TWM471672U - Wafer transfer apparatus - Google Patents
Wafer transfer apparatus Download PDFInfo
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- TWM471672U TWM471672U TW102211453U TW102211453U TWM471672U TW M471672 U TWM471672 U TW M471672U TW 102211453 U TW102211453 U TW 102211453U TW 102211453 U TW102211453 U TW 102211453U TW M471672 U TWM471672 U TW M471672U
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Description
本創作係關係於一種晶片移載裝置,特別是關於一種具有單一驅動軸結構的晶片移載裝置。The present invention relates to a wafer transfer device, and more particularly to a wafer transfer device having a single drive shaft structure.
在晶片的製造過程中,有搬動晶片以配合各階段製程之需要。該晶片移載的方向,一般分為Y軸移載、Z軸移載、以及R軸移載。所謂Y軸移載一般為指將晶片以水平之方向搬送,所謂Z軸移載一般為指將晶片以垂直水平之方向搬送,而所謂R軸移載一般為指Y軸移載以及Z軸移載之綜合,亦即R軸移載係指將晶片以非水平且非垂直的方向而搬送。During the manufacturing process of the wafer, there is a need to move the wafer to match the needs of the various stages of the process. The direction in which the wafer is transferred is generally divided into Y-axis transfer, Z-axis transfer, and R-axis transfer. The so-called Y-axis transfer generally refers to transporting the wafer in a horizontal direction. The so-called Z-axis transfer generally refers to transporting the wafer in a vertical horizontal direction, and the so-called R-axis transfer generally refers to Y-axis transfer and Z-axis shift. The combination of loading, that is, R-axis transfer, refers to transporting the wafer in a non-horizontal and non-perpendicular direction.
為了達成上述Y軸移載、Z軸移載、以及R軸移載,習知的晶片移載裝置為具有三個驅動軸,每個驅動軸對應於前述Y軸移載、Z軸移載、以及R軸移載中的一個。在這樣三個驅動軸的架構中,一般需要三個馬達,其所帶來的能源消耗、震動,對於成本以及產品品質將帶來不良的影響。此外,由於具有三個驅動軸以及三個馬達,其相互之間的配合,尤其是驅動軸與驅動軸之間的配合,將非常複雜,其所帶來之設計成本將為提高,且其晶密度也會受到設計本身的複雜度而降低。即使將三個驅動軸改為二個驅動軸,其所相對所需提升的設計複雜度、精密度、成本,仍為一問題。In order to achieve the above-mentioned Y-axis transfer, Z-axis transfer, and R-axis transfer, the conventional wafer transfer device has three drive shafts, each of which corresponds to the aforementioned Y-axis transfer, Z-axis transfer, And one of the R-axis shifts. In the architecture of such three drive shafts, three motors are generally required, and the energy consumption and vibration brought by them have adverse effects on cost and product quality. In addition, since there are three drive shafts and three motors, the mutual cooperation, especially the cooperation between the drive shaft and the drive shaft, will be very complicated, and the design cost thereof will be improved, and the crystal thereof will be improved. Density is also reduced by the complexity of the design itself. Even if the three drive shafts are changed to two drive shafts, the design complexity, precision, and cost of the required lift are still a problem.
緣此,本創作即是提供一種為以單一驅動軸以及單一馬達的方式而進行晶片移載之裝置,以解決習知晶片移載裝置 的成本、能源消耗、震動等問題。Therefore, the present invention provides a device for transferring wafers in a single drive shaft and a single motor to solve the conventional wafer transfer device. Cost, energy consumption, vibration and other issues.
