TWM482838U - Polishing apparatus with dustproof structure - Google Patents

Polishing apparatus with dustproof structure Download PDF

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Publication number
TWM482838U
TWM482838U TW103204483U TW103204483U TWM482838U TW M482838 U TWM482838 U TW M482838U TW 103204483 U TW103204483 U TW 103204483U TW 103204483 U TW103204483 U TW 103204483U TW M482838 U TWM482838 U TW M482838U
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TW
Taiwan
Prior art keywords
polishing
base
dustproof structure
grinding
item
Prior art date
Application number
TW103204483U
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Chinese (zh)
Inventor
Chin-Ya Liao
Cha-Lun Liu
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Warde Tec Taiwan Co Ltd
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Filing date
Publication date
Application filed by Warde Tec Taiwan Co Ltd filed Critical Warde Tec Taiwan Co Ltd
Priority to TW103204483U priority Critical patent/TWM482838U/en
Publication of TWM482838U publication Critical patent/TWM482838U/en

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  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Description

具防塵結構的研磨裝置Grinding device with dustproof structure

本新型為有關一種研磨裝置,尤指一種具有防塵結構的研磨裝置。The present invention relates to a grinding device, and more particularly to a grinding device having a dustproof structure.

「研磨」是工業製造上的一種精密技術,例如在半導體製程中,隨著線寬逐漸的縮小,為了順利建構多層導線架構,利用化學機械研磨(Chemical mechanical Polishing,CMP)將多層導線架構中的各層表面平坦化,已成為不可獲缺的關鍵製程。"Grinding" is a precision technology in industrial manufacturing. For example, in the semiconductor manufacturing process, as the line width is gradually reduced, in order to smoothly construct a multilayer wiring structure, chemical mechanical polishing (CMP) is used in a multilayer wiring structure. The flattening of the surface of each layer has become an indispensable key process.

例如,在台灣發明第397734號中,即揭示一種化學機械研磨機台,包含複數個設於一旋轉座上並以一方向旋轉的研磨台;複數個設於各研磨台上的研磨墊;複數個置於該研磨墊上的晶片,且該晶片的正面與該研磨墊相接觸;複數個設置於各研磨墊上方的分送管,用以輸送一研漿至各研磨墊上;一用以排流的排通管;一用以調節排通管流通的節流閥;一連接於排通管上的排通幫浦,用以將該旋轉座上已使用過的該研漿,抽送到該排通管中;以及一控制該節流閥的控制器。據此,當研磨製程停止時,利用該控制器關閉該節流閥,防止該研磨墊過度乾燥,影響晶片的品質,以提高良率。For example, in Taiwan Invention No. 397,734, a chemical mechanical polishing machine includes a plurality of polishing tables disposed on a rotating base and rotating in one direction; a plurality of polishing pads disposed on each of the polishing tables; a wafer placed on the polishing pad, and a front surface of the wafer is in contact with the polishing pad; a plurality of dispensing tubes disposed above each polishing pad for conveying a slurry to each polishing pad; a discharge pipe; a throttle valve for regulating the circulation of the discharge pipe; and a discharge pump connected to the discharge pipe for pumping the used slurry on the rotary seat to the row In the conduit; and a controller that controls the throttle. Accordingly, when the polishing process is stopped, the throttle valve is closed by the controller to prevent the polishing pad from being excessively dried, which affects the quality of the wafer to improve the yield.

然而,習知的化學機械研磨機台,在使用後容易受到因研磨所產生的灰塵影響,沾附許多不必要的粒子,例如,灰塵會隨空氣附著於其研磨頭因結構設計上所產生的縫隙,而於該研磨頭下次進行研磨時,從該縫隙掉落於所研磨的一晶圓上,影響研磨的品質,使得該研磨頭必須時常進行清理,增加作業的複雜度,而有改善的必要。However, conventional chemical mechanical polishing machines are susceptible to dust generated by grinding after use, and are exposed to many unnecessary particles. For example, dust may adhere to the polishing head due to air due to structural design. a gap, and when the polishing head is polished next time, it falls from the gap on the polished wafer, affecting the quality of the grinding, so that the polishing head must be cleaned frequently, increasing the complexity of the operation, and improving Necessary.

