TWM457730U - Replaceable treatment pool used for wet-type chemical treatment - Google Patents
Replaceable treatment pool used for wet-type chemical treatment Download PDFInfo
- Publication number
- TWM457730U TWM457730U TW101216939U TW101216939U TWM457730U TW M457730 U TWM457730 U TW M457730U TW 101216939 U TW101216939 U TW 101216939U TW 101216939 U TW101216939 U TW 101216939U TW M457730 U TWM457730 U TW M457730U
- Authority
- TW
- Taiwan
- Prior art keywords
- treatment
- treatment tank
- liquid
- container
- eccentric shaft
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Weting (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Gas Separation By Absorption (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Cleaning By Liquid Or Steam (AREA)
Description
本新型涉及一種用於借助處理液對襯底進行濕法化學處理的處理池。更準確地，本新型涉及一種可替換的處理池。The present invention relates to a treatment tank for wet chemical treatment of a substrate by means of a treatment liquid. More precisely, the present invention relates to an alternative processing pool.
通常使用容納相應處理液的處理池來對例如為矽襯底(晶圓)的物體進行濕法化學的處理，該處理例如涉及對這種襯底進行移除(蝕刻)、覆層或清洗。根據期望的處理，處理液為蝕刻液、覆層液(例如電解液)、或清洗液。隨後，襯底或者成堆疊狀地引入到池中(“批量處理”)，或者將該襯底以連續式方法運輸經過處理液或者沿著處理液運輸(“連續式處理”)，其中該襯底在處理時間內保留於該池中。The treatment chamber, for example a ruthenium substrate (wafer), is typically subjected to a wet chemical treatment using a treatment tank containing a corresponding treatment liquid, for example involving removal (etching), coating or cleaning of such a substrate. The treatment liquid is an etching liquid, a coating liquid (for example, an electrolytic solution), or a cleaning liquid according to a desired treatment. Subsequently, the substrate is introduced into the cell either in a stack ("batch processing"), or the substrate is transported through the treatment liquid in a continuous process or along a treatment liquid ("continuous treatment"), wherein the liner The bottom remains in the pool during the processing time.
例如從US 5,000,827和DE 10 2007 020 449中已知適合於成堆疊狀地處理襯底的設備的實例。該參考文獻示出用於處理置於反應器殼體之上的襯底的所謂的溢流反應器。借助於泵輸送的處理液穿過反應器殼體向上流動，其中在襯底和反應器殼體的上部端部之間設有一定距離，使得形成構造為溢流口的環形間隙。Examples of devices suitable for processing substrates in a stack are known, for example, from US Pat. No. 5,000,827 and DE 10 2007 020 449. This reference shows a so-called overflow reactor for treating a substrate placed above a reactor housing. The treatment liquid delivered by means of the pump flows upwards through the reactor housing, wherein a distance is provided between the substrate and the upper end of the reactor housing such that an annular gap configured as an overflow is formed.
因為在使用這種處理池時，處理液穿過反應器殼體的上部邊緣從該反應器殼體中流出，通常在池之下存在有用於容納溢出液體的容器。Since the treatment liquid flows out of the reactor housing through the upper edge of the reactor housing when such a treatment tank is used, there is usually a container for containing the overflow liquid under the pool.
由於處理順序的改變、由於定期的檢驗工作、或者由於要短時間內執行的維護工作，必須能夠替換處理池。對此，通常需要一系列的措施，其中尤其強調將處理池從用於容納的容器中脫離和可靠地提升池。在此，對池精確地以及謹慎地進行提升是期望的。The processing pool must be replaceable due to changes in the processing sequence, due to periodic inspection work, or due to maintenance work to be performed in a short period of time. In this regard, a series of measures are usually required, with particular emphasis on detaching the treatment tank from the container for containment and reliably lifting the pool. Here, it is desirable to carry out the lifting of the pool accurately and cautiously.
