WO2014013644A1

WO2014013644A1 - Planar connector

Info

Publication number: WO2014013644A1
Application number: PCT/JP2013/002413
Authority: WO
Inventors: 橋本　信一
Original assignee: タイコエレクトロニクスジャパン合同会社
Priority date: 2012-07-19
Filing date: 2013-04-09
Publication date: 2014-01-23
Also published as: CN104471794A; TWM465683U; CN104471794B

Abstract

Provided is a planar connector, which is to be used for the purpose of electrically connecting to each other the inner side and the outer side of an air-tight chamber partitioned by means of a partitioning wall, and which closes an opening formed in the partitioning wall to penetrate the air-tight chamber from the inside to the outside thereof, said planar connector being capable of effectively suppressing transmissivity of a gas, with which the inside of the air-tight chamber is filled, and reliably electrically connecting between the inner surface and the outer surface of a substrate. A planar connector (1) is provided with a planar substrate (10A) that closes an opening (41) in the partitioning wall (40). The substrate (10A) is provided with a conductor layer (11), that covers the inner surface (10a) of the substrate (10A), said inner surface being positioned to face the inner side of the air-tight chamber (C) and/or the outer surface (10b) of the substrate (10A), said outer surface being on the side reverse to the inner surface (10a).

Description

Flat connector

The present invention is used for electrically interconnecting the inside and outside of an airtight chamber defined by a partition wall, and is a flat plate connector formed in the partition wall for closing an opening that penetrates the inside and the outside of the airtight chamber. About.

Conventionally, there is a demand to electrically interconnect the inside and outside of an airtight chamber partitioned by a partition wall. For example, in a semiconductor chip process in which an integrated circuit is mounted, a vacuum chamber capable of reducing the pressure to near vacuum is used, and the inside and outside of the vacuum chamber are electrically connected. In addition, the inside of an airtight chamber partitioned by a partition wall is filled with a gas having a low molecular weight, for example, He gas or hydrogen gas, and decompressed. In the electrical connection between the inside and outside of the hermetic chamber whose pressure is adjusted, the airtightness inside the chamber is maintained, and at the same time, reliable electrical connectivity between the inside and outside of the chamber is required.

As a conventional electrical connection structure of this type, for example, the one shown in FIG. 11 is known (see Patent Document 1). FIG. 11 is a schematic diagram of an electrical connection structure for electrically interconnecting the inside and outside of a hermetic chamber, which is partitioned by a partition wall and adjusted in pressure, according to a conventional example.
The electrical connection structure shown in FIG. 11 electrically interconnects the interior A side and exterior B side of a chamber (not shown) that is partitioned by a partition wall (not shown) and whose internal pressure is adjusted.

In this electrical connection structure, the partition wall is formed with an opening (not shown) penetrating the inside A side and the outside B side of the chamber. The opening is closed by the flat connector 110.
Here, the base material of the flat connector 110 is provided with a plurality of via holes 112 filled with a conductor. In addition, a pair of

conductive pads

113 a and 113 b interconnected by the conductors of the via holes 112 are provided on the inner surface and the outer surface of the flat connector 110.

A plurality of first connectors 120 A are disposed inside the flat connector 110, and a plurality of second connectors 120 B are disposed outside the flat connector 110.
Each first connector 120A is arranged so as to extend in a direction orthogonal to the flat connector 110, and a plurality of the first connectors 120A are arranged along the longitudinal direction (vertical direction in FIG. 11) of the flat connector 110. ing. Each of the second connectors 120B is disposed so as to extend in a direction orthogonal to the flat connector 110. The second connector 120B extends along the longitudinal direction of the flat connector 110 so that the second connector 120B faces the first connector 120A. Are arranged.

Here, each first connector 120A is arranged so as to extend in a direction orthogonal to the flat connector 110, and the width direction of the second substrate 121 (perpendicular to the paper surface in FIG. 11). And a plurality of contacts 123 arranged at a predetermined pitch along the direction). On the surface of the second substrate 121 (the upper surface in FIG. 11), a plurality of conductive patterns 124 are provided at a predetermined pitch along the width direction of the second substrate 121. Each contact 123 is connected to one end side of each conductive pattern 124. A signal line 122 is connected to the other end side of each conductive pattern 124. Each second connector 120B has the same configuration as each first connector 120A.

In the electrical connection structure 101 having such a configuration, the first connector 120A is advanced in the direction of arrow F in FIG. 11, and the contact 123 is brought into contact with the conductive pad 113a provided on the inner surface of the flat connector 110. On the other hand, the second connector 120B is advanced in the direction of arrow F ′ in FIG. 11, and the contact 123 is brought into contact with the conductive pad 113 b provided on the outer surface of the flat connector 110. Thereby, the

signal lines

122 and 122 on the chamber inner side A and the outer side B are connected to the conductive pattern 124 on the chamber inner side A, the contact 123, the conductive pad 113a on the inner surface of the flat connector 110, the via hole 112, and the flat connector. It is electrically connected through the conductive pad 113b on the outer surface 110, the contact 123, and the conductive pattern 124 on the chamber outside B side.

On the other hand, as a conventional multilayer printed wiring board, for example, the one shown in FIG. 12 is known (see Patent Document 2). FIG. 12 is a cross-sectional view of a conventional multilayer printed wiring board.
In a multilayer printed wiring board 201 shown in FIG. 12, both surfaces of a high dielectric constant substrate 202 are sandwiched between planar copper foil pattern layers 203 serving as power supply lines or ground lines. An insulating layer 204 is formed outside the copper foil pattern layer 203, and a signal line 205 such as a copper foil is further formed outside the insulating layer 204.

JP 2004-349073 A Japanese Utility Model Publication No. 7-10979

However, the conventional electrical connection structure 101 shown in FIG. 11 and the conventional multilayer printed wiring board 201 shown in FIG. 12 have the following problems.
That is, in the case of the electrical connection structure 101 shown in FIG. 11, the exposed area of the base material of the flat connector 110 that closes the opening that penetrates the inside A side and the outside B side of the chamber is large. That is, the areas of the exposed portions without the

conductive pads

113a and 113b are large on the inner side A side and the outer side B side of the base material chamber of the flat connector 110. For this reason, the gas permeability which the gas with which the inside A of a chamber is filled permeate | transmits to the external B side cannot be suppressed effectively.