本新型的主要目的,在於解決習知的研磨機台,其研磨頭於結構上所具有的縫隙,容易附著灰塵,而有必須時常清理,影響研磨品質的問題。The main purpose of the novel is to solve the conventional grinding machine table, in which the grinding head has a gap in the structure, which is easy to adhere to dust, and has to be cleaned frequently, which affects the quality of the grinding.

為達上述目的,本新型提供一種具防塵結構的研磨裝置,包含有一傳動軸、一研磨頭以及一防塵罩。該研磨頭與該傳動軸連接,並包含一基座與一研磨部,該基座包含一靠近該傳動軸的頂側以及一遠離該頂側的底側,該研磨部連接於該基座的該底側,並與該基座之間形成一連接縫隙;該防塵罩罩覆該研磨頭,並包含一貼附該頂側的本體以及一由該本體朝該研磨部延伸的簷部,該簷部覆蓋該連接縫隙。To achieve the above object, the present invention provides a polishing apparatus having a dustproof structure, comprising a drive shaft, a polishing head and a dust cover. The polishing head is coupled to the drive shaft and includes a base and a grinding portion, the base includes a top side adjacent to the drive shaft and a bottom side away from the top side, the grinding portion is coupled to the base Forming a connection gap between the bottom side and the base; the dust cover covers the polishing head, and includes a body attached to the top side and a crotch portion extending from the body toward the polishing portion, The ankle covers the connection gap.

如此一來,本新型藉由該防塵罩的設置,覆蓋該連接縫隙,避免灰塵進入該連接縫隙之中,影響該研磨裝置的研磨品質,並且,當該防塵罩受灰塵污染時,可直接對該防塵罩進行替換或清理,而可避免清理該研磨頭的一複雜作業。In this way, the present invention covers the connection gap by the arrangement of the dust cover, prevents dust from entering the connection gap, affects the grinding quality of the grinding device, and, when the dust cover is contaminated by dust, can directly The dust cover is replaced or cleaned to avoid a complicated operation of cleaning the polishing head.

10‧‧‧研磨頭10‧‧‧ polishing head

11‧‧‧基座11‧‧‧Base

12‧‧‧研磨部12‧‧‧ Grinding Department

121‧‧‧研磨片121‧‧‧Abrasive

13‧‧‧連接縫隙13‧‧‧Connection gap

20‧‧‧防塵罩20‧‧‧ dust cover

21‧‧‧本體21‧‧‧ body

211‧‧‧穿孔211‧‧‧Perforation

22‧‧‧簷部22‧‧‧檐

221‧‧‧內緣221‧‧‧ inner edge

30‧‧‧傳動軸30‧‧‧Drive shaft

圖1A,為本新型一實施例的結構分解示意圖。1A is a schematic exploded view showing the structure of an embodiment of the present invention.

圖1B,為本新型一實施例的外觀立體示意圖。FIG. 1B is a perspective view showing the appearance of an embodiment of the present invention.

圖2,為本新型一實施例防塵罩的結構剖面示意圖。2 is a cross-sectional view showing the structure of a dust cover according to an embodiment of the present invention.

有關本新型的詳細說明及技術內容,現就配合圖式說明如下:The detailed description and technical content of this new model are described below with the following diagram:

請參閱『圖1A』、『圖1B』及『圖2』所示,『圖1A』與『圖1B』分別為本新型一實施例的結構分解及外觀立體示意圖,『圖2』為本新型一實施例防塵罩的結構剖面示意圖,本新型為一種具防塵結構的研磨裝置,包含有一傳動軸30、一研磨頭10以及一防塵罩20。該傳動軸30與該研磨頭10連接,以控制該研磨頭10轉動進行一研磨作業。Please refer to FIG. 1A, FIG. 1B and FIG. 2, and FIG. 1A and FIG. 1B are respectively a structural exploded view and an external perspective view of the present invention. FIG. 2 is a new type. A schematic cross-sectional view of a dust cover of an embodiment, the present invention is a polishing device having a dustproof structure, comprising a drive shaft 30, a polishing head 10 and a dust cover 20. The drive shaft 30 is coupled to the polishing head 10 to control the rotation of the polishing head 10 for a grinding operation.