因此，本新型的目的是提供一種設備，該設備實現對用於濕法化學處理的處理池進行簡單的以及可靠的替換。在此，尤其期望省時地、可靠地和盡可能位置精確地提升池或放下(替換)池。此外，解決方案應儘是可能低成本的。Accordingly, it is an object of the present invention to provide an apparatus that enables a simple and reliable replacement of a treatment tank for wet chemical treatment. Here, it is particularly desirable to lift the pool or to lower (replace) the pool in a time-saving, reliable and as precise position as possible. In addition, the solution should be as low-cost as possible.
該目的透過用於借助處理液對襯底進行濕法化學處理的設備實現，該設備包括：具有外壁的、能夠替換的處理池；設置在該處理池之下的、用於容納從該處理池中流出的處理液的容器；以及至少兩根偏心軸，借助於該偏心軸能夠透過提升來將該處理池與該用於容納的容器分離。其他有利的實施形式從說明書中以及附圖得出。The object is achieved by an apparatus for wet chemical treatment of a substrate by means of a treatment liquid, the apparatus comprising: a replaceable treatment tank having an outer wall; disposed under the treatment tank for accommodating from the treatment tank a container for the effluent treatment liquid; and at least two eccentric shafts by means of which the treatment tank can be separated from the container for accommodating by lifting. Further advantageous embodiments result from the description and from the figures.
根據本新型的設備用於借助處理液對襯底進行濕法化學處理。根據定義，這種處理不僅包括對襯底進行化學移除或覆層，而且包括穿過或沿著該處理液對襯底進行清洗或者僅僅運輸。The device according to the invention is used for wet chemical treatment of a substrate by means of a treatment liquid. By definition, such processing includes not only chemical removal or cladding of the substrate, but also cleaning or merely transporting the substrate through or along the processing fluid.
根據本新型，設備包括能夠具有外壁的、可替換的處理池；設置在處理池之下的、用於容納從處理池中流出的 處理液的容器；以及至少兩根偏心軸，借助於該偏心軸透過提升用於容納的容器能夠分離處理池。According to the present invention, the apparatus includes a replaceable treatment tank capable of having an outer wall; disposed under the treatment tank for accommodating the flow out of the treatment tank a container for the treatment liquid; and at least two eccentric shafts by means of which the treatment tank can be separated by lifting the container for accommodation.
較佳地，處理池能夠在至少兩根偏心軸上在提升位置中移動。Preferably, the processing tank is moveable in the elevated position on at least two eccentric shafts.
根據一個較佳的實施形式，在處理池的外壁和用於容納的容器之間的過渡區域中設置有基於液體的密封部，透過在過渡區域中提供液體收集容積部實現該密封部的構成。為了闡明這種密封部參考參附圖描述。According to a preferred embodiment, a liquid-based seal is provided in the transition region between the outer wall of the treatment tank and the container for accommodation, the configuration of which is achieved by providing a liquid collection volume in the transition region. In order to clarify such a seal, reference is made to the accompanying drawings.
尤其較佳地，該液體收集容積部具有小於偏心軸的偏心距的(要垂直地確定的)深度。透過以偏心距的大小提升處理池能夠足夠高地將該處理池從液體收集容積部的接合區域中提起，以便能夠無碰撞或歪斜地將該處理池可靠地移出。這當液體收集容積部的深度大於偏心距時是不可能的；因此，從接合區域中附加地進行提升是必需的。Particularly preferably, the liquid collecting volume has a depth (to be determined vertically) which is smaller than the eccentricity of the eccentric shaft. By raising the treatment tank by the eccentricity, the treatment tank can be lifted sufficiently high from the joint area of the liquid collection volume so that the treatment tank can be reliably removed without collision or skew. This is not possible when the depth of the liquid collecting volume portion is larger than the eccentricity; therefore, it is necessary to additionally perform lifting from the joint region.
此外較佳的是，偏心軸從設備的提取側朝向與該提取側對置的後側傾斜地延伸。因此，在拉出時，在然後起到滑軌或導軌作用的偏心軸上繼續提升處理池。對此也參考附圖描述。以這種方式可能的是，無工具地(或者至少用少量工具地)替換處理池，還在較短時間內完成該替換。Further preferably, the eccentric shaft extends obliquely from the extraction side of the device toward the rear side opposite the extraction side. Therefore, when pulling out, the processing tank is continuously lifted on the eccentric shaft which then acts as a slide rail or guide rail. This is also described with reference to the drawings. In this way it is possible to replace the processing pool without tools (or at least with a small amount of tools) and to complete the replacement in a shorter time.
