KR101005080B1 - LED lighting fixture having antistatic function and its manufacturing method - Google Patents

LED lighting fixture having antistatic function and its manufacturing method Download PDF

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KR101005080B1
KR101005080B1 KR1020100028928A KR20100028928A KR101005080B1 KR 101005080 B1 KR101005080 B1 KR 101005080B1 KR 1020100028928 A KR1020100028928 A KR 1020100028928A KR 20100028928 A KR20100028928 A KR 20100028928A KR 101005080 B1 KR101005080 B1 KR 101005080B1
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led
antistatic
led substrate
antistatic film
manufacturing
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최재덕
윤철구
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미미라이팅주식회사
루멘전광 주식회사
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/102—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening using gravity or suction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

본 발명은 대전방지기능을 갖는 엘이디 조명기구 및 그 제조방법에 관한 것으로서; 하나 이상의 엘이디가 회로기판의 표면에 일체로 부착되는 엘이디기판의 표면에 가열된 상태의 대전방지필름을 포개놓고 엘이디기판의 하부에서 진공흡착하여 엘이디기판의 표면에 대전방지필름을 밀착시켜서 이루어지는 것을 특징으로 하는 대전방지기능을 갖는 엘이디 조명기구와; 그와 같은 조명기구의 제조방법을 제공한다. 본 발명에 따른 조명기구는 엘이디 기판의 표면에 정전기의 발생을 방지하는 대전방지필름을 밀착시켜 엘이디를 커버함으로서 먼지와 같은 미세물질이 들러붙는 것을 방지함은 물론 다양한 형태로 슬림(slim)하게 조명기구를 제작할 수 있어 설치공간에 제약을 받지 않는 장점이 있다. 또한, 조명기구의 표면을 걸레로 닦아낼 수 있을 뿐만 아니라, 엘이디 보호를 위한 커버 등을 제작하기 위한 별도의 금형 등이 필요없어 조명기구의 제조단가를 낮추는 장점도 있다.The present invention relates to an LED lighting device having an antistatic function and a method of manufacturing the same; One or more LEDs are formed by placing an antistatic film in a heated state on the surface of the LED substrate, which is integrally attached to the surface of the circuit board, and vacuum adsorbing on the bottom of the LED substrate to bring the antistatic film into close contact with the surface of the LED substrate. LED lighting apparatus having an antistatic function; It provides a method of manufacturing such a lighting fixture. The lighting device according to the present invention is to contact the antistatic film to prevent the generation of static electricity on the surface of the LED substrate to cover the LED to prevent the adhesion of fine materials such as dust, as well as slim in various forms (slim) Since the apparatus can be manufactured, there is an advantage that the installation space is not restricted. In addition, the surface of the luminaire can be wiped off with a mop, and there is also an advantage of lowering the manufacturing cost of the luminaire since it does not require a separate mold for manufacturing a cover for LED protection.

Description

대전방지기능을 갖는 엘이디 조명기구 및 그 제조방법{LED lighting apparatus and the manufacturing method having antistatic function}LED lighting apparatus having antistatic function and its manufacturing method {LED lighting apparatus and the manufacturing method having antistatic function}

본 발명은 대전방지기능을 갖는 엘이디 조명기구 및 그 제조방법에 관한 것으로서, 좀 더 상세하게는 엘이디기판의 표면에 발생되는 정전기를 방지하여 공기중의 먼지와 같은 미세물질이 들러붙는 것을 방지하여 조도 저하를 방지할 수 있는 대전방지기능을 갖는 엘이디 조명기구 및 그 제조방법에 관한 것이다.
The present invention relates to an LED lighting device having an antistatic function and a method of manufacturing the same, and more particularly, to prevent static electricity generated on the surface of the LED substrate to prevent adhesion of fine materials such as dust in the air It relates to an LED lighting device having an antistatic function that can prevent the degradation and a method of manufacturing the same.

