TWM465683U - Planar connector - Google Patents

Abstract

Provided is a planar connector, which is to be used for the purpose of electrically connecting to each other the inner side and the outer side of an air-tight chamber partitioned by means of a partitioning wall, and which closes an opening formed in the partitioning wall to penetrate the air-tight chamber from the inside to the outside thereof, said planar connector being capable of effectively suppressing transmissivity of a gas, with which the inside of the air-tight chamber is filled, and reliably electrically connecting between the inner surface and the outer surface of a substrate. A planar connector (1) is provided with a planar substrate (10A) that closes an opening (41) in the partitioning wall (40). The substrate (10A) is provided with a conductor layer (11), that covers the inner surface (10a) of the substrate (10A), said inner surface being positioned to face the inner side of the air-tight chamber (C) and/or the outer surface (10b) of the substrate (10A), said outer surface being on the side reverse to the inner surface (10a).

Description

Flat connector

The present invention relates to a flat connector that is used to electrically connect the inside and the outside of an airtight chamber partitioned by a partition wall to block an opening formed in the partition wall and penetrate the inside of the airtight chamber and the outside.

Previously, there was an inner side and an outer side of an airtight chamber which were required to be electrically connected to each other by a partition wall. For example, in the semiconductor wafer processing in which the integrated circuit is mounted, a vacuum chamber that can be internally decompressed to a near vacuum state is used, and the inside and the outside of the vacuum chamber are electrically connected. Further, the inside of the airtight compartment partitioned by the partition wall is filled with a gas having a small molecular weight, for example, helium gas or hydrogen gas, to perform pressure reduction. When the pressure-controlled interior of the airtight chamber and the outside are electrically connected, the airtightness inside the processing chamber must be maintained, and the electrical connection between the interior of the chamber and the outside is required.

The electrical connection structure of the prior art is known, for example, as shown in the eleventh drawing (see Patent Document 1). The eleventh diagram is a schematic view showing the electrical connection structure of the airtight indoor side and the outer side of the pressure-adjusted pressure division of the prior art.

The electrical connection structure shown in FIG. 11 is electrically connected to each other by a partition wall (not shown), and the inner side A and the outer side B of the processing chamber (not shown) for adjusting the internal pressure.

In the electrical connection structure, an opening (not shown) penetrating the inside of the processing chamber A side and the outside B side is formed in the partition wall. Then, the opening is blocked by the flat connector 110.

Here, a plurality of via holes 112 filled with a conductor inside are provided in the base material of the flat connector 110. Further, on the inner surface and the outer surface of the flat connector 110, a pair of conductive pads 113a, 113b which are connected to each other by the conductor of the through hole 112 are provided.

Then, a plurality of first connectors 120A are disposed inside the flat connector 110, and a plurality of second connectors 120B are disposed outside the flat connector 110.

Each of the first connectors 120A is disposed to extend in a direction orthogonal to the flat connector 110, and a plurality of the first connections are disposed along a longitudinal direction of the flat connector 110 (upward and downward directions in the eleventh diagram) 120A. Further, each of the second connectors 120B extends in a direction orthogonal to the flat connector 110, and a plurality of the second connectors are disposed along the longitudinal direction of the flat connector 110 opposite to the first connector 120A. 120B.

Here, each of the first connectors 120A includes a second substrate 121 disposed along a direction orthogonal to the flat connector 110, and a width direction along the second substrate 121 (orthogonal to the paper surface in the eleventh drawing) The direction) a plurality of contacts 123 arranged at a specified pitch. On the surface of the second substrate 121 (upper in the eleventh drawing), a plurality of conductive patterns 124 are provided at a predetermined pitch along the width direction of the second substrate 121. Each of the contacts 123 is connected to one end side of each of the conductive patterns 124. Further, a signal line 122 is connected to the other end side of each of the conductive patterns 124. Further, each of the second connectors 120B has the same configuration as each of the first connectors 120A.

In the electrical connection structure 101 having such a configuration, the first connector 120A is advanced in the direction of the arrow F in the eleventh diagram, and the contact 123 is brought into contact with the conductive pad 113a provided on the inner surface of the flat connector 110. Further, the second connector 120B is advanced in the direction of the arrow F' in the eleventh diagram, and the contact 123 is brought into contact with the conductive pad 113b provided on the outer surface of the flat connector 110. Thereby, the signal lines 122 and 122 on the inside of the chamber A side and the outside B side are electrically conducted via the processing chamber A side. The pattern 124, the contact 123, the conductive pad 113a on the inner surface of the flat connector 110, the through hole 112, the conductive pad 113b on the outer surface of the flat connector 110, the contact 123, and the conductive pattern 124 on the side B of the processing chamber B And the electrical connector.

Further, the conventional multilayer printed wiring board is known, for example, as shown in Fig. 12 (see Patent Document 2). Figure 12 is a cross-sectional view of a prior multilayer printed wiring substrate.

The multilayer printed wiring board 201 shown in Fig. 12 is sandwiched between both surfaces of the high dielectric constant substrate 202 by a copper foil pattern layer 203 which is a surface of a power supply line or a ground line. An insulating layer 204 is formed on the outer side of the copper foil pattern layer 203, and a signal line 205 such as copper foil is further formed on the outer side of the insulating layer 204.

[Previous Technical Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-349073

[Patent Document 2] Japanese Unexamined Patent Publication No. Hei 7-10979

However, the previous electrical connection structure 101 shown in the eleventh diagram and the previous multilayer printed wiring board 201 shown in the twelfth figure have the following problems.

In other words, in the case of the electrical connection structure 101 shown in FIG. 11, the exposed area of the base material of the flat connector 110 that blocks the opening inside the processing chamber A side and the outer B side is large. In other words, in the side surface of the processing chamber A of the base material of the flat connector 110 and the side surface of the external B, the area where the conductive pads 113a and 113b are not exposed is large. Therefore, the gas permeability of the gas filled in the inside of the processing chamber A through the external B side cannot be effectively suppressed.

Further, in the case of the multilayer printed wiring board 201 shown in FIG. 12, when it is used for the purpose of blocking the opening formed in the partition wall, the gas permeability can be suppressed by the planar copper foil pattern layer 203. However, since the through holes penetrating between the both faces of the high dielectric constant substrate 202 are not formed, the two surfaces of the high dielectric constant substrate 202 cannot be electrically connected. When a perforation is formed between both surfaces of the high dielectric constant substrate 202, the gas permeates through the perforations, and the gas permeability cannot be suppressed.

Therefore, the present invention has been made to solve the above problems, and an object thereof is to provide a flat connector for electrically interconnecting the inner side and the outer side of an airtight chamber partitioned by a partition wall to block the formation on the partition wall. The gas passage rate of the gas filled inside the airtight chamber can be effectively suppressed by passing through the opening portion inside the airtight chamber and the outside, and the electrical property can be reliably connected between the inner surface and the outer surface of the substrate.

