TWM471120U - Automatic pasting machine - Google Patents

Description

Automatic laminating machine

The present invention relates to an automatic laminating machine, in particular to an upper and lower heater for heating a reinforcing plate by using an upper heater accompanying the movement of the nozzle, or heating the printed circuit board by using the lower heater. An automatic laminating machine that makes the reinforcing plate or the glue on the substrate easier to melt, so that the reinforcing plate and the substrate are easier to adhere to each other.

A printed circuit board (PCB) is widely used in electronic products and can be used to mount a carrier electronic device. Generally, a printed circuit board can include a rigid circuit substrate, a flexible circuit substrate, and a hard and flexible combined circuit substrate. In order to improve the bearing capacity, electromagnetic shielding or heat dissipation efficiency of the circuit board in combination with hard, soft or soft and hard, a reinforcing board is attached to a part of the circuit board. When the Die Bond process or the Wire Bond process is performed, the strength of the soft board on the circuit board is insufficient due to the hard and soft, so after the soft board or the soft and hard board is completed, A reinforced plate will be attached to the soft board to facilitate the Die Bond or Wire Bond process.

At present, the manner of attaching the reinforcing plate to the printed circuit board can be divided into a manual bonding method or a mechanical device automatic bonding method. The manual bonding method mainly involves placing the reinforcing plate on the printed circuit board, and then heating the reinforcing plate by using an iron. Since the reinforcing plate or the substrate has a glue, the reinforcing plate can be adhered after being heated to melt the glue. Printed circuit board. Such a heating and fitting method is time-consuming and labor-intensive, and it is difficult to control the alignment accuracy.

However, at present, if the reinforcing plate is automatically attached by a mechanical device, the suction plate is mainly used to adsorb the reinforcing plate, and the reinforcing plate is directly heated by the nozzle to provide a heat conduction function, so that the glue of the reinforcing plate is melted. Then attach the reinforcing plate to the printed circuit board. Alternatively, the substrate is heated by heat conduction to the stage carrying the substrate, and after the glue of the substrate is melted, the reinforcing plate is attached to the substrate. Since this method uses heat conduction to heat, the heat transfer efficiency is greatly affected by the material, so that the effect on heating is not good, and the glue on the reinforcing plate or the substrate is less likely to be melted. More time waiting for heating.

In view of the above, this creation aims to solve the above problems and develop a new type of automatic laminating machine to provide a more convenient and rapid heating and laminating technology.

In view of the above-mentioned problems of the prior art, the purpose of the present invention is to provide an automatic laminating machine to solve the conventional technique, which is time-consuming and labor-intensive and difficult to control the alignment accuracy, and is automatically attached to the machine. The problem of the heat conduction effect of the combined strong board is relatively poor.

According to the purpose of the present invention, an automatic laminating machine is proposed, which comprises a machine table, a substrate carrier, a reinforcing plate carrier, an adsorption device and a reinforcing plate heating device. The substrate stage is disposed on the machine table to carry the substrate. The reinforcing plate platform is arranged on the machine platform to carry the reinforcing plate, and one side of the reinforcing plate is provided with a glue. The adsorption device is disposed on the machine to adsorb and carry the reinforcing plate. The reinforcing plate heating device is arranged on the machine to heat the reinforcing plate. Wherein, when the adsorption device adsorbs the reinforcing plate and carries the reinforcing plate to the substrate stage, the reinforcing plate heating device moves to a heating position and moves with the adsorption device to simultaneously heat the reinforcing plate, and the adsorption device moves to the substrate. Above, when the reinforcing plate is to be attached to a target position of the substrate, the reinforcing plate heating device is moved out of the heating position to be away from the reinforcing plate, so that the adsorption device can adhere the surface of the reinforcing plate with the glue to the target position of the substrate. .