최근 엘이디(LED; Light-Emitting Diode) 기술의 비약적인 발전으로 인해 다양한 용도로 널리 사용되고 있다.Recently, due to the rapid development of light-emitting diode (LED) technology, it is widely used for various purposes.

특히 엘이디는 조명기구로 사용하는 경우 전력소모가 적고 충분한 조도를 갖고 있어 그 사용량이 점차 증가하고 있다.In particular, when the LED is used as a luminaire, the power consumption is low and has sufficient illuminance, so the usage is gradually increasing.

한편, 백열등이나 엘이디를 이용하는 조명기구의 경우 정전기 발생으로 인해 벌레나 먼지와 같은 미세물질이 들러붙거나 또는 습기가 생기고 이는 장시간 방치하는 경우 화재 발생의 원인이 되고 있다. On the other hand, in the case of lighting fixtures using incandescent lamps or LEDs due to the generation of static electricity, fine substances such as bees and dust adhere or moisture, which is a cause of fire when left for a long time.

이와 같은 문제점을 해소하기 위해 통상 발광부인 백열등이나 엘이디의 전면에 일정거리를 유지하며 유리 또는 플라스틱 재질의 투명 또는 반투명재질의 커버를 구비하여 백열등이나 엘이디 등에 미세물질이 달라붙는 것을 방지하고 있다.In order to solve such a problem, the light emitting part is generally maintained at a constant distance on the front surface of the LED and is provided with a transparent or translucent material cover of glass or plastic material to prevent the incidence of fine materials on the incandescent lamp or the LED.

그런데, 조명장치의 전면에 커버를 구비하는 경우 시간이 지남에 따라 조도가 낮아져 자주 커버를 분리해내 먼지 등을 제거해야 하므로 작업이 까다로울 뿐만 아니라 커버로 인해 조명기구의 부피가 커져 설치장소의 제약 등의 문제점을 안고 있다.However, when the cover is provided on the front of the lighting device, the illuminance decreases over time, so the cover must be removed frequently to remove dust and the like, which is not only difficult but also the volume of the lighting fixture is increased due to the cover. I have a problem.

또한, 커버를 제작하기 위해 별도의 금형을 이용해야 하고 그 커버의 체결을 위한 별도의 구성이 조명장치의 본체에 구비되어 있어야 함에 따라 제조단가가 상승하는 문제점도 있다.
In addition, a separate mold must be used to manufacture the cover, and a separate configuration for fastening the cover has to be provided in the main body of the lighting apparatus, thereby increasing the manufacturing cost.

따라서, 이러한 문제점들을 해결하기 위한 것으로서, 본 발명의 목적은 조명기구를 구성하는 엘이디 기판의 표면에 정전기의 발생을 방지하는 대전방지필름을 밀착시켜 먼지와 같은 미세물질이 들러붙는 것을 방지할 수 있는 대전방지기능을 갖는 엘이디 조명기구 및 그와 같은 엘이디 조명기구의 제조방법을 제공하는데 있다.Therefore, to solve these problems, an object of the present invention is to adhere the antistatic film to prevent the generation of static electricity on the surface of the LED substrate constituting the luminaire to prevent the adhesion of fine materials such as dust The present invention provides an LED lighting device having an antistatic function and a method of manufacturing such LED lighting device.

본 발명의 다른 목적은 설치장소에 제약받지 않도록 슬림(slim)한 형상으로 이루어지는 엘이디 조명기구 및 그 제조방법을 제공하는데 있다.
It is another object of the present invention to provide an LED lighting device having a slim shape so as not to be restricted by an installation place and a manufacturing method thereof.