On the other hand, in the case of the multilayer printed wiring board 201 shown in FIG. 12, when used for the purpose of closing the opening formed in the partition wall, the planar copper foil pattern layer 203 may suppress the gas permeability. Is possible. However, since there is no through-hole penetrating between both surfaces of the high dielectric constant substrate 202, the both surfaces of the high dielectric constant substrate 202 cannot be electrically connected. If a through hole penetrating between both surfaces of the high dielectric constant substrate 202 is formed, gas passes through the through hole and the gas permeability cannot be suppressed.

Accordingly, the present invention has been made to solve these conventional problems, and the object thereof is used to electrically interconnect the inside and outside of an airtight chamber partitioned by a partition, and is formed in the partition. In the flat connector that closes the opening that penetrates the inside and outside of the hermetic chamber, the gas permeability of the gas filled inside the hermetic chamber can be effectively suppressed, and the inside of the substrate An object of the present invention is to provide a flat connector that can electrically and reliably connect a surface and an outer surface.

In order to achieve the above object, a flat connector according to an aspect of the present invention is used to electrically interconnect the inside and outside of an airtight chamber partitioned by a partition, and is formed in the partition. A flat connector for closing an opening penetrating the inside and outside of the hermetic chamber, comprising a flat substrate for closing the opening, the substrate facing the inside of the hermetic chamber of the substrate An inner surface located, an outer surface opposite to the inner surface of the substrate, and a surface extending parallel to the inner surface present in the substrate between the inner surface and the outer surface A conductive layer covering at least one surface is provided.

Here, “covering” means that the conductor layer extends parallel to the inner surface of the substrate, the outer surface of the substrate, and the inner surface existing inside the substrate between the inner surface and the outer surface. It means that at least one part of the surface should cover at least a part of the surface. The conductor layer preferably covers nearly 100% of at least one of the inner surface and the outer surface of the substrate.

Further, in this flat connector, the substrate is a two-layer substrate, the two-layer substrate includes a flat substrate that closes the opening, and the conductor layer includes an inner surface and an outer surface of the substrate. A via that covers at least one surface of the base material and electrically interconnects the inner surface and the outer surface of the base material, the inner surface of the through-hole penetrating between the inner surface and the outer surface of the base material. It is preferable to include the via made of an annular conductive plating portion that is provided and extends between the inner surface and the outer surface of the substrate and a filler filled in the conductive plating portion.
In this flat connector, a soldering layer that extends continuously and endlessly along the outer periphery of the base material may be formed on the inner surface of the base material.
Furthermore, in this flat connector, it is preferable that the filler is a conductive solder.

Further, in this flat connector, the substrate is a multilayer substrate, and the multilayer substrate is formed on a flat plate-like first base material and an inner surface of the first base material positioned toward the inside of the airtight chamber. A flat plate-like second base material arranged to close the opening; and a flat plate-like third base material arranged on an outer surface of the first base material, wherein the conductor layer is formed of the second base material. An inner surface of the second substrate, an inner surface of the first substrate, an outer surface of the first substrate, an inner surface of the third substrate, and an outer surface of the third substrate. A via that covers at least one surface of the first substrate and electrically interconnects the inner surface and the outer surface of the first base material, the inner surface of the through hole penetrating between the inner surface and the outer surface of the first base material; The via provided with an annular conductive plating portion provided on a peripheral surface and extending between an inner surface and an outer surface of the first substrate; and the second group A first plated through hole interconnecting the inner and outer surfaces of the first substrate and the vias of the first substrate, and interconnecting the inner and outer surfaces of the third substrate and the first substrate There may be provided a second plated through hole connected to the via of the material.

Here, the “multilayer substrate” means a multilayer substrate having four or more layers.
In this flat connector, a soldering layer that extends continuously and endlessly along the outer periphery of the second base material may be formed on the inner surface of the second base material.
Furthermore, in this flat connector, the via may include a filler filled in the conductive plating portion.
In the flat connector, it is preferable that the filler is conductive solder.

According to the flat connector according to the present invention, the flat board includes a flat board that closes the opening of the partition wall, and the board includes an inner surface that is located toward an inner side of the hermetic chamber of the board, and the inner surface of the board. A conductor composed of a plurality of conductor patterns covering at least one of the outer surface opposite to the inner surface and a surface extending in parallel to the inner surface existing inside the substrate between the inner surface and the outer surface With layers. For this reason, even if the gas filled in the hermetic chamber can pass through the substrate from the inside of the hermetic chamber to the outside, it cannot pass through the conductor layer, and the gas permeation of the gas filled in the hermetic chamber is prevented. The rate can be effectively suppressed.

When the substrate is made of glass epoxy, the gas filled in the hermetic chamber, particularly He gas or hydrogen gas having a low molecular weight, easily passes through the epoxy part which is an organic substance. However, even in this case, when the gas filled in the hermetic chamber moves from the inside of the hermetic chamber toward the outside, the movement is blocked by the conductor layer. Thereby, the gas permeability of the gas with which the inside of an airtight chamber is filled can be suppressed more effectively.

Further, in this flat connector, the substrate is a two-layer substrate, the two-layer substrate includes a flat substrate that closes the opening, and the conductor layer includes an inner surface and an outer surface of the substrate. When covering at least one of the two layers, the gas permeability of the gas filled in the airtight chamber can be effectively suppressed using the two-layer substrate. The flat connector includes vias that electrically interconnect the inner surface and the outer surface of the substrate. For this reason, the inner surface and the outer surface of the base material of the two-layer substrate can be electrically and reliably connected by vias. Moreover, since the conductive plating part constituting the via is filled with the filler, the gas permeability of the gas filled in the airtight chamber can be further effectively suppressed.