本創作為解決習知技術之問題所採用之技術手段係提供一種晶片移載裝置,包含:一驅動軸,受一驅動機構所驅動;一R軸凸輪構件,具有一R軸凸輪軸孔、以及一R軸凸輪驅動件,R軸凸輪軸孔為驅動軸所穿過而轉動R軸凸輪構件;一R軸受動構件,具有一晶片轉載件、以及一R軸受動件,R軸受動構件因R軸受動件受R軸凸輪驅動件所驅動而在一R軸平移;一Y軸凸輪構件,具有一Y軸凸輪軸孔、以及一Y軸凸輪驅動件,Y軸凸輪軸孔為驅動軸所穿過而轉動Y軸凸輪構件;一支撐構件,具有一Y軸第一限位孔,支撐構件為驅動軸所穿過;一雙向導引構件,具有一Y軸第二限位孔以及一Z軸導引件,Z軸導引件藉由一Y軸受動件穿過Y軸第一限位孔而連動於Y軸凸輪驅動件;一Z軸偏心軸構件,其一端連接於穿過Y軸第二限位孔的驅動軸,另一端具有一Z軸偏心軸件;一晶片載送受動構件,具有一晶片載送件,且晶片載送受動構件受動於雙向導引構件以及Z軸偏心軸件而為Z軸以及Y軸之移動。The present invention provides a wafer transfer device for solving the problems of the prior art, comprising: a drive shaft driven by a drive mechanism; an R-axis cam member having an R-axis camshaft hole, and An R-axis cam drive member, the R-axis camshaft hole rotates the R-axis cam member for the drive shaft to pass therethrough; an R-axis driven member has a wafer transfer member and an R-axis actuator, and the R-axis driven member is R The shaft actuating member is driven by the R-axis cam driving member to translate in an R-axis; a Y-axis cam member having a Y-axis cam shaft hole and a Y-axis cam driving member, the Y-axis cam shaft hole being worn by the driving shaft And rotating the Y-axis cam member; a support member having a Y-axis first limiting hole through which the support member passes; a bidirectional guiding member having a Y-axis second limiting hole and a Z-axis a guiding member, the Z-axis guiding member is coupled to the Y-axis cam driving member through a Y-axis receiving member passing through the Y-axis first limiting hole; a Z-axis eccentric shaft member having one end connected to the Y-axis through The drive shaft of the second limiting hole has a Z-axis eccentric shaft member at the other end; Member having a wafer carrying member, and carrying the wafer by the movable member and by a Z-axis and the Y-axis of the bi-directional movement of the guide member movable in the Z-axis and the eccentric shaft.
依據本創作之一實施例,其中R軸凸輪驅動件為一槽孔,而R軸受動件為一凸體,經轉動驅動軸而使凸體導入至槽孔。According to an embodiment of the present invention, the R-axis cam driving member is a slot, and the R-axis receiving member is a convex body, and the protruding body is introduced into the slot by rotating the driving shaft.
依據本創作之一實施例,其中Y軸凸輪驅動件為一槽孔,而Y軸受動件為一凸體。According to an embodiment of the present invention, the Y-axis cam drive member is a slot and the Y-axis actuator is a protrusion.
依據本創作之一實施例,其中晶片載送受動構件具有一Y軸第三限位孔,Y軸第三限位孔的周緣並受Z軸偏心軸件的施力而使晶片載送受動構件為一Z軸之移動。According to an embodiment of the present invention, the wafer carrying member has a Y-axis third limiting hole, and the periphery of the Y-axis third limiting hole is biased by the Z-axis eccentric shaft member to cause the wafer to carry the driven member. For a Z-axis movement.
依據本創作之一實施例,其中晶片載送受動構件具有一Z軸滑軌件,Z軸滑軌件對應於雙向導引構件的Z軸導引件。In accordance with an embodiment of the present invention, wherein the wafer carrying member has a Z-axis rail member, the Z-axis rail member corresponds to the Z-axis guide member of the bidirectional guiding member.
依據本創作之一實施例,其中支撐構件具有一Y軸滑軌件,雙向導引構件藉由Y軸滑軌件而在Y軸滑動。In accordance with an embodiment of the present invention, wherein the support member has a Y-axis slide member that slides on the Y-axis by the Y-axis slide member.
依據本創作之一實施例,其中驅動機構為一驅動馬達。According to an embodiment of the present invention, the drive mechanism is a drive motor.
依據本創作之一實施例,更包括一凸輪固定件,穿設於R軸凸輪構件以及Y軸凸輪構件之間,以使R軸凸輪構件以及Y軸凸輪構件受驅動機構而同時旋轉。According to an embodiment of the present invention, a cam fixing member is further disposed between the R-axis cam member and the Y-axis cam member to simultaneously rotate the R-axis cam member and the Y-axis cam member by the driving mechanism.
經由本創作所採用之技術手段,晶片移載裝置能夠僅以單驅動軸單馬達之結構而達到三軸方向之控制,不僅能夠節省裝置之建構成本,更能降低裝置運作時的能源消耗,並且減少操作時的馬達震動,以使移載晶片更加地穩定。此外,由於僅使用單馬達而達到三軸控制,因此馬達控制能夠簡化。Through the technical means adopted by the present invention, the wafer transfer device can control the three-axis direction only by the structure of the single drive shaft single motor, which not only saves the construction cost of the device, but also reduces the energy consumption when the device operates, and Reduce motor vibration during operation to make the transfer wafer more stable. In addition, since three-axis control is achieved using only a single motor, motor control can be simplified.