In order to achieve the above object, the flat connector of the present invention is used for electrically interconnecting the inside and the outside of the airtight chamber partitioned by the partition wall to block the opening formed in the partition wall and penetrating the inside of the airtight chamber and the outside. A flat plate-shaped substrate that blocks the opening, the substrate including a conductor layer covering an inner surface facing the inner side of the inner surface of the substrate and an outer surface opposite to the inner surface of the substrate a surface, and at least one of the surfaces of the substrate extending between the inner surface and the outer surface and extending parallel to the inner surface.

Here, the term "covering" refers to guiding the bulk layer on at least the inner surface of the substrate, the outer surface of the substrate, and the inside of the substrate existing between the inner surface and the outer surface, and at least the surface extending parallel to the inner surface. On one side, at least one part of the one side can be covered. In addition, Preferably, the conductor layer covers at least one of the inner surface and the outer surface of the substrate.

Further, in the flat connector, the substrate is a two-layer substrate including a flat substrate that blocks the opening, and the conductor layer covers at least at least an inner surface and an outer surface of the substrate. One side is preferably provided with through holes electrically connected to each other between the inner surface and the outer surface of the substrate, and provided by an inner peripheral surface of the through hole provided between the inner surface and the outer surface of the substrate, and An annular conductive plating portion extending between the inner surface and the outer surface of the substrate, and a filler filled in the conductive plating portion.

Further, in the flat connector, a solder layer extending continuously annularly along the outer periphery of the substrate may be formed on the inner surface of the substrate.

Further, in the flat connector, the filler is preferably a conductive solder.

Further, in the flat connector, the substrate is a multilayer substrate, and the multilayer substrate includes a flat first substrate, and a flat second substrate disposed to face the first substrate. An inner surface on the inner side of the airtight chamber to block the opening; and a flat third substrate disposed on an outer surface of the first substrate; the conductor layer covering an inner surface of the second substrate; At least one of the outer surface of the second substrate, the inner surface of the first substrate, the outer surface of the first substrate, the inner surface of the third substrate, and the outer surface of the third substrate The method may include: a through hole electrically connected between the inner surface and the outer surface of the first substrate, and an annular conductive plating portion disposed on the inner surface and the outer surface of the first substrate The inner peripheral surface of the through hole extends between the inner surface and the outer surface of the first substrate; the first plated through hole is connected between the inner surface and the outer surface of the second substrate, and is a through hole connection of the first substrate; and a second Plating a perforation line interconnecting said first The inner surface and the outer surface of the three substrates are connected to the through holes of the first substrate.

Here, the "multilayer substrate" means a multilayer substrate of four or more layers.

Further, in the flat connector, a solder layer extending continuously annularly along the outer circumference of the second substrate may be formed on the inner surface of the second substrate.

Further, in the flat connector, the through hole may have a filling material filled in the conductive plating portion.

Further, in the flat connector, the filler is preferably a conductive solder.

When the flat connector of the present invention is used, the flat substrate having the opening of the partition wall is provided, and the substrate has an outer surface covering the inner surface facing the inner side of the inner surface of the substrate and the inner surface opposite to the inner surface of the substrate And a conductor layer formed of a plurality of conductor patterns on at least one of the surfaces of the inner surface parallel to the inner surface of the substrate between the inner surface and the outer surface. Therefore, even if the gas filled in the airtight chamber passes through the substrate from the inside of the airtight chamber to the outside, the gas does not pass through the conductor layer, and the gas permeability of the gas filled inside the airtight chamber can be effectively suppressed.

Further, when the substrate is made of a glass epoxy resin, the gas which is filled in the airtight interior portion, in particular, a portion in which helium or hydrogen having a small molecular weight easily passes through the epoxy resin of the organic substance. However, even in such a case, when the gas filled in the airtight chamber moves outward from the inside of the airtight chamber, the movement of the gas is blocked by the conductor layer. Thereby, the gas permeability of the gas filled inside the airtight chamber can be more effectively suppressed.

Further, in the flat connector, the substrate is a two-layer substrate, and the two-layer substrate When the flat substrate having the opening is blocked, and the conductor layer covers at least one of the inner surface and the outer surface of the substrate, the gas permeability of the gas filled inside the airtight chamber can be effectively suppressed by using the two-layer substrate. Then, the flat connector has a through hole electrically connected between the inner surface and the outer surface of the substrate. Therefore, the inner surface and the outer surface of the substrate of the two-layer substrate can be reliably connected by the via hole electrical property. Further, since the filler is filled in the conductive plating portion constituting the through hole, the gas permeability of the gas filled inside the airtight chamber can be further effectively suppressed.

Further, in the flat connector, the substrate-based multilayer substrate includes a flat first substrate, and is disposed on an inner surface facing the airtight chamber side of the first substrate, and is clogged a flat second substrate of the opening; and a flat third substrate disposed on the outer surface of the first substrate. Then, the conductor layer covers the inner surface of the second substrate, the outer surface of the second substrate, the inner surface of the first substrate, the outer surface of the first substrate, and the inner surface of the third substrate And at least one of the outer surfaces of the third substrate. At this time, the gas permeability of the gas filled inside the airtight chamber can be effectively suppressed by using the multilayer substrate. Then, the flat connector has a through hole electrically connected between the inner surface and the outer surface of the first substrate. Further, the flat connector has a first plated perforation that is connected between the inner surface and the outer surface of the second substrate, and is connected to the through hole of the first substrate; and interconnects the inner surface of the third substrate And a second plated perforation between the outer surface and the through hole of the first substrate. Therefore, the inner surface and the outer surface of the multilayer substrate can be reliably connected by the through hole, the first plated through hole and the second plated through hole. Further, the inner surface side of the through hole is blocked by the second substrate, and the outer surface side of the through hole is blocked by the third substrate. Therefore, in the multilayer substrate, it is not always necessary to fill the conductive plating portion constituting the through hole with a filling material.

