TWM471672U - Wafer transfer apparatus - Google Patents

Description

Wafer transfer device

The present invention relates to a wafer transfer device, and more particularly to a wafer transfer device having a single drive shaft structure.

During the manufacturing process of the wafer, there is a need to move the wafer to match the needs of the various stages of the process. The direction in which the wafer is transferred is generally divided into Y-axis transfer, Z-axis transfer, and R-axis transfer. The so-called Y-axis transfer generally refers to transporting the wafer in a horizontal direction. The so-called Z-axis transfer generally refers to transporting the wafer in a vertical horizontal direction, and the so-called R-axis transfer generally refers to Y-axis transfer and Z-axis shift. The combination of loading, that is, R-axis transfer, refers to transporting the wafer in a non-horizontal and non-perpendicular direction.

In order to achieve the above-mentioned Y-axis transfer, Z-axis transfer, and R-axis transfer, the conventional wafer transfer device has three drive shafts, each of which corresponds to the aforementioned Y-axis transfer, Z-axis transfer, And one of the R-axis shifts. In the architecture of such three drive shafts, three motors are generally required, and the energy consumption and vibration brought by them have adverse effects on cost and product quality. In addition, since there are three drive shafts and three motors, the mutual cooperation, especially the cooperation between the drive shaft and the drive shaft, will be very complicated, and the design cost thereof will be improved, and the crystal thereof will be improved. Density is also reduced by the complexity of the design itself. Even if the three drive shafts are changed to two drive shafts, the design complexity, precision, and cost of the required lift are still a problem.

Therefore, the present invention provides a device for transferring wafers in a single drive shaft and a single motor to solve the conventional wafer transfer device. Cost, energy consumption, vibration and other issues.

The present invention provides a wafer transfer device for solving the problems of the prior art, comprising: a drive shaft driven by a drive mechanism; an R-axis cam member having an R-axis camshaft hole, and An R-axis cam drive member, the R-axis camshaft hole rotates the R-axis cam member for the drive shaft to pass therethrough; an R-axis driven member has a wafer transfer member and an R-axis actuator, and the R-axis driven member is R The shaft actuating member is driven by the R-axis cam driving member to translate in an R-axis; a Y-axis cam member having a Y-axis cam shaft hole and a Y-axis cam driving member, the Y-axis cam shaft hole being worn by the driving shaft And rotating the Y-axis cam member; a support member having a Y-axis first limiting hole through which the support member passes; a bidirectional guiding member having a Y-axis second limiting hole and a Z-axis a guiding member, the Z-axis guiding member is coupled to the Y-axis cam driving member through a Y-axis receiving member passing through the Y-axis first limiting hole; a Z-axis eccentric shaft member having one end connected to the Y-axis through The drive shaft of the second limiting hole has a Z-axis eccentric shaft member at the other end; Member having a wafer carrying member, and carrying the wafer by the movable member and by a Z-axis and the Y-axis of the bi-directional movement of the guide member movable in the Z-axis and the eccentric shaft.

According to an embodiment of the present invention, the R-axis cam driving member is a slot, and the R-axis receiving member is a convex body, and the protruding body is introduced into the slot by rotating the driving shaft.

According to an embodiment of the present invention, the Y-axis cam drive member is a slot and the Y-axis actuator is a protrusion.

According to an embodiment of the present invention, the wafer carrying member has a Y-axis third limiting hole, and the periphery of the Y-axis third limiting hole is biased by the Z-axis eccentric shaft member to cause the wafer to carry the driven member. For a Z-axis movement.

In accordance with an embodiment of the present invention, wherein the wafer carrying member has a Z-axis rail member, the Z-axis rail member corresponds to the Z-axis guide member of the bidirectional guiding member.

In accordance with an embodiment of the present invention, wherein the support member has a Y-axis slide member that slides on the Y-axis by the Y-axis slide member.

According to an embodiment of the present invention, the drive mechanism is a drive motor.

According to an embodiment of the present invention, a cam fixing member is further disposed between the R-axis cam member and the Y-axis cam member to simultaneously rotate the R-axis cam member and the Y-axis cam member by the driving mechanism.