이와 같은 목적을 달성하기 위해 본 발명은; The present invention to achieve this object;

하나 이상의 엘이디가 회로기판의 표면에 일체로 부착되는 엘이디기판의 표면에 가열된 상태의 대전방지필름을 포개놓고 엘이디기판의 하부에서 진공흡착하여 엘이디기판의 표면에 대전방지필름을 밀착시켜서 이루어지는 것을 특징으로 하는 대전방지기능을 갖는 엘이디 조명기구를 제공한다.One or more LEDs are formed by placing an antistatic film in a heated state on the surface of the LED substrate, which is integrally attached to the surface of the circuit board, and vacuum adsorbing on the bottom of the LED substrate to bring the antistatic film into close contact with the surface of the LED substrate. It provides an LED lighting fixture having an antistatic function.

이때, 상기 대전방지필름은 대전방지제를 플라스틱 필름의 표면에 도포하여 제조하거나 또는 대전방지제와 플라스틱 원재료를 혼합하여 제조한 것을 특징으로 한다.In this case, the antistatic film is produced by applying an antistatic agent to the surface of the plastic film or by mixing the antistatic agent and the plastic raw material.

또한, 상기 회로기판의 표면에는 수지 접착제가 더 도포된 것을 특징으로 한다.In addition, a resin adhesive is further applied to the surface of the circuit board.

그리고, 상기 대전방지필름은 미크론 단위의 크기를 갖는 빛확산재를 더 혼합하여서 제조된 것을 특징으로 한다.
And, the antistatic film is characterized in that it is produced by further mixing the light diffusing material having a size of the micron unit.

또한, 본 발명은;The present invention also provides

하나 이상의 엘이디가 회로기판의 표면에 일체로 부착되는 엘이디기판의 표면에 대전방지필름을 포개놓고 그 대전방지필름의 상측에 히터를 구비하여 대전방지필름을 일정한 형상변형이 일어날 수 있도록 일정온도로 가열하는 제1단계; 및 상기 대전방지필름을 가열한 상태에서 엘이디기판의 하부에 진공흡입장치를 이용해 엘이디기판의 표면에 형성된 다수의 통기공을 통해 진공흡착하는 제2단계;로 구성되는 것을 특징으로 하는 대전방지기능을 갖는 엘이디 조명기구의 제조방법도 제공한다.The antistatic film is placed on the surface of the LED substrate on which one or more LEDs are integrally attached to the surface of the circuit board and the heater is provided on the antistatic film to heat the antistatic film to a certain temperature so that a certain shape deformation can occur. The first step to do; And a second step of vacuum adsorbing through a plurality of vents formed on the surface of the LED substrate by using a vacuum suction device under the LED substrate while the antistatic film is heated. It also provides a method of manufacturing an LED lighting fixture having.

이때, 상기 제1단계 이전에, 상기 회로기판의 표면에 수지 접착제가 도포하는 제3단계;를 더 포함하는 것을 특징으로 한다.
At this time, before the first step, a third step of applying a resin adhesive on the surface of the circuit board; characterized in that it further comprises.

본 발명에 따른 조명기구는 엘이디 기판의 표면에 정전기의 발생을 방지하는 대전방지필름을 밀착시켜 엘이디를 커버함으로서 먼지와 같은 미세물질이 들러붙는 것을 방지함은 물론 다양한 형태로 슬림(slim)하게 조명기구를 제작할 수 있어 설치공간에 제약을 받지 않는 장점이 있다.The lighting device according to the present invention is to contact the antistatic film to prevent the generation of static electricity on the surface of the LED substrate to cover the LED to prevent the adhesion of fine materials such as dust, as well as slim in various forms (slim) Since the apparatus can be manufactured, there is an advantage that the installation space is not restricted.

또한, 조명기구의 표면을 걸레로 닦아낼 수 있을 뿐만 아니라, 엘이디 보호를 위한 커버 등을 제작하기 위한 별도의 금형 등이 필요없어 조명기구의 제조단가를 낮추는 장점도 있다.
In addition, the surface of the luminaire can be wiped off with a mop, and there is also an advantage of lowering the manufacturing cost of the luminaire since it does not require a separate mold for manufacturing a cover for LED protection.

