TWM468021U - Magnetic field sensor - Google Patents

Abstract

A magnetic field sensor includes a circuit board, a patterned magnetic thin film and a magnetic field sensing element. The patterned magnetic thin film is disposed on a surface of the circuit board. The magnetic field sensing element is electrically connected to the patterned magnetic thin film.

Description

Magnetic field sensor

The present invention relates to a magnetic field sensor.

With the advancement of integrated circuits and electromechanical integration technologies, electronic products with navigation and positioning functions are becoming more diverse. The electronic compass provides the equivalent of a traditional compass in the field of automotive navigation, flight and personal hand-held devices.

At present, the electronic compass can detect the magnetic field stereoscopically using only one semiconductor device based on the Hal-effect sensor technology. The semiconductor device includes a magnetic element, a Hall element, or other sensor elements that can be disposed together on the surface of the semiconductor wafer. However, contamination problems are apt to occur in the process of manufacturing such semiconductor devices. This is because the magnetic element contains a magnetic metal material such as iron, cobalt or nickel which is likely to contaminate other components in the semiconductor process.

The purpose of the present invention is to provide a novel magnetic field sensor comprising a line carrier, a patterned magnetic film and a magnetic field sensing element, and the patterned magnetic film is disposed on the line carrier. Since the patterned magnetic film and the magnetic field sensing element are not integrated in one semiconductor device, magnetic material does not occur. The problem of contaminating other components can solve the problems faced by conventional technologies.

One aspect of the present invention provides a magnetic field sensor comprising a line carrier, a patterned magnetic film, and a magnetic field sensing element. The patterned magnetic film is disposed above the surface of the line carrier. The magnetic field sensing element is electrically connected to the patterned magnetic film.

According to one embodiment of the present invention, the patterned magnetic film covers and contacts the surface of the line carrier.

According to an embodiment of the present invention, the line carrier has a three-dimensional structure protruding or recessed into the surface of the line carrier, the three-dimensional structure has at least three surfaces that are not parallel to each other, and the patterned magnetic film is disposed on three surfaces of the three-dimensional structure. Above at least one.

According to an embodiment of the present invention, the three-dimensional structure is a rectangular convex portion having four sides and a top surface, and the patterned magnetic film is respectively disposed on two adjacent sides and a top surface of the four sides. At least above the two.

According to an embodiment of the present invention, the three-dimensional structure is a rectangular recess having four sides and a bottom surface, and the patterned magnetic film is respectively disposed on at least two of the two adjacent sides and the bottom surface of the four sides. Above.

According to an embodiment of the present invention, the line carrier has a first conductive hole located inside the line carrier, and the patterned magnetic film is electrically connected to the magnetic field sensing element through the first conductive hole.

According to one embodiment of the present invention, the patterned magnetic film has a cross-sectional profile that is cross-shaped.

According to one embodiment of the present invention, the magnetic field sensing element is disposed above the surface of the line carrier.

According to an embodiment of the present invention, the magnetic field sensing element is disposed directly above the patterned magnetic film.

According to an embodiment of the present invention, the magnetic field sensor further includes a solder ball disposed on the other surface of the line carrier, and the other surface of the line carrier is opposite to the surface of the line carrier.

According to an embodiment of the present invention, the line carrier has a second conductive hole extending through the line carrier, and the magnetic field sensing element is electrically connected to the solder ball through the second conductive hole.

100, 200, 300, 400‧‧‧ magnetic field sensors

110‧‧‧Line carrier

110a‧‧‧ surface

110b‧‧‧Other surface

1102, 1104‧‧‧Three-dimensional structure

1102a‧‧‧ top surface

1102b, 1102c, 1104b, 1104c‧‧‧ side

1104a‧‧‧ bottom

120‧‧‧ patterned magnetic film

120a‧‧‧The first part of patterned magnetic film

120b‧‧‧The second part of the patterned magnetic film

120c‧‧‧Part 3 of patterned magnetic film

130‧‧‧ Magnetic field sensing components

140, 170‧‧‧ solder balls

150‧‧‧ lead

1C-1C’, 4B-4B’‧‧‧ segments

FIG. 1A is a perspective view showing a patterned magnetic film according to a first embodiment of the present invention.