本創作所採用的具體實施例,將藉由以下之實施例及附呈圖式作進一步之說明。The specific embodiments of the present invention will be further described by the following examples and accompanying drawings.
100‧‧‧晶片移載裝置100‧‧‧ wafer transfer device
1‧‧‧驅動軸機構1‧‧‧Drive shaft mechanism
11‧‧‧受驅動機構11‧‧‧Driven institutions
12‧‧‧軸件12‧‧‧ shaft parts
13‧‧‧凸輪固定件13‧‧‧Cam fixtures
131‧‧‧固定柱131‧‧‧Fixed column
2‧‧‧本體2‧‧‧ Ontology
21‧‧‧中央軸孔21‧‧‧Central shaft hole
22‧‧‧R軸滑槽22‧‧‧R-axis chute
221‧‧‧滑軌221‧‧‧rails
3‧‧‧支撐構件3‧‧‧Support members
31‧‧‧中央軸孔31‧‧‧Central shaft hole
32‧‧‧Y軸第一限位孔32‧‧‧Y-axis first limit hole
33‧‧‧Y軸滑軌件33‧‧‧Y-axis rail parts
34‧‧‧R軸滑軌件34‧‧‧R-axis slides
4‧‧‧R軸凸輪構件4‧‧‧R-axis cam member
41‧‧‧R軸凸輪軸孔41‧‧‧R-axis camshaft hole
42‧‧‧R軸凸輪驅動件42‧‧‧R-axis cam drive
43‧‧‧R軸凸輪固定孔43‧‧‧R-axis cam fixing hole
5‧‧‧R軸受動構件5‧‧‧R-axis driven components
51‧‧‧基板51‧‧‧Substrate
52‧‧‧晶片轉載件52‧‧‧ wafer transfer parts
53‧‧‧滑塊53‧‧‧ Slider
54‧‧‧R軸受動件54‧‧‧R-axis actuator
541‧‧‧R軸軸承滾輪541‧‧‧R-axis bearing roller
6‧‧‧Y軸凸輪構件6‧‧‧Y-axis cam member
61‧‧‧Y軸凸輪軸孔61‧‧‧Y-axis camshaft hole
62‧‧‧Y軸凸輪驅動件62‧‧‧Y-axis cam drive
63‧‧‧Y軸凸輪固定孔63‧‧‧Y-axis cam fixing hole
7‧‧‧雙向導引構件7‧‧‧Bidirectional guiding member
71‧‧‧Y軸第二限位孔71‧‧‧Y-axis second limit hole
72‧‧‧Z軸導引件72‧‧‧Z-axis guide
721‧‧‧滑軌721‧‧‧rails
73‧‧‧Y軸受動件73‧‧‧Y-axis actuator
8‧‧‧Z軸偏心軸構件8‧‧‧Z-axis eccentric shaft member
81‧‧‧中心軸孔81‧‧‧Center shaft hole
82‧‧‧Z軸偏心軸件82‧‧‧Z-axis eccentric shaft parts
9‧‧‧晶片載送受動構件9‧‧‧The wafer carries the driven member
91‧‧‧Z軸滑移構件91‧‧‧Z-axis glide member
911‧‧‧Y軸第三限位孔911‧‧‧Y-axis third limit hole
92‧‧‧晶片載送件92‧‧‧ wafer carrier
W‧‧‧晶片W‧‧‧ wafer
第1圖係顯示依據本創作之一實施例的晶片移載裝置的立體示意圖;第2圖與第3圖係顯示依據本創作之一實施例的晶片移載裝置的立體爆炸圖;第4圖係顯示依據本創作之一實施例的晶片移載裝置於初始位置的透視示意圖;第5圖係顯示依據本創作之一實施例的晶片移載裝置於進程後的透視示意圖;第6圖係顯示依據本創作之一實施例的晶片移載裝置於初始位置的正視圖;第7圖係顯示依據本創作之一實施例的晶片移載裝置於進程後的正視圖;第8圖係顯示依據本創作之一實施例的晶片移載裝置於返程後的正視圖。1 is a perspective view showing a wafer transfer device according to an embodiment of the present invention; FIGS. 2 and 3 are perspective exploded views of a wafer transfer device according to an embodiment of the present invention; FIG. A perspective view showing a wafer transfer device according to an embodiment of the present invention in an initial position; FIG. 5 is a schematic perspective view showing a wafer transfer device according to an embodiment of the present invention; A front view of the wafer transfer device according to an embodiment of the present invention in an initial position; FIG. 7 is a front elevational view of the wafer transfer device according to an embodiment of the present invention; FIG. 8 is a view showing A front view of the wafer transfer device of one of the embodiments is shown after the return.
