TWI396808B - Led lamp - Google Patents
Led lamp Download PDFInfo
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- TWI396808B TWI396808B TW97122097A TW97122097A TWI396808B TW I396808 B TWI396808 B TW I396808B TW 97122097 A TW97122097 A TW 97122097A TW 97122097 A TW97122097 A TW 97122097A TW I396808 B TWI396808 B TW I396808B
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Description
本發明涉及一種照明裝置,特別係指一種發光二極體燈具。 The invention relates to a lighting device, in particular to a light-emitting diode lamp.
發光二極體作為一種高效之發光源,具有環保、亮度高、省電、壽命長等諸多特點已經被廣泛之運用於各種領域,如用作壁燈等照明設備。但是,應用發光二極體之壁燈體積往往較小,其發光二極體工作時會產生大量熱量,該熱量如若得不到及時散發,容易使發光二極體產生過熱現象,進而導致其發光效率下降。因此如何對發光二極體燈具之散熱也是業界非常重視之問題。 As a highly efficient light source, the light-emitting diode has many characteristics such as environmental protection, high brightness, power saving, long life and the like, and has been widely used in various fields, such as lighting equipment such as wall lamps. However, the wall lamp using the light-emitting diode is often small in volume, and a large amount of heat is generated when the light-emitting diode works. If the heat is not released in time, the light-emitting diode is easily overheated, which leads to luminous efficiency. decline. Therefore, how to heat the LEDs of the LEDs is also a problem that the industry attaches great importance to.
有鑒於此,有必要提供一種具有較佳散熱性能之發光二極體燈具。 In view of this, it is necessary to provide a light-emitting diode lamp having better heat dissipation performance.
一種發光二極體燈具,包括一散熱器、一貼設於該散熱器上方之發光二極體模組、一安裝於該散熱器上並且將發光二極體模組罩設於其內之燈罩,該散熱器包括一基座、一自基座底面中部向下垂直延伸之導熱筒以及形成於該基座底部且環繞該導熱筒之複數散熱鰭片,該等散熱鰭片自該導熱筒之外壁放射性延伸,該發光二極體模組貼置於基座頂面與導熱筒對應之位置處。 A light-emitting diode lamp includes a heat sink, a light-emitting diode module attached to the heat sink, and a lamp cover mounted on the heat sink and covering the light-emitting diode module therein The heat sink includes a base, a heat-conducting tube extending vertically downward from a central portion of the bottom surface of the base, and a plurality of heat-dissipating fins formed at the bottom of the base and surrounding the heat-conducting tube. The heat-dissipating fins are from the heat-dissipating tube The outer wall is radially extended, and the light emitting diode module is placed at a position corresponding to the top surface of the base and the heat conducting tube.
本發明發光二極體燈具藉由基座及散熱鰭片之作用,很好地散除發光二極體產生之熱量,且散熱器結構簡單,易於製造,可有效降低發光二極體燈具之成本。 The light-emitting diode lamp of the invention can dissipate the heat generated by the light-emitting diode by the action of the base and the heat-dissipating fin, and the heat sink has a simple structure and is easy to manufacture, and can effectively reduce the cost of the light-emitting diode lamp. .
如圖1及圖2所示,為本發明發光二極體燈具之較佳實施例,為一安裝於牆壁上之壁燈,主要包括一發光二極體模組10、一用以貼設並冷卻該發光二極體模組10之散熱器20、一安裝在散熱器20上並將發光二極體模組10罩設其內之燈罩30及將散熱器20及燈罩30罩設於其內之前蓋40。該發光二極體燈具還包括一圍設於燈罩30底部邊緣之防水墊圈50、一用於將燈罩30及防水墊圈50固定在散熱器20之壓環60、以及安裝於散熱器20內之電源驅動模組70。 As shown in FIG. 1 and FIG. 2 , a preferred embodiment of the light-emitting diode lamp of the present invention is a wall lamp mounted on a wall, which mainly includes a light-emitting diode module 10 for attaching and cooling The heat sink 20 of the LED module 10, a lamp cover 30 mounted on the heat sink 20 and covering the LED module 10, and the heat sink 20 and the lamp cover 30 are disposed therein Cover 40. The light-emitting diode lamp further includes a waterproof gasket 50 surrounding the bottom edge of the lamp cover 30, a pressure ring 60 for fixing the lamp cover 30 and the waterproof gasket 50 to the heat sink 20, and a power source mounted in the heat sink 20. Drive module 70.
