TWM455260U - LED lamp, LED module - Google Patents

Description

Light-emitting diode lamp and light-emitting diode module

The present invention is a light-emitting diode lamp and a light-emitting diode module, in particular, a light-emitting diode lamp and a light-emitting diode module with waterproof function.

The life of modern people relies heavily on electric lights. In addition to fluorescent lighting, table lamps, table lamps, wall lamps, etc., it is also used for indoor lighting. It also uses street lights, art street lights for outdoor lighting, or warning lights as warnings for roadblocks. Various indoor or outdoor night lighting.

With the development of lighting diode technology and the awareness of environmental protection, the current LED is commonly used as a lighting body for lighting fixtures. However, Taiwan is a place with high humidity, and the light-emitting diode is very sensitive to moisture, moisture and dust. If the lighting fixture is not waterproof and dustproof, the club will shorten the service life of the light-emitting diode. In addition, the LED generates high heat when it is operated. If the heat dissipation mechanism of the lighting fixture itself is poorly designed, the LED may be damaged. If the waterproof heat dissipation design is poor, the light-emitting diodes will often be damaged, and the lighting fixtures will lose the lighting function, so that the user is forced to replace the new lighting fixtures, which is not only economical and environmentally friendly.

Therefore, it is necessary to provide a light-emitting diode lamp with good waterproof and heat-dissipating effects to improve the waterproof and heat dissipation of the light-emitting diode lamp, so as to improve the service life of the light-emitting diode lamp.

One of the aims of this creation is to provide a light-emitting diode lamp with waterproof function.

Another object of the present invention is to provide a light-emitting diode module having a waterproof function.

In order to achieve the above objectives, the light-emitting diode lamp of the present invention comprises a base and a light-emitting diode module. The pedestal includes a first surface; the illuminating diode module is connected to the pedestal, and the illuminating diode module comprises a circuit board, a plurality of illuminating diodes, a waterproof pad, and a light transmissive plate. The circuit board is located on the first surface; the plurality of light emitting diodes are disposed on the circuit board; the waterproof pad comprises a plurality of through holes, wherein the positions of the through holes correspond to the respective light emitting diodes, thereby being embedded with the respective light emitting diodes And the light-transmitting plate is located on the plurality of light-emitting diodes and the waterproof pad.

According to an embodiment of the present invention, the base includes a second surface and a plurality of heat dissipation fins, wherein the plurality of heat dissipation fins are disposed on the second surface.

According to an embodiment of the present invention, the LED module further includes a thermal conductive sheet disposed between the circuit board and the first surface for guiding heat generated by the plurality of light emitting diodes to the plurality of heat dissipating fins.

According to an embodiment of the present invention, the light-emitting diode lamp further includes a metal member located above the light-transmitting plate.

According to an embodiment of the present invention, the LED lamp further includes a cushion between the light transmissive plate and the metal member.

According to an embodiment of the present invention, the LED device further includes a first auxiliary heat sink, and the waterproof pad further includes a first side, wherein the first auxiliary heat sink is located at the first side, and the metal member and the first auxiliary heat sink At least a portion of the device is in contact.

According to an embodiment of the present invention, the light-emitting diode lamp further includes a second auxiliary heat sink, and the waterproof pad further includes a second side perpendicular to the first side, wherein the second auxiliary heat sink is located on the second side And the metal member is in contact with at least a portion of the second auxiliary heat sink.

According to an embodiment of the present invention, the first auxiliary heat sink and the second auxiliary heat sink are each provided with a plurality of heat sink fins, and the arrangement direction of the plurality of heat sink fins of the first auxiliary heat sink and the plurality of second heat sinks The arrangement of the fins is vertical.

The present invention further provides a light emitting diode module, which comprises a circuit board, a plurality of light emitting diodes, a waterproof pad, and a light transmissive plate, wherein the plurality of light emitting diodes are disposed on the circuit board; the waterproof pad comprises a plurality of through holes The position of each of the through holes corresponds to each of the light emitting diodes, thereby being matched with the respective light emitting diodes; the light transmitting plate is located above the plurality of light emitting diodes and the waterproof pad.