Preferably, the automatic laminating machine of the present invention further includes a first imaging device and a second imaging device disposed on the machine, and the second imaging device is synchronously moved along with the adsorption device. When the adsorption device is adsorbed by the reinforcing plate carrier to a predetermined distance, the image of the reinforcing plate can be photographed by the first camera. Alternatively, before the adsorption device adsorbs the reinforcing plate, the image of the reinforcing plate is captured by the second imaging device to generate a first alignment data by acquiring the image of the reinforcing plate by one of the above methods.

Preferably, the automatic laminating machine of the present invention, wherein the second imaging device captures the image of the substrate to generate a second alignment data when the adsorption device moves synchronously over the substrate stage.

Preferably, the adsorption device rotates according to the first alignment data and the second alignment data to adjust the angular deviation, and the adsorption device and the substrate carrier generate relative motion according to the first alignment data and the second alignment data. And adjusting the relative position between the reinforcing plate and the substrate, and bonding the reinforcing plate to the target position of the substrate.

Preferably, one side of the substrate is provided with a glue.

Preferably, the automatic laminating machine of the present invention further comprises a substrate heating device disposed on the machine table. When the substrate carrier moves to move to a position to be heated, the substrate heating device is paired with the substrate. Heating is performed to melt at least a portion of the gel on the substrate.

Preferably, the reinforcing plate carrier has a region to be adsorbed, and the reinforcing plate carrier carries the reinforcing plate to the area to be adsorbed in a predetermined carrying manner, and then the adsorption device performs an adsorption operation on the reinforcing plate.

Preferably, the reinforcing plate carrier can be an air floating transport carrier, a belt transport carrier or a slide transport carrier.

Preferably, the reinforcing plate carrier is provided with one movable movable block at the area to be adsorbed, and when the stopper moves, the adjustable reinforcing plate is located at a central point of the area to be adsorbed.

Preferably, the substrate stage has a plurality of vacuum holes, and the substrate is pasted on the substrate stage by vacuuming through a plurality of vacuum holes.

Preferably, the reinforcing plate heating device may be a ceramic heater or an electrothermal heater.

According to the purpose of the present invention, an automatic laminating machine is further provided, which comprises a machine table, a substrate stage, a reinforcing plate stage, an adsorption device and a substrate heating device. The substrate carrier is disposed on the machine platform to carry a substrate, and one surface of the substrate is provided with a glue. The reinforcing plate carrier is arranged on the machine platform to carry a reinforcing plate. The adsorption device is disposed on the machine to adsorb and carry the reinforcing plate. The substrate heating device is disposed on the machine to heat the substrate. Wherein, when the adsorption device adsorbs the reinforcing plate and carries the reinforcing plate to the substrate stage, the substrate carrier moves to move to a position to be heated, and the substrate heating device applies at least a portion of the glue on the substrate. The object is heated so that the heated portion of the substrate forms a target position to be bonded. When the substrate is heated, the substrate carrier moves out of the position to be heated and moves to a bonding position, so that the adsorption device can be reinforced. The board is attached to the target position of the substrate.

As stated above, the automatic laminating machine of the present invention may have one or more of the following advantages:

(1) The automatic laminating machine may have a single heating device or two heating devices at the same time, one of which is for heating the upper surface of the reinforcing plate and the other for heating the printed circuit substrate. The upper heater and the suction nozzle are separate components. When the suction nozzle absorbs the reinforcing plate, the upper heater can move with the suction nozzle to heat the reinforcing plate, and the glue on the reinforcing plate can be quickly and effectively melted. Eli is engaged in the cooperation industry. The lower heater can be used to heat at least a portion of the glue of the printed circuit board. In this way, the automatic cooperation of the creation of the creative cooperation industry can not only improve the time-consuming and labor-intensive problem of the manual-adhesive cooperation industry, but also directly heat the reinforcing plate and the substrate by using the upper and lower heaters, and can effectively overcome the conventional heat conduction. The problem caused by poor heating.