Furthermore, in this flat connector, the substrate is a multilayer substrate, and the multilayer substrate is formed on a flat plate-like first base material and an inner surface of the first base material facing the inside of the hermetic chamber. A flat plate-like second base material that is arranged and closes the opening, and a flat plate-like third base material that is arranged on the outer surface of the first base material. The conductor layer includes an inner surface of the second substrate, an outer surface of the second substrate, an inner surface of the first substrate, an outer surface of the first substrate, and an inner surface of the third substrate. Covering at least one of the surface and the outer surface of the third substrate. In this case, the gas permeability of the gas filled in the hermetic chamber can be effectively suppressed using the multilayer substrate. The flat connector includes a via that electrically interconnects the inner surface and the outer surface of the first base material. The flat connector includes a first plated through hole that interconnects the inner surface and the outer surface of the second base material and connects to the via of the first base material, the inner surface of the third base material, and A second plated through hole interconnecting the outer surfaces and connecting to the via of the first substrate is provided. For this reason, the inner surface and the outer surface of the multilayer substrate can be electrically and reliably connected by the via, the first plated through hole, and the second plated through hole. Note that the inner surface side of the via is closed by the second base material, and the outer surface side of the via is closed by the third base material. For this reason, in the multilayer substrate, it is not always necessary to fill the conductive plating portion constituting the via with a filler.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram of the electrical connection structure using 1st Embodiment of the flat connector which concerns on this invention. FIG. 2 is a cross-sectional view showing in detail the periphery of the flat connector in the electrical connection structure using the flat connector shown in FIG. 1. It is a top view of the flat connector shown in FIG. FIG. 4 is a cross-sectional view taken along line 4-4 in FIG. FIG. 5 is an enlarged view of the via and its periphery in FIG. 4. It is a top view of the flat connector which removed the conductor layer from the flat connector shown in FIG. It is a top view of the modification of the flat connector shown in FIG. FIG. 2A is a plan view of a flat connector according to the present invention, and FIG. 4B is a cross-sectional view taken along line 8B-8B in FIG. 8 shows a first modification of the flat connector shown in FIG. 8, (A) is a plan view, and (B) is a sectional view taken along line 9B-9B in (A). 8 shows a second modification of the flat connector shown in FIG. 8, (A) is a cross-sectional view, and (B) is a cross-sectional view taken along line 10B-10B in (A). It is a schematic diagram of the electrical connection structure which electrically interconnects the inner side and the outer side of the airtight chamber in which the pressure was adjusted divided by the partition of a prior art example. It is sectional drawing of the conventional multilayer printed wiring board.

Hereinafter, an embodiment of an electrical connection structure using a flat connector according to the present invention will be described with reference to the drawings.
FIG. 1 shows an electrical connection structure using the flat connector according to the first embodiment of the present invention. In this electrical connection structure, an airtight chamber C partitioned by a partition wall 40 and kept airtight. Are electrically interconnected using a flat connector 1. The inside of the airtight chamber C may be in a state close to a vacuum, or may be filled with a gas having a low molecular weight, such as He gas or hydrogen gas, and reduced in pressure to a pressure lower than the external pressure. Further, the inside of the airtight chamber C may be in a state of a pressure higher than the external pressure.

Here, the partition wall 40 is formed with an opening 41 penetrating the inside and the outside of the hermetic chamber C. Further, the partition wall 40 is formed with a gas injection opening 42 for injecting gas into the hermetic chamber C of the partition wall 40. The partition 40 is made of metal.
And the opening part 41 of the partition 40 is block | closed with the flat connector 1 as shown in FIG.1 and FIG.2.

The flat connector 1 includes a substrate 10A that closes the opening 41 as shown in FIG. The substrate 10 A is a two-layer substrate, and the two-layer substrate includes a base material 10 that closes the opening 41. As shown in FIG. 3, the base material 10 is a substantially rectangular flat plate member extending in the width direction (up and down direction in FIG. 3) and the longitudinal direction (left and right direction in FIG. 3). As shown in FIGS. 2 to 4, the base material 10 has an inner surface 10a positioned toward the inner side of the airtight chamber C and an outer surface 10b opposite to the inner surface 10a. Moreover, the base material 10 has the width direction right end surface 10c, the width direction left end surface 10d, the longitudinal direction rear end surface 10e, and the longitudinal direction front end surface 10f. The inner surface 10a of the base material 10 is formed with a notch 19 having a predetermined width and extending in an endless manner along the outer periphery of the base material 10 and having an inner side surface 19a and a bottom surface 19b. The base material 10 is made of glass-filled epoxy, for example. Here, the “inner surface located toward the inner side of the hermetic chamber of the substrate” defined in claim 1 corresponds to the inner surface 10a of the base material 10 and “the opposite side of the inner surface of the substrate”. The “outer surface” corresponds to the outer surface 10 b of the substrate 10. Further, the “plane extending parallel to the inner surface existing inside the substrate between the inner surface and the outer surface” defined in claim 1 does not exist in the flat connector 1.

Further, as shown in FIGS. 2 and 3, the base material 10 is provided with a conductor layer 11. The conductor layer 11 includes a plurality of two rows of conductor patterns 11a formed on the inner surface 10a of the substrate 10, a plurality of two rows of conductor patterns 11a formed on the outer surface 10b of the substrate 10, and these The conductor pattern 11b is provided so as to surround the outside of the plurality of conductor patterns 11a. One of the two rows of conductive patterns 11a formed on the inner surface 10a of the base material 10 is a conductor pattern adjacent along the longitudinal direction of the base material 10 on the right side in the width direction of the base material 10. 11a is arranged at a pitch that does not short-circuit each other. The other row of the plurality of two-row conductive patterns 11 a formed on the inner surface 10 a of the base material 10 is adjacent to the left side of the base material 10 along the longitudinal direction of the base material 10. The conductor patterns 11a are arranged at a pitch that does not cause a short circuit. Furthermore, one row of the plurality of two rows of conductive patterns 11 a formed on the outer surface 10 b of the base material 10 is adjacent to the width direction of the base material 10 along the longitudinal direction of the base material 10. The conductor patterns 11a are arranged at a pitch that does not cause a short circuit. The other row of the plurality of two-row conductive patterns 11 a formed on the outer surface 10 b of the base material 10 is adjacent to the left side of the base material 10 along the longitudinal direction of the base material 10. The conductor patterns 11a are arranged at a pitch that does not cause a short circuit. The conductor pattern 11 b of the conductor layer 11 covers the inner surface 10 a of the substrate 10 of the flat connector 1, the inner surface 19 a and the bottom surface 19 b of the notch 19, and the outer surface 10 b of the substrate 10. And the conductor pattern 11b of the conductor layer 11 has the conductor pattern row | line extension part 11c extended between the row | line | columns of the two-row-like conductor pattern 11a each formed in the inner surface 10a and the outer surface 10b of the base material 10. ing.

Between the adjacent conductor patterns 11a of the two rows of conductor patterns 11a respectively formed on the inner surface 10a and the outer surface 10b of the base material 10, between the conductor patterns 11b and the two rows of conductor patterns 11a, and the conductor pattern rows The space between the extended portion 11c and the two rows of conductor patterns 11a is a portion having the same width and exposing the base material 10.
Here, the conductor layer 11 is not limited to the above case, and may cover at least one of the inner surface 10a and the outer surface 10b of the substrate 10. And "covering" as used herein means that the plurality of

conductor patterns

11a and 11b may cover at least a part of one surface of at least one of the inner surface 10a and the outer surface 10b of the base material 10. Means that. Note that the plurality of

conductor patterns

11a and 11b cover almost 100% of the inner surface 10a and the outer surface 10b of the base material 10 in a state where

adjacent conductor patterns

10a and 10b are not short-circuited. Preferably it is. The conductor layer 11 is formed of, for example, copper foil.