도 1은 본 발명에 따른 대전방지기능을 갖는 엘이디 조명기구의 일 예를 도시한 도면이다.
도 2는 도 1에 따른 대전방지기능을 갖는 엘이디 조명기구의 단면도이다.
도 3은 본 발명에 따른 대전방지기능을 갖는 엘이디 조명기구의 다른 예를 도시한 단면도이다.
도 4 내지 도 16은 본 발명에 따른 대전방지기능을 갖는 엘이디 조명기구의 다양한 예를 도시한 도면이다.1 is a view showing an example of an LED lighting device having an antistatic function according to the present invention.
2 is a cross-sectional view of the LED lighting device having an antistatic function according to FIG.
3 is a cross-sectional view showing another example of an LED lighting device having an antistatic function according to the present invention.
4 to 16 are views showing various examples of the LED lighting fixture having an antistatic function according to the present invention.

이하, 첨부된 도면을 참고로 본 발명에 따른 대전방지기능을 갖는 엘이디 조명기구 및 그 제조방법을 설명한다.
Hereinafter, with reference to the accompanying drawings will be described an LED lighting fixture having an antistatic function and a method of manufacturing the same according to the present invention.

도 1 및 도 2에 의하면, 본 발명에 따른 대전방지기능을 갖는 엘이디 조명기구(100)는 하나 이상의 엘이디(112)가 회로기판(114)의 표면에 일체로 부착되는 엘이디기판(110)의 표면에 가열된 상태의 대전방지필름(120)을 포개놓고 엘이디기판(110)의 하부에서 진공흡착하여 엘이디기판(110)의 표면에 대전방지필름(120)을 밀착시켜서 이루어진다.1 and 2, the LED lighting fixture 100 having an antistatic function according to the present invention is the surface of the LED substrate 110, the one or more LEDs 112 is integrally attached to the surface of the circuit board 114 The antistatic film 120 in a heated state is superimposed on the lower surface of the LED substrate 110 by vacuum adsorption and is made by bringing the antistatic film 120 in close contact with the surface of the LED substrate 110.

이때, 상기 대전방지필름(120)은 PET, PVC 등의 다양한 종류의 플라스틱 필름의 공통된 결점인 대전성을 방지하기 위하여 도시된 바와 같이 대전방지제(122)를 플라스틱 필름(121)의 표면에 도포하거나, 대전방지제와 플라스틱 원재료를 혼합하여 제조함도 가능하다.In this case, the antistatic film 120 is applied to the surface of the plastic film 121 or the antistatic agent 122 as shown in order to prevent the chargeability, which is a common drawback of various types of plastic film, such as PET, PVC It is also possible to manufacture a mixture of antistatic agent and plastic raw materials.

한편, 상기 엘이디기판(110)을 구성하는 엘이디(112)는 원형 사각형 등의 다양한 형상으로 이루어지는 것을 사용할 수 있으나, 회로기판(114)의 표면에 칩엘이디(Chip LED)(112a)를 부착함으로서 슬림한 형상의 조명기구(100)로 제작할 수 있다.Meanwhile, the LEDs 112 constituting the LED substrate 110 may be formed in various shapes such as a circular quadrangle, but are slim by attaching a chip LED 112a to the surface of the circuit board 114. It can be produced with a light fixture 100 of one shape.

이때, 상기 회로기판(114)의 표면에 칩엘이디(112a)를 실장하는 경우 칩엘이디(112a)의 단자는 납땜처리를 하여서 이루어진다. In this case, when the chip LEDs 112a are mounted on the surface of the circuit board 114, the terminals of the chip LEDs 112a are soldered.

이와 같은 엘이디기판(110)의 후면에는 엘이디(112)가 점등시에 방열효과를 높이기 위해 열전도가 우수한 알루미늄 재질의 방열판(미도시됨)을 밀착 고정함이 바람직하다.The rear surface of the LED substrate 110 is preferably closely fixed to the heat sink (not shown) made of aluminum having excellent thermal conductivity in order to increase the heat dissipation effect when the LED 112 is turned on.

