematic cross-sectional view of a fourth embodiment of the electronic package structure of the present invention.

The other embodiments of the present invention will be readily understood by those skilled in the art from this disclosure.

It is to be understood that the structure, the proportions, the size, and the like of the present invention are intended to be used in conjunction with the disclosure of the specification, and are not intended to limit the invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effects and the objectives that can be achieved by the present invention. The technical content disclosed in the invention can be covered. At the same time, as quoted in this manual The terms "upper", "lower", "first", "second" and "one" are used for convenience of description only, and are not intended to limit the scope of the invention, and the relative relationship changes. Or, if it is not specifically changed, it is considered to be within the scope of the invention.

2A to 2D are cross-sectional views showing a first embodiment of the electronic package structure 2a-2d of the present invention. The electronic package structures 2a-2d of this embodiment are applied to products such as fingerprint recognition or image sensors.

Furthermore, the following embodiments illustrate the application of the conductive structures 28a-28d shown in Figures 2-1 to 2-4.

As shown in Figures 2A and 2A', the electronic package structure 2a includes an insulator 20, an electronic component 23, a wiring structure 27, and a conductive structure 28a.

The insulator 20 has opposite first and second surfaces 20a, 20b. In this embodiment, the insulator 20 is a molding compound, a dielectric material, such as an epoxy resin (Epoxy), a polyimide (PI), or other photosensitive or non-photosensitive. An organic resin such as a material.

The electronic component 23 is embedded in the insulator 20. In this embodiment, the electronic component 23 is a sensor component, such as a semiconductor wafer structure, having an active surface 23a and an inactive surface 23b opposite to the active surface 23a. The active surface 23a has a light perception. The sensing area 231 and the plurality of electrode pads 230 are disposed such that the active surface 23a is flush or slightly lower than the first surface 20a of the insulator 20, and the sensing area 231 and the electrode pads 230 are exposed to the insulator 20. The first surface 20a.

The line structure 27 is formed in the insulator 20 and communicates with the first surface 20a and the second surface 20b of the insulator 20.

In this embodiment, the circuit structure 27 includes a plurality of circuit layers 22 and a plurality of conductive pillars 24, and each of the circuit layers 22 is electrically connected to each other by the conductive pillars 24, and the conductive pillars 24 are electrically connected to each other. The first surface 20a is connected to have its end surface as the electrical contact pad 240, and the circuit layer 22 communicates with the second surface 20b to make the exposed surface of the circuit layer 22 serve as the electrical contact pad 220. Specifically, the wiring layer 22 such as copper and the conductive pillar 24 are formed by plating, deposition or etching of a patterning process.

Furthermore, the electrical contact pads 220 of the circuit layer 22 can be flush, slightly higher or slightly lower than the second surface 20b of the insulator 20, and the electrical contact pads 240 of the conductive pillars 24 can also be flush and slightly High or slightly lower than the first surface 20a.

Moreover, the circuit layer 22 does not contact the inactive surface 23b of the electronic component 23, that is, the insulator 20 is provided between the wiring layer 22 and the non-active surface 23b of the electronic component 23.

The conductive structure 28a is disposed on the first surface 20a of the insulator 20 and electrically connected to the electronic component 23 and the circuit structure 27, and the conductive structure 28a does not cover the conductive structure 28a. Sensing area 231.

In this embodiment, the conductive structure 28a is a lead frame, and the plurality of conductive bumps 280, such as solder or metal glue, are in contact with the electrode pads 230 and the electrical contact pads 240 to electrically connect the electrons. Element 23 and the line structure 27.

Moreover, the conductive structure 28a is disposed on the first surface 20a of the insulator 20 by the bonding layer 29, wherein the bonding layer 29 is a dielectric material or An insulating material such as a solder resist material, and the bonding layer 29 covers the local active surface 23a of the electronic component 23 without covering the sensing region 231.

As shown in FIG. 2A, the electronic package structure 2a is suitable for a planar grid array (LGA), that is, directly connected to the electrical contact pad 220 of the circuit layer 22, such as a circuit board. On the electronic device (figure omitted).

