TWM475137U - Cooling module and fan structure thereof - Google Patents

Description

Thermal module and fan structure

This creation is a heat dissipation module, especially a heat dissipation module that is quiet and easy to manufacture.

The internal components of the notebook generate a lot of heat during operation, so a cooling fan needs to be installed on the notebook to blow the heat to the outside. In order to meet the consumer's requirements for the appearance and weight of the notebook, the current design of the notebook computer is getting thinner and lighter, so the cooling fan must also be designed to be smaller in size with the notebook computer.

In the structure of a small-sized cooling fan, the blade is the most fragile part, and it is easily broken during the manufacturing process by the impact of an external force (for example, being crushed by a manufacturing tool, and being pinched). In order to solve the problem that the fan blade is easily damaged during the manufacturing process, the fan is more likely to be produced, and a ring is mounted on the fan blade; thus, the ring can be pushed by the manufacturing device instead of the fan blade. Or clamped to avoid the blade being broken by direct external impact. However, if a small-sized cooling fan with a ring is placed in the notebook and the notebook is used, the ring will interact with the airflow to generate a fairly significant noise, which may affect consumption. The willingness to purchase.

Therefore, it is necessary to provide a new cooling fan which is easy to manufacture and has low noise.

The main purpose of this creation is to provide a heat dissipation module, especially a heat dissipation module that is low in noise and easy to manufacture.

In order to achieve the above object, the heat dissipation module of the present invention comprises a casing and a fan structure. The housing includes a receiving space. The fan structure is located in the housing space of the housing. The fan structure includes a plurality of blades and a type of circular outer frame. A circular circular outer frame surrounds and joins a plurality of blades.

In one embodiment of the present invention, the toroidal outer frame includes an outer side and an inner side.

In one embodiment of the present invention, the outer side is a wave type and the inner side is a circular ring or a wave type.

In one embodiment of the present invention, the circular-shaped outer frame includes a plurality of frame blocks, wherein a portion of the frame blocks are located on a first circumference and the other portion of the frame blocks are located on a second circumference. The radius of the first circumference is smaller than the radius of the second circumference.

In an embodiment of the present invention, the circular-shaped outer frame includes a plurality of frame blocks, wherein a part of the frame blocks are located on one plane, and another part of the frame block is located on another plane.

Another object of the present invention is to provide a fan structure in which a fan structure is located in a housing of a housing of a heat dissipation module. The fan structure includes a plurality of blades and a type of circular outer frame. A circular circular outer frame surrounds and joins a plurality of blades.

Because the creation of this creation is novel, it can provide industrial use, and it has improved efficiency, so it applies for a new patent according to law.

The above and other objects, features and advantages of the present invention will become more apparent and understood.

Please refer to FIG. 1 to FIG. 3, which are the electronic device and the heat dissipation module according to the first embodiment of the present invention. 1 is a schematic diagram of a heat dissipation module according to a first embodiment of the present invention; FIG. 2 is a schematic diagram of an electronic device and a heat dissipation module according to a first embodiment of the present invention; and FIG. 3 is a heat dissipation mode of the first embodiment of the present invention. Schematic diagram of the group and its fan structure.

As shown in FIG. 1 to FIG. 3, in the first embodiment, the heat dissipation module 1 of the present invention is applied to an electronic device 100, for example, a notebook computer; however, the type of the electronic device 100 is not To this end, it can also be a tablet or other device that requires heat dissipation. The heat dissipation module 1 of the first embodiment of the present invention includes a housing 10 and a fan structure 20.

The housing 10 of the present invention includes a receiving space 11 and an air outlet 12. The accommodating space 11 is for accommodating the fan structure 20. The air outlet 12 is for air in and out. The fan structure 20 is located within the receiving space 11 of the housing 10, and the fan structure 20 includes a plurality of blades 21 and a circular outer frame 22. The toroidal outer frame 22 surrounds and joins the plurality of blades 21. The plurality of blades 21 are rotated to produce a gas flow; and the air generated by the plurality of blades 21 is used to discharge heat generated by the electronic device 100 from the air outlet 12. The circular annular outer frame 22 is used to protect the plurality of blades 21 from damage and contact caused by the manufacturing tool during the manufacturing process of the heat dissipation module 1. The annular outer frame 22 includes an outer side 221 and an inner side 222. In the first embodiment of the present invention, the outer side 221 is a wave type and the inner side 222 is also a wave type. It can be known from the actual experiment of the inventor of the present invention that since the circular outer frame 22 such as the first embodiment of the present invention is not a conventional circular ring but is designed in the shape of a wave, when the heat dissipation module is used When the fan structure 20 of 1 operates, the airflow does not interact with the toroidal outer frame 22 to produce harsh noise. However, the shapes of the outer side 221 and the inner side 222 are not limited to the above.

Please refer to FIG. 4 and FIG. 5 for a heat dissipation module according to a second embodiment of the present invention. 4 is a schematic view showing a heat dissipation module and a fan structure thereof according to a second embodiment of the present invention; and FIG. 5 is a schematic view showing a fan structure of the second embodiment of the present invention.

As shown in FIGS. 4 and 5, the second embodiment differs from the first embodiment in that, in the second embodiment, the circular-like annular frame 22a of the fan structure 20a is not designed in the shape of a wave, and the second The circular outer frame 22a of the embodiment includes a plurality of frame blocks 223, 223a. A part of the frame block 223 is located on a first circumference A, and another part of the frame block 223a is located on a second circumference B. The radius of the first circumference A is smaller than the radius of the second circumference B, and the plurality of frames of the second embodiment The body blocks 223, 223a are located on the same horizontal plane. Thereby, the plurality of frame blocks 223, 223a form a discontinuous circle-like shape. When the fan structure 20a of the second embodiment is in operation, the airflow does not interact with the toroidal outer frame 22a to generate harsh noise.