1‧‧‧flat connector

10‧‧‧Substrate

10A‧‧‧Substrate

10a‧‧‧ inner surface

10b‧‧‧ outer surface

10c‧‧‧width direction right end face

10d‧‧‧width direction left end

10e‧‧‧ Length direction rear end face

10f‧‧‧ Length direction front face

11‧‧‧Conductor layer

11a, 11b‧‧‧ conductor pattern

11c‧‧‧Extensions between conductor patterns

12‧‧‧through holes

13‧‧‧Electrical plating department

14‧‧‧ Filling materials

15‧‧‧through hole

16‧‧‧Electrical pads

17‧‧‧welding layer

18‧‧‧resist

19‧‧ ‧ gap

19a‧‧‧ inside

19b‧‧‧ bottom

20‧‧‧First circuit board

21‧‧‧Contacts

30‧‧‧Second circuit substrate

31‧‧‧Contacts

40‧‧‧ next door

41‧‧‧ openings

42‧‧‧ openings for gas injection

50‧‧‧flat connector

51‧‧‧flat connector

60‧‧‧First substrate

60A‧‧‧Substrate

60a‧‧‧ inner surface

60b‧‧‧ outer surface

61‧‧‧through holes

62‧‧‧First Conductive Plating Department (Electrical Plating Department)

63‧‧‧Filling materials

64‧‧‧through hole

65‧‧‧First conductive layer

66‧‧‧Second conductive layer

67‧‧‧ Space

70‧‧‧Second substrate

70a‧‧‧ inner surface

70b‧‧‧ outer surface

71‧‧‧through holes

72‧‧‧Second Conductive Plating Department

73‧‧‧First electroplated perforation

74‧‧‧Electrical pads

75‧‧‧ Space

80‧‧‧ Third substrate

80a‧‧‧ inner surface

80b‧‧‧ outer surface

81‧‧‧through holes

82‧‧‧ Third Conductive Plating Department

83‧‧‧Second electroplated perforation

84‧‧‧Electrical pads

85‧‧‧ Space

90‧‧‧Conductor layer

91‧‧‧welding layer

101‧‧‧Electrical connection structure

110‧‧‧flat connector

112‧‧‧through hole

113a, 113b‧‧‧ conductive pads

120A‧‧‧First connector

120B‧‧‧Second connector

121‧‧‧second substrate

122‧‧‧ signal line

123‧‧‧Contacts

124‧‧‧ conductive pattern

201‧‧‧Multilayer printed circuit board

202‧‧‧High dielectric constant substrate

203‧‧‧ copper foil pattern layer

204‧‧‧Insulation

205‧‧‧ signal line

C‧‧‧Airlock

F, F'‧‧‧ arrows

S‧‧‧ solder

The first drawing is a schematic view showing an electrical connection structure of a first embodiment of the flat connector of the present invention.

The second drawing shows a cross-sectional view of the periphery of the flat connector in detail in the electrical connection structure using the flat connector shown in the first figure.

The third figure is a plan view of the flat connector shown in the first figure.

The fourth figure is a cross-sectional view taken along line 4-4 of the third figure.

The fifth figure is an enlarged view of the through hole and its periphery in the fourth figure.

Figure 6 is a plan view of the flat connector after removing the conductor layer from the flat connector shown in Fig. 1.

The seventh drawing is a plan view showing a modification of the flat connector shown in the first figure.

Figure 8 shows a second embodiment of the flat connector of the present invention, (A) is a plan view, and (B) is a cross-sectional view taken along line 8B-8B of (A).

Fig. 9 shows a first modification of the flat connector shown in Fig. 8, (A) is a plan view, and (B) is a cross-sectional view taken along line 9B-9B of (A).

Fig. 10 shows a second modification of the flat connector shown in Fig. 8, (A) is a cross-sectional view, and (B) is a cross-sectional view taken along line 10B-10B in (A).

The eleventh figure is a schematic view showing an electrical connection structure of the inner side and the outer side of the airtight chamber in which the electric pressure is connected to each other by the partition wall.

Figure 12 is a cross-sectional view of a prior multilayer printed wiring substrate.

Hereinafter, an electrical connection using the flat connector of the present invention will be described with reference to the drawings. The embodiment of the structure.

The first figure shows an electrical connection structure of a first embodiment using the flat connector of the present invention. In the electrical connection structure, the flat connector 1 is electrically connected to each other and partitioned by the partition 40 to be internally retained. Inside and outside of the airtight airtight chamber C. The inside of the airtight chamber C may be in a state close to a vacuum, or may be a gas having a small molecular weight, for example, filled with helium or hydrogen, and depressurized to a pressure lower than the external pressure. Further, the inside of the airtight chamber C may be in a pressure state higher than the external air pressure.

Here, the partition 40 is formed with an opening 41 that penetrates the inside and the outside of the airtight chamber C. Further, a gas injection opening portion 42 for injecting a gas into the airtight chamber C of the partition wall 40 is formed in the partition wall 40. The partition 40 is made of metal.

Then, as shown in the first figure and the second figure, the opening portion 41 of the partition wall 40 is closed by the flat connector 1.

As shown in the second figure, the flat connector 1 is provided with a substrate 10A that blocks the opening 41. The substrate 10A is a two-layer substrate including a substrate 10 that blocks the opening 41. As shown in the third figure, the base material 10 is a flat-shaped member having a substantially rectangular shape extending in the width direction (upward and downward directions in the third drawing) and the longitudinal direction (left-right direction in the third drawing). As shown in the second to fourth figures, the substrate 10 has an inner surface 10a facing the inner side of the airtight chamber C and an outer surface 10b opposite to the inner surface 10a. Further, the base material 10 has a right end surface 10c in the width direction, a left end surface 10d in the width direction, a rear end surface 10e in the longitudinal direction, and a front end surface 10f in the longitudinal direction. A notch 19 of a predetermined width is formed on the inner surface 10a of the substrate 10, which extends continuously annularly along the outer circumference of the substrate 10, and has an inner side surface 19a and a bottom surface 19b. The substrate 10 is made of, for example, a glass epoxy resin. Here, the "inner surface on the side of the airtight chamber facing the substrate" defined in the claim 1 corresponds to the inner surface of the substrate 10. 10a, "the outer surface on the side opposite to the inner surface of the substrate" corresponds to the outer surface 10b of the substrate 10. Further, the "surface existing in the substrate between the inner surface and the outer surface and extending in parallel with the inner surface" defined in the claim 1 does not exist in the flat connector 1.

Further, as shown in the second and third figures, the conductor layer 11 is provided in the substrate 10. The conductor layer 11 includes a plurality of conductor patterns 11a formed in two rows on the inner surface 10a of the substrate 10, a plurality of conductor patterns 11a formed in two rows on the outer surface 10b of the substrate 10, and a plurality of conductor patterns 11a. The conductor pattern 11b provided on the outer side of the conductor pattern 11a is comprised. One of the plurality of rows of the plurality of conductor patterns 11a formed on the inner surface 10a of the substrate 10 is adjacent to each other along the longitudinal direction of the substrate 10 on the right side in the width direction of the substrate 10. 11a is arranged without spacing the degree of short circuit. Further, the other of the plurality of the plurality of conductor patterns 11a formed on the inner surface 10a of the substrate 10 is adjacent to each other in the longitudinal direction of the substrate 10 on the left side in the width direction of the substrate 10. The conductor patterns 11a are arranged without being spaced apart by the degree of short circuit. Further, one of the plurality of two conductor patterns 11a formed in the outer surface 10b of the substrate 10 is adjacent to each other in the longitudinal direction of the substrate 10 on the right side in the width direction of the substrate 10. The conductor patterns 11a are arranged without being spaced apart by the degree of short circuit. Further, the other of the plurality of two conductor patterns 11a formed in the outer surface 10b of the substrate 10 is adjacent to each other in the longitudinal direction of the substrate 10 on the left side in the width direction of the substrate 10. The conductor patterns 11a are arranged without being spaced apart by the degree of short circuit. The conductor pattern 11b of the conductor layer 11 covers the inner surface 10a of the substrate 10 of the flat connector 1, the inner side surface 19a and the bottom surface 19b of the notch 19, and the outer surface 10b of the substrate 10. Then, the conductor pattern 11b of the conductor layer 11 has the conductor pattern-column extending portion 11c extending between the rows of the two-row conductor patterns 11a formed on the inner surface 10a and the outer surface 10b of the substrate 10, respectively.