Alternatively, as shown in FIG. 2A', the electronic package structure 2a' includes a plurality of conductive elements 25 formed on the second surface 20b of the insulator 20 for use in a Ball Grid Array (BGA). Therefore, in the subsequent process, the conductive elements 25 are placed on an electronic device (not shown) such as a circuit board.

In the present embodiment, the conductive elements 25 are in various aspects, such as solder balls, solder bumps, copper bumps, etc., and are not particularly limited, and the conductive elements 25 are formed on the circuit layer 22 The contact pad 220 is electrically connected to the line structure 27.

Furthermore, as shown in FIG. 2A', the electronic package structure 2a' includes a cover layer 21 formed on the conductive structure 28a, such as an insulating material, to cover the sensing region 231. Specifically, the material of the cover layer 21 and the material of the bonding layer 29 may be the same (as shown in the figure) or different, and the cover layer 21 and the bonding layer 29 may be simultaneously or separately fabricated (as shown in the figure). Shown).

Further, as shown in FIG. 2A', the conductive structure 28a, the conductive paths of the conductive pillars 24 and the wiring layer 22 extend below the non-active surface 23b of the electronic component 23.

In addition, other types of applications of the conductive structure can be referred to 2B to The 2D diagram is described in detail below.

The electronic package structure 2b shown in FIG. 2B is a structure according to FIG. 2A. The conductive structure 28b is as shown in FIG. 2-2, and includes a lead frame 28 having a plurality of openings 281 and a plurality of conductive layers. The bumps 280 , and the conductive bumps 280 are correspondingly disposed in the openings 281 to electrically connect the electrode pads 230 and the conductive pillars 24 .

The lead frame 28 is disposed on the first surface 20a of the insulator 20, and each of the openings 281 corresponds to the electrode pads 230 and the conductive pillars 24 (ie, the electrical contact pads). At the position of 240), a conductive material such as solder or metal paste is formed in the opening 281 to serve as the conductive bump 280.

Furthermore, as shown in FIG. 2B', the electronic package structure 2b' can form a cover layer 21' on the conductive structure 28b to cover the sensing region 231, and the material of the cover layer 21' and the bonding layer The material of 29 is different.

The electronic package structure 2c shown in FIG. 2C corresponds to the structure of FIG. 2A. The conductive structure 28c is as shown in FIG. 2-3, and has a plurality of integrally formed bump contacts 282 as conductive bumps. The bumps 282 are bonded and electrically connected to the conductive pads 24 by adhesive materials 284 (such as conductive paste or insulating glue).

During fabrication, stamping is performed on the upper side of a straight lead frame to form the bump contacts 282 on the lower side of the lead frame.

Furthermore, the electronic package structure 2c' shown in FIG. 2C' can form a cover layer 21" on the conductive structure 28c to cover the sensing area 231. For example, the material of the cover layer 21" is combined with the material. Layer 29 is the same material, so two Can be made at the same time.

The electronic package structure 2d shown in FIG. 2D corresponds to the structure of FIG. 2A. The conductive structure 28d has a plurality of conductive bumps 280, 283 on the upper and lower sides, as shown in FIG. The conductive bumps 280 on the lower side are electrically connected to the electrode pads 230 and the conductive pillars 24, and the conductive bumps 283 disposed on the upper side are externally connected to the other electronic components 26.

In this embodiment, the electronic component 26 is an active component, a passive component, or a combination thereof, and the active component is, for example, a semiconductor wafer, and the passive component is, for example, a resistor, a capacitor, and an inductor. Here, the electronic component 26 is a passive component.

Furthermore, as shown in the electronic package structure 2d' shown in FIG. 2D, a cover layer 21 may be formed on the conductive structure 28d to cover the sensing region 231 and the electronic component 26.

In the electronic package structures 2a-2d, 2a-2d' of the present invention, since the electronic component 23 is embedded in the insulator 20, the thickness of the overall structure can be reduced.

Moreover, since the conductive structures 28a-28d are straight-type lead frames, no curvature is generated, which is advantageous for reducing the thickness of the overall structure.

The third and third views are schematic cross-sectional views of a second embodiment of the electronic package structure 3, 3' of the present invention. The difference between this embodiment and the first embodiment lies in the manner in which the electronic component 23 is embedded.