한편, 상기 회로기판(114)의 표면에는 진공장치를 이용하여 대전방지필름(120)을 흡착하는 경우 신속한 진공상태의 유지를 위해 다수의 통기공(116)을 형성함이 바람직하다.On the other hand, when adsorbing the antistatic film 120 by using a vacuum device on the surface of the circuit board 114, it is preferable to form a plurality of vent holes 116 to maintain a rapid vacuum state.

그리고, 상기 회로기판(114)의 표면에는 수지 접착제가 도포된 것을 사용할 수 있다. 이 경우 수지 접착제를 칩엘이디(112a)에도 도포할 수 있으나 조도가 낮아지는 것을 방지하기 위해 칩엘이디에는 수지 접착제를 도포하지 않음이 바람직하다.The resin substrate may be coated with a resin adhesive on the surface of the circuit board 114. In this case, the resin adhesive may be applied to the chip LEDs 112a, but it is preferable not to apply the resin adhesive to the chip LEDs in order to prevent the roughness from being lowered.

또한, 상기 대전방지필름(120)은 미크론 단위의 크기를 갖는 빛확산재를 더 혼합하여서 제조된 것을 사용함도 바람직하다.
In addition, the antistatic film 120 is preferably used by further mixing the light diffusion material having a size of the micron unit.

이하, 도 2를 참고로 본 발명에 따른 대전방지기능을 갖는 엘이디 조명기구의 제조과정을 설명한다.Hereinafter, the manufacturing process of the LED lighting device having an antistatic function according to the present invention with reference to FIG.

먼저 하나 이상의 엘이디(112)를 회로기판(114)의 표면에 납땜을 통해 일체로 부착하여 엘이디기판(110)을 제조한다.First, one or more LEDs 112 are integrally attached to the surface of the circuit board 114 by soldering to manufacture the LED substrate 110.

이와 같은 상태에서 도 2의 (a)에 도시된 바와 같이 엘이디(112)가 부착된 엘이디기판(110)의 표면에 대전방지필름(120)을 포개놓고 그 대전방지필름(120)의 상측에 히터(200)를 구비하여 대전방지필름(120)을 일정한 형상변형이 일어날 수 있도록 일정온도(필름에 따라 70 ~ 150℃의 온도범위)로 가열한다.In this state, as shown in FIG. 2A, the antistatic film 120 is stacked on the surface of the LED substrate 110 to which the LED 112 is attached, and the heater is placed on the antistatic film 120. It is provided with a 200 to heat the antistatic film 120 to a predetermined temperature (temperature range of 70 ~ 150 ℃ depending on the film) so that a certain shape deformation can occur.

이와 같이 대전방지필름(120)을 가열한 상태에서 도 2의 (b)에 도시된 바와 같이 엘이디기판(110)의 하부에 공지의 진공흡입장치(300)를 이용해 엘이디기판(110)의 표면에 형성된 다수의 통기공(116)을 통해 진공흡착하게 된다. As described above, the antistatic film 120 is heated in the lower portion of the LED substrate 110 as shown in FIG. 2B using a well-known vacuum suction device 300 on the surface of the LED substrate 110. The vacuum is sucked through a plurality of vents 116 formed.

상기 엘이디기판(110)의 통기공(116)을 통해 진공흡착을 하게 되면 도 2의 (c)에 도시된 바와 같이 대전방지필름(120)이 엘이디기판(110)의 표면에 완전 밀착되어 엘이디기판(110)의 일면을 감싸게 된다.When the vacuum adsorption is performed through the vent hole 116 of the LED substrate 110, the antistatic film 120 is completely adhered to the surface of the LED substrate 110 as shown in FIG. One surface of the 110 is wrapped.