(2) This automatic laminating machine is equipped with a plurality of cameras, which can be used to photograph the image of the suction nozzle when the suction plate is attached, and the image when the reinforcing plate is attached to the substrate, so that the control in the automatic laminating machine The system can adjust the position of the reinforcing plate relative to the axis of the nozzle according to the image captured by the camera, and can control the nozzle to make the rotation to compensate the θ angle, and adjust the between the nozzle and the substrate stage. The X/Y coordinate deviation can achieve a precise alignment between the reinforcing plate and the printed circuit board.

1‧‧‧Automatic laminating machine

11‧‧‧ machine

12‧‧‧Substrate stage

121‧‧‧Motor

122‧‧‧rails

123‧‧‧ screw

13‧‧‧Reinforcing board

131‧‧‧feeding area

132‧‧‧ areas to be adsorbed

133‧‧ ‧ block

14‧‧‧Adsorption device

15‧‧‧Reinforcing plate heating device

16‧‧‧Substrate heating device

17‧‧‧First camera

18‧‧‧Second camera

Figure 1 is a top plan view of an embodiment of the automatic laminating machine of the present invention.

Figure 2 is a front elevational view of an embodiment of the automated laminating machine of the present invention.

Figure 3 is a side view of an embodiment of the automatic laminating machine of the present invention.

Fig. 4 is a right side view showing the combined structure of the adsorption device, the reinforcing plate heating device and the second imaging device of the embodiment of the automatic laminating machine of the present invention.

Fig. 5 is a schematic plan view showing the substrate heating device of the embodiment of the automatic laminating machine of the present invention.

In order to understand the technical characteristics, content and advantages of the creation and the effects that can be achieved by the examiner, the author will use the drawings in detail and explain the following in the form of the examples, and the drawings used therein The subject matter is only for the purpose of illustration and supplementary instructions. It is not necessarily the true proportion and precise configuration after the implementation of the original creation. Therefore, the proportions and configuration relationships of the attached drawings should not be interpreted or limited in the actual implementation scope. First described.

Please refer to Figures 1, 2 and 3, which are top view, front view and right side view of the embodiment of the automatic laminating machine of the present invention. Please also refer to Figures 4 and 5, respectively, which are adsorption devices, A right side view of the combined structure of the reinforcing plate heating device and the second imaging device, and a schematic plan view of the substrate heating device. In the embodiment, the automatic laminating machine 1 can be mainly used to automatically adhere the reinforcing plate to the printed circuit board to reinforce the printed circuit board, so that it is not easily damaged by the mounting of the electronic component, and The printed circuit board obtains functions such as better heat dissipation or electromagnetic shielding. The automatic laminating machine 1 includes an organic table 11, a substrate stage 12, a reinforcing plate stage 13, an adsorption device 14, a reinforcing plate heating device 15, a substrate heating device 16, a first imaging device 17, and a second imaging device 18, and The automatic laminating machine 1 can further include a plurality of computers or other control devices. The machine table 11 can be composed of a metal skeleton, and a plurality of control buttons can be provided at one place. The substrate stage 12, the reinforcing plate stage 13, the adsorption device 14, the reinforcing plate heating device 15, the substrate heating device 16, the first imaging device 17, and the second imaging device 18 may be disposed on the machine table 11.

In the above, the substrate stage 12 can be used to carry the printed circuit board, and the substrate stage 12 can be disposed with a motor 121, a slide rail 122 and a screw 123. The two sides of the substrate stage 12 can be movably engaged with the slide. On the rail 122, the motor 121 can be disposed on the substrate carrier 12 for carrying the opposite side of the substrate, and the motor 121 is connected to the screw 123. When the motor 121 is driven, the screw 123 can be pulled to move the substrate stage 12 so that the substrate stage 12 can be relatively slid by the slide rails 122. The substrate stage 12 can have a plurality of vacuum holes, and the vacuum circuit can be vacuumed to place the printed circuit board on the substrate stage 12 in an abutting manner.