請參閱第1圖至第3圖,依據本創作之一實施例的一種晶片移載裝置100,包含:一驅動軸機構1、一本體2、一支撐構件3、一R軸凸輪構件4、一R軸受動構件5、一Y軸凸輪構件6、一雙向導引構件7、一Z軸偏心軸構件8、以及一晶片載送受動構件9。Referring to FIGS. 1 to 3 , a wafer transfer device 100 according to an embodiment of the present invention includes: a drive shaft mechanism 1 , a body 2 , a support member 3 , an R-axis cam member 4 , and a The R-axis driven member 5, a Y-axis cam member 6, a bidirectional guiding member 7, a Z-axis eccentric shaft member 8, and a wafer carrying driven member 9.
驅動軸機構1包括一驅動機構11、一軸件12、以及一凸輪固定件13。驅動機構11係為一馬達。軸件12一端連接驅動機構11,另一端則供R軸凸輪構件4及Y軸凸輪構件6套設。軸件12受驅動機構11帶動而旋轉作動,進而帶動R軸凸輪構件4及Y軸凸輪構件6旋轉。The drive shaft mechanism 1 includes a drive mechanism 11, a shaft member 12, and a cam holder 13. The drive mechanism 11 is a motor. The shaft member 12 is connected to the drive mechanism 11 at one end, and the R-axis cam member 4 and the Y-axis cam member 6 are sleeved at the other end. The shaft member 12 is rotated by the drive mechanism 11 to drive the R-axis cam member 4 and the Y-axis cam member 6 to rotate.
凸輪固定件13一端係套設於軸件12上,另一端則凸設有朝向X軸延伸的一固定柱131。固定柱131穿設於R軸凸輪構件4以及Y軸凸輪構件6之間,以使R軸凸輪構件4以及Y軸凸輪構件6在旋轉時能夠保持固定的相對位置,使得晶片移載裝置100作動時的精確度更佳。One end of the cam fixing member 13 is sleeved on the shaft member 12, and the other end is convexly provided with a fixing post 131 extending toward the X-axis. The fixing post 131 is disposed between the R-axis cam member 4 and the Y-axis cam member 6 such that the R-axis cam member 4 and the Y-axis cam member 6 can maintain a fixed relative position when rotated, so that the wafer transfer device 100 operates The accuracy is better.
本體2包括一中央軸孔21以及一R軸滑槽22。中央軸孔21用以供軸件12設置於其中。R軸滑槽22位於本體2之左側,內側設置有平行於R軸的一滑軌221。The body 2 includes a central shaft hole 21 and an R-axis chute 22. The central shaft hole 21 is for the shaft member 12 to be disposed therein. The R-axis chute 22 is located on the left side of the body 2, and a slide rail 221 parallel to the R-axis is disposed on the inner side.
支撐構件3設置於本體2之前側。支撐構件3具有中央軸孔31以及一Y軸第一限位孔32,並包括一Y軸滑軌件33以及一R軸滑軌件34。中央軸孔31為軸件12所穿過。Y軸第一限位孔32係為孔型與Y軸平行的一長條孔。Y軸滑軌件33係為兩滑軌,分別設置於Y軸第一限位孔32的上下兩側而平行於Y軸。R軸滑軌件34係為一滑軌,其係設置於支撐構件3之左前側並平行於R軸。The support member 3 is disposed on the front side of the body 2. The support member 3 has a central shaft hole 31 and a Y-axis first limiting hole 32, and includes a Y-axis slide member 33 and an R-axis slide member 34. The central shaft hole 31 is through which the shaft member 12 passes. The Y-axis first limiting hole 32 is a long hole in which the hole type is parallel to the Y-axis. The Y-axis rail member 33 is a two-slide rail, which is respectively disposed on the upper and lower sides of the Y-axis first limiting hole 32 and parallel to the Y-axis. The R-axis rail member 34 is a slide rail that is disposed on the left front side of the support member 3 and parallel to the R-axis.