該發光二極體模組10包括一圓形電路板12及安裝於電路板12一側面之複數發光二極體14。該電路板12之另外一側面貼合於該散熱器20上。 The LED module 10 includes a circular circuit board 12 and a plurality of LEDs 14 mounted on one side of the circuit board 12. The other side of the circuit board 12 is attached to the heat sink 20.
請一併參閱圖3,該散熱器20包括一用於貼設該發光二極體模組10之圓形基座21及自基座21底面垂直向下延伸之複數散熱鰭片27。該基座21之頂面中部向上延伸一圓形凸台23。該凸台23與基座21之軸心相同,其直徑大小對應該電路板12之直徑以貼設發光二極體模組10。該基座21中心設置一通孔230,以供發光二極體模組10之電線穿過連接置於散熱器20底部之電源驅動模組70。該基座21之邊緣均勻垂直向上延伸三安裝柱25。基座21底部中間垂直延伸一與基座21同軸之導熱筒24,該導熱筒24之位置與設置發光二極體之基座21對應。該等散熱鰭片27垂直於基座21底面之同時環繞該導熱筒24,自該導熱筒24之外壁放射性延伸且不超出基座21之邊緣而置於基座21 邊緣內。該等散熱鰭片27相互間隔形成散熱通道270。每一散熱鰭片27中部設置一缺口,使得該等散熱鰭片27之缺口共同形成一圓形之溝槽275。該溝槽275垂直於連通該散熱通道270,以增加氣流流動之方向。二連接柱29自基座21垂直延伸並位於溝槽275上。該等連接柱29設有貫穿之安裝孔290以藉由複數固定件(圖未示)將整個散熱器20固定在牆壁上。 As shown in FIG. 3 , the heat sink 20 includes a circular base 21 for attaching the LED module 10 and a plurality of heat dissipation fins 27 extending vertically downward from the bottom surface of the base 21 . A circular boss 23 extends upward in the middle of the top surface of the base 21. The boss 23 is the same as the axis of the susceptor 21, and has a diameter corresponding to the diameter of the circuit board 12 to affix the LED module 10. A through hole 230 is defined in the center of the base 21 for the electric wire of the light emitting diode module 10 to pass through the power driving module 70 connected to the bottom of the heat sink 20. The edge of the base 21 extends evenly vertically upwards to the three mounting posts 25. A heat conducting tube 24 coaxially with the base 21 extends vertically in the middle of the bottom of the base 21, and the position of the heat conducting tube 24 corresponds to the base 21 on which the light emitting diode is disposed. The heat dissipating fins 27 surround the heat conducting tube 24 while being perpendicular to the bottom surface of the base 21, and extend radially from the outer wall of the heat conducting tube 24 and are placed on the base 21 without exceeding the edge of the base 21. Inside the edge. The heat dissipation fins 27 are spaced apart from each other to form a heat dissipation channel 270. A notch is formed in the middle of each of the heat dissipation fins 27 such that the notches of the heat dissipation fins 27 together form a circular groove 275. The trench 275 is perpendicular to the heat dissipation channel 270 to increase the direction of airflow. The two connecting posts 29 extend perpendicularly from the base 21 and are located on the grooves 275. The connecting posts 29 are provided with mounting holes 290 therethrough for securing the entire heat sink 20 to the wall by a plurality of fasteners (not shown).
電源驅動模組70收容於該導熱筒24中。一後蓋242安裝於該導熱筒24之底部以將電源驅動模組70封閉在導熱筒24中。該後蓋242中部設有一中心孔240,一護線套246卡設在後蓋242之中心孔240中,以防止從電源驅動模組70引出之電線被後蓋242刮傷。 The power drive module 70 is received in the heat transfer tube 24 . A rear cover 242 is mounted to the bottom of the heat conducting tube 24 to enclose the power drive module 70 in the heat conducting tube 24. A central hole 240 is defined in the middle of the rear cover 242. A retaining sleeve 246 is disposed in the central hole 240 of the rear cover 242 to prevent the electric wire drawn from the power driving module 70 from being scratched by the rear cover 242.