FIG. 1B is a perspective view showing a magnetic sensor according to a first embodiment of the present invention.

Fig. 1C is a schematic cross-sectional view taken along line 1C-1C' of Fig. 1B.

2 is a perspective view showing a magnetic sensor according to a second embodiment of the present invention.

3 is a perspective view showing a magnetic sensor according to a third embodiment of the present invention.

4A is a perspective view showing a magnetic sensor according to a fourth embodiment of the present invention.

Fig. 4B is a schematic cross-sectional view taken along line 4B-4B' of Fig. 4A.

In the following, a plurality of embodiments of the present invention will be disclosed in the drawings. For the sake of explanation, many practical details will be explained in the following description. However, it should be understood that these practical details are not intended to limit the novel. That is to say, in some embodiments of the present invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

First Embodiment: Method of Manufacturing Patterned Magnetic Film

FIG. 1A is a schematic perspective view showing the patterned magnetic film 120 of the present embodiment. First, a magnetic material may be locally formed on the surface 110a of the line carrier 110. For example, a photolithographic and etching process, a screen printing process, an inkjet coating process, a metal mask deposition process, a metal mask evaporation process, or other suitable process can be utilized to form a patterned magnetic material on the line. On the surface 110a of the carrier 110. The above magnetic material may comprise magnetic powder, and the material of the magnetic powder may be iron, cobalt, nickel, copper or a combination thereof.

Then, the patterned magnetic material is heated to be cured to form the patterned magnetic film 120. For example, the patterned magnetic material can be heated to cure using a reflow process. The reflow temperature can be between about 200 and about 260 °C. The patterned magnetic film 120 also adheres to the surface 110a of the line carrier 110 during curing. The formed patterned magnetic film 120 can be applied to the field of magnetic field sensors.

First Embodiment: Magnetic Field Sensor

FIG. 1B is a perspective view showing the magnetic sensor 100 of the present embodiment. Fig. 1C is a schematic cross-sectional view taken along line 1C-1C' of Fig. 1B. The magnetic field sensor 100 can sense a one-dimensional magnetic field including a line carrier 110, a patterned magnetic film 120, and a magnetic field sensing element 130.

The line carrier 110 can be, for example, an IC substrate, a System in Package substrate (SIP). Substrate) or printed circuit board. The main material of the line carrier 110 may be an organic insulating material, an inorganic insulating material or an organic-inorganic composite insulating material. For example, the organic insulating material may be a Bismaleimide Triazine (BT) resin or a Polyimide resin. The inorganic insulating material may be, for example, a ceramic substrate. The organic-inorganic composite insulating material may be, for example, an epoxy resin impregnated fiberglass cloth.

The patterned magnetic film 120 is disposed above the surface 110a of the line carrier 110. In the present embodiment, the patterned magnetic film 120 covers and contacts the surface 110a of the line carrier 110. As shown in FIG. 1A, the top view profile of the patterned magnetic film 120 may be a cross shape, but is not limited thereto, and may be, for example, a circle, an ellipse, a polygon, or other suitable shape.

The magnetic field sensing component 130 is electrically connected to the patterned magnetic film 120. The magnetic field sensing element 130 can be a Hall-effect element. The magnetic field sensor 100 further includes a lead 150 for electrically connecting the patterned magnetic film 120 to the magnetic field sensing element 130 through the lead 150.

In the present embodiment, the magnetic field sensing element 130 is disposed above the surface 110a of the line carrier 110. The magnetic field sensing element 130 is affixed to the surface 110a of the line carrier 110 via a solder ball 140. In detail, as shown in FIG. 1C, the magnetic field sensing element 130 is disposed directly above the patterned magnetic film 120 to reduce the area occupied by the magnetic field sensing element 130 and the patterned magnetic film 120 occupying the surface 110a of the line carrier 110. . However, the arrangement of the magnetic field sensing element 130 and the patterned magnetic film 120 is not limited to the embodiment. That is to say, the arrangement of the magnetic field sensing element 130 and the patterned magnetic film 120 can be changed as long as the magnetic field sensing element 130 can be electrically connected to the patterned magnetic film 120.