According to an embodiment of the present invention, the LED module further includes a thermal pad under the circuit board for deriving heat generated by the plurality of LEDs.

Because the creation of this creation is novel, it can provide industrial use, and it has improved efficiency, so it applies for a new patent according to law.

The above and other objects, features and advantages of the present invention will become more apparent and understood.

Please refer to FIG. 1 to FIG. 4 together to understand one embodiment of the light-emitting diode lamp of the present invention, wherein FIG. 1 is a structural explosion diagram of the light-emitting diode lamp of the present invention; FIG. 2 is the creation of the present invention. A schematic diagram of a partial cross section of a light-emitting diode lamp; FIG. 3 is a schematic view of the light-emitting diode lamp of the present invention; FIG. 4 is a schematic view of the light-emitting diode module of the present invention.

As shown in FIG. 1 , the light-emitting diode lamp 1 of the present invention comprises a base 10 , a light-emitting diode module 20 , a cushion 30 , a metal member 40 , a first auxiliary heat sink 51 , and a second auxiliary heat sink 52 . The illuminating diode module 20 is connected to the pedestal 10, the snubber 30 is located between the illuminating diode module 20 and the metal member 40, and the first auxiliary heat dissipating device 51 and the second auxiliary heat dissipating device 52 are disposed on the illuminating diode The circumference of the body module 20.

In the embodiment, the susceptor 10 includes a first surface 12 , a second surface 11 , and a plurality of heat dissipation fins 13 , wherein the plurality of heat dissipation fins 13 are disposed on the second surface 11 . The light emitting diode module 20 includes a circuit board 21, a plurality of light emitting diodes 22, a waterproof pad 23, a light transmitting plate 24, and a heat conducting sheet 25, wherein the circuit board 21 is located above the first surface 12. The plurality of light-emitting diodes 22 of the present embodiment are high-power light-emitting diodes (LEDs), and the plurality of light-emitting diodes 22 are disposed on the circuit board 21, and in the embodiment, each of the light-emitting diodes 22 is provided with a corresponding Photomask 221.

As shown in FIG. 1, the waterproof pad 23 of the present embodiment is made of rubber, and the waterproof pad 23 is provided with a plurality of through holes 231, wherein the number and position of the through holes 231 are different from the number and position of the respective light emitting diodes 22. Corresponding to this, let the waterproof pad 23 is closely fitted with the reticle 221 of each of the illuminating diodes 22 to fix the illuminating diode 22, and at the same time, moisture or dust can be prevented from entering the illuminating diode 22, and the anti-slip and positioning of the illuminating diode 22 can be achieved. effect.

The light-transmitting plate 24 is located on the plurality of light-emitting diodes 22 and the waterproof pad 23, and the light-transmitting plate 24 of the embodiment is glass. However, the present invention is not limited thereto, and the light-transmitting plate 24 may also be acrylic ( Acrylic) or polycarbonate (Polycarbonate) and other transparent materials with higher strength. The heat conducting sheet 25 is located between the circuit board 21 and the first surface 12 to guide the heat generated by the plurality of light emitting diodes 22 to the plurality of heat radiating fins 13.

As shown in FIG. 1 and FIG. 2, the cushion pad 30 covers the light-transmitting plate 24 and is located under the metal member 40. The metal member 40 and the cushion pad 30 are disposed to protect the light-transmitting plate 24 from external force. The metal member 40 also has a lightning protection effect by direct impact damage, thereby protecting the light-emitting diode lamp 1 from lightning damage. The cushion 30 may be a soft material such as silicone or rubber. The metal member 40 is an iron member in the embodiment, and the light of the light-emitting diode 22 is penetrated. The cushion 30 and the metal member 40 of the embodiment are illuminated. The corresponding positions of the diodes 22 are provided with openings for light to penetrate.

As shown in FIG. 1 and FIG. 2, in addition to the heat dissipation fins 13 on the susceptor 10, the first illuminating diode 1 and the second auxiliary heat sink 52 are added to the illuminating diode lamp 1 of the present invention. The first auxiliary heat sink 51 of the embodiment is disposed on the first side edges 232 and 234 of the waterproof pad 23 , and the second auxiliary heat sink 52 is disposed on the second side edges 233 and 235 of the waterproof pad 23 .