燈罩30用透明或半透明材料製成,如玻璃等,使得從發光二極體14發出之光透過燈罩30。該燈罩30呈一倒置之碗狀,其底部延伸有環狀凸緣33,該凸緣33外徑尺寸小於基座21頂面之尺寸,並使得該燈罩30安裝在基座21上以後凸緣33置於固定柱25之內側。該燈罩30用以保護置於其內之發光二級管模組10,避免灰塵進入發光二極體模組10,影響發光二極體14之工作。 The globe 30 is made of a transparent or translucent material such as glass or the like so that light emitted from the LEDs 14 passes through the globe 30. The lamp cover 30 has an inverted bowl shape, and an annular flange 33 is extended at the bottom thereof. The outer diameter of the flange 33 is smaller than the top surface of the base 21, and the lamp cover 30 is mounted on the base 21 and then flanged. 33 is placed inside the fixed column 25. The lamp cover 30 is used to protect the LED module 10 disposed therein to prevent dust from entering the LED module 10 and affecting the operation of the LEDs 14.
該防水墊圈50套設在該燈罩30底部之凸緣33以加強發光二極體燈具之密封性,以實現防水和防塵。該防水墊圈50由具有彈性之材料如橡膠組成,呈環狀設置。該防水墊圈50之內壁設有環槽55,該環槽55之大小與燈罩30之凸緣33大小匹配,使得防水墊圈50將整個凸緣33圍設其內。該壓環60包括一環狀之抵靠部61及自抵靠部61向外 延伸之三定位部62。該抵靠部61之大小與防水墊圈50之大小對應;定位部62與散熱器20之固定柱25對應。 The waterproof gasket 50 is sleeved on the flange 33 at the bottom of the lampshade 30 to enhance the sealing of the light-emitting diode lamp to achieve waterproof and dustproof. The waterproof gasket 50 is composed of a material having elasticity such as rubber and is provided in a ring shape. The inner wall of the waterproof gasket 50 is provided with a ring groove 55 which is sized to match the size of the flange 33 of the lamp cover 30 such that the waterproof gasket 50 encloses the entire flange 33 therein. The pressure ring 60 includes an annular abutting portion 61 and an outward abutting portion 61 The three positioning portions 62 are extended. The size of the abutting portion 61 corresponds to the size of the waterproof gasket 50; the positioning portion 62 corresponds to the fixing post 25 of the heat sink 20.
前蓋40包括一圓環狀之本體42及自本體42向下延伸之側壁41。該本體42均勻向下延伸三連接柱420以對應散熱器20之安裝柱25。該等連接柱420兩側設有複數加強肋425以連接本體42與邊框41並增加固定連接柱420之強度。該本體42向內延伸有一半圓形之遮光板43,使得本體42頂部形成與遮光板43對應之半圓形透光孔44。本體42與遮光板43整體向上稍凸,以對應燈罩30。 The front cover 40 includes an annular body 42 and side walls 41 extending downward from the body 42. The body 42 extends the three connecting posts 420 uniformly downward to correspond to the mounting posts 25 of the heat sink 20 . A plurality of reinforcing ribs 425 are disposed on both sides of the connecting post 420 to connect the body 42 and the frame 41 and increase the strength of the fixed connecting post 420. The body 42 extends inwardly with a semi-circular light-shielding plate 43 such that a semi-circular light-transmissive hole 44 corresponding to the light-shielding plate 43 is formed at the top of the body 42. The body 42 and the light shielding plate 43 are slightly convex upward to correspond to the lamp cover 30.
請一併參閱圖4,該發光二極體燈具組裝時,先將發光二極體模組10固定在散熱器20之基座21上,同時將電源驅動模組70固定在散熱器20之導熱筒24中,藉由後蓋242將其封閉;然後,將防水墊圈50套設在該燈罩30之凸緣33一併放置在基座21上,將壓環60壓在防水墊圈50上方;最後,將前蓋40罩設散熱器20之基座21、發光二極體模組10以及燈罩30,螺釘80穿過前蓋40之連接柱420、壓環60之定位部62進而螺合在散熱器20之安裝柱25中。其中,前蓋40之側壁41超過基座21將散熱鰭片27之上部分圍設。此時,整個發光二極體燈具完成安裝。 Referring to FIG. 4 together, when the LED package is assembled, the LED module 10 is first fixed on the base 21 of the heat sink 20, and the power drive module 70 is fixed to the heat transfer of the heat sink 20. The sleeve 24 is closed by the rear cover 242; then, the waterproof gasket 50 is sleeved on the flange 33 of the lamp cover 30 and placed on the base 21 to press the pressure ring 60 over the waterproof gasket 50; The front cover 40 is covered with the base 21 of the heat sink 20, the light-emitting diode module 10, and the lamp cover 30. The screw 80 passes through the connecting post 420 of the front cover 40 and the positioning portion 62 of the pressure ring 60 to be screwed together for heat dissipation. The mounting of the device 20 is in the column 25. Wherein, the side wall 41 of the front cover 40 surrounds the base 21 to enclose the upper portion of the heat dissipation fin 27 . At this point, the entire light-emitting diode lamp is installed.