R軸凸輪構件4係為一盤型凸輪,具有一R軸凸輪軸孔41、一R軸凸輪驅動件42、以及一R軸凸輪固定孔43。R 軸凸輪軸孔41設置於盤型凸輪之圓心處,供軸件12穿設於其中,以使驅動軸機構1帶動R軸凸輪構件4以X軸為旋轉軸而旋轉。R軸凸輪驅動件42係為R軸凸輪構件4之周緣,接觸R軸受動構件5並帶動R軸受動構件5沿著R軸作動。不過,R軸凸輪驅動件42也可為一槽孔,供R軸受動構件5之一R軸受動件(例如,一凸塊)導入槽孔之中,以使R軸受動構件5沿著R軸作動。R軸凸輪固定孔43設置鄰近於R軸凸輪軸孔41處,供固定柱131穿設於其中。在本實施例中,R軸凸輪構件4在進程時係為逆時針旋轉。The R-axis cam member 4 is a disc type cam having an R-axis cam shaft hole 41, an R-axis cam driving member 42, and an R-axis cam fixing hole 43. R The shaft camshaft hole 41 is disposed at the center of the disc cam, and the shaft member 12 is bored therein such that the drive shaft mechanism 1 drives the R-axis cam member 4 to rotate with the X-axis as a rotation axis. The R-axis cam driver 42 is a peripheral edge of the R-axis cam member 4, and contacts the R-axis driven member 5 to drive the R-axis driven member 5 to move along the R-axis. However, the R-axis cam driving member 42 may also be a slot for introducing an R-axis actuator (for example, a bump) of the R-axis driven member 5 into the slot so that the R-axis driven member 5 is along the R The shaft is actuated. The R-axis cam fixing hole 43 is disposed adjacent to the R-axis cam shaft hole 41 for the fixing post 131 to pass therethrough. In the present embodiment, the R-axis cam member 4 is rotated counterclockwise during the process.
詳細而言,隨著R軸凸輪構件4之進程旋轉角度增加,R軸凸輪構件4之內徑(外緣輪廓到R軸凸輪軸孔41的長度)係為漸縮。較佳地,R軸凸輪構件4可挖有多個開孔,以減輕R軸凸輪構件4的重量而降低轉動慣量,進而使R軸凸輪構件4易於旋轉。In detail, as the rotation angle of the process of the R-axis cam member 4 increases, the inner diameter of the R-axis cam member 4 (the length of the outer-edge contour to the length of the R-axis camshaft hole 41) is tapered. Preferably, the R-axis cam member 4 can be dug with a plurality of openings to reduce the weight of the R-axis cam member 4 and reduce the moment of inertia, thereby making the R-axis cam member 4 easy to rotate.
R軸受動構件5包括一基板51、一晶片轉載件52、兩組滑塊53、以及一R軸受動件54。晶片轉載件52設置於基板51之外側面。兩組滑塊53係設置於基板51之上側面而平行於R軸,且兩滑塊53相間隔一距離。R軸受動構件5藉由滑塊53而滑設於滑軌121以及R軸滑軌件34,以使R軸受動構件5沿著R軸作動。R軸受動件54設置於基板51之上側面而位於兩組滑塊53之間,自基板51之上側面而垂直向上延伸。一R軸軸承滾輪541設置於R軸受動件54之延伸末端處,並靠置於R軸凸輪驅動件42。The R-axis driven member 5 includes a substrate 51, a wafer transfer member 52, two sets of sliders 53, and an R-axis actuator 54. The wafer transfer member 52 is disposed on the outer side of the substrate 51. The two sets of sliders 53 are disposed on the upper side of the substrate 51 and parallel to the R axis, and the two sliders 53 are spaced apart by a distance. The R-axis driven member 5 is slidably provided to the slide rail 121 and the R-axis slide rail member 34 by the slider 53, so that the R-axis driven member 5 is actuated along the R-axis. The R-axis actuator 54 is disposed on the upper surface of the substrate 51 between the two sets of the sliders 53 and extends vertically upward from the upper side of the substrate 51. An R-axis bearing roller 541 is disposed at the extended end of the R-axis actuator 54 and rests on the R-axis cam drive member 42.