Between the conductor patterns 11a adjacent to the two-row conductor pattern 11a formed on the inner surface 10a and the outer surface 10b of the substrate 10, and between the conductor pattern 11b and the two-row conductor pattern 11a, The conductor pattern row extending portion 11c and the two row-shaped conductor patterns 11a have the same width and are exposed portions of the substrate 10.

Here, the conductor layer 11 is not limited to the above, and it is only necessary to cover at least one of the inner surface 10a and the outer surface 10b of the substrate 10. Here, "covering" means that a plurality of conductor patterns 11a, 11b may cover at least one of the inner surface 10a and the outer surface 10b of the substrate 10, and cover at least a part of the surface. Further, it is preferable that the plurality of conductor patterns 11a, 11b cover at least one of the inner surface 10a and the outer surface 10b of the substrate 10 so as to approach 100% of the adjacent bonding devices 10a, 10b without short-circuiting. The conductor layer 11 is formed, for example, by a copper foil.

Further, in the substrate 10 of the substrate 10A, a plurality of through holes 15 electrically connected between the inner surface 10a and the outer surface 10b of the substrate 10 are provided. As shown in the third figure, the through holes 15 are provided for each of the conductor patterns 11a, and one of the conductor patterns 11b is provided on each side in the longitudinal direction of each of the conductor patterns 11a of the respective rows, and a total of four are provided. Each of the through holes 15 is formed by an annular conductive plating portion 13 provided on the inner circumferential surface of the through hole 12 penetrating the inner surface 10a and the outer surface 10b of the base material 10, and a filler 14 filled in the conductive plating portion 13. The conductive plating portion 13 extends between the inner surface 10a and the outer surface 10b of the substrate 10. The conductive plating portion 13 is formed, for example, by tin plating or gold plating. Since the filler 14 is filled in the conductive plating portion 13, the gas permeability of the gas filled inside the airtight chamber can be effectively suppressed. In the case of this embodiment, the filler 14 is made of conductive solder. When the conductive material 14 is made of a conductive solder, the electrical connection between the inner surface 10a of the substrate 10 and the outer surface 10b can be surely performed, and when the gas filled in the interior of the airtight chamber C moves from the inside to the outside of the airtight chamber C. With solder, it can effectively block its movement. Thereby, the gas permeability of the gas filled in the inside of the airtight chamber C can be more effectively suppressed. Further, the filler 14 does not necessarily have to be electrically conductive, and may be a resin having airtightness (for example, trade name "Torr Seal" (registered trademark).

As clearly shown in the fourth and fifth figures, the conductor pattern 11a of the inner surface 10a and the outer surface 10b of the substrate 10 extends between the inner circumferential surface of the through hole 12 of the substrate 10 and the conductive plating portion 13. Then, a conductive plating portion 13 is provided on the inner circumferential surface of the conductor pattern 11a. The conductor pattern 11a and the conductive plating portion 13 are sealed, and the conductive plating portion 13 and the filling material 14 are also sealed. Thereby, the gas does not leak from the inside of the airtight chamber C via the through hole 15.

Then, on the conductor pattern 11a of the inner surface 10a and the outer surface 10b of the substrate 10, a pair of conductive pads 16 which are connected to each other by the conductive plating portion 13 of the through holes 15 are provided. These conductive pads 16 are formed separately from the conductive plating portion 13, but they do not necessarily need to be formed separately. That is, the conductive plating portion 13 on the inner surface 10a and the outer surface 10b side of the substrate 10 may be used as the conductive pad 16.

Further, as shown in the second to fifth figures, in the conductor pattern 11b of the inner surface 10a of the substrate 10, a solder layer 17 extending continuously annularly along the outer periphery of the substrate 10 is formed. As clearly shown in the third and fifth figures, the solder layer 17 extends from the inner surface 10a of the substrate 10 through the inner side surface 19a and the bottom surface 19b of the notch 19 to the right end surface 10c in the width direction of the substrate 10, and the left end surface in the width direction. 10d, the longitudinal direction rear end surface 10e and the longitudinal direction front end surface 10f. The solder layer 17 is formed, for example, by tin plating or gold plating. In addition, the symbols 18 in the second, fourth, and fifth figures are resist layers.

Next, when the flat connector 1 is electrically connected to the inside and the outside of the airtight chamber C, first, as shown in the first figure, the first circuit board 20 is first placed in the airtight chamber C. Then, as shown in the second figure, the inner surface 10a of the flat connector 1 is on the side of the partition 40, and faces the side of the opening 41. Then, the solder layer 17 on the inner surface 10a side of the substrate 10 is joined to the partition wall 40 by the solder S. Thereby, the flat connector 1 is fixed to the partition 40, and the opening 41 is blocked by the flat connector 1. In addition, the conductive pad 16 on the inner surface 10a side of the flat connector 1 is disposed first The contacts 21 of the circuit substrate 20 are in contact.

Then, as shown in the first figure, the contact 31 provided on the second circuit substrate 30 is brought into contact with the conductive pad 16 on the outer surface 10b of the flat connector 1. Thereby, the first circuit board 20 and the second circuit board 30 are electrically connected to each other via the flat connector 1 .

Here, in the present embodiment, as shown in the third embodiment, the flat connector 1 provided with the conductor layer 11, and the flat connector 51 from which the conductor layer 11 is removed, as shown in Fig. 6, is on the substrate. The change in the exposed area of the substrate in the inner surface 10a and the outer surface 10b of 10 is explained.

As shown in the third figure, in the case of the flat connector 1 in which the conductor layer 11 is provided, the exposed area of the substrate on the inner surface 10a and the outer surface 10b of the substrate 10 is 12.01 mm ² . Further, as shown in the sixth figure, in the case where the flat connector 51 of the conductor layer 11 is removed, it is 89.15 mm ² . As described above, in the third embodiment, when the flat connector 1 having the conductor layer 11 is provided, the exposed area of the substrate on the inner surface 10a and the outer surface 10b of the substrate 10 is removed. In the case of the flat connector 51 of the conductor layer 11, the ratio is reduced by about 1/7.