특히 엘이디기판(110)의 통기공(116)으로 대전방지필름(120)의 일부가 빨려들어가 자리를 잡은 상태에서 냉각되면 엘이디(112)를 커버하는 상태를 유지할 수 있다.In particular, when the part of the antistatic film 120 is sucked into the vent hole 116 of the LED substrate 110 is cooled in the seated position can be maintained to cover the LED 112.

물론, 대전방지필름(120)의 강한 결합상태를 유지할 수 있도록 이와 같은 밀착상태에서 볼트 및 너트와 같은 체결수단(미도시됨)을 이용하여 고정함도 바람직하다.Of course, it is also preferable to fasten using fastening means (not shown) such as bolts and nuts in such a close state to maintain a strong bonding state of the antistatic film 120.

그리고, 도면으로 도시하지는 않았지만 상기 엘이디기판(110)의 표면에 대전방지필름(120)을 부착시킨 상태에서 엘이디기판(110)의 후면에 방열기능을 하는 알루미늄 재질의 방열판(미도시됨)을 밀착 고정함이 바람직하다.
Although not shown in the drawings, the heat dissipation plate (not shown) of aluminum material, which radiates heat to the rear surface of the LED substrate 110 in a state where the antistatic film 120 is attached to the surface of the LED substrate 110, is closely attached. It is preferable to fix it.

한편, 도 3은 본 발명에 따른 대전방지기능을 갖는 엘이디 조명기구의 다른 예를 도시한 도면이다.On the other hand, Figure 3 is a view showing another example of the LED lighting fixture having an antistatic function according to the present invention.

이는 도 3의 (a)에 도시된 바와 같이 하나 이상의 엘이디(112)가 회로기판(114)의 표면에 일체로 부착되는 엘이디기판(110)의 표면에 수지 접착제(124)를 도포하고, 그 표면에 대전방지필름(120)을 포개놓고 그 대전방지필름(120)의 상측에 히터를 구비하여 대전방지필름(120)을 일정한 형상변형이 일어날 수 있도록 일정온도(필름에 따라 70 ~ 150℃의 온도범위)로 가열한다.This is to apply a resin adhesive 124 to the surface of the LED substrate 110, the one or more LEDs 112 are integrally attached to the surface of the circuit board 114, as shown in Figure 3 (a), the surface The antistatic film 120 is superimposed on the antistatic film 120 and provided with a heater on the upper side of the antistatic film 120 so that a certain shape deformation can occur a certain temperature (temperature of 70 ~ 150 ℃ depending on the film Range).

이와 같이 대전방지필름(120)을 가열한 상태에서 도 3의 (b)에 도시된 바와 같이 엘이디기판(110)의 하부에 공지의 진공흡입장치(300)를 이용해 엘이디기판(110)의 표면에 형성된 다수의 통기공(116)을 통해 진공흡착하게 된다. Thus, the antistatic film 120 is heated to the surface of the LED substrate 110 using a well-known vacuum suction device 300 in the lower portion of the LED substrate 110 as shown in FIG. The vacuum is sucked through a plurality of vents 116 formed.

상기 엘이디기판(110)의 통기공(116)을 통해 진공흡착을 하게 되면 도 3의 (c)에 도시된 바와 같이 대전방지필름(120)이 엘이디기판(110)의 표면에 완전 밀착되는데, 이때 접착제(124)에 의해 엘이디기판(110)의 일면에 일체로 접합된다.
When the vacuum adsorption is performed through the vent hole 116 of the LED substrate 110, the antistatic film 120 is completely in contact with the surface of the LED substrate 110, as shown in (c) of FIG. The adhesive 124 is integrally bonded to one surface of the LED substrate 110.

이상의 설명에서와 같이 제조되는 조명기구는 도 4 내지 도 16에 도시된 바와 같은 다양한 등기구에 적용할 수 있다.The luminaire manufactured as described above may be applied to various luminaires as shown in FIGS. 4 to 16.