Y軸凸輪構件6係為一槽型凸輪,具有一Y軸凸輪軸孔61、一Y軸凸輪驅動件62、以及一Y軸凸輪固定孔63。Y軸凸輪軸孔61設置於盤型凸輪之圓心處,軸件12穿設於Y軸凸輪軸孔61中,以使驅動軸機構1帶動Y軸凸輪構件6以X軸為旋轉軸而旋轉。Y軸凸輪驅動件62係為一導引槽,其係對應Y軸 凸輪構件6之外緣輪廓的形狀而凹設於表面處。Y軸凸輪固定孔63係設置於表面處而鄰近Y軸凸輪軸孔61,供固定柱131穿設其中。The Y-axis cam member 6 is a groove type cam having a Y-axis cam shaft hole 61, a Y-axis cam driving member 62, and a Y-axis cam fixing hole 63. The Y-axis camshaft hole 61 is disposed at the center of the disc cam, and the shaft member 12 is bored in the Y-axis camshaft hole 61 such that the drive shaft mechanism 1 drives the Y-axis cam member 6 to rotate with the X-axis as a rotation axis. The Y-axis cam driving member 62 is a guiding groove corresponding to the Y-axis. The shape of the outer edge contour of the cam member 6 is recessed at the surface. The Y-axis cam fixing hole 63 is provided at the surface adjacent to the Y-axis cam shaft hole 61 through which the fixing post 131 is inserted.
雙向導引構件7係呈「L」字型,設置於支撐構件3之前側。雙向導引構件7具有一Y軸第二限位孔71,包括一Z軸導引件72以及一Y軸受動件73。Y軸第二限位孔71係為一長條孔,其孔型平行於Y軸。Z軸導引件72係為一滑軌,設置於雙向導引構件7之右側而平行於Z軸。Y軸受動件73設置於雙向導引構件7之後側,其可穿於支撐構件3的Y軸第一限位孔32後,而容置於Y軸凸輪構件6的Y軸凸輪驅動件62(導引槽)之中。在本實施例中,Y軸受動件73係為一軸承滾輪,而可滾動於Y軸凸輪驅動件62之中。The bidirectional guide member 7 has an "L" shape and is disposed on the front side of the support member 3. The bidirectional guiding member 7 has a Y-axis second limiting hole 71, and includes a Z-axis guiding member 72 and a Y-axis receiving member 73. The Y-axis second limiting hole 71 is a long hole whose hole shape is parallel to the Y-axis. The Z-axis guide 72 is a slide rail that is disposed on the right side of the bidirectional guide member 7 and parallel to the Z-axis. The Y-axis actuator 73 is disposed on the rear side of the bidirectional guiding member 7, which can pass through the Y-axis first limiting hole 32 of the supporting member 3, and is accommodated in the Y-axis cam driving member 62 of the Y-axis cam member 6 ( In the guide slot). In the present embodiment, the Y-axis actuator 73 is a bearing roller that can be rolled into the Y-axis cam driver 62.
Z軸偏心軸構件8具有一中心軸孔81以及一Z軸偏心軸件82。Z軸偏心軸構件8一端連接於穿過Y軸第二限位孔71的軸件12,Z軸偏心軸件82則設置於另一端。在本實施例中,Z軸偏心軸件82係為一軸承滾輪。The Z-axis eccentric shaft member 8 has a center shaft hole 81 and a Z-axis eccentric shaft member 82. One end of the Z-axis eccentric shaft member 8 is connected to the shaft member 12 passing through the Y-axis second limiting hole 71, and the Z-axis eccentric shaft member 82 is disposed at the other end. In the present embodiment, the Z-axis eccentric shaft member 82 is a bearing roller.
晶片載送受動構件9固設於雙向導引構件7之前側。晶片載送受動構件9包括一Z軸滑移構件91以及一晶片載送件92。Z軸滑移構件91係為一滑台,具有一Y軸第三限位孔911。Z軸滑移構件91滑設於滑軌721上,而能夠作動於Z軸。Y軸第三限位孔911設置於Z軸滑移構件91之左側,用以容置Z軸偏心軸件82。晶片載送件92設置於Z軸滑移構件91之前側,能夠吸取晶片載送件92正下方之晶片W。The wafer carrier member 17 is fixed to the front side of the bidirectional guide member 7. The wafer carrier member 9 includes a Z-axis slide member 91 and a wafer carrier 92. The Z-axis slide member 91 is a slide table having a Y-axis third limit hole 911. The Z-axis sliding member 91 is slidably disposed on the slide rail 721 and is movable on the Z-axis. The Y-axis third limiting hole 911 is disposed on the left side of the Z-axis sliding member 91 for accommodating the Z-axis eccentric shaft member 82. The wafer carrier 92 is disposed on the front side of the Z-axis slide member 91, and is capable of sucking the wafer W directly under the wafer carrier 92.