Through the technical means adopted by the present invention, the wafer transfer device can control the three-axis direction only by the structure of the single drive shaft single motor, which not only saves the construction cost of the device, but also reduces the energy consumption when the device operates, and Reduce motor vibration during operation to make the transfer wafer more stable. In addition, since three-axis control is achieved using only a single motor, motor control can be simplified.

The specific embodiments of the present invention will be further described by the following examples and accompanying drawings.

100‧‧‧ wafer transfer device

1‧‧‧Drive shaft mechanism

11‧‧‧Driven institutions

12‧‧‧ shaft parts

13‧‧‧Cam fixtures

131‧‧‧Fixed column

2‧‧‧ Ontology

21‧‧‧Central shaft hole

22‧‧‧R-axis chute

221‧‧‧rails

3‧‧‧Support members

31‧‧‧Central shaft hole

32‧‧‧Y-axis first limit hole

33‧‧‧Y-axis rail parts

34‧‧‧R-axis slides

4‧‧‧R-axis cam member

41‧‧‧R-axis camshaft hole

42‧‧‧R-axis cam drive

43‧‧‧R-axis cam fixing hole

5‧‧‧R-axis driven components

51‧‧‧Substrate

52‧‧‧ wafer transfer parts

53‧‧‧ Slider

54‧‧‧R-axis actuator

541‧‧‧R-axis bearing roller

6‧‧‧Y-axis cam member

61‧‧‧Y-axis camshaft hole

62‧‧‧Y-axis cam drive

63‧‧‧Y-axis cam fixing hole

7‧‧‧Bidirectional guiding member

71‧‧‧Y-axis second limit hole

72‧‧‧Z-axis guide

721‧‧‧rails

73‧‧‧Y-axis actuator

8‧‧‧Z-axis eccentric shaft member

81‧‧‧Center shaft hole

82‧‧‧Z-axis eccentric shaft parts

9‧‧‧The wafer carries the driven member

91‧‧‧Z-axis glide member

911‧‧‧Y-axis third limit hole

92‧‧‧ wafer carrier

W‧‧‧ wafer

1 is a perspective view showing a wafer transfer device according to an embodiment of the present invention; FIGS. 2 and 3 are perspective exploded views of a wafer transfer device according to an embodiment of the present invention; FIG. A perspective view showing a wafer transfer device according to an embodiment of the present invention in an initial position; FIG. 5 is a schematic perspective view showing a wafer transfer device according to an embodiment of the present invention; A front view of the wafer transfer device according to an embodiment of the present invention in an initial position; FIG. 7 is a front elevational view of the wafer transfer device according to an embodiment of the present invention; FIG. 8 is a view showing A front view of the wafer transfer device of one of the embodiments is shown after the return.

Referring to FIGS. 1 to 3 , a wafer transfer device 100 according to an embodiment of the present invention includes: a drive shaft mechanism 1 , a body 2 , a support member 3 , an R-axis cam member 4 , and a The R-axis driven member 5, a Y-axis cam member 6, a bidirectional guiding member 7, a Z-axis eccentric shaft member 8, and a wafer carrying driven member 9.

The drive shaft mechanism 1 includes a drive mechanism 11, a shaft member 12, and a cam holder 13. The drive mechanism 11 is a motor. The shaft member 12 is connected to the drive mechanism 11 at one end, and the R-axis cam member 4 and the Y-axis cam member 6 are sleeved at the other end. The shaft member 12 is rotated by the drive mechanism 11 to drive the R-axis cam member 4 and the Y-axis cam member 6 to rotate.

One end of the cam fixing member 13 is sleeved on the shaft member 12, and the other end is convexly provided with a fixing post 131 extending toward the X-axis. The fixing post 131 is disposed between the R-axis cam member 4 and the Y-axis cam member 6 such that the R-axis cam member 4 and the Y-axis cam member 6 can maintain a fixed relative position when rotated, so that the wafer transfer device 100 operates The accuracy is better.