Also, the base material 10 of the substrate 10A is provided with a plurality of vias 15 that electrically interconnect the inner surface 10a and the outer surface 10b of the base material 10. As shown in FIG. 3, one via 15 is provided for each conductor pattern 11a, and four conductors 11b are provided on each side of the conductor pattern 11b in the longitudinal direction of each row of conductor patterns 11a. Each via 15 includes an annular conductive plating portion 13 provided on the inner peripheral surface of the through hole 12 that penetrates the inner surface 10 a and the outer surface 10 b of the base material 10, and filling that is filled in the conductive plating portion 13. It consists of material 14. The conductive plating portion 13 extends between the inner surface 10 a and the outer surface 10 b of the base material 10. The conductive plating portion 13 is formed by, for example, tin plating or gold plating. Since the conductive material 13 is filled with the filler 14, the gas permeability of the gas filled in the airtight chamber can be effectively suppressed. In this embodiment, the filler 14 is made of conductive solder. When conductive solder is used for the filler 14, not only can the electrical connection between the inner surface 10 a and the outer surface 10 b of the base material 10 be ensured, but the gas filled in the hermetic chamber C is airtight. When moving from the inside of the chamber C toward the outside, the movement can be effectively blocked by the solder. Thereby, the gas permeability of the gas with which the inside of the airtight chamber C is filled can be suppressed more effectively. The filler 14 does not necessarily need to be electrically conductive, and may be an airtight resin (for example, trade name “Torr Seal” (registered trademark)).

Between the inner peripheral surface of the through-hole 12 provided in the base material 10 and the conductive plating portion 13, as shown in FIGS. 4 and 5, the conductor pattern of the inner surface 10 a and the outer surface 10 b of the base material 10. 11a extends. And the conductive plating part 13 is provided in the internal peripheral surface of this conductor pattern 11a. The conductor pattern 11a and the conductive plating portion 13 are sealed, and the conductive plating portion 13 and the filler 14 are also sealed. Thereby, there is no gas leakage from the inside of the airtight chamber C through the via 15.

And on the conductor pattern 11a of the inner surface 10a and the outer surface 10b of the base material 10, a pair of conductive pads 16 interconnected by the conductive plating part 13 of the via 15 are provided. These conductive pads 16 are formed separately from the conductive plating portion 13, but are not necessarily formed separately. That is, the conductive plating part 13 itself on the inner surface 10 a and outer surface 10 b side of the base material 10 may be used as the conductive pad 16.

Further, as shown in FIGS. 2 to 5, a soldering layer 17 extending continuously and endlessly along the outer periphery of the base material 10 is formed on the conductor pattern 11 b on the inner surface 10 a of the base material 10. . As shown well in FIGS. 3 and 5, the soldering layer 17 passes through the inner surface 19 a and the bottom surface 19 b of the notch 19 from the inner surface 10 a of the substrate 10, and the width direction right end surface 10 c and the width direction left end surface of the substrate 10. 10d, the longitudinal rear end surface 10e, and the longitudinal front end surface 10f. The soldering layer 17 is formed by, for example, tin plating or gold plating. 2, 4, and 5, reference numeral 18 denotes a resist layer.

Next, when the inner side and the outer side of the hermetic chamber C are electrically interconnected using the flat connector 1, first, the first circuit board 20 is disposed in the hermetic chamber C as shown in FIG. Keep it. Then, as shown in FIG. 2, the inner surface 10a of the flat connector 1 is directed toward the opening 41 with the partition wall 40 side. Then, the soldering layer 17 on the inner surface 10 a side of the base material 10 is connected to the partition wall 40 by the solder S. Thereby, the flat connector 1 is fixed to the partition wall 40 and the opening 41 is closed by the flat connector 1. In addition, the conductive pad 16 on the inner surface 10 a side of the flat connector 1 contacts the contact 21 provided on the first circuit board 20.

Then, as shown in FIG. 1, the contact 31 provided on the second circuit board 30 is brought into contact with the conductive pad 16 on the outer surface 10 b of the flat connector 1. As a result, the first circuit board 20 and the second circuit board 30 are electrically connected to each other via the flat connector 1.
Here, in this embodiment, the flat connector 1 provided with the conductor layer 11 as shown in FIG. 3 and the flat connector 51 with the conductor layer 11 removed as shown in FIG. A description will be given of how the substrate exposed area on the outer surface 10b and the outer surface 10b has changed.

In the case of the flat connector 1 provided with the conductor layer 11 as shown in FIG. 3, the substrate exposed area on the inner surface 10 a and the outer surface 10 b of the substrate 10 was 12.01 mm ² . On the other hand, in the case of the flat connector 51 with the conductor layer 11 removed as shown in FIG. 6, it was 89.15 mm ² . Thus, in this embodiment, that is, in the case of the flat connector 1 provided with the conductor layer 11 as shown in FIG. 3, the substrate exposed areas on the inner surface 10a and the outer surface 10b of the substrate 10 are the conductor layers. Compared with the case of the flat connector 51 from which 11 is removed, it is reduced to about 1/7.

As a result, when the gas permeation (mol / s · Pa) filled in the hermetic chamber C is the flat connector 1 provided with the conductor layer 11 as shown in FIG. Is reduced to about 1/7 as compared with the case of the flat connector 51 from which the conductor layer 11 is removed.
Therefore, according to the flat connector 1 according to the present embodiment, the substrate 10A is a two-layer substrate, and the two-layer substrate includes the flat substrate 10 that closes the opening 41, and the conductor layer 11 has a base layer. At least one of the inner surface 10a and the outer surface 10b of the material 10 is covered. For this reason, even if the gas filled in the airtight chamber C can pass through the base material 10 from the inside of the airtight chamber C to the outside, it cannot pass through the conductor layer 11 and fills the inside of the airtight chamber C. It is possible to effectively suppress the gas permeability of the gas being used. And the gas permeability of the gas with which the inside of the airtight chamber C is filled using a 2 layer board | substrate can be suppressed effectively.