In the above, the reinforcing plate stage 13 can be used to carry the placement reinforcing plate, and the reinforcing plate stage 13 can carry the reinforcing plate from a feeding area 131 to a to-be-adsorbed area 132 in a predetermined manner. The reinforcing plate stage 13 can be an air floating type transport stage, a belt type transport stage, a slide type transport stage, or a combination of both air floating type and belt type functions. Thereby, the reinforcing plate stage 13 can carry the reinforcing plate from the feeding zone 131 to the to-be-adsorbed zone 132 in a predetermined manner of air-floating, belt-carrying or rail-carrying. If the reinforcing plate stage 13 is an air floating type carrier, the reinforcing plate stage 13 will have a plurality of air outlet holes, and the reinforcing plate stage 13 is one of the high to low ones from the feeding area 131 to the area to be adsorbed 132. The inclined platform, and the inclined platform is tilted to one side. By the gas discharged from the plurality of vent holes and the inclination of the inclined platform, the reinforcing plate can be pushed to the side of the inclined body by air floating and gravity movement, and floated from the feeding area 131 to be adsorbed. Area 132. The airfoil, belt or slide rails described herein are for example only and are not limited thereto. In addition, the reinforcing plate stage 13 is further provided with a stopper 133. The stopper 133 can be disposed in the area to be adsorbed 132, and the block 133 can move movable. When the block 133 moves, it can be used to adjust the reinforcing plate. At the center point of the area to be adsorbed 132. For example, when the size of the reinforcing plate located in the area to be adsorbed 132 is the first size, after the end of the stopper 132, the center point position of the reinforcing plate of the first size to be adsorbed is fixed to a specific size. point. When the following reinforcing plate is of the second size, the user can adjust the position of the stopper 132 to change the position of the center point to which the reinforcing plate is to be adsorbed.

In the above, the adsorption device 14 is a member having a nozzle, and two or more nozzles can be disposed, and the adsorption device 14 can be moved to the adsorption region 132 of the reinforcing plate stage 13 for adsorption. A reinforcing plate for the adsorption zone 132 to be adsorbed. In addition, the adsorption device 14 is an axially rotatable device for rotating the adsorbed reinforcing plate, and the adsorption device 14 can suck the reinforcing plate in a straight manner.

In the above, the reinforcing plate heating device 15 may be a ceramic heater or an electric heater, but may be other types of heaters, and is not limited thereto. A stiffener heating device 15 can be used to heat the stiffener. The substrate heating device 16 can be a heating rod, but can be other heating devices that can be used to heat the substrate. The first imaging device 17 and the second imaging device 18 can be generally known cameras, and can be used to capture images on the machine table 11 during the workflow, in particular, to capture images of the reinforcing plate and the substrate.

In the embodiment, the glue may be disposed on one side of the reinforcing plate or the opposite side of the substrate-affining substrate 12, or the reinforcing plate and the substrate may be provided with a glue at the same time. Glue, etc., is not limited. First, an embodiment in which a glue is provided on one of the reinforcing plates will be described first. If the reinforcing plate is provided with a glue on one side and the reinforcing plate is to be attached to the substrate, the reinforcing plate stage 13 can first carry the reinforcing plate to the area to be adsorbed 132, and visually adjust the position of the plate to determine whether it is needed. The moving block 133 is moved to adjust the position of the reinforcing plate at the center point of the area to be adsorbed 132, and the position of the center point is the position to be adsorbed by the adsorption device 14. Next, the adsorption device 14 is moved to the position of the reinforcing plate stage 13 to be adsorbed to the adsorption zone 132 to adsorb the reinforcing plate on the adsorption zone 132 by the adsorption device 14. As mentioned above, the adsorption device 14 can have at least one suction nozzle, and one suction nozzle can adsorb a reinforcing plate. Therefore, the adsorption device 14 can adsorb more than one reinforcing plate at a time. When the adsorption device 14 adsorbs the reinforcing plate and moves to a predetermined distance, the image of the reinforcing plate when being adsorbed can be photographed by the first imaging device 17 to generate the first alignment data, or when the adsorption device is used. 14: Before the adsorption plate 132 is adsorbed by the adsorption area 132, the image of the reinforcing plate is captured by the second imaging device 18, thereby generating the first alignment data. The first alignment data may be the axial data of the adsorbed reinforcing plate relative to the adsorption device 14, and the computer (or control device) of the automatic bonding machine 1 will receive the first alignment data and automatically The axial direction of the adsorbed reinforcing plate relative to the adsorption device 14 is adjusted. Wherein, the predetermined distance is referred to as the distance between the first imaging device 17 and the to-be-adsorbed area 132 of the reinforcing plate stage 13 on the machine table 11.