The body 2 includes a central shaft hole 21 and an R-axis chute 22. The central shaft hole 21 is for the shaft member 12 to be disposed therein. The R-axis chute 22 is located on the left side of the body 2, and a slide rail 221 parallel to the R-axis is disposed on the inner side.

The support member 3 is disposed on the front side of the body 2. The support member 3 has a central shaft hole 31 and a Y-axis first limiting hole 32, and includes a Y-axis slide member 33 and an R-axis slide member 34. The central shaft hole 31 is through which the shaft member 12 passes. The Y-axis first limiting hole 32 is a long hole in which the hole type is parallel to the Y-axis. The Y-axis rail member 33 is a two-slide rail, which is respectively disposed on the upper and lower sides of the Y-axis first limiting hole 32 and parallel to the Y-axis. The R-axis rail member 34 is a slide rail that is disposed on the left front side of the support member 3 and parallel to the R-axis.

The R-axis cam member 4 is a disc type cam having an R-axis cam shaft hole 41, an R-axis cam driving member 42, and an R-axis cam fixing hole 43. R The shaft camshaft hole 41 is disposed at the center of the disc cam, and the shaft member 12 is bored therein such that the drive shaft mechanism 1 drives the R-axis cam member 4 to rotate with the X-axis as a rotation axis. The R-axis cam driver 42 is a peripheral edge of the R-axis cam member 4, and contacts the R-axis driven member 5 to drive the R-axis driven member 5 to move along the R-axis. However, the R-axis cam driving member 42 may also be a slot for introducing an R-axis actuator (for example, a bump) of the R-axis driven member 5 into the slot so that the R-axis driven member 5 is along the R The shaft is actuated. The R-axis cam fixing hole 43 is disposed adjacent to the R-axis cam shaft hole 41 for the fixing post 131 to pass therethrough. In the present embodiment, the R-axis cam member 4 is rotated counterclockwise during the process.

In detail, as the rotation angle of the process of the R-axis cam member 4 increases, the inner diameter of the R-axis cam member 4 (the length of the outer-edge contour to the length of the R-axis camshaft hole 41) is tapered. Preferably, the R-axis cam member 4 can be dug with a plurality of openings to reduce the weight of the R-axis cam member 4 and reduce the moment of inertia, thereby making the R-axis cam member 4 easy to rotate.

The R-axis driven member 5 includes a substrate 51, a wafer transfer member 52, two sets of sliders 53, and an R-axis actuator 54. The wafer transfer member 52 is disposed on the outer side of the substrate 51. The two sets of sliders 53 are disposed on the upper side of the substrate 51 and parallel to the R axis, and the two sliders 53 are spaced apart by a distance. The R-axis driven member 5 is slidably provided to the slide rail 121 and the R-axis slide rail member 34 by the slider 53, so that the R-axis driven member 5 is actuated along the R-axis. The R-axis actuator 54 is disposed on the upper surface of the substrate 51 between the two sets of the sliders 53 and extends vertically upward from the upper side of the substrate 51. An R-axis bearing roller 541 is disposed at the extended end of the R-axis actuator 54 and rests on the R-axis cam drive member 42.

The Y-axis cam member 6 is a groove type cam having a Y-axis cam shaft hole 61, a Y-axis cam driving member 62, and a Y-axis cam fixing hole 63. The Y-axis camshaft hole 61 is disposed at the center of the disc cam, and the shaft member 12 is bored in the Y-axis camshaft hole 61 such that the drive shaft mechanism 1 drives the Y-axis cam member 6 to rotate with the X-axis as a rotation axis. The Y-axis cam driving member 62 is a guiding groove corresponding to the Y-axis. The shape of the outer edge contour of the cam member 6 is recessed at the surface. The Y-axis cam fixing hole 63 is provided at the surface adjacent to the Y-axis cam shaft hole 61 through which the fixing post 131 is inserted.