When the substrate 10 is made of glass epoxy, the gas filled in the hermetic chamber C, particularly He gas or hydrogen gas having a low molecular weight, easily passes through the epoxy part which is an organic substance. However, even in this case, when the gas filled in the airtight chamber C moves from the inside of the airtight chamber C toward the outside, the movement is blocked by the conductor layer 11. Thereby, the gas permeability of the gas with which the inside of the airtight chamber C is filled can be suppressed more effectively.

Further, according to the flat connector 1, the via 15 for electrically interconnecting the inner surface 10 a and the outer surface 10 b of the substrate 10 is provided. For this reason, the inner surface 10a and the outer surface 10b of the base material 10 of the two-layer substrate can be electrically and reliably connected by the via 15. Moreover, since the filler 14 is filled in the conductive plating part 13 constituting the via 15, the gas permeability of the gas filled in the airtight chamber C can be more effectively suppressed.

Further, a soldering layer 17 extending continuously and endlessly along the outer periphery of the substrate 10 is formed on the inner surface 10a of the substrate 10. For this reason, by connecting the soldering layer 17 on the inner surface 10a side of the base material 10 to the partition wall 40 with the solder S, the substrate 10A constituting the flat connector 1 can be fixed to the partition wall 40.

Next, a modification of the flat connector 1 shown in FIG. 1 will be described with reference to FIG.
In the flat connector 1 shown in FIG. 7, the conductor layer 11 is provided in the base material 10 similarly to the flat connector 1 shown in FIG. 1, FIG. The conductor layer 11 includes a plurality of two rows of conductor patterns 11a formed on the inner surface 10a of the substrate 10, a plurality of two rows of conductor patterns 11a formed on the outer surface 10b of the substrate 10, and these The conductor pattern 11b is provided so as to surround the outside of the plurality of conductor patterns 11a. The area of each conductor pattern 11a is larger than the conductor pattern 11a of the flat connector 1 shown in FIG. However, unlike the conductor pattern 11b shown in FIG. 3, the conductor pattern 11b of the conductor layer 11 is a conductor extending between the two rows of conductor patterns 11a formed on the inner surface 10a and the outer surface 10b of the substrate 10, respectively. The extension part 11c between pattern rows is not formed.

One of the two rows of conductive patterns 11a formed on the inner surface 10a of the base material 10 is a conductor pattern adjacent along the longitudinal direction of the base material 10 on the right side in the width direction of the base material 10. 11a is arranged at a pitch that does not short-circuit each other. The other row of the plurality of two-row conductive patterns 11 a formed on the inner surface 10 a of the base material 10 is adjacent to the left side of the base material 10 along the longitudinal direction of the base material 10. The conductor patterns 11a are arranged at a pitch that does not cause a short circuit. Furthermore, one row of the plurality of two rows of conductive patterns 11 a formed on the outer surface 10 b of the base material 10 is adjacent to the width direction of the base material 10 along the longitudinal direction of the base material 10. The conductor patterns 11a are arranged at a pitch that does not cause a short circuit. The other row of the plurality of two-row conductive patterns 11 a formed on the outer surface 10 b of the base material 10 is adjacent to the left side of the base material 10 along the longitudinal direction of the base material 10. The conductor patterns 11a are arranged at a pitch that does not cause a short circuit.

Between the adjacent conductor patterns 11a of the two rows of conductor patterns 11a formed on the inner surface 10a and the outer surface 10b of the substrate 10, respectively, between the conductor patterns 11b and the two rows of conductor patterns 11a, and in two rows Between the rows of the conductor patterns 11a, the portions having the same width and the substrate 10 are exposed.
Further, as shown in FIG. 7, one via 15 is provided for each conductor pattern 11a, but is different from the flat connector 1 shown in FIG. 3 in that it is not provided on the conductor pattern 11b.

As shown in FIG. 7, in the case of the flat connector 1 provided with the conductor layer 11, the substrate exposed area on the inner surface 10 a and the outer surface 10 b of the substrate 10 was 21.44 mm ² . In the case of the flat connector 1 provided with the conductor layer 11 as shown in FIG. 7, the substrate exposed areas on the inner surface 10a and the outer surface 10b of the substrate 10 are removed from the conductor layer 11 shown in FIG. Compared to the case of the flat connector 51, it is reduced to about 1/4.
As a result, when the gas permeation (mol / s · Pa) filled in the airtight chamber C is the flat connector 1 provided with the conductor layer 11 as shown in FIG. In accordance with the decrease rate of the flat connector 51, it is reduced to about 1/4 compared with the case of the flat connector 51 from which the conductor layer 11 is removed.

Next, a second embodiment of the flat connector according to the present invention will be described with reference to FIGS.
8A and 8B show a second embodiment of a flat connector according to the present invention, and this flat connector 50 is replaced with the flat connector 1 of the first embodiment shown in FIG. Used in the electrical connection structure shown in FIG.
The flat connector 50 shown in FIGS. 8A and 8B closes the opening 41 of the partition wall 40 and electrically connects the inside and the outside of the airtight chamber C.

The flat connector 50 includes a board 60 A that closes the opening 41 of the partition wall 40. This substrate 60A is a four-layer substrate as a multilayer substrate. The substrate 60 A includes a flat plate-like first base material 60, a flat plate-like second base material 70 that is disposed on the inner surface 60 a of the first base material 60 and closes the opening 41, and an outer surface of the first base material 60. And a flat plate-like third base member 80 disposed at 60b.
Here, the first base member 60 is a substantially rectangular flat plate member extending in the width direction (left-right direction in FIG. 8A) and the longitudinal direction (up-down direction in FIG. 8A). The first base member 60 has an inner surface 60a positioned toward the inner side of the hermetic chamber C (see FIG. 1), and an outer surface 60b opposite to the inner surface 60a. The first base material 60 is made of glass-containing epoxy, for example.

In addition, as shown in FIG. 8B, the first base material 60 is formed with a plurality of vias 64 that electrically interconnect the inner surface 60 a and the outer surface 60 b of the first base material 60. . The plurality of vias 64 are formed in two rows in the width direction of the first base material 60. Although not shown, the vias 64 in each row are formed at a predetermined pitch along the longitudinal direction. Each via 64 includes an annular first conductive plating portion 62 provided on the inner peripheral surface of the through hole 61 penetrating between the inner peripheral surface 60 a and the outer surface 60 b of the first base material 60. A filler 63 is filled in the first conductive plating part 62. The first conductive plating portion 62 extends between the inner peripheral surface 60 a and the outer surface 60 b of the first base material 60. The first conductive plating part 62 is formed by, for example, tin plating or gold plating. The filler 63 is made of conductive solder. When conductive solder is used for the filler 63, not only can the electrical connection between the inner surface 60a and the outer surface 60b of the first base member 60 be ensured, but also the gas filled in the hermetic chamber C. However, when moving from the inside of the airtight chamber C to the outside, the movement can be effectively blocked by the solder. Thereby, the gas permeability of the gas with which the inside of the airtight chamber C is filled can be suppressed more effectively. The filler 14 does not necessarily need to be electrically conductive, and may be an airtight resin (for example, trade name “Torr Seal” (registered trademark)).

