TWM460506U - Multi-separation chamber low flow heat conduction device - Google Patents

Description

Multi-divided cavity low flow heat conduction device

The present invention relates to a multi-divided cavity low-flow heat-conducting device, and more particularly to a heat-conducting device which can effectively prevent partial accumulation of heat-exchange fluid during use, thereby causing a decrease in heat exchange efficiency.

Conventionally, a heat transfer device using a heat exchange fluid as a main medium is provided, and an accommodating space is disposed in a metal shell having thermal conductivity, and a heat exchange fluid (liquid refrigerant) is directly disposed in the accommodating space; The metal casing is partially or partially attached to a predetermined heat source, and the heat exchange fluid (liquid refrigerant) can absorb most of the heat, and the phase change or heat convection and siphoning of the heat exchange fluid, The heat is quickly guided to other low temperature parts by various heat conduction methods, thereby achieving effective heat conduction and heat dissipation for the heat generating components.

However, in practical applications, the above structure has much excellent fluidity due to the liquid heat exchange fluid (liquid refrigerant) itself, so when the metal casing is in a non-horizontal inclined environment, the heat exchange fluid ( The liquid refrigerant will flow toward the lower end due to gravity and cause local accumulation. In this case, if the heat source for providing heat dissipation is in a position relative to the heat conducting device, the capacity is generally The portion closer to the heat source in the space is in the absence of the auxiliary conduction of the heat exchange fluid (liquid refrigerant), so that most of the heat cannot be transmitted through the liquid heat exchange fluid (liquid refrigerant) to greatly affect the heat conduction effect of the heat conduction device as a whole.

To this end, a structural design as shown in FIG. 1 is disclosed, which comprises a thermally conductive housing 1 composed of two relatively half-shells 11 and 12 (mostly metallic) having excellent thermal conductivity. An accommodating space is disposed between the two housing halves 11 and 12, and a micro-structural component 20 having a fine pore distribution is disposed in the accommodating space, and the micro-structural component 20 forms a dense structure in the accommodating space. a structure of micropores or microcells to facilitate a siphon effect on the heat exchange fluid A (which may be a liquid refrigerant) filled in the accommodating space to attract the heat exchange fluid A upward, and by the microstructure component 20 conducts heat to a heat exchange fluid A (as shown in Fig. 2) that may be concentrated to a position under the heat transfer device; to improve the loss of local accumulation of the heat exchange fluid (liquid refrigerant); but because of the heat exchange fluid A produced above In the case of local accumulation, the loss of heat transfer efficiency is still not effectively improved.

In view of the above-mentioned shortcomings of the heat-conducting device having the compartments, the creators have researched and improved the shortcomings of these shortcomings, and finally the creation of this creation.

The main purpose of the present invention is to provide a multi-cavity low flow type heat conducting device which can effectively avoid the phenomenon of local accumulation of heat exchange fluid to maintain better heat conduction efficiency.

In order to achieve the above-mentioned purpose and effect, the technical means adopted by the present invention includes: a heat-conducting casing having at least one accommodating space therein; a spacer member disposed in the accommodating space of the heat-conducting casing, and The accommodating space may be divided into a plurality of adjacent and independent compartments, and a fine communication structure is arranged on the spacer, and a heat exchange medium with a solid-liquid two-phase change is filled in each compartment a low-flow heat exchange medium (for example, paraffin or other hot-thick heat-conducting fluid, such as a thermal conductive adhesive) such that during the heat exchange process, the heat exchange fluids can be kept confined in each of the compartments The above partial accumulation is not caused, thereby ensuring that each part of the thermal conduction device can maintain high thermal conductivity.

According to the above structure, the spacer has a plurality of longitudinally and laterally extending partitions, and the partitions define the interior of the integral heat conducting device with a plurality of adjacently arranged partitions.

According to the above structure, the top and bottom sides of the spacer are respectively coupled to the inner side of the heat conducting housing, so that the partitions can form separate partition chambers.

According to the above structure, the heat conducting housing is formed by combining a plurality of semi-shells having thermal conductivity.

According to the above structure, the heat conducting housing is formed by relatively combining the two housing halves.

According to the above structure, the two half-shells are provided with a joint formed by welding between the opposite contact portions.

According to the above structure, the low-flow heat exchange medium is a viscous heat transfer fluid.

According to the above structure, the low-flow heat exchange medium is a heat exchange medium having a solid-liquid two-phase change.

In order to achieve a more specific understanding of the above objectives, effects and features of this creation, the following figures are illustrated as follows:

1‧‧‧thermal housing

11, 12‧‧‧ half shell

13‧‧‧Separate chamber

14‧‧‧Combination Department

2‧‧‧ spacers

20‧‧‧Microstructural components

21‧‧‧Departure

22‧‧‧Separation zone

A‧‧‧Heat exchange fluid (liquid refrigerant)

B‧‧‧Low-flow heat exchange medium

Figure 1 is a cross-sectional view of a heat transfer device with a compartment.

Fig. 2 is a schematic cross-sectional view showing the heat transfer device of Fig. 1 when it is inclined at a large angle.

Figure 3 is an exploded view of the structure of the creation.

Figure 4 is a schematic diagram of the overall composition of the creation.

Figure 5 is a schematic diagram of the use of the structure of Figure 4.