隨後，描述利用根據本新型的設備對用於借助處理液對襯底進行濕法化學處理的處理池的替換。為避免重復可以參考上述實施形式。Subsequently, an alternative to a treatment tank for wet chemical treatment of a substrate by means of a treatment liquid using the apparatus according to the invention will be described. To avoid repetition, reference may be made to the above embodiment.
這種應用包括利用至少兩根偏心軸透過提升來將處理池與用於容納的容器分離的、與替換池有關的步驟，以及 接下來在提升位置中的處理池的移動。Such applications include the steps associated with replacing the pool with at least two eccentric shafts through lifting to separate the treatment tank from the container for containment, and Next is the movement of the processing pool in the elevated position.
為替換處理池，首先在與處理池連接的配合面處透過與該配合面共同作用的偏心軸的旋轉將該處理池提升。To replace the treatment tank, the treatment tank is first lifted through the rotation of the eccentric shaft cooperating with the mating surface at the mating face that is connected to the treatment tank.
隨後，在借助於旋轉偏心軸進行提升之後，在提升位置中，處理池在該偏心軸上移動。清楚的是，進行該移動使得將要替換的處理池從處理站的區域中移出。較佳地，能夠將處理池在充分的移動之後放置在池運輸設備上。Subsequently, after lifting by means of the rotary eccentric shaft, in the lifting position, the treatment tank moves on the eccentric shaft. It is clear that this movement is made such that the processing pool to be replaced is removed from the area of the processing station. Preferably, the processing pool can be placed on the pool transport device after sufficient movement.
同樣清楚的是，以相反的方式進行將同一個或另一個處理池裝如到處理站中。因此不相應地進行描述。It is also clear that the same or another processing pool is loaded into the processing station in the opposite manner. Therefore, the description is not made accordingly.
因此，本新型提供一種設備，借助該設備基於借助於偏心軸進行的提升可實現簡單、可靠、快速和低成本地替換用於濕法化學處理襯底的處理池。Thus, the present invention provides an apparatus by which a treatment tank for wet chemically treating a substrate can be replaced simply, reliably, quickly and at low cost based on lifting by means of an eccentric shaft.
在該實施形式中，處理池1雙層壁式地構成。該處理池的外壁2和內壁3在構成中間腔4的情況下相互隔開。溢流的或噴出的處理液能夠透過該中間腔4向下引出，以便不泄漏到周圍空氣中或不污染周圍環境U。In this embodiment, the treatment tank 1 is constructed in a double-walled manner. The outer wall 2 and the inner wall 3 of the treatment tank are spaced apart from each other in the case of constituting the intermediate chamber 4. The overflowed or sprayed treatment liquid can be drawn downward through the intermediate chamber 4 so as not to leak into the surrounding air or contaminate the surrounding environment U.
在處理池1之下設置有用於容納處理液F的容器5。在示出的實施形式中，該容器支承處理池1，並且類似於具有基本上氣密的壁的台座(包括底板和覆蓋板)構成。然而，在朝向處理池下側的邊界區域中，用於容納的容器5具有通孔6(僅左側的通孔設有附圖標記)。處理液F能夠穿過該通孔6到達用於容納的容器5的內腔7中。A container 5 for accommodating the treatment liquid F is provided below the treatment tank 1. In the embodiment shown, the container supports the treatment tank 1 and is constructed similarly to a pedestal (including a bottom plate and a cover plate) having substantially airtight walls. However, in the boundary area facing the lower side of the treatment tank, the container 5 for accommodation has a through hole 6 (only the left side through hole is provided with a reference numeral). The treatment liquid F can pass through the through hole 6 to reach the inner cavity 7 of the container 5 for accommodation.