發光二極體燈具工作時,發光二極體14發出之光線透過燈罩30以及前蓋40之透光孔44照射出去。由於前蓋40之遮光板43之作用,使得發光二極體燈具照射出來之光線可以根據實際需要朝向一側,例如該發光二極體燈具安裝在牆壁較高處時,遮光板43位於上側使得光線朝下;發光二極體燈具安裝在牆壁較低處時,遮光板43位於下 側使得光線朝上照射,減少對人之眼睛之直射。當該發光二極體燈具安裝在天花板上朝下照射時,遮光板43可以去掉,起全面照射之作用。散熱器20可對發光二極體模組10進行散熱,以保證發光二極體模組10處於正常之工作溫度範圍內,且散熱器20結構簡單,易於製造,可有效降低發光二極體燈具之成本。另外,前蓋40之側壁41將置於發光二極體燈具底部之散熱器20之散熱鰭片27部分圍住,在不影響散熱器20之散熱性能之同時很好地保護了散熱鰭片27。 When the illuminating diode lamp is in operation, the light emitted by the illuminating diode 14 is radiated through the lamp cover 30 and the light transmission hole 44 of the front cover 40. Due to the function of the visor 43 of the front cover 40, the light emitted by the illuminating diode lamp can be directed to one side according to actual needs. For example, when the illuminating diode lamp is installed at a higher position of the wall, the visor 43 is located on the upper side. The light is facing downwards; when the light-emitting diode lamp is installed at a lower part of the wall, the light shielding plate 43 is located below The side illuminates the light upwards, reducing direct exposure to the human eye. When the light-emitting diode lamp is mounted on the ceiling and irradiated downward, the light shielding plate 43 can be removed to function as a full illumination. The heat sink 20 can dissipate heat from the LED module 10 to ensure that the LED module 10 is in a normal operating temperature range, and the heat sink 20 has a simple structure and is easy to manufacture, and can effectively reduce the LED lamp. The cost. In addition, the side wall 41 of the front cover 40 partially encloses the heat dissipation fins 27 of the heat sink 20 disposed at the bottom of the light emitting diode lamp, and the heat dissipation fins 27 are well protected without affecting the heat dissipation performance of the heat sink 20. .
綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,舉凡熟悉本案技藝之人士,在爰依本發明精神所作之等效修飾或變化,皆應涵蓋於以下之申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
10‧‧‧發光二極體模組 10‧‧‧Lighting diode module
12‧‧‧電路板 12‧‧‧ boards
14‧‧‧發光二極體 14‧‧‧Lighting diode
20‧‧‧散熱器 20‧‧‧ radiator
21‧‧‧基座 21‧‧‧Base
23‧‧‧凸台 23‧‧‧Boss
230‧‧‧通孔 230‧‧‧through hole
24‧‧‧導熱筒 24‧‧‧thermal tube
240‧‧‧中心孔 240‧‧‧ center hole
242‧‧‧後蓋 242‧‧‧Back cover
246‧‧‧護線套 246‧‧‧ Guarding sleeve
25‧‧‧固定柱 25‧‧‧Fixed column
27‧‧‧散熱鰭片 27‧‧‧ Heat sink fins
270‧‧‧散熱通道 270‧‧‧heating channel
275‧‧‧溝槽 275‧‧‧ trench
29‧‧‧連接柱 29‧‧‧Connecting column
290‧‧‧安裝孔 290‧‧‧ mounting holes
30‧‧‧燈罩 30‧‧‧shade
33‧‧‧凸緣 33‧‧‧Flange
40‧‧‧前蓋 40‧‧‧ front cover
41‧‧‧側壁 41‧‧‧ side wall
42‧‧‧本體 42‧‧‧Ontology
420‧‧‧連接柱 420‧‧‧Connecting column
425‧‧‧加強肋 425‧‧‧Strengthened ribs
43‧‧‧遮光板 43‧‧ ‧ visor
44‧‧‧透光孔 44‧‧‧Light hole
50‧‧‧防水墊圈 50‧‧‧Waterproof gasket
55‧‧‧環槽 55‧‧‧ Ring groove
60‧‧‧壓環 60‧‧‧pressure ring
61‧‧‧抵靠部 61‧‧‧Abutment
62‧‧‧定位部 62‧‧‧ Positioning Department
70‧‧‧電源驅動模組 70‧‧‧Power Driver Module
80‧‧‧螺釘 80‧‧‧ screws
圖1係本發明發光二極體燈具之組裝圖。 1 is an assembled view of a light-emitting diode lamp of the present invention.