請同時參閱第4圖至第8圖。第4圖、第6圖係顯示晶片移載裝置100位於初始位置的示意圖。此時R軸凸輪構件4、Y軸凸輪構件6以及Z軸偏心軸構件8位於一初始位置,R軸受動構件5以R軸受動件54靠置於R軸凸輪構件4而保持一高度,雙向導引構件7則藉由Y軸受動件73而靜止於Y軸第一限 位孔32之右側。Please also refer to Figures 4 to 8. 4 and 6 are schematic views showing the wafer transfer device 100 in an initial position. At this time, the R-axis cam member 4, the Y-axis cam member 6, and the Z-axis eccentric shaft member 8 are at an initial position, and the R-axis driven member 5 is held at a height by the R-axis actuator 54 against the R-axis cam member 4, bidirectional The guiding member 7 is stationary at the Y-axis first limit by the Y-axis actuator 73 The right side of the bit hole 32.
當晶片移載裝置100欲進行晶片W之移載作業時,驅動軸機構1以逆時針方向旋轉而為進程,並帶動R軸凸輪構件4以及Y軸凸輪構件6旋轉。此時R軸凸輪構件4之內徑隨著進程旋轉角度增加而為漸縮,亦即,R軸凸輪構件4之外緣側距離圓心之距離越來越短,靠置在R軸凸輪構件4外緣端的R軸受動件54因此逐漸靠近圓心,進而帶動R軸受動構件5沿著R軸而於滑軌121以及R軸滑軌件34下滑。Y軸受動件73設置於Y軸凸輪驅動件62之中,由於Y軸凸輪驅動件62之設計,故進程時,Y軸受動件73會先滯留初始位置一段時間,再受槽壁之正向力導引而沿著Y軸作動,進而帶動雙向導引構件7沿著Y軸作動。When the wafer transfer device 100 is to perform the transfer operation of the wafer W, the drive shaft mechanism 1 rotates in the counterclockwise direction to drive the R-axis cam member 4 and the Y-axis cam member 6 to rotate. At this time, the inner diameter of the R-axis cam member 4 is tapered as the process rotation angle increases, that is, the distance from the outer edge side of the R-axis cam member 4 to the center of the circle is shorter and shorter, and the R-axis cam member 4 is placed. The R-axis actuator 54 at the outer edge end thus gradually approaches the center of the circle, thereby driving the R-axis driven member 5 to slide down the rail 121 and the R-axis rail member 34 along the R-axis. The Y-axis actuator 73 is disposed in the Y-axis cam driver 62. Due to the design of the Y-axis cam driver 62, the Y-axis actuator 73 will remain in the initial position for a period of time before being subjected to the positive force of the groove wall. Guided to act along the Y axis, thereby driving the bidirectional guiding member 7 to move along the Y axis.
同時,Z軸偏心軸件82以逆時針旋轉,而卡於Y軸第三限位孔911。故Z軸偏心軸件82以向上之分力而帶動Z軸滑移構件91於滑軌721沿著Z軸上升。當進程旋轉角度超過180度時,Z軸偏心軸件82則改以向下之Z軸分力帶動Z軸滑移構件91於滑軌721沿著Z軸下降。At the same time, the Z-axis eccentric shaft member 82 rotates counterclockwise and is engaged with the Y-axis third limiting hole 911. Therefore, the Z-axis eccentric shaft member 82 drives the Z-axis sliding member 91 to rise along the Z-axis on the slide rail 721 with an upward component force. When the process rotation angle exceeds 180 degrees, the Z-axis eccentric shaft member 82 is driven by the downward Z-axis component to drive the Z-axis glide member 91 to descend along the Z-axis of the slide rail 721.