As shown in Figures 3 and 3', the first surface 20a of the insulator 20 has a recess 300 in the electronic component 23 in the recess 300.

In this embodiment, the electronic component 23 is disposed on the bottom surface of the recess 300 by the adhesive layer 33 with its non-active surface 23b, and the electronic component 23 is convex. The first surface 20a of the insulator 20 is formed, so that the conductive structure 38a is designed to have a height difference of a lead frame, such as a stepped shape.

Moreover, as shown in FIG. 3, a cover layer 31 may be formed on the first surface 20a of the insulator 20 such that the cover layer 31 covers the conductive structure 38a and the conductive bumps 280 and covers the sensing layer. A region 231 is formed, and the cover layer 31 is formed in the recess 300 to fix the electronic component 23.

Alternatively, as shown in FIG. 3', the conductive structure 38a may be first disposed on the first surface 20a of the insulator 20 by a bonding layer 39 to fix a portion of the conductive bump 280 by the bonding layer 39. ', and the bonding layer 39 is formed in the recess 300 to fix the electronic component 23, but the bonding layer 39 does not cover the sensing region 231, and then a cover layer 31 is formed on the bonding layer 39. The cover layer 31 covers the conductive structure 38a and a portion of the conductive bump 280 and covers the sensing region 231.

Therefore, the material of the cover layer 31 and the material of the bonding layer 39 may be the same or different, and the cover layer 31 and the bonding layer 39 may be fabricated simultaneously or separately.

In addition, the type of the conductive structure having the height difference is not limited to the above. For example, the electronic package structure 3 shown in FIG. 3 designs the conductive structure shown in FIGS. 2B to 2D to have a structure with a height difference, such as Conductive structures 38b-38d shown in Figures 3A through 3C.

In the electronic package structure 3, 3' of the present invention, since the electronic component 23 is provided in the recess 300 of the insulator 20, the thickness of the overall structure can be reduced.

4 and 4' are schematic cross-sectional views showing a third embodiment of the electronic package structure 4, 4' of the present invention. The difference between this embodiment and the second embodiment lies in the new The passive component 40 is increased, and the other configurations are substantially the same, so the differences will be described in detail below, and the same points will not be described.

As shown in Figures 4 and 4', the electronic package structure 4, 4' includes a further electronic component 40 embedded in the insulator 20 from the first surface 20a.

In this embodiment, the other electronic component 40 is an active component, a passive component or a combination thereof, and the active component is, for example, a semiconductor wafer, and the passive component is, for example, a resistor, a capacitor, and an inductor. Here, the other electronic component 40 is a passive component.

Furthermore, the other electronic component 40 is partially disposed in the insulator 20 to partially protrude from the first surface 20a, and the other electronic component 40 is electrically connected to the conductive pillar 24.

Further, the other electronic component 40 may be entirely provided in the insulator 20 (as shown in Fig. 4') or entirely on the first surface 20a (as shown in Fig. 4).

In addition, as shown in FIG. 4' or 4", a cover layer 31 may be formed on the first surface 20a of the insulator 20 such that the cover layer 31 covers the electronic components 23, 40 and the conductive structure 38a. The sensing area 231 is covered.

The fifth and fifth views are schematic cross-sectional views of a fifth embodiment of the electronic package structure 5, 5' of the present invention. The difference between this embodiment and the above embodiments is that the electronic package structure 5, 5' of the embodiment is applied to a camera lens, for example, a new light transmissive member 50 is added, and other structures are substantially the same, so the differences are detailed below, instead of Describe the same place.

As shown in FIG. 5, the electronic package structure 5 further includes a light transmissive member 50 covering the sensing region 231 of the electronic component 23, such as a lens or a glass element. Pieces.

In the present embodiment, corresponding to the structure of FIG. 2A, the light transmissive member 50 is disposed on the conductive structure 28a, so that it is not necessary to fabricate a conventional support member, so that the thickness of the overall structure can be reduced.

Alternatively, as shown in Fig. 5', the light transmissive member 50 may be provided on the cover layer 21 in accordance with the structure of Fig. 2A'. Therefore, the arrangement of the light transmitting member 50 is not particularly limited.