圖2係圖1中發光二極體燈具之立體分解圖。 2 is an exploded perspective view of the light-emitting diode lamp of FIG. 1.
圖3係圖2中發光二極體燈具之倒置圖。 3 is an inverted view of the light-emitting diode lamp of FIG. 2.
圖4係圖1中發光二極體燈具沿IV-IV線之剖視圖。 4 is a cross-sectional view of the light-emitting diode lamp of FIG. 1 taken along line IV-IV.
10‧‧‧發光二極體模組 10‧‧‧Lighting diode module
12‧‧‧電路板 12‧‧‧ boards
14‧‧‧發光二極體 14‧‧‧Lighting diode
20‧‧‧散熱器 20‧‧‧ radiator
21‧‧‧基座 21‧‧‧Base
23‧‧‧凸台 23‧‧‧Boss
230‧‧‧通孔 230‧‧‧through hole
240‧‧‧中心孔 240‧‧‧ center hole
242‧‧‧後蓋 242‧‧‧Back cover
246‧‧‧護線套 246‧‧‧ Guarding sleeve
25‧‧‧固定柱 25‧‧‧Fixed column
27‧‧‧散熱鰭片 27‧‧‧ Heat sink fins
30‧‧‧燈罩 30‧‧‧shade
33‧‧‧凸緣 33‧‧‧Flange
40‧‧‧前蓋 40‧‧‧ front cover
41‧‧‧側壁 41‧‧‧ side wall
42‧‧‧本體 42‧‧‧Ontology
420‧‧‧連接柱 420‧‧‧Connecting column
43‧‧‧遮光板 43‧‧ ‧ visor
44‧‧‧透光孔 44‧‧‧Light hole
50‧‧‧防水墊圈 50‧‧‧Waterproof gasket
55‧‧‧環槽 55‧‧‧ Ring groove
60‧‧‧壓環 60‧‧‧pressure ring
61‧‧‧抵靠部 61‧‧‧Abutment
62‧‧‧定位部 62‧‧‧ Positioning Department
70‧‧‧電源驅動模組 70‧‧‧Power Driver Module
80‧‧‧螺釘 80‧‧‧ screws
Claims (7)
Priority Applications (1)
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TW97122097A TWI396808B (en) | 2008-06-13 | 2008-06-13 | Led lamp |
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TW97122097A TWI396808B (en) | 2008-06-13 | 2008-06-13 | Led lamp |
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TW200951362A TW200951362A (en) | 2009-12-16 |
TWI396808B true TWI396808B (en) | 2013-05-21 |
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TW97122097A TWI396808B (en) | 2008-06-13 | 2008-06-13 | Led lamp |
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TW (1) | TWI396808B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US8240887B2 (en) * | 2010-08-27 | 2012-08-14 | Tyco Electronics Corporation | LED light module |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM304736U (en) * | 2006-07-06 | 2007-01-11 | Augux Co Ltd | Illuminating source structure for heat dissipation type LED signal lamp |
TW200733421A (en) * | 2006-02-27 | 2007-09-01 | gui-fang Chen | Lighting device with light emitting diode |
TWM325433U (en) * | 2007-07-20 | 2008-01-11 | Augux Co Ltd | LED lighting apparatus |
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2008
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200733421A (en) * | 2006-02-27 | 2007-09-01 | gui-fang Chen | Lighting device with light emitting diode |
TWM304736U (en) * | 2006-07-06 | 2007-01-11 | Augux Co Ltd | Illuminating source structure for heat dissipation type LED signal lamp |
TWM325433U (en) * | 2007-07-20 | 2008-01-11 | Augux Co Ltd | LED lighting apparatus |
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TW200951362A (en) | 2009-12-16 |
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MM4A | Annulment or lapse of patent due to non-payment of fees |