As a result, the permeation (mol/s. Pa) of the gas filled in the inside of the airtight chamber C, as shown in the third figure, in the case of the flat connector 1 provided with the conductor layer 11, the reduction in the exposed area of the substrate The rate is reduced by about 1/7 as compared with the case of the flat connector 51 from which the conductor layer 11 is removed.

Therefore, according to the flat connector 1 of the present embodiment, the substrate 10A is a two-layer substrate having a flat substrate 10 that blocks the opening 41, and the conductor layer 11 covers the inner surface 10a of the substrate 10 and the outside. At least one of the surfaces 10b. Therefore, even if the gas filled in the inside of the airtight chamber C passes through the base material 10 from the inside to the outside of the airtight chamber C, the conductor layer 11 cannot pass through, and the gas permeability of the gas filled in the inside of the airtight chamber C can be effectively suppressed. The use of the two-layer substrate can effectively suppress the gas permeability of the gas filled inside the airtight chamber C.

Further, in the case where the substrate 10 is made of a glass epoxy resin, the gas filled in the inside of the airtight chamber C, in particular, helium or hydrogen having a small molecular weight easily passes through the epoxy resin portion of the organic substance. However, even in this case, when the gas filled in the inside of the airtight chamber C moves from the inside to the outside of the airtight chamber C, the movement thereof is blocked by the conductor layer 11. Thereby, the gas permeability of the gas filled in the inside of the airtight chamber C can be more effectively suppressed.

Further, according to the flat connector 1, the through hole 15 between the inner surface 10a and the outer surface 10b of the base material 10 is electrically connected to each other. Therefore, the inner surface 10a and the outer surface 10b of the substrate 10 of the two-layer substrate can be electrically connected by the through hole 15 electrically. Further, since the filler plating material 14 is filled in the conductive plating portion 13 constituting the through hole 15, the gas permeability of the gas filled inside the airtight chamber C can be more effectively suppressed.

Further, a solder layer 17 extending continuously annularly along the outer circumference of the substrate 10 is formed on the inner surface 10a of the substrate 10. Therefore, the substrate 10A constituting the flat connector 1 can be fixed to the partition 40 by soldering the solder layer 17 on the inner surface 10a side of the substrate 10 to the partition 40 by solder S.

Next, a modification of the flat connector 1 shown in the first figure will be described with reference to the seventh embodiment.

In the flat connector 1 shown in FIG. 7, the conductor layer 11 is provided in the base material 10 similarly to the flat connector 1 shown in FIG. 1 and FIG. The conductor layer 11 is composed of a plurality of conductor patterns 11a formed in two rows on the inner surface 10a of the substrate 10, a plurality of inner surfaces 10a formed in two rows on the outer surface 10b of the substrate 10, and a plurality of inner surfaces 10a. The conductor pattern 11b provided on the outer side of the conductor pattern 11a is comprised. The area of each conductor pattern 11a is larger than the conductor pattern 11a of the flat connector 1 shown in the third figure. However, the conductor pattern 11b of the conductor layer 11 and the conductor pattern 11b shown in the third figure Unlike the conductor pattern row extending portion 11c extending between the rows of the two-row conductor patterns 11a formed on the inner surface 10a and the outer surface 10b of the substrate 10, respectively.

One of the plurality of the plurality of conductor patterns 11a formed in the inner surface 10a of the substrate 10 is adjacent to each other in the longitudinal direction of the substrate 10 in the longitudinal direction of the substrate 10. Do not arrange the distance between the short circuits. Further, the other of the plurality of the plurality of conductor patterns 11a formed on the inner surface 10a of the substrate 10 is adjacent to each other in the longitudinal direction of the substrate 10 on the left side in the width direction of the substrate 10. The conductor patterns 11a are arranged without being short-circuited. Further, one of the plurality of two conductor patterns 11a formed in the outer surface 10b of the substrate 10 is adjacent to each other in the longitudinal direction of the substrate 10 on the right side in the width direction of the substrate 10. The conductor patterns 11a are arranged without being short-circuited. Further, the other of the plurality of two conductor patterns 11a formed in the outer surface 10b of the substrate 10 is adjacent to each other in the longitudinal direction of the substrate 10 on the left side in the width direction of the substrate 10. The conductor patterns 11a are arranged without being short-circuited.

The conductor patterns 11a adjacent to the two-row conductor pattern 11a formed on the inner surface 10a and the outer surface 10b of the substrate 10, the conductor pattern 11b and the two-row conductor pattern 11a, and the two-row conductor pattern The columns 11a have the same width and are the exposed portions of the substrate 10.

Further, as shown in FIG. 7, one through hole 15 is provided for each of the conductor patterns 11a. However, unlike the flat connector 1 shown in FIG. 3, the conductor pattern 11b is not provided.

As shown in the seventh figure, in the case of the flat connector 1 in which the conductor layer 11 is provided, the exposed area of the substrate in the inner surface 10a and the outer surface 10b of the substrate 10 is 21.44 mm ² . As shown in the seventh figure, in the case of the flat connector 1 in which the conductor layer 11 is provided, the exposed area of the substrate in the inner surface 10a and the outer surface 10b of the substrate 10 is removed as shown in FIG. In the case of the flat connector 51 of the conductor layer 11, the ratio is reduced by about 1/4.

As a result, the permeation (mol/s. Pa) of the gas filled in the inside of the airtight chamber C, as shown in the seventh diagram, in the case of the flat connector 1 in which the conductor layer 11 is provided, the reduction in the exposed area of the substrate The rate is reduced by about 1/4 as compared with the case of the flat connector 51 from which the conductor layer 11 is removed.

Next, a second embodiment of the flat connector of the present invention will be described with reference to the eighth to tenth drawings.

A second embodiment of the flat connector of the present invention is shown in the eighth (A) and (B). The flat connector 50 replaces the flat connector 1 of the first embodiment, and is used for the first The electrical connection structure shown in the figure.

The flat connector 50 shown in the eighth (A) and (B) blocks the opening 41 of the partition 40 and is electrically connected to the inner side and the outer side of the airtight chamber C.

The flat connector 50 includes a substrate 60A that blocks the opening 41 of the partition 40. This substrate 60A is a four-layer substrate which is a multilayer substrate. The substrate 60A includes a flat first substrate 60, a second substrate 70 disposed on the inner surface 60a of the first substrate 60 to block the opening 41, and a flat plate disposed on the outer surface 60b of the first substrate 60. The third substrate 80.