즉, 도 4의 (a)(b)는 본 발명에 따른 조명기구가 적용된 다운라이트형 LED등기구의 정면 및 측면를 도시한 도면이고, 도 5의 (a)(b)는 본 발명에 따른 조명기구가 적용된 쎈서용 LED등기구의 정면 및 측면를 도시한 도면이고, 도 6의 (a)(b)는 본 발명에 따른 조명기구가 적용된 고정형 LED등기구의 정면 및 측면를 도시한 도면이고, 도 7의 (a)(b)는 본 발명에 따른 조명기구가 적용된 거실용 LED등기구의 정면 및 측면를 도시한 도면이고, 도 8의 (a)(b)는 본 발명에 따른 조명기구가 적용된 매입형 LED등기구의 정면 및 측면를 도시한 도면이고, 도 9의 (a)(b)는 본 발명에 따른 조명기구가 적용된 고정형 LED등기구의 정면 및 측면를 도시한 도면이고, 도 10의 (a)(b)는 본 발명에 따른 조명기구가 적용된 컨버터 내장형 LED램프의 정면 및 측면를 도시한 도면이고, 도 11의 (a)(b)는 본 발명에 따른 조명기구가 적용된 컨버터 외장형 LED램프의 정면 및 측면를 도시한 도면이고, 도 12의 (a)(b)는 본 발명에 따른 조명기구가 적용된 터널용 LED등기구의 정면 및 측면를 도시한 도면이고, 도 13의 (a)(b)는 본 발명에 따른 조명기구가 적용된 보안등용 LED등기구의 정면 및 측면를 도시한 도면이고, 도 14의 (a)(b)는 본 발명에 따른 조명기구가 적용된 가로등용 LED등기구의 정면 및 측면를 도시한 도면이고, 도 15는 본 발명에 따른 조명기구가 적용된 확산형 컨버터 내장형 LED램프를 도시한 도면이고, 도 16은 본 발명에 따른 조명기구가 적용된 확산형 컨버터 LED램프를 도시한 도면이다.
That is, Figure 4 (a) (b) is a view showing the front and side of the downlight type LED light fixture to which the luminaire according to the invention is applied, Figure 5 (a) (b) is a luminaire according to the present invention Figure 6 is a view showing the front and side of the LED light fixture for application, Figure 6 (a) (b) is a view showing the front and side of the fixed LED light fixture to which the luminaire according to the invention is applied, Figure 7 (a (b) is a view showing the front and side of the LED lighting fixture for the living room to which the luminaire according to the present invention is applied, Figure 8 (a) (b) is the front of the recessed type LED luminaire to which the luminaire according to the present invention is applied And (a) and (b) of FIG. 9 are views showing the front and side surfaces of the fixed LED light fixture to which the luminaire according to the present invention is applied, and (a) and (b) of FIG. The front and side views of the converter-equipped LED lamp to which the luminaire according to the present invention is applied, Figure 11 (a) (b) is The front and side views of the converter external LED lamp to which the luminaire according to the present invention is applied, Figure 12 (a) (b) is a view showing the front and side of the tunnel LED luminaire to which the luminaire according to the present invention is applied And, Figure 13 (a) (b) is a view showing the front and side of the LED light fixture for the security light applied to the luminaire according to the present invention, Figure 14 (a) (b) is a luminaire according to the present invention Figure is a view showing the front and side of the applied LED lamp for street light, Figure 15 is a view showing a diffused converter built-in LED lamp to which the luminaire according to the invention is applied, Figure 16 is a diffused type to which the luminaire according to the present invention is applied The figure shows the converter LED lamp.

이상과 같이 본 발명의 실시 예에 대하여 상세히 설명하였으나, 본 발명의 권리범위는 이에 한정되지 않으며, 본 발명의 실시 예와 실질적으로 균등의 범위에 있는 것까지 본 발명의 권리범위가 미친다.
As described above, embodiments of the present invention have been described in detail, but the scope of the present invention is not limited thereto, and the scope of the present invention extends to the range substantially equivalent to the embodiments of the present invention.