In the above, when the adsorption device 14 is to carry the reinforcing plate onto the substrate stage 12, the reinforcing plate heating device 15 and the second imaging device 18 will move together with the adsorption device 14. The reinforcing plate heating device 15 is moved to a heating position during the moving process, and continuously heats the surface of the adsorbed reinforcing plate having the glue, so that the glue of the reinforcing plate is melted. The heating position may be below the opposite side of the reinforcing plate being adsorbed, but not limited thereto. Wherein, before or during the adsorption device 14 adsorbing the reinforcing plate, the substrate stage 12 can be first slid to a bonding position so that one part of the substrate serves as a target position to be bonded. When the adsorption device 14 moves onto the substrate stage 12 (above the bonding position), the second imaging device 18 can be used to capture an image of the substrate to generate a second alignment data, the second alignment data is mainly The substrate is to be attached to the orientation data of the target location. The computer (or control device) can control the adsorption device 14 to perform rotation according to the first alignment data and the second alignment data to adjust an angular deviation of the θ relative to the substrate stage 12, and control the substrate stage 12 and the adsorption device. 14 performs relative motion to adjust the deviation between the X coordinate and the Y coordinate between the adsorption device 14 and the substrate stage 12, thereby adjusting the relative position between the target position of the substrate and the reinforcing plate. When there is no deviation between the target position of the substrate to be bonded and the relative position of the reinforcing plate, the adsorption device 14 can bond the reinforcing plate to the target position of the substrate. When the adsorption device 14 is to perform the bonding operation, the reinforcing plate heating device 15 will move out of the heating position to be away from the reinforcing plate, so that the adsorption device 14 can have the surface of the reinforcing plate with the glue to be attached to the target position of the substrate. The automatic laminating machine 1 of the present invention can also have only the second imaging device 18, and the image of the substrate and the reinforcing plate can be captured by the second imaging device 18, so that the computer or the control device controls the adsorption according to the captured image. The device 14 is rotated to adjust the angular deviation, and the adsorption device 14 and the substrate stage 12 are controlled to move relative to each other to adjust the relative position between the reinforcing plate and the substrate.