Please refer to FIG. 6 for a heat dissipation module according to a third embodiment of the present invention. FIG. 6 is a schematic diagram of a heat dissipation module and a fan structure thereof according to a third embodiment of the present invention.

As shown in FIG. 6, the third embodiment differs from the second embodiment in that, in the third embodiment, the circular-like annular frame 22b of the fan structure 20b has a plurality of frame blocks 223b, 223c, and a part thereof. The frame block 223b is located on one plane, and the other part of the frame block 223c is located on the other plane. The plane of the frame block 223c is slightly lower than the plane of the frame block 223b. Thereby, the plurality of frame blocks 223b, 223c form a discontinuous circle-like shape. When the fan structure 20b of the third embodiment is in operation, the airflow does not interact with the toroidal outer frame 22b to generate harsh noise.

Please refer to FIG. 7 for a heat dissipation module according to a fourth embodiment of the present invention. FIG. 7 is a schematic diagram of a heat dissipation module and a fan structure thereof according to a fourth embodiment of the present invention.

As shown in Fig. 7, the fourth embodiment differs from the first embodiment in that, in the fan structure 20c of the fourth embodiment, the outer side 221a is a wave type, and the inner side 222a is a ring type. When the fan structure 20c of the fourth embodiment is in operation, the airflow does not interact with the toroidal outer frame 22c to generate harsh noise.

By the design of the circular-shaped annular frames 22, 22a, 22b, 22c of the heat-dissipating modules 1, 1a, 1b, 1c of the present invention, the plurality of heat-dissipating modules 1, 1a, 1b, 1c can be made in the process of manufacturing the heat-dissipating modules 1, 1a, 1b, 1c The blade 21 is not damaged or contacted by the manufacturing tool. Moreover, when the heat dissipation modules 1, 1a, 1b, and 1c of the present invention are in operation, the airflow does not interact with the circular-shaped annular frames 22, 22a, 22b, and 22c to generate harsh noise.

In summary, this creation, regardless of its purpose, means and efficacy, is showing its characteristics that are different from the well-known techniques. You are kindly requested to review the examination and express the patent as soon as possible. It is to be noted that the various embodiments described above are merely illustrative for ease of explanation, and the scope of the claims is intended to be limited by the scope of the claims.

1, 1a, 1b, 1c‧‧‧ heat module
10‧‧‧shell
11‧‧‧ accommodation space
12‧‧‧air outlet
20‧‧‧Fan structure
21‧‧‧ fan leaves
22, 22a, 22b, 22c‧‧‧ round circular frame
221, 221a‧‧‧ outside
222, 222a‧‧‧ inside
223, 223a, 223b, 223c‧‧‧ frame blocks
100‧‧‧Electronic devices
A‧‧‧first circumference
B‧‧‧second circumference

1 is a schematic view of a heat dissipation module of a first embodiment of the present invention. 2 is a schematic diagram of an electronic device and a heat dissipation module according to a first embodiment of the present invention. FIG. 3 is a schematic diagram of a heat dissipation module and a fan structure thereof according to the first embodiment of the present invention. 4 is a schematic view showing a heat dissipation module and a fan structure thereof according to a second embodiment of the present invention. Fig. 5 is a schematic view showing the structure of a fan of the second embodiment of the present invention. FIG. 6 is a schematic diagram of a heat dissipation module and a fan structure thereof according to a third embodiment of the present invention. FIG. 7 is a schematic diagram of a heat dissipation module and a fan structure thereof according to a fourth embodiment of the present invention.

1‧‧‧ Thermal Module

10‧‧‧shell

11‧‧‧ accommodation space

12‧‧‧air outlet

20‧‧‧Fan structure

21‧‧‧ fan leaves

22‧‧‧-shaped circular frame

221‧‧‧ outside

222‧‧‧ inside

Claims (10)

A heat dissipation module includes: a housing including a receiving space; and a fan structure located in the receiving space of the housing, the fan structure comprising: a plurality of blades; and a circular outer frame surrounding and connecting The plurality of blades. The heat dissipation module of claim 1, wherein the annular outer frame further comprises an outer side and an inner side. The heat dissipation module of claim 2, wherein the outer side is a wave type, and the inner side is a ring type or a wave type. The heat dissipation module of claim 1, wherein the circular outer frame comprises a plurality of frame blocks, wherein a part of the frame block is located on a first circumference, and another part of the frame block is located at a second circumference. Above, the radius of the first circumference is smaller than the radius of the second circumference. The heat dissipation module of claim 1, wherein the circular outer frame comprises a plurality of frame blocks, wherein a part of the frame blocks are located on one plane, and another part of the frame block is located on the other plane. A fan structure is located in an accommodating space of a housing of a heat dissipation module, the fan structure comprising: a plurality of blades; and a circular annular frame surrounding and connecting the plurality of blades. The fan structure of claim 6, wherein the annular outer frame further comprises an outer side and an inner side. The fan structure of claim 7, wherein the outer side is a wave type, and the inner side is a ring type or a wave type. The fan structure of claim 6, wherein the circular outer frame further comprises a plurality of frame blocks, wherein a part of the frame block is located on a first circumference, and another part of the frame block is located at a second circumference. Above, the radius of the first circumference is smaller than the radius of the second circumference. The fan structure of claim 6, wherein the circular outer frame further comprises a plurality of frame blocks, wherein a part of the frame blocks are located on one plane and the other part of the frame block is located on the other plane.