In addition, in the above embodiments of the present invention, the circuit layer 22 may also contact (or bond with an adhesive layer) the non-active surface 23b of the electronic component 23 for heat dissipation of the electronic component 23.

In summary, the electronic package structure of the present invention can reduce the thickness of the overall structure by embedding the electronic component in the insulator.

Furthermore, the electronic component is electrically connected by a conductive structure such as a lead frame. Therefore, it is not necessary to consider the thickness of the wire arc or the thickness of the encapsulant during manufacture, so that the thickness of the electronic package structure can be easily controlled to achieve a thinner thickness. thickness.

Moreover, since the non-semiconductor process is used, the manufacturing cost can be reduced, and the electronic package structure is easy to adjust the structure and design according to the product requirements, so the design flexibility is good.

The above embodiments are intended to illustrate the principles of the invention and its effects, and are not intended to limit the invention. Any of the above-described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the appended claims.

2a‧‧‧Electronic package structure

20‧‧‧Insulator

20a‧‧‧ first surface

20b‧‧‧second surface

22‧‧‧Line layer

220,240‧‧‧Electrical contact pads

23‧‧‧Electronic components

23a‧‧‧Action surface

23b‧‧‧Non-active surface

230‧‧‧electrode pads

231‧‧‧ Sensing area

24‧‧‧Electrical cylinder

27‧‧‧Line structure

28a‧‧‧Electrical structure

280‧‧‧Electrical bumps

29‧‧‧Combination layer

Claims (16)

An electronic package structure comprising: an insulator having a first surface and a second surface; a line structure embedded in the insulator, wherein the circuit structure comprises a plurality of circuit layers and a plurality of conductive pillars, and each Between the circuit layers, the conductive pillars are electrically connected to each other, and the conductive pillars are connected to the first surface; an electronic component is embedded in the insulator from the first surface and has an exposed At least one sensing region of the first surface; and a conductive structure disposed on the first surface of the insulator and electrically connecting the electronic component and the conductive pillar, and the conductive structure does not cover the sensing region. An electronic package structure comprising: an insulator having a first surface and a second surface; a line structure embedded in the insulator, wherein the circuit structure comprises a plurality of circuit layers and a plurality of conductive pillars, and each The conductive layers are electrically connected to each other by the conductive pillars, and the conductive pillars are connected to the first surface; an electronic component is embedded in the insulator from the first surface and protrudes from the insulator a first surface having at least one sensing region exposed on the first surface; and a conductive structure having a height difference, disposed on the first surface of the insulator and electrically connecting the electronic component and the conductive pillar And the conductive structure does not cover the sensing area. The electronic package structure of claim 1 or 2, wherein the conductive structure is a lead frame. The electronic package structure of claim 1 or 2, wherein the conductive structure connects the electronic component or another electronic component with a plurality of conductive bumps. The electronic package structure of claim 1 or 2, wherein the conductive structure comprises a lead frame having a plurality of openings and a plurality of conductive bumps disposed in the openings, and the conductive The bump is electrically connected to the electronic component. The electronic package structure of claim 1 or 2, wherein the conductive structure has a plurality of bumps, and the bumps are electrically connected to the electronic component. The electronic package structure of claim 1 or 2, further comprising a plurality of conductive elements formed on the second surface of the insulator. The electronic package structure of claim 1 or 2, wherein the first surface of the insulator has a recess for providing the electronic component. The electronic package structure according to claim 1 or 2, further comprising covering a cover layer of the sensing area. The electronic package structure of claim 1 or 2, wherein the conductive structure is stepped. The electronic package structure of claim 1 or 2, further comprising another electronic component coupled to the insulator. The electronic package structure of claim 11, wherein The other electronic component is an active component, a passive component, or a combination thereof. The electronic package structure of claim 11, wherein the other electronic component is partially disposed in the insulator and partially protrudes from the first surface, and the other electronic component is electrically connected to the conductive pillar body. The electronic package structure of claim 11, wherein the other electronic component is all disposed in the insulator. The electronic package structure of claim 11, wherein the other electronic component is all disposed on the first surface. The electronic package structure according to claim 1 or 2, further comprising a light transmissive member for covering the sensing area.