Here, the first base material 60 is a flat rectangular member having a rectangular shape extending in the width direction (the horizontal direction in the eighth (A) diagram) and the longitudinal direction (the upper and lower directions in the eighth (A) diagram). The first base material 60 has an inner surface 60a located on the inner side toward the airtight chamber C (refer to the first figure) and an outer surface 60b on the side opposite to the first inner surface 60a. The first base material 60 is made of, for example, a glass epoxy resin.

Further, as shown in the eighth (B) diagram, a plurality of through holes 64 electrically connected between the inner surface 60a and the outer surface 60b of the first substrate 60 are formed in the first base material 60. Multiple through holes 64 is formed in two rows in the width direction of the first base material 60. Each of the column through holes 64 is formed at a predetermined pitch along the longitudinal direction, but is not shown. Each of the through holes 64 is provided with an annular first conductive plating portion 62 that is applied to the inner circumferential surface of the through hole 61 that penetrates between the inner surface 60a and the outer surface 60b of the first base material 60. The inside of the first conductive plating portion 62 is filled with a filling material 63. The first conductive plating portion 62 extends between the inner surface 60a and the outer surface 60b of the first substrate 60. The first conductive plating portion 62 is formed, for example, by tin plating or gold plating. Further, the filler 63 is made of a conductive solder. When the conductive material 63 is made of a conductive solder, not only the electrical connection between the inner surface 60a of the first substrate 60 and the outer surface 60b can be reliably performed, but when the gas filled in the interior of the airtight chamber C moves from the inside to the outside of the airtight chamber C. When it is soldered, it can effectively block its movement. Thereby, the gas permeability of the gas filled in the inside of the airtight chamber C can be more effectively suppressed. Further, the filler 14 does not necessarily have to be electrically conductive, and may be a resin having airtightness (for example, trade name "Torr Seal" (registered trademark).

Further, a plurality of first conductive layers 65 connected to the inner surface 60a side of the first conductive plating portion 62 are provided on the inner surface 60a of the first substrate 60. Further, on the outer surface 60b of the first substrate 60, a plurality of second conductive layers 66 connected to the outer surface 60b side of the first conductive plating portion 62 are provided.

The second base material 70 is a flat rectangular member extending in the width direction (the horizontal direction in the eighth (A) drawing) and the longitudinal direction (the upper and lower directions in the eighth (A) drawing). The second substrate 70 has the same width and length as the inner surface 60a of the first substrate 60. The second substrate 70 has an inner surface 70a located toward the inner side of the airtight chamber C shown in the first figure, and an outer surface 70b opposite to the inner surface 70a. The second substrate 70 is made of, for example, a glass epoxy resin.

Further, as shown in the eighth (B) diagram, the second substrate 70 is formed with a first plating via 73 interposed between the inner surface 70a and the outer surface 70b of the second substrate 70. Multiple first electric The plated perforations 73 are formed in a line shape in the width direction of the second base material 70 at the outer position than the through hole 64. The first electroplated perforations 73 of the respective rows are subjected to the second electroconductive plating portion 72 on the inner circumferential surface of the through hole 71 penetrating between the inner surface 70a and the outer surface 70b of the second substrate 70. The second conductive plating portion 72 extends between the inner surface 70a and the outer surface 70b of the second substrate 70. As shown in the eighth (B) diagram, the second conductive plating portion 72 is formed so as to be entirely buried inside the through hole 71. Then, the outer surface 70b side of each of the second conductive plating portions 72 is connected to the first conductive layer 65, and the first conductive layer 65 and the first conductive plating portion 62 constituting the through hole 64 formed in the first substrate 60 are formed. The surface 60a is connected to the side. Further, a plurality of conductive pads 74 connected to the inner surface side of the second conductive plating portion 72 are provided on the inner surface 70a of the second substrate 70. As shown in the eighth (A) diagram, the plurality of conductive pads 74 are formed in two rows in the width direction on the inner surface 70a of the second substrate 70. Each of the conductive pads 74 is formed in a rectangular shape.

Further, the third base material 80 is a flat rectangular member extending in the width direction (the horizontal direction in the eighth (A) drawing) and the longitudinal direction (the upper and lower directions in the eighth (A) drawing). The third substrate 80 has the same width and length as the outer surface 60b of the first substrate 60. Then, the third base material 80 has an inner surface 80a and an opposite side outer surface 80b which are located toward the inner side of the airtight chamber C shown in the first figure. The third substrate 80 is made of, for example, a glass epoxy resin.

Further, as shown in the eighth (B) diagram, a plurality of second plated perforations 83 interposed between the inner surface 80a and the outer surface 80b of the third substrate 80 are formed in the third substrate 80. The plurality of second plating perforations 83 are formed in a line shape at a position outside the through hole 64 in the width direction of the third base material 80. The second electroplated portion 82 of each row is subjected to a third conductive plating portion 82 on the inner peripheral surface of the through hole 81 penetrating between the inner surface 80a and the outer surface 80b of the third base member 80. The third conductive plating portion 82 extends between the inner surface 80a and the outer surface 80b of the third substrate 80. As shown in the eighth (B) diagram, the third conductive plating portion 82 is formed so as to be entirely buried inside the through hole 81. Then, each of the third conductive plating portions 82 The inner surface 80a side is connected to the second conductive layer 66, and the second conductive layer 66 is connected to the outer surface 60b side of the first conductive plating portion 62 constituting the through hole 64 formed in the first substrate 60. Further, a plurality of conductive pads 84 connected to the outer surface side of the third conductive plating portion 82 are provided on the outer surface 80b of the third substrate 80. The plurality of conductive pads 84 are formed in two rows on the outer surface 80b of the third substrate 80 in the width direction, but are not shown. Each of the conductive pads 84 has a rectangular shape.

Here, as shown in the eighth (B), the outer surface 70b of the second substrate 70 is disposed in contact with the inner surface 60a of the first substrate 60, and is formed by the second substrate 70 being clogged. The inner surface side of the through hole 64 of a substrate 60. Further, the inner surface 80a of the third substrate 80 is disposed in contact with the outer surface 60b of the first substrate 60, and is blocked by the third substrate 80 on the outer surface of the through hole 64 of the first substrate 60. side.

Further, as shown in the eighth (A) and (B), the conductor layer 90 is provided on the inner surface 70a of the second substrate 70. The conductor layer 90 is formed in a substantially rectangular shape so as to surround the outer surface 70a of the second base material 70 so as to form a plurality of outer sides of the plurality of conductive pads 74 in the width direction. The conductor layer 90 is disposed so as to be short-circuited with the conductive pads 74, and the conductive pads 74 are arranged at a predetermined interval. The conductor layer 90 is provided on the inner surface 70a of the second base material 70 so as to substantially cover a portion of the weld layer 91 which is continuously annularly extended along the outer periphery of the second base material 70, which will be described later. The conductor layer 90 is formed, for example, by a copper foil.