Furthermore, an embodiment in which a glue is provided on one surface of a printed circuit board will be described. If the substrate is provided with a glue on one side and the reinforcing plate is to be attached to the substrate, the operation flow is similar to the above process, and the reinforcing plate is first carried by the reinforcing plate stage 13 to the area to be adsorbed 132, and then The adsorption device 14 adsorbs the reinforcing plate in the area to be adsorbed 132, and can capture the image of the reinforcing plate by the first imaging device 17 or the second imaging device 18, thereby adjusting the axial direction of the reinforcing plate relative to the adsorption device 14. The difference is that when the adsorption device 14 is to carry the reinforcing plate to the substrate stage 12, although the reinforcing plate heating device 15 and the second imaging device 18 will also move with the adsorption device 14, the reinforcing plate heating device 15 will not The reinforcing plate is heated. In the above, the substrate stage 12 can be moved, whereby the position at which the substrate is heated and bonded can be adjusted. When the substrate stage 12 is moved to a position to be heated, the substrate heating device 16 directly heats at least a portion of the glue on the substrate to melt the glue of the heated portion of the substrate to form a to-be-fitted portion. One of the target locations. Then, after the substrate is heated, the substrate stage 12 is moved out of the position to be heated and moved to a bonding position, and when the adsorption device 14 moves above the substrate stage 12 (above the bonding position), the second camera The device 18 can be used to capture the image of the substrate, and the first imaging device 17 and the second imaging device 18 can respectively capture the images of the reinforcing plate and the substrate, or can be adjusted by the image of the reinforcing plate and the substrate captured by the second imaging device 18. The θ angular deviation of the adsorption device 14 and the X and Y coordinates of the adsorption device 14 and the substrate stage 12 can adjust the relative position between the target position of the substrate and the reinforcing plate. Finally, when the relative position between the target position of the substrate and the reinforcing plate is determined to be unbiased, the adsorption device 14 can adhere the reinforcing plate to the target position of the substrate.

Further, when both the reinforcing plate and the substrate are provided with a glue, the reinforcing plate heating device 15 and the substrate heating device 16 can be selectively operated simultaneously. When the adsorption device 14 adsorbs the reinforcing plate, the substrate stage 12 can be moved to a position to be heated, which is a target position at which the substrate is to be attached. Similarly, the image of the reinforcing plate can be imaged by the first imaging device 17 or the second imaging device 18 to adjust the axial direction between the reinforcing plate and the adsorption device 14. The reinforcing plate heating device 15 and the second imaging device 18 will also move with the adsorption device 14, and the reinforcing plate heating device 15 can be moved to a heating position to heat or preheat the reinforcing plate, and the substrate heating device 16 can be used to Heating or preheating at the target location of the substrate. When the target position of the substrate is heated or preheated to a certain extent, the substrate stage 12 is moved from the position to be heated to a bonding position. When the adsorption device 14 is moved to the substrate stage 12, the second imaging device 18 can be used to capture an image of the substrate, and the image of the image of the reinforcing plate and the image of the substrate can be adjusted to adjust the target position between the substrate and the reinforcing plate. relative position. Finally, when the relative position adjustment between the substrate and the reinforcing plate is completed, the reinforcing plate heating device 15 will be away from the reinforcing plate so that the adsorption device 14 can adhere the reinforcing plate to the target position of the substrate. Wherein, if one side of the reinforced reinforcing plate is provided with a glue, the reinforcing plate heating device 15 heats the reinforcing plate to melt the glue, and at this time, the reinforcing plate is attached to the target position of the substrate. There is no glue, and the substrate heating 16 only performs a warm-up action on the target position to raise the temperature of the target position, so that the reinforcing plate is attached to the target position. In contrast, if one side of the reinforced reinforcing plate is not provided with a glue, the reinforcing plate heating device 15 can be used to perform a preheating heating action on the reinforcing plate to increase the surface temperature of the reinforcing plate, and at this time, the substrate is required The target position to be attached will have a glue, and the substrate heating device 16 can be used to directly heat the glue on the target position of the substrate to melt the glue so that the reinforcing plate is attached to the target position with the glue. on. By simultaneously operating the reinforcing plate heating device 15 and the substrate heating device 16, the heating waiting time can be more effectively reduced to improve the overall working efficiency. Of course, the simultaneous operation of the reinforcing plate heating device and the substrate heating device can be performed not only when the reinforcing plate and the substrate have the activation of the glue, but also when one of the reinforcing plate or the substrate has the glue, the heating can be started simultaneously.