Second embodiment

FIG. 2 is a perspective view showing the magnetic sensor 200 according to the embodiment. The magnetic field sensor 200 can sense a two-dimensional magnetic field including a line carrier 110, a patterned magnetic film 120, and a magnetic field sensing element 130.

The line carrier 110 has a solid structure 1102 that protrudes from the surface 110a of the line carrier 110. This solid structure 1102 has at least three surfaces that are not parallel to each other. The patterned magnetic film 120 is disposed over at least one of the three surfaces of the solid structure 1102. In detail, as shown in FIG. 2, the three-dimensional structure 1102 is a rectangular convex portion having four side faces and a top surface 1102a, and the patterned magnetic film 120 is respectively disposed adjacent to the four side faces. Above at least two of the two sides 1102b, 1102c and the top surface 1102a. However, the solid structure 1102 can also be other shapes, such as a pyramid shape or other suitable solid shape. The above-described three-dimensional structure 1102 can be formed by stacking a plurality of substrates. Taking a ceramic substrate as an example, a plurality of ceramic substrates of different sizes may be stacked first, and then a sintering step is performed to form a wiring carrier 110 having a three-dimensional structure 1102.

The patterned magnetic film 120 includes a first portion 120a and a second portion 120b which are respectively disposed on the top surface 1102a and the side surface 1102b and are separated from each other without being in contact. The magnetic field sensor 200 further includes a lead 150 for electrically connecting the first portion 120a and the second portion 120b of the patterned magnetic film 120 to the magnetic field sensing element 130 through the lead 150.

Third embodiment

FIG. 3 is a perspective view showing the magnetic sensor 300 according to the embodiment. The magnetic field sensor 300 can sense a three-dimensional magnetic field including a line carrier 110, a patterned magnetic film 120, and a magnetic field sensing element 130.

The line carrier 110 has a three-dimensional structure 1104 recessed line carrier Surface 110a of 110. This solid structure 1104 has at least three surfaces that are not parallel to each other. The patterned magnetic film 120 is disposed over at least one of the three surfaces of the solid structure 1104. In detail, the three-dimensional structure 1104 is a rectangular recess having four sides and a bottom surface 1104a. The patterned magnetic film 120 is respectively disposed on two adjacent ones of the four sides 1104b, 1104c and the bottom surface 1104a. Above at least two of them. However, the three-dimensional structure 1104 can also be other shapes, such as a pyramid shape or other suitable three-dimensional shape. The above-described three-dimensional structure 1104 can be formed by a digging process. Taking an epoxy resin impregnated fiberglass cloth as an example, the epoxy resin may be impregnated with a fiberglass cloth to perform a hole-cutting process to form a line carrier 110 having a three-dimensional structure 1104.

The patterned magnetic film 120 includes a first portion 120a, a second portion 120b, and a third portion 120c disposed on the bottom surface 1104a and the two side surfaces 1104b, 1104c, respectively, and separated from each other without contact. The magnetic field sensor 300 further includes a lead 150 for electrically connecting the first portion 120a, the second portion 120b, and the third portion 120c of the patterned magnetic film 120 to the magnetic field sensing element 130 through the lead 150. The first portion 120a, the second portion 120b, and the third portion 120c of the patterned magnetic film 120 are orthogonal to each other, so the magnetic field sensor 300 can sense a three-dimensional magnetic field.

Fourth embodiment

FIG. 4A is a perspective view showing the magnetic sensor 400 according to the embodiment. Fig. 4B is a schematic cross-sectional view taken along line 4B-4B' of Fig. 4A. The magnetic field sensor 400 can sense a three-dimensional magnetic field including a line carrier 110, a patterned magnetic film 120, and a magnetic field sensing element 130.