The conductor layer 90 is not limited to covering the inner surface 70a of the second substrate 70, and only covers the inner surface 70a of the second substrate 70, the outer surface 70b of the second substrate 70, and the inner surface of the first substrate 60. The outer surface 60b of the first base material 60, the inner surface 80a of the third base material 80, and the outer surface 80b of the third base material 80 may be at least one surface. The term "covering" as used herein refers to the inner surface 70a of the second substrate 70, the outer surface 70b of the second substrate 70, and the inner surface of the first substrate 60. At least one of the outer surface 60b of the first base material 60, the inner surface 80a of the third base material 80, and the outer surface 80b of the third base material 80 may cover at least a part of the one surface. In addition, the conductor layer 90 should preferably cover 100% of the side.

Further, as shown in the eighth (A) and (B), the inner surface 70a of the second substrate 70 is formed with a solder layer 91 extending continuously annularly at a predetermined width along the outer circumference of the second substrate 70. The solder layer 91 is formed, for example, by tin plating or gold plating.

In addition, the "inner surface located on the inner side of the airtight chamber facing the substrate" defined in the claim 1 corresponds to the inner surface 70a of the second base material 70 and the "outer surface opposite to the inner surface of the substrate". The outer surface 80b of the third substrate 80. Further, the "face extending parallel to the inner surface of the substrate existing between the inner surface and the outer surface" specified in the claim 1 corresponds to the outer surface 70b of the second substrate 70 and the inner surface of the first substrate 60. 60a, the outer surface 60b of the first substrate 60, and the inner surface 80a of the third substrate 80.

Next, when the flat connector 50 is electrically connected to the inside and the outside of the airtight chamber C, first, as shown in the first figure, the first circuit board 20 is first placed in the airtight chamber C. Then, the inner surface 70a of the second base material 70 of the flat connector 50 is on the side of the partition 40, and faces the side of the opening 41, but is not shown. Then, the solder layer 91 on the inner surface 70a side of the second substrate 70 is bonded to the partition wall 40 by soldering. Thereby, the flat connector 50 is fixed to the partition wall 40, and the opening portion 41 is blocked by the flat connector 50. Further, the conductive pads 74 on the inner surface 70a side of the second substrate 70 of the flat connector 50 are in contact with the contacts 21 provided on the first circuit substrate 20.

Then, the contact 31 provided on the second circuit substrate 30 is brought into contact with the conductive pad 84 on the outer surface 80b side of the third substrate 80 of the flat connector 50. Thereby, the first circuit board 20 and the second circuit board 30 are electrically connected to each other via the flat connector 50.

According to the flat connector 50 of the embodiment, the substrate 60A that blocks the opening 41 serves as a four-layer substrate of the multilayer substrate. Then, the substrate 60A includes a flat first substrate 60; a flat second substrate 70 that is disposed on the inner surface 60a of the first substrate 60 to block the opening 41; and is disposed on the first substrate 60. A flat third substrate 80 having an outer surface 60b. Further, the conductor layer 90 covers one side of the inner surface 70a of the second substrate 70. Therefore, the gas filled in the inside of the airtight chamber C cannot pass through the conductor layer 90 through the second base material 70, the first base material 60, and the third base material 80 even from the inside to the outside of the airtight chamber C. Thereby, the gas permeability of the gas filled in the inside of the airtight chamber C can be effectively suppressed by using the four-layer substrate which is a multilayer substrate.

Then, the flat connector 50 is provided with a through hole 64 electrically connected between the inner surface 60a and the outer surface 60b of the first base material 60. Further, the flat connector 50 is provided with a first plated through hole 73 which is connected between the inner surface 70a and the outer surface 70b of the second substrate 70 and is connected to the through hole 64 of the first substrate 60. Further, the flat connector 50 is provided with a second plated through hole 83 which is connected between the inner surface 80a and the outer surface 80b of the third base material 80 and is connected to the through hole 64 of the first base material 60. Therefore, the through hole 64, the first plated through hole 73 and the second plated through hole 83 can be electrically connected between the inner surface 60a and the outer surface 80b of the four-layer substrate. Further, the inner surface 60a side of the through hole 64 is blocked by the second base material 70, and the outer surface 60b side of the through hole 64 is blocked by the third base material 80. Therefore, in the four-layer substrate, it is not necessary to fill the filling material 63 in the first conductive plating portion 62 constituting the through hole 64. In the present embodiment, when the filling material 63 is filled in the first conductive plating portion 62, the gas permeability of the gas filled in the inside of the airtight chamber C can be further suppressed.

Next, a first modification of the flat connector shown in the eighth (A) and (B) will be described with reference to the ninth (A) and (B) drawings.

The flat connector 50 and the eighth (A), (B) shown in the ninth (A) and (B) The basic configuration of the flat connector 50 shown in the drawing is the same, except that the first conductive plating portion 62 constituting the through hole 64 is not filled with the filling material 63 as the space 67. As described above, the inner surface 60a side of the through hole 64 is blocked by the second base material 70, and the outer surface 60b side of the through hole 64 is blocked by the third base material 80. Therefore, in the four-layer substrate, it is not necessary to fill the filling material 63 in the first conductive plating portion 62 constituting the through hole 64 (refer to FIG. 8(B)).

Further, in the flat connector 50 shown in the ninth (A) and (B), a space 75 is formed in each of the first plating vias 73 inside the second conductive plating portion 72. Further, in each of the second plating vias 83, a space 85 is formed inside the third conductive plating portion 82. In the flat connector 50 shown in the eighth (A) and (B), the second conductive plating portion 72 and the third conductive plating portion 82 are formed so as to be entirely buried inside the through holes 71 and 81. Regarding these portions, the flat connector 50 shown in the ninth (A) and (B) is different from the flat connector 50 shown in the eighth (A) and (B). When the spaces 75 and 85 are formed inside the second conductive plating portion 72 and the third conductive plating portion 82, it is effective when the diameters of the through holes 71 and 81 are large in each of the first plating vias 73 and the second plating vias 83.

Even in the flat connector 50 shown in the ninth (A) and (B), the substrate 60A that blocks the opening portion 41 serves as a four-layer substrate of the multilayer substrate. Then, the substrate 60A includes a flat first substrate 60, a flat second substrate 70 that is disposed on the inner surface 60a of the first substrate 60 and blocks the opening 41, and is disposed on the first substrate 60. A flat third substrate 80 having an outer surface 60b. Further, the conductor layer 90 covers the inner surface 70a of the second substrate 70. Therefore, even if the gas filled in the inside of the airtight chamber C passes through the second base material 70, the first base material 60, and the third base material 80 from the inside to the outside of the airtight chamber C, the conductor layer 90 cannot pass. Thereby, the gas permeability of the gas filled in the inside of the airtight chamber C can be effectively suppressed by using the four-layer substrate which is a multilayer substrate.