Furthermore, as shown in FIG. 2 and FIG. 3, the metal members 40 are respectively in contact with at least a portion of the first auxiliary heat sink 51 and the second auxiliary heat sink 52, whereby the heat generated by the LEDs 22 is made of metal. Piece 40 leads to The first auxiliary heat dissipating device 51 and the second auxiliary heat dissipating device 52 enable the heat generated by the LED device 1 of the present invention to simultaneously dissipate heat through the susceptor 10, the first auxiliary heat dissipating device 51, and the second The auxiliary heat sink 52 is dissipated, thereby increasing the heat dissipation efficiency of the light-emitting diode lamp 1 of the present invention. It should be noted that in order to increase the heat dissipation efficiency of the side of the light-emitting diode lamp 1 of the present invention, the second side edges 233 and 235 of the waterproof pad 23 are perpendicular to the first side edges 232 and 234.

In addition, as shown in FIG. 2 and FIG. 3 , the first auxiliary heat dissipation device 51 and the second auxiliary heat dissipation device 52 are all provided with a plurality of heat dissipation fins 511 and 521 , and the plurality of heat dissipation fins 511 of the first auxiliary heat dissipation device 51 are arranged. The direction is perpendicular to the direction in which the plurality of heat dissipation fins 521 of the second auxiliary heat sink 521 are arranged.

It should be noted that, in this embodiment, the circuit board 21, the waterproof pad 23, and the light transmissive plate 24 of the LED module 20 are integrally formed by heating and high voltage, and the entire LED module 20 is integrated. The structure does not need to use adhesive bonding, and the metal member 40, the cushion 30, the first auxiliary heat sink 51 and the second auxiliary heat sink 52 can improve the waterproof level of the light-emitting diode lamp 1 of the present invention to IP68. Grade, therefore, the light-emitting diode lamp 1 of the present invention can be used in a harsh external environment, such as water. However, the present invention is not limited to this embodiment, and the circuit board 21, the waterproof pad 23, and the light transmissive plate 24 of the LED module 20 may also be bonded by using adhesive; or by using fixing elements such as screws and cassettes. And so on, the circuit board 21, the waterproof pad 23, and the light transmissive plate 24 of the LED module 20 are combined.

It should be noted that, as shown in FIG. 4, the internal components of the LED module 20 of the present invention can be integrally combined by heating and high pressure, combined by adhesive, or by using fixing components such as screws. Matching The design of the waterproof pad 23 enables the light-emitting diode module 20 to have good waterproof, crash-resistant and shock-proof characteristics. The manufacturer of the LED module can separately manufacture the LED module 20, and then combine the LED module 20 with different heat dissipation modules, thereby increasing the LED module 20 of the present invention. applicability.

In summary, this creation, regardless of its purpose, means and efficacy, is showing its characteristics that are different from the well-known techniques. You are kindly requested to review the examination and express the patent as soon as possible. It is to be noted that the various embodiments described above are merely illustrative for ease of explanation, and the scope of the claims is intended to be limited by the scope of the claims.

1‧‧‧Lighting diode lamps

10‧‧‧ Pedestal

11‧‧‧ second surface

12‧‧‧ first surface

13,511, 521‧‧‧ Heat sink fins

20‧‧‧Lighting diode module

21‧‧‧ boards

22‧‧‧Lighting diode

23‧‧‧Waterproof mat

231‧‧‧through hole

232, 234‧‧‧ first side

233, 235‧‧‧ second side

24‧‧‧light board

25‧‧‧ Thermal sheet

40‧‧‧Metal parts

30‧‧‧ cushion

51‧‧‧First auxiliary heat sink

52‧‧‧Second auxiliary heat sink

221‧‧‧Photomask

Figure 1 is a structural exploded view of the light-emitting diode lamp of the present invention.

FIG. 2 is a partial cross-sectional view of the light-emitting diode lamp of the present invention.

Figure 3 is a schematic diagram of the light-emitting diode lamp of the present invention.