In summary, the automatic laminating machine of the present invention has two heating devices, which can respectively perform direct heating action on the reinforcing plate and the glue on the substrate, such as ceramic or electric heating, etc., instead of the conventional nozzle. The heat conduction method is used to melt the glue on the reinforcing plate, and the substrate on the substrate is thermally fused to melt the glue on the substrate. Therefore, the automatic laminating machine not only improves the time-consuming and laborious problem caused by the manual bonding method, but also improves the heating of the conventional automatic laminating machine by heat conduction heating, and takes more time to wait for heating. . In addition, this creation has more than one camera device, which can be used to capture the bonding heating process and perform the alignment function. The image data can automatically adjust the angular position of the nozzle and the nozzle and the substrate carrier. The relative position is used to adjust the matching angle and position between the reinforcing plate and the substrate to achieve accurate alignment, which can effectively avoid the problem of deviation of the bonding position.

Looking at the above, it can be seen that under the previous technology, this creation has indeed achieved the desired effect, and it is not easy for people who are familiar with the art to think about it. Moreover, this creation has not been disclosed before the application, and it has Progressive and practical, it has already met the application requirements of the patent, and has filed a patent application according to law. You are requested to approve the application for the creation of this patent to encourage creation.

The embodiments described above are only for explaining the technical idea and characteristics of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement them according to the scope of the patent. That is, the equivalent changes or modifications made by the people in accordance with the spirit revealed by this creation should still be covered by the scope of the patent of this creation.

1‧‧‧Automatic laminating machine

11‧‧‧ machine

12‧‧‧Substrate stage

121‧‧‧Motor

122‧‧‧rails

123‧‧‧ screw

13‧‧‧Reinforcing board

131‧‧‧feeding area

132‧‧‧ areas to be adsorbed

133‧‧ ‧ block

14‧‧‧Adsorption device

15‧‧‧Reinforcing plate heating device

16‧‧‧Substrate heating device

17‧‧‧First camera

18‧‧‧Second camera

Claims (21)