Further, a second modification of the flat connector shown in Figs. 8(A) and (B) will be described with reference to the tenth (A) and (B) drawings.

The flat connector 50 shown in the tenth (A) and (B) is the same as the basic configuration of the flat connector 50 shown in the eighth (A) and (B), but the difference is not the coverage. The inner surface 70a of the second substrate 70 is provided with a conductor layer 90 so as to cover the inner surface 60a of the first substrate 60.

Specifically, the conductor layer 90 is formed into a substantially rectangular shape so as to cover the outer surface of the plurality of first conductive layers 65 in which the inner surface 70a of the second base material 70 is formed in a row in the width direction. The conductor layer 90 is disposed at a predetermined interval from each of the first conductive layers 65 so as not to be short-circuited with each of the first conductive layers 65. The conductor layer 90 is disposed in a substantially uniform manner covering the inner surface 70a of the second substrate 70.

Further, the flat connector 50 shown in the tenth (A) and (B) is different from the flat connector 50 shown in the eighth (A) and (B) in that the through hole 64 is formed. A filling material 63 is not filled in the conductive plating portion 62 as a space 67.

Even in the flat connector 50, the substrate 60A that blocks the opening portion 41 serves as a four-layer substrate of the multilayer substrate. Then, the substrate 60A includes a flat first substrate 60, a flat second substrate 70 that is disposed on the inner surface 60a of the first substrate 60 and blocks the opening 41, and is disposed on the first substrate 60. A flat third substrate 80 having an outer surface 60b. Further, the conductor layer 90 covers the inner surface 60a of the first substrate 60. Therefore, even if the gas filled in the inside of the airtight chamber C passes through the second base material 70, the first base material 60, and the third base material 80 from the inside to the outside of the airtight chamber C, the gas cannot pass through the conductor layer 90. Thereby, the gas permeability of the gas filled in the inside of the airtight chamber C can be effectively suppressed by using the four-layer substrate which is a multilayer substrate.

The above description has been made on the embodiment of the present creation, but the present creation is not limited thereto, and various modifications and improvements can be made.

For example, the conductor layer 11 only needs to cover at least one of the inner surface 10a and the outer surface 10b of the substrate 10, and it is not necessary to cover the inner surface 10a of the substrate 10 of the flat connector 1, the inner side surface 19a of the notch 19, and The bottom surface 19b and the outer surface 10b of the substrate 10.

Further, the inner surface 10a of the substrate 10 may not form the solder layer 17 which continuously extends annularly along the outer periphery of the substrate 10.

Further, the inner surface 70a of the second substrate 70 may not form the solder layer 91 extending continuously annularly at a predetermined width along the outer circumference of the second substrate 70.

Further, in the eighth to tenth embodiments, the multilayer substrate is described as an example in which a four-layer substrate is used, but it may be a multilayer substrate of six or more layers. In this case, the conductor layer only needs to cover the inner surface located on the inner side of the airtight chamber C facing the multilayer substrate, the outer surface opposite to the inner surface of the multilayer substrate, and the aforementioned multilayer substrate existing between the inner surface and the outer surface. The inner portion may have at least one of the faces extending parallel to the inner surface.

Further, in the flat connector 1 shown in the first to seventh embodiments, metal contacts can be connected to the conductive pads 16 formed on the inner surface 10a and the outer surface 10b of the substrate 10, respectively. In addition, the conductive pad 16 may also be connected to a metal contact mounted on an insulating frame.

Furthermore, the flat connectors 50 shown in the eighth to tenth embodiments are respectively formed on the inner surfaces 70a of the second substrate 70 and the conductive pads 74, 84 of the outer surface 80b of the third substrate 80. Metal joints can also be connected. In addition, the conductive pads 74, 84 can also be connected to metal contacts mounted on an insulating frame.

1‧‧‧flat connector

20‧‧‧First circuit board

21‧‧‧Contacts

30‧‧‧Second circuit substrate

31‧‧‧Contacts

40‧‧‧ next door

41‧‧‧ openings

42‧‧‧ openings for gas injection

C‧‧‧Airlock

Claims (8)

A flat-plate connector for electrically interconnecting an inner side and an outer side of an airtight chamber partitioned by a partition wall to block an opening formed in the partition wall and penetrating inside the airtight chamber and the outside, and is characterized in that: a flat substrate is provided The clogging of the opening, the substrate including a conductor layer covering an inner surface facing the inner side of the inner surface of the substrate, an outer surface opposite to the inner surface of the substrate, and the inner surface At least one of the surfaces of the aforementioned substrate between the outer surface and the outer surface extending parallel to the inner surface. The flat connector of the first aspect of the invention, wherein the substrate is a two-layer substrate, wherein the two-layer substrate includes a flat substrate that blocks the opening, and the conductor layer covers an inner surface of the substrate and At least one of the outer surfaces and the through holes are electrically connected to each other between the inner surface and the outer surface of the substrate, and are provided by the inner peripheral surface of the through hole provided between the inner surface and the outer surface of the substrate And comprising an annular conductive plating portion extending between the inner surface and the outer surface of the substrate, and a filler filled in the conductive plating portion. A flat connector according to claim 2, wherein a solder layer extending continuously annularly along the outer periphery of the substrate is formed on the inner surface of the substrate. A flat connector according to claim 2 or 3, wherein the filler material is a conductive solder. The flat connector of the first aspect of the invention, wherein the substrate is a multilayer substrate, and the multilayer substrate includes: a first substrate having a flat shape; and a second substrate having a flat shape disposed to face the first substrate An inner surface of the inner surface of the inner surface of the inner surface of the substrate, which blocks the foregoing And a third substrate having a flat shape disposed on an outer surface of the first substrate; the conductor layer covering an inner surface of the second substrate, an outer surface of the second substrate, and the first surface At least one of an inner surface of the substrate, an outer surface of the first substrate, an inner surface of the third substrate, and an outer surface of the third substrate, and a through hole electrically connected to each other Between the inner surface and the outer surface of the first substrate, an annular conductive plating portion is provided on the inner circumferential surface of the through hole penetrating between the inner surface and the outer surface of the first substrate, and a first plated perforation extending between the inner surface and the outer surface of the second substrate and connected to the through hole of the first substrate; and a second The electroplated perforations are connected between the inner surface and the outer surface of the third substrate, and are connected to the through holes of the first substrate. The flat connector of claim 5, wherein the inner surface of the second substrate forms a solder layer extending continuously annularly along the outer circumference of the second substrate. A flat connector according to claim 5 or 6, wherein the through hole has a filling material filled in the conductive plating portion. The flat connector of claim 7, wherein the filler material is a conductive solder.