該研磨頭10與該傳動軸30連接,並包含一基座11與一研磨部12,該基座11包含一頂側與一底側,該頂側為靠近該傳動軸30,該底側則相對該頂側遠離該傳動軸30,在此實施例中,該傳動軸30為連接於該頂側而控制該研磨頭10轉動。The grinding head 10 is coupled to the drive shaft 30 and includes a base 11 and a grinding portion 12. The base 11 includes a top side and a bottom side, the top side being adjacent to the drive shaft 30, and the bottom side is The top side is away from the transmission shaft 30. In this embodiment, the transmission shaft 30 is coupled to the top side to control the rotation of the polishing head 10.

該研磨部12連接於該基座11的該底側,並與該基座11之間形成一凹陷的連接縫隙13,在此實施例中,該研磨部12還包含有一研磨片121,該研磨片121設置於該研磨部12遠離該基座11的一側,為用以對一晶圓接觸而進行該研磨作業。The polishing portion 12 is connected to the bottom side of the base 11 and forms a recessed connection slot 13 with the base 11. In this embodiment, the polishing portion 12 further includes an abrasive sheet 121. The sheet 121 is disposed on a side of the polishing portion 12 away from the susceptor 11 for performing a polishing operation for contacting a wafer.

該防塵罩20罩覆該研磨頭10,並包含一本體21以及一簷部22,該本體21貼附該基座11的該頂側,在本實施例中,該本體21還具有一供該傳動軸30穿過以連接該頂側的穿孔211。該簷部22則由該本體21朝該研磨部12延伸,將該連接縫隙13覆蓋,不過該簷部22延伸的長度以不超出該研磨片121為佳,避免影響該研磨作業,另外,在本實施例中,該簷部22還包含有一內緣221,該內緣221由該簷部22的一內面朝內凸出而伸入該連接縫隙13而形成。The dust cover 20 covers the polishing head 10 and includes a body 21 and a crotch portion 22 attached to the top side of the base 11. In the embodiment, the body 21 further has a The drive shaft 30 passes through a through hole 211 that connects the top side. The cymbal portion 22 extends from the body 21 toward the polishing portion 12, and covers the connection slit 13. However, the length of the cymbal portion 22 extends not to exceed the polishing sheet 121, thereby avoiding affecting the polishing operation, and In this embodiment, the crotch portion 22 further includes an inner edge 221 formed by an inner surface of the crotch portion 22 projecting inwardly and extending into the connecting slit 13.

如此,當該研磨頭10於進行該研磨作業時,由於該防塵罩20已覆蓋該連接縫隙13,使得因該研磨作業所產生的一灰塵無法輕易的附著於該連接縫隙13之中,再者,該防塵罩20還具有伸入該連接縫隙13之中的該內緣221,不僅進一步擋止該灰塵侵入該連接縫隙13,還具有穩定嵌合該防塵罩20於該研磨頭10的功能。Thus, when the polishing head 10 performs the polishing operation, since the dust cover 20 has covered the connection slit 13, a dust generated by the polishing operation cannot be easily attached to the connection slit 13, and further The dust cover 20 further has the inner edge 221 extending into the connecting slit 13, which not only further prevents the dust from intruding into the connecting slit 13, but also has a function of stably fitting the dust cover 20 to the polishing head 10.

綜上所述,由於本新型於該研磨頭罩覆該防塵罩,而具有下以優點:In summary, since the present invention covers the dust cover with the polishing head, it has the following advantages:

1.避免因該研磨作業所產生的該灰塵附著於該連接縫隙,而影響該研磨頭於下次進行該研磨作業的品質。1. Avoiding the adhesion of the dust generated by the polishing operation to the connection gap, thereby affecting the quality of the polishing head to perform the polishing operation next time.

2.該防塵罩的該內緣,除了可進一步擋止該灰塵的侵入之外,還可適當的嵌合該防塵罩於該研磨頭上。2. The inner edge of the dust cover can further block the intrusion of the dust, and the dust cover can be appropriately fitted to the polishing head.

3.當該防塵罩受灰塵污染時,該防塵罩可進行替換或清理,避免清理該研磨頭的複雜作業。3. When the dust cover is contaminated by dust, the dust cover can be replaced or cleaned to avoid complicated work of cleaning the polishing head.