從處理池1溢流出的處理液F由於重力S在中間腔4中向下流動並且收集在處理池1的下側和用於容納的容器5的上側之間的邊界區域中。在那裏，更準確地說在處理池1的外壁2和用於容納的容器5之間的過渡區域中設置有相對於周圍環境U遮罩處理液F的密封部8。該密封部8是必要的，因此處理液F還保持在設備的內部中，並且不能夠到達周圍環境U中。密封部8是液密的。The treatment liquid F overflowing from the treatment tank 1 flows downward in the intermediate chamber 4 due to the gravity S and is collected in the boundary region between the lower side of the treatment tank 1 and the upper side of the container 5 for accommodation. There, more precisely, in the transition region between the outer wall 2 of the treatment tank 1 and the container 5 for accommodation, a sealing portion 8 is provided which covers the treatment liquid F with respect to the surrounding environment U. This sealing portion 8 is necessary, so the treatment liquid F is also held in the interior of the device and cannot reach the surrounding environment U. The sealing portion 8 is liquid-tight.
在圖1中僅在細節圈K中表明密封部8。尤其較佳的是，該密封部構成為基於液體的密封部，透過在處理池1的外壁2和用於容納的容器5之間的過渡區域中提供液體收集容積部(沒有示出)來實現密封部8的構成。The seal 8 is only indicated in the detail circle K in FIG. It is particularly preferred that the sealing portion is formed as a liquid-based sealing portion which is realized by providing a liquid collecting volume portion (not shown) in a transition region between the outer wall 2 of the processing tank 1 and the container 5 for accommodating The configuration of the sealing portion 8.
根據本新型的設備具有兩根偏心軸9，借助於該偏心軸能夠透過提升將處理池1與用於容納的容器5分離，並且在偏心軸9上能夠將該處理池在提升位置中朝設備提取側移動。在示出的視圖中，該提取側朝向觀察者。The device according to the invention has two eccentric shafts 9 by means of which the treatment tank 1 can be separated from the container 5 for accommodation by means of lifting, and on the eccentric shaft 9 the treatment tank can be moved towards the device in the lifting position The extraction side moves. In the view shown, the extraction side is towards the viewer.
透過將偏心軸9從下沈位置中以較佳為180度的角度旋轉到提升位置中來進行該提升。在此，由於偏心軸9的偏心距，相應地指向上的、與處理池1的相應的配合面接觸的接觸線到密封部8或用於容納的容器5的上側的距離也發生改變。This lifting is performed by rotating the eccentric shaft 9 from the sinking position at an angle of preferably 180 degrees into the lifting position. In this case, due to the eccentricity of the eccentric shaft 9, the distance of the contact line which is correspondingly directed upwards in contact with the respective mating surface of the treatment bath 1 to the upper side of the sealing portion 8 or the container 5 for accommodation also changes.
根據示出的、較佳的實施形式，偏心軸9具有偏心距，該偏心距至少與較佳存在的液體收集容積部的深度(沒有示出)一致。因此確保，在從下沈位置到提升位置的轉換中，將外壁2提升為使得處理池1實際上能夠自由 移動。According to the preferred embodiment shown, the eccentric shaft 9 has an eccentricity which coincides at least with the depth (not shown) of the preferably present liquid collecting volume. It is thus ensured that in the transition from the sinking position to the lifting position, the outer wall 2 is raised such that the processing tank 1 is actually free mobile.
同樣能夠認識到，偏心軸9從提取側中朝向與該提取側對置的(背離觀察者的)後側傾斜地延伸。因此，在偏心軸9上朝觀察者的方向進行滑動期間，繼續向上提升處理池1。以這種方式也能夠較簡單地將其他的、在圖中沒有示出的連接件(例如，處理池1的進水件和/或排水件)與相應的配合件分離。尤其較佳地，該連接件滑入到彼此中或者從彼此中滑出，使得在替換處理池1時，取消手動的聯接和分離。It can likewise be appreciated that the eccentric shaft 9 extends obliquely from the extraction side towards the rear side (facing away from the viewer) opposite the extraction side. Therefore, during the sliding of the eccentric shaft 9 toward the observer, the processing tank 1 is continuously lifted upward. In this way, it is also relatively simple to separate the other connecting parts (for example, the water inlet and/or the drain of the treatment tank 1) which are not shown in the figures from the respective fittings. Particularly preferably, the connectors slide into or out of each other such that manual coupling and disengagement are eliminated when the treatment tank 1 is replaced.