FIG. 4 is a schematic diagram of the LED module of the present invention.

1‧‧‧Lighting diode lamps

10‧‧‧ Pedestal

13, 521‧‧‧ Heat sink fins

21‧‧‧ boards

22‧‧‧Lighting diode

23‧‧‧Waterproof mat

24‧‧‧light board

221‧‧‧Photomask

40‧‧‧Metal parts

51‧‧‧First auxiliary heat sink

52‧‧‧Second auxiliary heat sink

Claims (20)

An illuminating diode lamp includes: a pedestal comprising: a first surface; a light emitting diode module connected to the pedestal, the illuminating diode module comprising: a circuit board Located on the first surface; a plurality of light-emitting diodes disposed on the circuit board; a waterproof pad comprising: a plurality of through holes, wherein the positions of the through holes correspond to the respective light-emitting diodes, thereby a light emitting diode is embedded; and a light transmissive plate is disposed on the plurality of light emitting diodes and the waterproof pad. The light-emitting diode lamp of claim 1, wherein the base comprises a second surface and a plurality of heat-dissipating fins, wherein the plurality of heat-dissipating fins are disposed on the second surface. The illuminating diode lamp of claim 2, wherein the illuminating diode module further comprises a thermal conductive sheet disposed between the circuit board and the first surface for illuminating the plurality of The heat generated by the diode is directed to the plurality of fins. The illuminating diode lamp of claim 1, further comprising a metal member, wherein the metal member is located above the light transmissive plate. The light-emitting diode lamp of claim 4, further comprising a cushion, wherein the cushion is located between the light-transmitting plate and the metal member. The illuminating diode lamp of claim 4, further comprising a first auxiliary heat sink, wherein the waterproof pad further comprises a first side, wherein the first auxiliary heat sink is located at the first side . The illuminating diode lamp of claim 6, wherein the metal member is in contact with at least a portion of the first auxiliary heat sink. The illuminating diode lamp of claim 6, further comprising a second auxiliary heat dissipating device, wherein the waterproof pad further comprises a second side perpendicular to the first side, wherein the second auxiliary The heat sink is located on the second side. The illuminating diode lamp of claim 8, wherein the metal member is in contact with at least a portion of the second auxiliary heat sink. The illuminating diode lamp of claim 8, wherein the first auxiliary heat sink and the second auxiliary heat sink are provided with a plurality of heat sink fins, and the plurality of heat sink fins of the first auxiliary heat sink The arrangement direction is perpendicular to the arrangement direction of the plurality of heat dissipation fins of the second auxiliary heat sink. The light-emitting diode lamp of claim 1, wherein the circuit board, the waterproof pad, and the light-transmitting plate are integrally combined by heating and high-pressure bonding. The light-emitting diode lamp of claim 1, wherein the circuit board, the waterproof pad, and the light-transmitting plate are bonded by an adhesive. The illuminating diode lamp of claim 1, wherein the circuit board, the waterproof pad, and the light transmissive plate are coupled by a fixing component. The illuminating diode lamp of claim 13, wherein the fixing component is a screw. A light emitting diode module includes: a circuit board; a plurality of light emitting diodes disposed on the circuit board; and a waterproof pad comprising: a plurality of through holes, wherein each of the through holes is located at a position corresponding to each of the light emitting diodes Correspondingly, the LEDs are assembled with the light-emitting diodes; and a light-transmitting plate is disposed on the plurality of light-emitting diodes and the waterproof pad. The light-emitting diode module of claim 15, further comprising a heat-conducting sheet under the circuit board for deriving heat generated by the plurality of light-emitting diodes. The light-emitting diode module of claim 15, wherein the circuit board, the waterproof pad, and the light-transmitting plate are integrally combined by heating and high-pressure bonding. The light emitting diode module of claim 15, wherein the circuit board, the waterproof pad, and the light transmissive plate are bonded by an adhesive. The light-emitting diode module of claim 15, wherein the circuit board, the waterproof pad, and the light-transmitting plate are coupled by a fixing member. The illuminating diode module of claim 19, wherein the fixing component is a screw.