因此,本新型極具進步性及符合申請新型專利的要件,爰依法提出申請,祈 鈞局早日賜准專利,實感德便。Therefore, this new type is highly progressive and meets the requirements for applying for a new type of patent. It is required to apply in accordance with the law, and the Bureau of Health will grant patents as soon as possible.

以上已將本新型做一詳細說明,惟以上所述者,僅爲本新型的一較佳實施例而已,當不能限定本新型實施的範圍。即凡依本新型申請範圍所作的均等變化與修飾等,皆應仍屬本新型的專利涵蓋範圍內。The present invention has been described in detail above, but the above is only a preferred embodiment of the present invention, and the scope of the present invention is not limited. That is, the equal changes and modifications made in accordance with the scope of this new application shall remain within the scope of the patent of this new type.

10‧‧‧研磨頭 10‧‧‧ polishing head

11‧‧‧基座 11‧‧‧Base

12‧‧‧研磨部 12‧‧‧ Grinding Department

121‧‧‧研磨片 121‧‧‧Abrasive

13‧‧‧連接縫隙 13‧‧‧Connection gap

20‧‧‧防塵罩 20‧‧‧ dust cover

21‧‧‧本體 21‧‧‧ body

211‧‧‧穿孔 211‧‧‧Perforation

22‧‧‧簷部 22‧‧‧檐

221‧‧‧內緣 221‧‧‧ inner edge

30‧‧‧傳動軸 30‧‧‧Drive shaft

Claims (5)

【第1項】[Item 1] 一種具防塵結構的研磨裝置,包含有:
一傳動軸;
一與該傳動軸連接並包含一基座與一研磨部的研磨頭,該基座包含一靠近該傳動軸的頂側以及一遠離該頂側的底側,該研磨部連接於該基座的該底側,並與該基座之間形成一連接縫隙;以及
一罩覆該研磨頭的防塵罩,該防塵罩包含一貼附該頂側的本體以及一由該本體朝該研磨部延伸的簷部,該簷部覆蓋該連接縫隙。
A grinding device with a dustproof structure, comprising:
a drive shaft;
a polishing head coupled to the drive shaft and including a base and a polishing portion, the base includes a top side adjacent to the drive shaft and a bottom side away from the top side, the grinding portion being coupled to the base Forming a connection gap between the bottom side and the base; and a dust cover covering the polishing head, the dust cover including a body attached to the top side and a body extending from the body toward the polishing portion The crotch portion covers the connection gap.
【第2項】[Item 2] 如申請專利範圍第1項所述的具防塵結構的研磨裝置,其中該本體具有一供該傳動軸穿過的穿孔。A grinding apparatus with a dustproof structure according to the above aspect of the invention, wherein the body has a perforation through which the transmission shaft passes. 【第3項】[Item 3] 如申請專利範圍第1項所述的具防塵結構的研磨裝置,其中該簷部包含一向內凸出而伸入該連接縫隙的內緣。A polishing apparatus with a dustproof structure according to claim 1, wherein the dam portion includes an inner edge that protrudes inwardly and protrudes into the connection slit. 【第4項】[Item 4] 如申請專利範圍第1項所述的具防塵結構的研磨裝置,其中該研磨部包含一研磨片,該研磨片位於該研磨部遠離該基座的一側。A polishing apparatus having a dustproof structure according to claim 1, wherein the polishing section comprises an abrasive sheet located on a side of the polishing section away from the base. 【第5項】[Item 5] 如申請專利範圍第4項所述的具防塵結構的研磨裝置,其中該簷部從該本體朝該研磨部延伸,覆蓋該連接縫隙而不超出該研磨片。A polishing apparatus having a dustproof structure according to claim 4, wherein the dam portion extends from the body toward the polishing portion to cover the connection slit without exceeding the abrasive sheet.
TW103204483U 2014-03-17 2014-03-17 Polishing apparatus with dustproof structure TWM482838U (en)

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TW103204483U TWM482838U (en) 2014-03-17 2014-03-17 Polishing apparatus with dustproof structure

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TWM482838U true TWM482838U (en) 2014-07-21

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI737390B (en) * 2020-01-17 2021-08-21 台灣積體電路製造股份有限公司 Cmp systems, tray assembly for cmp systems and cleaning method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI737390B (en) * 2020-01-17 2021-08-21 台灣積體電路製造股份有限公司 Cmp systems, tray assembly for cmp systems and cleaning method thereof

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