A plurality of first conductive layers 65 connected to the inner surface 60 a side of the first conductive plating portion 62 are provided on the inner surface 60 a of the first base material 60. A plurality of second conductive layers 66 connected to the outer surface 60 b side of the first conductive plating portion 62 are provided on the outer surface 60 b of the first base material 60.
The second base material 70 is a substantially rectangular flat plate member extending in the width direction (left-right direction in FIG. 8A) and the longitudinal direction (up-down direction in FIG. 8A). The second base material 70 has the same width and length as the inner surface 60 a of the first base material 60. And the 2nd base material 70 has the inner surface 70a located toward the inner side of the airtight chamber C shown in FIG. 1, and the outer surface 70b on the opposite side to this inner surface 70a. The second base material 70 is made of glass-containing epoxy, for example.

Further, as shown in FIG. 8B, the second base material 70 is formed with a plurality of first plated through holes 73 that interconnect the inner surface 70 a and the outer surface 70 b of the second base material 70. Yes. The plurality of first plated through holes 73 are formed in two rows at positions outside the vias 64 in the width direction of the second base material 70. The first plated through hole 73 in each row is formed by providing a second conductive plating portion 72 on the inner peripheral surface of the through hole 71 that penetrates between the inner surface 70 a and the outer surface 70 b of the second base material 70. The second conductive plating part 72 extends between the inner surface 70 a and the outer surface 70 b of the second base material 70. As shown in FIG. 8B, the second conductive plating portion 72 is formed so as to completely fill the inside of the through hole 71. Then, the outer surface 70 b side of each second conductive plating part 72 is connected to the inner surface 60 a side of the first conductive plating part 62 constituting the via 64 formed on the first base material 60. Connect with. A plurality of conductive pads 74 connected to the inner surface side of the second conductive plating part 72 are provided on the inner surface 70 a of the second base material 70. As shown in FIG. 8A, the plurality of conductive pads 74 are formed in two rows in the width direction on the inner surface 70 a of the second base material 70. Each conductive pad 74 is formed in a rectangular shape.

Furthermore, the third base member 80 is a substantially rectangular flat plate member extending in the width direction (left-right direction in FIG. 8A) and the longitudinal direction (up-down direction in FIG. 8A). The third substrate 80 has the same width and length as the outer surface 60 b of the first substrate 60. And the 3rd base material 80 has the inner surface 80a located toward the inner side of the airtight chamber C shown in FIG. 1, and the outer surface 80b on the opposite side. The third substrate 80 is made of glass-containing epoxy, for example.

Further, as shown in FIG. 8B, the third base material 80 is formed with a plurality of second plating through holes 83 interconnecting the inner surface 80a and the outer surface 80b of the second base material 80. Yes. The plurality of second plated through holes 83 are formed in two rows at positions outside the vias 64 in the width direction of the third base material 80. The second plated through hole 83 in each row is formed by providing a third conductive plated portion 82 on the inner peripheral surface of the through hole 81 that penetrates between the inner surface 80a and the outer surface 80b of the third substrate 80. The third conductive plating portion 82 extends between the inner surface 80 a and the outer surface 80 b of the third base material 80. As shown in FIG. 8B, the third conductive plating portion 82 is formed so as to completely fill the inside of the through hole 81. Then, the inner surface 80a side of each third conductive plating portion 82 is connected to the second conductive layer 66 connected to the outer surface 60b side of the first conductive plating portion 62 constituting the via 64 formed on the first base member 60. Connect with. A plurality of conductive pads 84 connected to the outer surface side of the third conductive plating portion 82 are provided on the outer surface 80 b of the third base material 80. Although not shown, the plurality of conductive pads 84 are formed in two rows in the width direction on the outer surface 80 b of the third base material 80. Each conductive pad 84 is formed in a rectangular shape.

Here, as shown in FIG. 8B, the second base material 70 is arranged so that the outer surface 70 b of the second base material 70 is in contact with the inner surface 60 a of the first base material 60. The inner surface side of the via 64 formed in 60 is closed. In addition, the inner surface 80a of the third base material 80 is disposed so as to contact the outer surface 60b of the first base material 60, and the outer surface side of the via 64 formed on the first base material 60 by the third base material 80 is It is blocked.

Further, as shown in FIGS. 8A and 8B, a conductor layer 90 is provided on the inner surface 70 a of the second base material 70. The conductor layer 90 is formed in a substantially rectangular shape so as to surround the outside of the plurality of conductive pads 74 formed in two rows in the width direction on the inner surface 70 a of the second base material 70. The conductor layer 90 is arranged at a predetermined interval with respect to each conductive pad 74 so as not to be short-circuited with each conductive pad 74. The conductor layer 90 is provided so as to substantially cover a portion of the inner surface 70a of the second base material 70 excluding a soldering layer 91 that continuously extends endlessly along the outer periphery of the second base material 70, which will be described later. It is done. The conductor layer 90 is formed of, for example, copper foil.

The conductor layer 90 is not limited to covering the inner surface 70 a of the second base material 70, but the inner surface 70 a of the second base material 70, the outer surface 70 b of the second base material 70, and the inner surface of the first base material 60. It is only necessary to cover at least one of 60a, the outer surface 60b of the first substrate 60, the inner surface 80a of the third substrate 80, and the outer surface 80b of the third substrate 80. Here, “covering” means that the conductor layer 90 has the inner surface 70 a of the second base material 70, the outer surface 70 b of the second base material 70, the inner surface 60 a of the first base material 60, and the first base material 60. It means that at least one part of the outer surface 60b, the inner surface 80a of the third base member 80, and the outer surface 80b of the third base member 80 only needs to be covered. Note that the conductor layer 90 preferably covers nearly 100% of the one surface.