Referring to Figures 3 and 4, it can be seen that the structure of the present invention mainly includes: a heat conducting housing 1 and a spacer 2, wherein the heat conducting housing 1 can be formed by combining a plurality of semi-shells having thermal conductivity. (In the embodiment disclosed in the present disclosure, the heat-conducting housing 1 is formed by relatively combining the two housing halves 11 and 12 via high-temperature welding, and therefore, is disposed between the opposite contact portions of the two housing halves 11 and 12. There is a joint portion 14) formed by high-temperature welding, and an accommodation space 13 is formed between the two housing halves 11 and 12.

The spacer 2 is disposed in the accommodating space 13 of the heat-conducting housing 1. The spacer 2 can be disposed with a plurality of longitudinal and laterally extending partitions 21, and a plurality of adjacent portions can be defined between the partitions 21 The arranging partitions 22, in combination with the top and bottom sides of the spacer 2 are respectively coupled to the inner sides of the half-shells 11, 12, so that the partitions 22 can be formed into separate partition chambers 13; The spacer 2 may be a thermally conductive microstructure provided with a microporous or micro-mesh structure, and filled in each of the compartments 13 with a low-flow heat exchange medium fluid heat exchange fluid B (which may be solid) A two-phase heat exchange medium, such as: paraffin; or a viscous heat transfer fluid, such as: thermal paste.

Referring to FIG. 5, it can be seen that the above structure of the present invention is in practical application, since the low flow rate heat exchange medium B is respectively accommodated in the adjacent array and independent partition chambers 13, and is not endothermic. In the cooled state, it may be a semi-fluid of solid or extremely high viscosity, so that it cannot or extremely hardly flow through the microstructure on the spacer 2, and therefore, even if the heat-conducting casing 1 is in a heat exchange state, The horizontally inclined use environment, the low flow rate heat exchange medium B can still be held in each of the separation chambers 13 in the heat conducting housing 1 due to its high viscosity characteristic, forming a state uniformly distributed in each area And can utilize the thermal conductivity of the spacer 2 itself, and the heat transfer characteristics of the heat transfer of each microstructure to achieve rapid heat conduction diffusion, and there is no low flow rate heat exchange medium B accumulated in a local position. Therefore, it is ensured that the low flow rate heat exchange medium B (viscous heat transfer medium) can maintain optimum heat conduction with respect to the heat conductive housing. Deletion of the above-described conventional improve the heat conducting means.

In summary, the multi-cavity low-flow heat-conducting device of the present invention can achieve the effect of preventing local accumulation of heat-exchange fluid, which is a novel and progressive creation, and proposes a new type of patent according to law; The content of the description is only for the description of the preferred embodiment of the present invention. Any changes, modifications, changes or equivalent replacements that extend from the technical means and scope of the creation should also fall within the scope of the patent application of the creation. .

1‧‧‧thermal housing

11, 12‧‧‧ half shell

13‧‧‧Separate chamber

14‧‧‧Combination Department

2‧‧‧ spacers

21‧‧‧Departure

B‧‧‧Low-flow heat exchange medium

Claims (14)

A multi-cavity low flow type heat conduction device comprising at least:
a heat conducting housing having at least one receiving space therein;
a spacer disposed in the accommodating space of the heat conducting housing, and partitioning the accommodating space into a plurality of adjacent and independent partitioning chambers, and having a fine communication structure on the spacer, and Each of the compartments is filled with a low-flow heat exchange medium. The multi-cavity low-flow heat-conducting device according to claim 1, wherein the spacer has a plurality of longitudinally and laterally extending partitions, and the partitions can define a plurality of adjacently arranged partitions. . The multi-cavity low-flow heat-conducting device according to claim 2, wherein the top and bottom sides of the spacer are respectively coupled to the inner side of the heat-conducting casing, so that the partitions are formed into separate partitions. Chamber. The multi-cavity low-flow heat-conducting device according to claim 1 or 2 or 3, wherein the heat-conducting casing is composed of a plurality of semi-shells having thermal conductivity. The multi-cavity low-flow heat-conducting device according to claim 4, wherein the heat-conducting shell is formed by relatively combining two housing halves. The multi-cavity low-flow heat conduction device according to claim 5, wherein the two half-shells are provided with a joint formed by welding between the opposite contact portions. The multi-cavity low flow type heat transfer device according to claim 1 or 2 or 3, wherein the low flow heat exchange medium is a viscous heat transfer fluid. The multi-cavity low-flow heat conduction device according to claim 4, wherein the low-flow heat exchange medium is a viscous heat transfer fluid. The multi-cavity low-flow heat conduction device according to claim 5, wherein the low-flow heat exchange medium is a viscous heat transfer fluid. The multi-cavity low-flow heat-conducting device according to claim 6, wherein the low-flow heat exchange medium is a viscous heat-conducting fluid. The multi-cavity low flow type heat transfer device according to claim 1 or 2 or 3, wherein the low flow heat exchange medium is a heat exchange medium having a solid-liquid two-phase change. The multi-cavity low-flow heat-conducting device according to claim 4, wherein the low-flow heat exchange medium is a heat exchange medium having a solid-liquid two-phase change. The multi-cavity low-flow heat-conducting device according to claim 5, wherein the low-flow heat exchange medium is a heat exchange medium having a solid-liquid two-phase change. The multi-cavity low-flow heat-conducting device according to claim 6, wherein the low-flow heat exchange medium is a heat exchange medium having a solid-liquid two-phase change.