1‧‧‧處理池1‧‧‧Processing pool
2‧‧‧外壁2‧‧‧ outer wall
3‧‧‧內壁3‧‧‧ inner wall
4‧‧‧中間腔4‧‧‧Intermediate cavity
5‧‧‧用於容納的容器5‧‧‧ Containers for containment
6‧‧‧通孔6‧‧‧through hole
7‧‧‧內腔7‧‧‧ lumen
8‧‧‧密封部8‧‧‧ Sealing Department
9‧‧‧偏心軸9‧‧‧Eccentric shaft
10‧‧‧配合面10‧‧‧Materials
F‧‧‧處理液、液體F‧‧‧Processing liquid, liquid
U‧‧‧周圍環境U‧‧‧ surroundings
S‧‧‧重力S‧‧‧Gravity
K‧‧‧細節圈K‧‧‧Detail circle
在圖1中示出用於濕法化學處理的根據本新型的設備的較佳的實施形式的剖面圖。A cross-sectional view of a preferred embodiment of the apparatus according to the invention for wet chemical treatment is shown in FIG.
該設備在其上部區域中具有用於例如尤其為平坦襯底的物體(沒有示出)的處理池1。在處理池1中存在處理液F，從該處理液中連續地、然而尤其在處理期間能夠流出處理液F，該處理液在圖1中透過相應的箭頭表明(僅部分地設有附圖標記)。The device has in its upper region a treatment cell 1 for an object, for example a flat substrate, in particular. The treatment liquid F is present in the treatment tank 1 , from which the treatment liquid F can be discharged continuously, but in particular during the treatment, which is indicated in FIG. 1 by corresponding arrows (only partial reference numerals are provided ).
1‧‧‧處理池1‧‧‧Processing pool
2‧‧‧外壁2‧‧‧ outer wall
3‧‧‧內壁3‧‧‧ inner wall
4‧‧‧中間腔4‧‧‧Intermediate cavity
5‧‧‧用於容納的容器5‧‧‧ Containers for containment
6‧‧‧通孔6‧‧‧through hole
7‧‧‧內腔7‧‧‧ lumen
8‧‧‧密封部8‧‧‧ Sealing Department
9‧‧‧偏心軸9‧‧‧Eccentric shaft
10‧‧‧配合面10‧‧‧Materials
F‧‧‧處理液、液體F‧‧‧Processing liquid, liquid
U‧‧‧周圍環境U‧‧‧ surroundings
S‧‧‧重力S‧‧‧Gravity
K‧‧‧細節圈K‧‧‧Detail circle
Claims (5)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE201110120133 DE102011120133B4 (en) | 2011-12-06 | 2011-12-06 | Replaceable treatment basin for wet-chemical processes and procedures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM457730U true TWM457730U (en) | 2013-07-21 |
Family
ID=47503533
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101216940U TWM458656U (en) | 2011-12-06 | 2012-09-03 | Apparatus for wet chemical treatment |
| TW101216939U TWM457730U (en) | 2011-12-06 | 2012-09-03 | Replaceable treatment pool used for wet-type chemical treatment |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101216940U TWM458656U (en) | 2011-12-06 | 2012-09-03 | Apparatus for wet chemical treatment |
Country Status (4)
| Country | Link |
|---|---|
| KR (2) | KR20130003551U (en) |
| CN (2) | CN203260558U (en) |
| DE (3) | DE102011120133B4 (en) |
| TW (2) | TWM458656U (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6543534B2 (en) | 2015-08-26 | 2019-07-10 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing equipment |
| CN105671521B (en) * | 2016-01-14 | 2020-04-28 | 电子科技大学 | High-throughput wet-process chemical combined material chip preparation device and preparation method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE281482C (en) | ||||
| US5000827A (en) | 1990-01-02 | 1991-03-19 | Motorola, Inc. | Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect |
| TW513594B (en) * | 1996-06-14 | 2002-12-11 | Seiko Epson Corp | Pull-up Novel pull-up drying method and apparatus |
| JPH1012585A (en) * | 1996-06-24 | 1998-01-16 | Sony Corp | Closed type wafer-cleaning equipment |
| DE102007020449A1 (en) | 2006-12-13 | 2008-06-19 | Rena Sondermaschinen Gmbh | Device for the wet chemical, electrochemical or electrolytic treatment or for cleaning the lower side of a flat material comprises a treatment chamber with an overflow edge which forms a gap with a support for the material |