The bidirectional guide member 7 has an "L" shape and is disposed on the front side of the support member 3. The bidirectional guiding member 7 has a Y-axis second limiting hole 71, and includes a Z-axis guiding member 72 and a Y-axis receiving member 73. The Y-axis second limiting hole 71 is a long hole whose hole shape is parallel to the Y-axis. The Z-axis guide 72 is a slide rail that is disposed on the right side of the bidirectional guide member 7 and parallel to the Z-axis. The Y-axis actuator 73 is disposed on the rear side of the bidirectional guiding member 7, which can pass through the Y-axis first limiting hole 32 of the supporting member 3, and is accommodated in the Y-axis cam driving member 62 of the Y-axis cam member 6 ( In the guide slot). In the present embodiment, the Y-axis actuator 73 is a bearing roller that can be rolled into the Y-axis cam driver 62.

The Z-axis eccentric shaft member 8 has a center shaft hole 81 and a Z-axis eccentric shaft member 82. One end of the Z-axis eccentric shaft member 8 is connected to the shaft member 12 passing through the Y-axis second limiting hole 71, and the Z-axis eccentric shaft member 82 is disposed at the other end. In the present embodiment, the Z-axis eccentric shaft member 82 is a bearing roller.

The wafer carrier member 17 is fixed to the front side of the bidirectional guide member 7. The wafer carrier member 9 includes a Z-axis slide member 91 and a wafer carrier 92. The Z-axis slide member 91 is a slide table having a Y-axis third limit hole 911. The Z-axis sliding member 91 is slidably disposed on the slide rail 721 and is movable on the Z-axis. The Y-axis third limiting hole 911 is disposed on the left side of the Z-axis sliding member 91 for accommodating the Z-axis eccentric shaft member 82. The wafer carrier 92 is disposed on the front side of the Z-axis slide member 91, and is capable of sucking the wafer W directly under the wafer carrier 92.

Please also refer to Figures 4 to 8. 4 and 6 are schematic views showing the wafer transfer device 100 in an initial position. At this time, the R-axis cam member 4, the Y-axis cam member 6, and the Z-axis eccentric shaft member 8 are at an initial position, and the R-axis driven member 5 is held at a height by the R-axis actuator 54 against the R-axis cam member 4, bidirectional The guiding member 7 is stationary at the Y-axis first limit by the Y-axis actuator 73 The right side of the bit hole 32.

When the wafer transfer device 100 is to perform the transfer operation of the wafer W, the drive shaft mechanism 1 rotates in the counterclockwise direction to drive the R-axis cam member 4 and the Y-axis cam member 6 to rotate. At this time, the inner diameter of the R-axis cam member 4 is tapered as the process rotation angle increases, that is, the distance from the outer edge side of the R-axis cam member 4 to the center of the circle is shorter and shorter, and the R-axis cam member 4 is placed. The R-axis actuator 54 at the outer edge end thus gradually approaches the center of the circle, thereby driving the R-axis driven member 5 to slide down the rail 121 and the R-axis rail member 34 along the R-axis. The Y-axis actuator 73 is disposed in the Y-axis cam driver 62. Due to the design of the Y-axis cam driver 62, the Y-axis actuator 73 will remain in the initial position for a period of time before being subjected to the positive force of the groove wall. Guided to act along the Y axis, thereby driving the bidirectional guiding member 7 to move along the Y axis.

At the same time, the Z-axis eccentric shaft member 82 rotates counterclockwise and is engaged with the Y-axis third limiting hole 911. Therefore, the Z-axis eccentric shaft member 82 drives the Z-axis sliding member 91 to rise along the Z-axis on the slide rail 721 with an upward component force. When the process rotation angle exceeds 180 degrees, the Z-axis eccentric shaft member 82 is driven by the downward Z-axis component to drive the Z-axis glide member 91 to descend along the Z-axis of the slide rail 721.

As a result, when the wafer transfer device 100, the R-axis driven member 5 slides down from the initial position along the R axis, and the wafer carrying the driven member 9 is first subjected to the Z-axis eccentric shaft member 82 along the Z-axis. The wafer is moved upward, and the wafer-carrying member 9 is traversed leftward along the Y-axis by the bidirectional guiding member 7 to cause the wafer carrier 92 to place the sucked wafer W on the wafer carrier 52.