An automatic laminating machine comprising:
One machine
a substrate carrier is disposed on the machine platform to carry a substrate;
a reinforcing plate carrier is disposed on the machine platform to carry a reinforcing plate, and one surface of the reinforcing plate is provided with a glue;
An adsorption device is disposed on the machine to adsorb and carry the reinforcing plate; and a reinforcing plate heating device is disposed on the machine to heat the reinforcing plate;
Wherein, when the adsorption device adsorbs the reinforcing plate and carries the reinforcing plate to the substrate stage, the reinforcing plate heating device is moved to a heating position and is moved along with the adsorption device to simultaneously heat the reinforcing plate When the adsorption device is moved above the substrate, and the reinforcing plate is to be attached to a target position of the substrate, the reinforcing plate heating device is moved out of the heating position to be away from the reinforcing plate, so that the adsorption device can be The surface of the reinforcing plate having the glue is attached to the target position of the substrate. The automatic laminating machine of claim 1, further comprising a first camera device and a second camera device disposed on the machine, the second camera device being synchronously moved along with the adsorption device When the adsorption device is adsorbed by the reinforcing plate carrier to a predetermined distance, the image of the reinforcing plate is captured by the first imaging device; or when the adsorption device adsorbs the reinforcing plate, The second camera captures the image of the reinforcing plate to generate a first alignment data by acquiring the image of the reinforcing plate by one of the methods. The automatic laminating machine of claim 2, wherein the second imaging device captures an image of the substrate to generate a second alignment data as the adsorption device moves synchronously over the substrate stage. The automatic laminating machine of claim 3, wherein the adsorption device rotates according to the first alignment data and the second alignment data to adjust an angular deviation, and the adsorption device and the substrate carry The stage further generates a relative motion according to the first alignment data and the second alignment data, thereby adjusting a relative position between the reinforcing plate and the substrate, and bonding the reinforcing plate to the target position of the substrate. The automatic laminating machine according to claim 1, wherein one of the substrates is provided with a glue. The automatic laminating machine according to claim 5, further comprising a substrate heating device disposed on the machine, the substrate heating when the substrate carrier moves to move to a position to be heated The apparatus heats the substrate such that at least a portion of the gel on the substrate is melted. The automatic laminating machine according to claim 1, wherein the reinforcing plate carrier has a region to be adsorbed, and the reinforcing plate carrier carries the reinforcing plate to the to-be-adsorbed region in a predetermined carrying manner. Thereafter, the reinforcing plate is subjected to an adsorption operation by the adsorption device. The automatic laminating machine according to claim 7, wherein the reinforcing plate carrier is an air floating transport carrier, a belt transport carrier or a slide transport carrier. The automatic laminating machine according to claim 7, wherein the reinforcing plate carrier is provided with one movable movable block at the to-be-adsorbed area, and when the blocking block moves, the reinforcing plate is adjusted. Located at the center point of the area to be adsorbed. The automatic laminating machine of claim 1, wherein the substrate stage has a plurality of vacuum holes, and the substrate is pasted on the substrate stage by vacuuming the plurality of vacuum holes. The automatic laminating machine according to claim 1, wherein the reinforcing plate heating device is a ceramic heater or an electric heater. An automatic laminating machine comprising:
One machine
a substrate carrier is disposed on the machine platform to carry a substrate, and one surface of the substrate is provided with a glue;
a reinforcing plate carrier is disposed on the machine platform to carry a reinforcing plate;
An adsorption device is disposed on the machine to adsorb and carry the reinforcing plate; and a substrate heating device is disposed on the machine to heat the substrate;
Wherein, when the adsorption device adsorbs the reinforcing plate and carries the reinforcing plate to the substrate stage, the substrate carrier moves to move to a position to be heated, and the substrate is heated by the substrate heating device At least a portion of the glue is heated to form a heated portion of the substrate to form a target position to be bonded. When the substrate is heated, the substrate carrier moves out of the position to be heated and moves to a position The position is adjusted so that the adsorption device can adhere the reinforcing plate to the target position of the substrate. The automatic laminating machine of claim 12, further comprising a first camera device and a second camera device disposed on the machine, the second camera device being synchronously moved along with the adsorption device When the adsorption device is adsorbed by the reinforcing plate carrier to a predetermined distance, the image of the reinforcing plate is captured by the first imaging device; or when the adsorption device adsorbs the reinforcing plate, The second camera captures the image of the reinforcing plate to generate a first alignment data by acquiring the image of the reinforcing plate by one of the methods. The automatic laminating machine of claim 13, wherein the second imaging device captures an image of the substrate to generate a second alignment data as the adsorption device moves synchronously over the substrate stage. The automatic laminating machine of claim 14, wherein the adsorption device rotates according to the first alignment data and the second alignment data to adjust an angular deviation, and the adsorption device and the substrate carry The stage further generates a relative motion according to the first alignment data and the second alignment data, thereby adjusting a relative position between the reinforcing plate and the substrate, and bonding the reinforcing plate to the target position of the substrate. The automatic laminating machine according to claim 12, further comprising a reinforcing plate heating device disposed on the machine to selectively heat the reinforcing plate. The automatic laminating machine according to claim 12, wherein the reinforcing plate carrier has a region to be adsorbed, and the reinforcing plate carrier carries the reinforcing plate to the to-be-adsorbed region in a predetermined carrying manner. Thereafter, the reinforcing plate is subjected to an adsorption operation by the adsorption device. The automatic laminating machine according to claim 17, wherein the reinforcing plate carrier is an air floating transport carrier, a belt transport carrier or a slide transport carrier. The automatic laminating machine according to claim 17, wherein the reinforcing plate carrier is provided with one movable movable block at the to-be-adsorbed area, and when the blocking block moves, the reinforcing plate is adjusted. Located at the center point of the area to be adsorbed. The automatic laminating machine of claim 12, wherein the substrate stage has a plurality of vacuum holes, and the substrate is pasted on the substrate stage by vacuuming the plurality of vacuum holes. The automatic laminating machine according to claim 12, wherein the reinforcing plate heating device is a ceramic heater or an electrothermal heater.