The patterned magnetic film 120 and the magnetic field sensing element 130 of the present embodiment are the same as those of the third embodiment. Poor of this embodiment and the third embodiment The difference between the circuit board 110 and the first conductive hole 112 is located inside the circuit carrier 110, so that the second portion 120b of the patterned magnetic film 120 is electrically connected to the magnetic field sensing component 130 through the first conductive hole 112, such as 4B. The figure shows. Of course, the first portion 120a and the third portion 120c of the patterned magnetic film 120 can also be electrically connected to the magnetic field sensing element 130 through other conductive holes (not shown). Therefore, in the present embodiment, the magnetic sensor 400 may not include a lead.

On the other hand, the magnetic field sensor 400 further includes a solder ball 170 disposed on the other surface 110b of the line carrier 110. The other surface 110b of the line carrier 110 is opposite the surface 110a of the line carrier 110. The circuit carrier 110 further has a second conductive hole 114 extending through the line carrier 110 to electrically connect the magnetic field sensing component 130 to the solder ball 170 through the second conductive hole 114. The solder ball 170 can be used to electrically connect a printed circuit board (not shown), but is not limited thereto.

It can be understood from the above that the present invention provides a novel magnetic field sensor comprising a line carrier, a magnetic film and a magnetic field sensing element, and the magnetic film is disposed on the line carrier. Since the magnetic field sensing element and the magnetic film are not integrated in the same semiconductor device, the problem that the magnetic material contaminates other components in the semiconductor process does not occur, and the problems faced by the prior art can be solved.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Any one skilled in the art can make various changes and retouchings without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

110‧‧‧Line carrier

110a‧‧‧ surface

1104‧‧‧Three-dimensional structure

1104a‧‧‧ bottom

1104b, 1104c‧‧‧ side

120‧‧‧ patterned magnetic film

120a‧‧‧The first part of patterned magnetic film

120b‧‧‧The second part of the patterned magnetic film

120c‧‧‧Part 3 of patterned magnetic film

130‧‧‧ Magnetic field sensing components

140‧‧‧ solder balls

150‧‧‧ lead

300‧‧‧Magnetic field sensor

Claims (11)

A magnetic field sensor includes: a line carrier; a patterned magnetic film disposed above a surface of the line carrier; and a magnetic field sensing component electrically connected to the patterned magnetic film. The magnetic field sensor of claim 1, wherein the patterned magnetic film covers and contacts the surface of the line carrier. The magnetic field sensor of claim 1, wherein the line carrier has a three-dimensional structure protruding or recessed into the surface of the line carrier, the three-dimensional structure having at least three surfaces that are not parallel to each other, the patterned magnetic A film is disposed over at least one of the three surfaces of the three-dimensional structure. The magnetic field sensor according to claim 3, wherein the three-dimensional structure is a rectangular convex portion having four sides and a top surface, and the patterned magnetic film is respectively disposed adjacent to the four sides. Above the two sides and at least two of the top surfaces. The magnetic field sensor of claim 3, wherein the three-dimensional structure is a rectangular recess having four sides and a bottom surface, and the patterned magnetic film is respectively disposed adjacent to the four sides Above the sides and at least two of the bottom surfaces. The magnetic field sensor of claim 1, wherein the circuit carrier has a first conductive hole located inside the circuit carrier, and the patterned magnetic film is electrically connected to the magnetic field sensing element through the first conductive hole. The magnetic field sensor of claim 1, wherein the patterned magnetic film has a cross-shaped profile. The magnetic field sensor of claim 1, wherein the magnetic field sensing element is disposed above the surface of the line carrier. The magnetic field sensor of claim 8, wherein the magnetic field sensing element is disposed directly above the patterned magnetic film. The magnetic field sensor of claim 8 further comprising a solder ball disposed on the other surface of the line carrier, the other surface of the line carrier being opposite the surface of the line carrier. The magnetic field sensor of claim 10, wherein the circuit carrier has a second conductive hole extending through the circuit carrier, and the magnetic field sensing component is electrically connected to the solder ball through the second conductive hole.