Thereafter, if the wafer transfer device 100 is to perform a returning operation to transfer the wafer W on the wafer carrier 52 to another position, the drive shaft mechanism 1 rotates in a clockwise direction and drives the R-axis cam member 4 and the Y-axis cam. The member 6 is rotated back to the initial position, and the actuation details are similar to the foregoing and are only reversed, and therefore will not be described herein. Thus, the wafer carrier 92 returns to the initial position and is ready to pick up the next wafer, while the wafer carrier 52 carries the wafer W along the R axis to the next stage of the process.

According to the above configuration, the wafer transfer device 100 can achieve the control of the three-axis direction only by the structure of the single drive shaft single motor, which not only saves the construction cost of the device, but also reduces the energy consumption during the operation of the device, and reduces the operation. The motor shakes at the time to make the transfer wafer more stable. In addition, since three-axis control is achieved using only a single motor, motor control can be simplified.

The above description is only for the preferred embodiment of the present invention, and those skilled in the art can make other improvements according to the above description, but these changes still belong to the creative spirit of the creation and the patents defined below. In the scope.

100‧‧‧ wafer transfer device

2‧‧‧ Ontology

3‧‧‧Support members

34‧‧‧R-axis slides

4‧‧‧R-axis cam member

5‧‧‧R-axis driven components

52‧‧‧ wafer transfer parts

54‧‧‧R-axis actuator

541‧‧‧R-axis bearing roller

7‧‧‧Bidirectional guiding member

72‧‧‧Z-axis guide

721‧‧‧rails

8‧‧‧Z-axis eccentric shaft member

81‧‧‧Center shaft hole

82‧‧‧Z-axis eccentric shaft parts

9‧‧‧The wafer carries the driven member

92‧‧‧ wafer carrier

Claims (8)

A wafer transfer device comprising: a drive shaft driven by a drive mechanism; an R-axis cam member having an R-axis camshaft bore and an R-axis cam drive member for the drive The R-axis cam member is rotated by the shaft; an R-axis driven member has a wafer transfer member and an R-axis actuator, and the R-axis driven member is received by the R-axis cam member Driving and translating in an R-axis; a Y-axis cam member having a Y-axis camshaft bore and a Y-axis cam drive member for rotating the Y-axis cam member for the drive shaft to pass therethrough a support member having a Y-axis first limiting hole through which the support member passes; a bidirectional guiding member having a Y-axis second limiting hole and a Z-axis guiding member, The Z-axis guide member is coupled to the Y-axis cam drive member through a Y-axis driven member passing through the Y-axis first limit hole; a Z-axis eccentric shaft member having one end connected to the Y-axis through the second The drive shaft of the limiting hole has a Z-axis eccentric shaft member at the other end; a wafer carrying the driven member has a crystal Carrying member, carrying the wafer and the Z-axis and the Y axis by movement of the movable member to move by the bidirectional guide member and the Z-axis of the eccentric shaft. The wafer transfer device of claim 1, wherein the R-axis cam drive member is a slot, and the R-axis actuator is a protrusion, and the protrusion is introduced into the slot by rotating the drive shaft. hole. The wafer transfer device of claim 1, wherein the Y-axis cam drive member is a slot and the Y-axis actuator is a protrusion. The wafer transfer device of claim 1, wherein the wafer is carried by The movable member has a Y-axis third limiting hole, and the peripheral edge of the Y-axis third limiting hole is biased by the Z-axis eccentric shaft member to cause the wafer to carry the Z-axis movement. The wafer transfer device of claim 1, wherein the wafer-carrying member has a Z-axis slide member corresponding to the Z-axis guide of the bidirectional guide member. The wafer transfer device of claim 1, wherein the support member has a Y-axis slide member that slides on the Y-axis by the Y-axis slide member. The wafer transfer device of claim 1, wherein the drive mechanism is a drive motor. The wafer transfer device of claim 1, further comprising a cam fixing member disposed between the R-axis cam member and the Y-axis cam member to cause the R-axis cam member and the Y-axis cam member Rotate simultaneously by the drive mechanism.