Further, as shown in FIGS. 8A and 8B, the inner surface 70a of the second base material 70 is soldered to extend continuously and endlessly with a predetermined width along the outer periphery of the second base material 70. A layer 91 is formed. The soldering layer 91 is formed by, for example, tin plating or gold plating.
The “inner surface located toward the inner side of the hermetic chamber of the substrate” defined in claim 1 corresponds to the inner surface 70a of the second base material 70, and “the opposite side of the inner surface of the substrate”. Corresponds to the outer surface 80b of the third base member 80. Further, the “surface extending parallel to the inner surface existing inside the substrate between the inner surface and the outer surface” defined in claim 1 is the outer surface 70b of the second base material 70, the first surface. The inner surface 60a of the substrate 60, the outer surface 60b of the first substrate 60, and the inner surface 80a of the third substrate 80 correspond to each other.

Next, when the inner side and the outer side of the hermetic chamber C are electrically interconnected using the flat connector 50, first, the first circuit board 20 is disposed in the hermetic chamber C as shown in FIG. Keep it. And although not shown in figure, the inner surface 70a of the 2nd base material 70 of the flat connector 50 is turned to the partition 40 side, and is turned to the opening part 41 side. And the soldering layer 91 in the inner surface 70a side of the 2nd base material 70 is connected to the partition 40 with solder. Accordingly, the flat connector 50 is fixed to the partition wall 40 and the opening 41 is closed by the flat connector 50. Further, the conductive pads 74 on the inner surface 70 a side of the second base material 70 of the flat connector 50 come into contact with the contacts 21 provided on the first circuit board 20.

Then, the contact 31 provided on the second circuit board 30 is brought into contact with the conductive pad 84 on the outer surface 80 b side of the third base member 80 of the flat connector 50. As a result, the first circuit board 20 and the second circuit board 30 are electrically connected to each other via the flat connector 50.
According to the flat connector 50 according to this embodiment, the substrate 60A that closes the opening 41 is a four-layer substrate as a multilayer substrate. The substrate 60 A includes a flat plate-like first base material 60, a flat plate-like second base material 70 that is disposed on the inner surface 60 a of the first base material 60 and closes the opening 41, and the first base material 60. A flat plate-like third base material 80 disposed on the outer surface 60b. The conductor layer 90 covers one surface of the inner surface 70 a of the second base material 70. For this reason, even if the gas filled in the airtight chamber C can pass through the second base material 70, the first base material 60, and the third base material 80 from the inside of the airtight chamber C to the outside. It cannot pass through the conductor layer 90. Thereby, the gas permeability of the gas with which the inside of the airtight chamber C is filled using the four-layer board | substrate as a multilayer board | substrate can be suppressed effectively.

The flat connector 50 includes a via 64 that electrically interconnects the inner surface 60a and the outer surface 60b of the first base member 60. In addition, the flat connector 50 includes a first plated through hole 73 that interconnects the inner surface 70 a and the outer surface 70 b of the second base material 70 and connects to the via 64 of the first base material 60. Further, the flat connector 50 includes a second plated through hole 83 that interconnects the inner surface 80 a and the outer surface 80 b of the third base member 80 and connects to the via 64 of the first base member 60. Therefore, the inner surface 60a and the outer surface 80b of the four-layer substrate can be electrically and reliably connected by the via 64, the first plating through hole 73, and the second plating through hole 83. Note that the inner surface 60 a side of the via 64 is closed by the second base material 70, and the outer surface 60 b side of the via 64 is closed by the third base material 80. For this reason, in the four-layer substrate, it is not always necessary to fill the filler 63 in the first conductive plating part 62 constituting the via 64. When the filler 63 is filled in the first conductive plating part 62 as in the present embodiment, the gas permeability of the gas filled in the airtight chamber C can be further suppressed.

Next, a first modification of the flat connector shown in FIGS. 8A and 8B will be described with reference to FIGS. 9A and 9B.
The flat connector 50 shown in FIGS. 9A and 9B has the same basic configuration as the flat connector 50 shown in FIGS. 8A and 8B, but the first conductive plating constituting the via 64 is the same. The difference is that the space 63 is not filled with the filler 63 in the portion 62. As described above, the inner surface 60 a side of the via 64 is closed by the second base material 70, and the outer surface 60 b side of the via 64 is closed by the third base material 80. Therefore, in the four-layer substrate, it is not always necessary to fill the filler 63 (see FIG. 8B) in the first conductive plating portion 62 constituting the via 64.

Further, in the flat connector 50 shown in FIGS. 9A and 9B, a space 75 is formed inside the second conductive plating portion 72 in each first plating through hole 73. In each second plating through hole 83, a space 85 is also formed inside the third conductive plating portion 82. In the flat connector 50 shown in FIGS. 8A and 8B, the second conductive plating portion 72 and the third conductive plating portion 82 are formed so as to completely fill the insides of the through

holes

71 and 81. In these respects, the flat connector 50 shown in FIGS. 9A and 9B is different from the flat connector 50 shown in FIGS. 8A and 8B. The

spaces

75 and 85 are formed inside the second conductive plating part 72 and the third conductive plating part 82 because the diameters of the through

holes

71 and 81 in each of the first plating through hole 73 and the second plating through hole 83 are the same. Effective when large.

9A and 9B, the board 60A that closes the opening 41 is a four-layer board as a multilayer board also by the flat connector 50 shown in FIGS. The substrate 60 A includes a flat plate-like first base material 60, a flat plate-like second base material 70 that is disposed on the inner surface 60 a of the first base material 60 and closes the opening 41, and the first base material 60. A flat plate-like third base material 80 disposed on the outer surface 60b. In addition, the conductor layer 90 covers the inner surface 70 a of the second base material 70. For this reason, even if the gas filled in the airtight chamber C can pass through the second base material 70, the first base material 60, and the third base material 80 from the inside of the airtight chamber C to the outside. It cannot pass through the conductor layer 90. Thereby, the gas permeability of the gas with which the inside of the airtight chamber C is filled using the four-layer board | substrate as a multilayer board | substrate can be suppressed effectively.

Further, a second modification of the flat connector shown in FIGS. 8A and 8B will be described with reference to FIGS.
The flat connector 50 shown in FIGS. 10 (A) and 10 (B) has the same basic configuration as the flat connector 50 shown in FIGS. 8 (A) and 8 (B). The difference is that it is provided so as to cover not the inner surface 70 a of the 70 but the inner surface 60 a of the first base material 60.
Specifically, the conductor layer 90 is formed in a substantially rectangular shape so as to surround the outer sides of the plurality of first conductive layers 65 formed in two rows in the width direction on the inner surface 70a of the second base material 70. ing. The conductor layer 90 is arranged at a predetermined interval with respect to each first conductive layer 65 so as not to be short-circuited with each first conductive layer 65. The conductor layer 90 is provided so as to cover almost the entire inner surface 70 a of the second base material 70.