如此一來,當晶片移載裝置100,R軸受動構件5自初始位置而沿著R軸向下滑移,而晶片載送受動構件9則先受Z軸偏心軸件82而沿著Z軸向上滑移,並且晶片載送受動構件9受雙向導引構件7帶動而沿著Y軸向左橫移,以使晶片載送件92將吸取之晶片W放置於晶片轉載件52。As a result, when the wafer transfer device 100, the R-axis driven member 5 slides down from the initial position along the R axis, and the wafer carrying the driven member 9 is first subjected to the Z-axis eccentric shaft member 82 along the Z-axis. The wafer is moved upward, and the wafer-carrying member 9 is traversed leftward along the Y-axis by the bidirectional guiding member 7 to cause the wafer carrier 92 to place the sucked wafer W on the wafer carrier 52.
之後,晶片移載裝置100若欲進行返程作業,以將晶片轉載件52上之晶片W移載至別處,則驅動軸機構1以順時針方向旋轉,並帶動R軸凸輪構件4以及Y軸凸輪構件6旋轉回復至初始位置,其作動細節與前述類似而僅為反向作動,故在此不再贅述。從而,晶片載送件92回到初始位置並預備吸取下個晶片,而晶片轉載件52則將晶片W沿著R軸載送至下一階段的製程。Thereafter, if the wafer transfer device 100 is to perform a returning operation to transfer the wafer W on the wafer carrier 52 to another position, the drive shaft mechanism 1 rotates in a clockwise direction and drives the R-axis cam member 4 and the Y-axis cam. The member 6 is rotated back to the initial position, and the actuation details are similar to the foregoing and are only reversed, and therefore will not be described herein. Thus, the wafer carrier 92 returns to the initial position and is ready to pick up the next wafer, while the wafer carrier 52 carries the wafer W along the R axis to the next stage of the process.
藉由上述之結構,晶片移載裝置100能夠僅以單驅動軸單馬達之結構而達到三軸方向之控制,不僅能夠節省裝置之建構成本,更能降低裝置運作時的能源消耗,並且減少操作時的馬達震動,以使移載晶片更加地穩定。此外,由於僅使用單馬達而達到三軸控制,因此馬達控制能夠簡化。According to the above configuration, the wafer transfer device 100 can achieve the control of the three-axis direction only by the structure of the single drive shaft single motor, which not only saves the construction cost of the device, but also reduces the energy consumption during the operation of the device, and reduces the operation. The motor shakes at the time to make the transfer wafer more stable. In addition, since three-axis control is achieved using only a single motor, motor control can be simplified.
以上之敘述僅為本創作之較佳實施例說明,凡精於此項技藝者當可依據上述之說明而作其他種種之改良,惟這些改變仍屬於本創作之創作精神及以下所界定之專利範圍中。The above description is only for the preferred embodiment of the present invention, and those skilled in the art can make other improvements according to the above description, but these changes still belong to the creative spirit of the creation and the patents defined below. In the scope.
100‧‧‧晶片移載裝置100‧‧‧ wafer transfer device
2‧‧‧本體2‧‧‧ Ontology
3‧‧‧支撐構件3‧‧‧Support members
34‧‧‧R軸滑軌件34‧‧‧R-axis slides
4‧‧‧R軸凸輪構件4‧‧‧R-axis cam member
5‧‧‧R軸受動構件5‧‧‧R-axis driven components
52‧‧‧晶片轉載件52‧‧‧ wafer transfer parts
54‧‧‧R軸受動件54‧‧‧R-axis actuator
541‧‧‧R軸軸承滾輪541‧‧‧R-axis bearing roller
7‧‧‧雙向導引構件7‧‧‧Bidirectional guiding member
72‧‧‧Z軸導引件72‧‧‧Z-axis guide
721‧‧‧滑軌721‧‧‧rails
8‧‧‧Z軸偏心軸構件8‧‧‧Z-axis eccentric shaft member
81‧‧‧中心軸孔81‧‧‧Center shaft hole
82‧‧‧Z軸偏心軸件82‧‧‧Z-axis eccentric shaft parts
9‧‧‧而晶片載送受動構件9‧‧‧The wafer carries the driven member
92‧‧‧晶片載送件92‧‧‧ wafer carrier
Claims (8)
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TW102211453U TWM471672U (en) | 2013-06-19 | 2013-06-19 | Wafer transfer apparatus |
CN201320369763.4U CN203450841U (en) | 2013-06-19 | 2013-06-26 | Chip transfer device |
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TW102211453U TWM471672U (en) | 2013-06-19 | 2013-06-19 | Wafer transfer apparatus |
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2013
- 2013-06-19 TW TW102211453U patent/TWM471672U/en not_active IP Right Cessation
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