100: 엘이디 조명기구 110: 엘이디기판
112: 엘이디 114: 회로기판
120: 대전방지필름100: LED lighting fixtures 110: LED substrate
112: LED 114: circuit board
120: antistatic film

Claims (6)

하나 이상의 엘이디(112)가 회로기판(114)의 표면에 일체로 부착되는 가열된 상태의 대전방지필름(120)을 포개놓고 엘이디기판(110)의 하부에서 진공흡착하여 엘이디기판(110)의 표면에 대전방지필름(120)을 밀착시켜서 이루어지며;
상기 대전방지필름(120)은 미크론 단위의 크기를 갖는 빛확산재를 더 혼합하여서 제조되며,
상기 회로기판(114)의 표면에는 수지 접착제가 더 도포된 것을 특징으로 하는 대전방지기능을 갖는 엘이디 조명기구.
The surface of the LED substrate 110 is formed by placing the antistatic film 120 in a heated state in which one or more LEDs 112 are integrally attached to the surface of the circuit board 114 and vacuum-absorbing the lower portion of the LED substrate 110. It is made by bringing the antistatic film 120 in close contact with;
The antistatic film 120 is manufactured by further mixing the light diffusion material having a size of the micron unit,
LED lighting device having an antistatic function, characterized in that the surface of the circuit board 114 is further coated with a resin adhesive.
삭제delete 삭제delete 하나 이상의 엘이디(112)가 회로기판(114)의 표면에 일체로 부착되는 엘이디기판(110)의 표면에 미크론 단위의 크기를 갖는 빛확산재가 혼합된 대전방지필름(120)을 포개놓고 그 대전방지필름(120)의 상측에 히터(200)를 구비하여 대전방지필름(120)을 일정한 형상변형이 일어날 수 있도록 일정온도로 가열하는 제1단계;
상기 대전방지필름(120)을 가열한 상태에서 엘이디기판(110)의 하부에 진공흡입장치(300)를 이용해 엘이디기판(110)의 표면에 형성된 다수의 통기공(116)을 통해 진공흡착하는 제2단계;로 구성되며,
상기 제1단계 이전에, 상기 회로기판(114)의 표면에 수지 접착제(124)를 도포하는 제3단계;를 더 포함하는 것을 특징으로 하는 대전방지기능을 갖는 엘이디 조명기구의 제조방법.
At least one LED 112 is integrally attached to the surface of the circuit board 114, the antistatic film 120 mixed with a light diffusing material having a size of a micron unit is stacked on the surface of the LED substrate 110 and the antistatic A first step of heating the antistatic film 120 to a predetermined temperature to provide a constant shape deformation by providing a heater 200 above the film 120;
The agent for vacuum adsorption through a plurality of vent holes 116 formed on the surface of the LED substrate 110 using the vacuum suction device 300 in the lower portion of the LED substrate 110 in the state in which the antistatic film 120 is heated. Consists of two steps;
Before the first step, the third step of applying a resin adhesive (124) on the surface of the circuit board 114; manufacturing method of the LED lighting device having an antistatic function further comprising.
삭제delete 삭제delete
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KR20190026197A (en) * 2017-09-04 2019-03-13 미미라이팅주식회사 Led lighting apparatus with indirect lighting type
KR102020984B1 (en) * 2017-09-04 2019-11-04 미미라이팅주식회사 Led lighting apparatus with indirect lighting type
CN111156232A (en) * 2020-01-15 2020-05-15 邵小祥 A bonding device for LED light source module and base
CN111156232B (en) * 2020-01-15 2021-05-21 赣州市云霞电子科技有限公司 A bonding device for LED light source module and base
KR102220869B1 (en) 2020-09-25 2021-03-02 주식회사 천일 LED lights for prevent dust Deposition

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