Further, the flat connector 50 shown in FIGS. 10A and 10B does not fill the filler 63 in the first conductive plating portion 62 that constitutes the via 64 but forms a space 67 in FIG. ), Different from the flat connector 50 shown in FIG.
Even with the flat connector 50, the board 60A that closes the opening 41 is a four-layer board as a multilayer board. The substrate 60 A includes a flat plate-like first base material 60, a flat plate-like second base material 70 that is disposed on the inner surface 60 a of the first base material 60 and closes the opening 41, and the first base material 60. A flat plate-like third base material 80 disposed on the outer surface 60b. Further, the conductor layer 90 covers the inner surface 60 a of the first base material 60. For this reason, even if the gas filled in the airtight chamber C can pass through the second base material 70, the first base material 60, and the third base material 80 from the inside of the airtight chamber C to the outside. It cannot pass through the conductor layer 90. Thereby, the gas permeability of the gas with which the inside of the airtight chamber C is filled using the four-layer board | substrate as a multilayer board | substrate can be suppressed effectively.

As mentioned above, although embodiment of this invention was described, this invention is not limited to this, A various change and improvement can be performed.
For example, the conductor layer 11 only needs to cover at least one of the inner surface 10a and the outer surface 10b of the substrate 10, and the inner surface 10a of the substrate 10 of the flat connector 1, the inner surface 19a of the notch 19, and The bottom surface 19b and the outer surface 10b of the base material 10 may not be covered.
Further, the soldering layer 17 that extends continuously and endlessly along the outer periphery of the base material 10 may not be formed on the inner surface 10 a of the base material 10.
Further, the soldering layer 91 that extends continuously and endlessly with a predetermined width along the outer periphery of the second base material 70 may not be formed on the inner surface 70 a of the second base material 70.

Furthermore, although the example using a four-layer substrate in FIGS. 8 to 10 has been described as a multilayer substrate, a multilayer substrate having six or more layers may be used. In this case, the conductor layer has an inner surface located toward the inner side of the airtight chamber C of the multilayer substrate, an outer surface opposite to the inner surface of the multilayer substrate, and the inner surface and the outer surface between the inner surface and the outer surface. What is necessary is just to make it cover at least 1 side of the surfaces extended in parallel with the said inner surface which exists in the inside of a multilayer substrate.

Further, in the flat connector 1 shown in FIGS. 1 to 7, metal contacts may be connected to the conductive pads 16 formed on the inner surface 10a and the outer surface 10b of the substrate 10, respectively. Further, a metal contact attached to an insulating housing may be connected to the conductive pad 16.
Further, in the flat connector 50 shown in FIGS. 8 to 10, the

conductive pads

74 and 84 formed on the inner surface 70 a of the second substrate 70 and the outer surface 70 b of the third substrate 80 are made of metal. Contacts may be connected. Further, metal contacts attached to an insulating housing may be connected to the

conductive pads

74 and 84.

DESCRIPTION OF SYMBOLS 1 Flat connector 10A Board | substrate 10 Base material

10a Inner surface

10b Outer surface 11

Conductor layer

11a, 11b Conductor pattern 12 Through-hole 13 Conductive plating part 14 Filler 15 Via 17 Soldering layer 40 Partition 41 Opening 50 Flat connector 60A board 60 1st base material

60a Inner surface

60b Outer surface 61 Through-hole 62 1st electroconductive plating part (electroconductive plating part)
63 Filler 64 Via 70 Second substrate

70a Inner surface

70b Outer surface 73 First plated through hole 80 Third substrate

80a Inner surface

80b Outer surface 83 Second plated through hole 90 Conductive layer 91 Soldering layer C Airtight chamber

Claims

A flat connector that is used to electrically interconnect the inside and outside of an airtight chamber defined by a partition wall and closes an opening formed in the partition wall that passes through the inside and the outside of the airtight chamber. ,
A flat substrate that closes the opening; the substrate being an inner surface of the substrate facing the inner side of the hermetic chamber; an outer surface of the substrate opposite to the inner surface; and the inner surface A flat connector having a conductor layer covering at least one of the surfaces extending in parallel to the inner surface existing inside the substrate between the outer surface and the outer surface.
The substrate is a two-layer substrate, and the two-layer substrate includes a flat base material that closes the opening,
The conductor layer covers at least one of the inner surface and the outer surface of the substrate;
A via that electrically interconnects the inner surface and the outer surface of the substrate, and is provided on an inner peripheral surface of a through-hole that penetrates between the inner surface and the outer surface of the substrate. 2. The flat connector according to claim 1, further comprising an annular conductive plating portion extending between the surface and the outer surface, and the via made of a filler filled in the conductive plating portion.
3. The flat connector according to claim 2, wherein a soldering layer extending continuously and endlessly along the outer periphery of the base material is formed on the inner surface of the base material.
The flat connector according to claim 2 or 3, wherein the filler is a conductive solder.
The substrate is a multilayer substrate, and the multilayer substrate is disposed on a flat plate-like first base material and an inner surface of the first base material facing the inner side of the hermetic chamber to block the opening. A flat second substrate and a flat third substrate disposed on the outer surface of the first substrate;
The conductor layer includes an inner surface of the second substrate, an outer surface of the second substrate, an inner surface of the first substrate, an outer surface of the first substrate, an inner surface of the third substrate, And covering at least one of the outer surfaces of the third base material,
A via for electrically interconnecting the inner surface and the outer surface of the first base material, provided on an inner peripheral surface of a through-hole penetrating between the inner surface and the outer surface of the first base material, The via having an annular conductive plating portion extending between the inner surface and the outer surface of the first substrate, and the via of the first substrate interconnecting the inner surface and the outer surface of the second substrate A first plated through hole to be connected; and a second plated through hole for interconnecting an inner surface and an outer surface of the third base material and connected to a via of the first base material. The flat connector according to claim 1.
6. The flat connector according to claim 5, wherein a soldering layer continuously extending endlessly along the outer periphery of the second base material is formed on the inner surface of the second base material.
The flat connector according to claim 5 or 6, wherein the via includes a filler filled in the conductive plating portion.
The flat connector according to claim 7, wherein the filler is a conductive solder.