-
2011
- 2011-12-06 DE DE201110120133 patent/DE102011120133B4/en active Active
-
2012
- 2012-07-24 DE DE201220102763 patent/DE202012102763U1/en not_active Expired - Lifetime
- 2012-07-24 DE DE201220102765 patent/DE202012102765U1/en not_active Expired - Lifetime
- 2012-09-03 TW TW101216940U patent/TWM458656U/en not_active IP Right Cessation
- 2012-09-03 TW TW101216939U patent/TWM457730U/en not_active IP Right Cessation
- 2012-09-05 CN CN 201220451506 patent/CN203260558U/en not_active Expired - Fee Related
- 2012-09-05 CN CN 201220451012 patent/CN203055873U/en not_active Expired - Fee Related
- 2012-10-10 KR KR2020120009104U patent/KR20130003551U/en not_active Application Discontinuation
- 2012-10-10 KR KR2020120009105U patent/KR20130003552U/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| DE202012102765U1 (en) | 2012-12-06 |
| CN203055873U (en) | 2013-07-10 |
| TWM458656U (en) | 2013-08-01 |
| CN203260558U (en) | 2013-10-30 |
| DE102011120133A1 (en) | 2013-06-06 |
| DE202012102763U1 (en) | 2012-12-06 |
| DE102011120133B4 (en) | 2014-01-02 |
| KR20130003551U (en) | 2013-06-14 |
| KR20130003552U (en) | 2013-06-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI518778B (en) | Gas phase etching apparatus | |
| CN105408983B (en) | Vertical non-rotating processing chamber | |
| US10646901B2 (en) | Cleaning device for small parts | |
| CN106987894B (en) | A kind of inversion type electrolytic buffing attachment and its electrobrightening equipment | |
| TWM457730U (en) | Replaceable treatment pool used for wet-type chemical treatment | |
| TW201704556A (en) | Electroplating apparatus | |
| KR101665537B1 (en) | Etching system and method of using it to etch the glass substrate | |
| KR20130037099A (en) | Cleaning apparatus for a shower-head used in manufacturing process of semiconductor | |
| CN103846250B (en) | The filter pumping equipment of a kind of ultrasonic cleaner and fluid-discharge method | |
| CN103157635B (en) | Collecting device of residual oil of oil drum | |
| CN207002869U (en) | A kind of inversion type electrolytic buffing attachment and its electrobrightening equipment | |
| US9199237B2 (en) | Automated well plate | |
| CN106216000A (en) | A kind of high leakproofness test tube rack with buffer structure | |
| KR102343633B1 (en) | Apparatus and method for treating substrate | |
| JP2018049199A5 (en) | ||
| TWI747580B (en) | Etching device | |
| US20160102397A1 (en) | Vacuum pre-wetting apparatus and methods | |
| JP5911682B2 (en) | Tank carrier and substrate processing apparatus | |
| WO2015148316A4 (en) | Methods and apparatus for a cleanspace fabricator to process products in vessels | |
| CN205582893U (en) | A integrated liquid medicine groove for wet -type processing procedure | |
| KR102616125B1 (en) | Tube cleaning apparatus for semiconductor manufacturing | |
| US6294028B1 (en) | Mercury process gold ballbond removal apparatus | |
| KR101648333B1 (en) | Apparatus for agitating and supplying chemical solution | |
| JP2014103149A (en) | Substrate processing apparatus and substrate processing method, and computer readable recording medium recording substrate processing program | |
| CN105691967A (en) | Self-cleaning vertical storage tank |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4K | Annulment or lapse of a utility model due to non-payment of fees |