TWM455209U - Touch panel - Google Patents

Abstract

A touch panel is provided. The touch panel includes a substrate, a first conductive layer, a first insulating layer and a second conductive layer. The first conductive layer is disposed on the substrate. The first insulating layer is disposed on the first conductive layer, and the first conductive layer is located betweeen the first insulating layer and the substrate. The second conductive layer is disposed on the first insulating layer, and the first insulating layer is located betweeen the second conductive layer and the first conductive layer, wherein a material of the second conductive layer is nano silver.

Description

Touch panel

This creation is related to a panel, and in particular to a touch panel.

With the rapid development and application of information technology, wireless mobile communication and information appliances, many information products have been transformed from traditional keyboards or mouse input devices to use for the convenience of portability, light weight and user-friendly operation. Touch the panel as an input device.

Currently, touch panels can be roughly classified into resistive, capacitive, infrared, and ultrasonic touch panels. Among them, resistive touch panels and capacitive touch panels are the most common products. In the case of a capacitive touch panel, the multi-touch feature provides a more user-friendly operation mode, and the capacitive touch panel is favored by the market.

In general, a capacitive touch panel detects a touch position of a finger or a conductive object by a change in a capacitance value caused by a user touching a capacitive touch panel through a finger or a conductive object. Further, the capacitive touch panel generally has a first conductive layer and a second conductive layer that are electrically insulated from each other. When the user does not touch the touch panel, there is an initial value of capacitance between the conductive layers. When the user touches the touch panel, a change in the capacitance value occurs between the conductive layers, thereby changing the original capacitance initial value. At this time, it is possible to determine the position touched by the user by discriminating the position of the changed capacitance value.

Currently, touch panels on the market are mostly indium tin oxide (Indium). Tin Oxide, ITO) is used as the material of the first conductive layer and the second conductive layer. However, indium is a rare substance, and its price is relatively expensive in addition to being easily limited by the place of production. The price of the touch panel cannot be reduced, which is unfavorable for commercial competition.

The present invention provides a touch panel that has a relatively low process cost.

An embodiment of the present invention provides a touch panel including a substrate, a first conductive layer, a first insulating layer, and a second conductive layer. The first conductive layer is disposed on the substrate. The first insulating layer is disposed on the first conductive layer, and the first conductive layer is located between the first insulating layer and the substrate. The second conductive layer is disposed on the first insulating layer, and the first insulating layer is located between the second conductive layer and the first conductive layer, wherein the material of the second conductive layer is nano silver.

In an embodiment of the present invention, the material of the first conductive layer is a metal oxide, a nano silver, a carbon nanotube (CNT), a graphene or a polymer conductive material.

In an embodiment of the present invention, the material of the first insulating layer is an inorganic material, an organic material or a combination thereof.

In an embodiment of the present invention, the material of the first insulating layer is polyethylene (PE), polypropylene (PP), polystyrene (PS), polymethyl methacrylate (PMMA), polyvinyl chloride. (PVC), nylon (Nylon), polycarbonate (PC), polyurethane (PU), polytetrafluoroethylene (PTFE) or polyethylene terephthalate (PET).

In an embodiment of the present invention, the touch panel further includes a first adhesive layer between the first insulating layer and the first conductive layer.

In an embodiment of the present invention, the touch panel further includes a second insulating layer and a second adhesive layer. The second insulating layer is located between the first conductive layer and the substrate. The second adhesive layer is located between the second insulating layer and the substrate.

In an embodiment of the present invention, the material of the substrate is glass, quartz, organic polymer or polymer material.

In an embodiment of the present invention, the touch panel further includes a black matrix pattern disposed on the substrate, the substrate has a touch area and a peripheral area adjacent to the touch area, and the peripheral area is covered by the black matrix pattern. The control region is not covered by the black matrix pattern, and a portion of the black matrix pattern adjacent to one side of the touch region is located between the first conductive layer and the substrate.

In one embodiment of the present invention, the touch panel further includes a plurality of metal traces on the black matrix pattern and electrically connected to the first conductive layer or the second conductive layer.

In an embodiment of the present invention, the touch panel further includes a cover plate and a black matrix pattern. The cover plate is disposed opposite to the substrate. The black matrix pattern is located between the cover and the substrate. The substrate has a touch area and a peripheral area adjacent to the touch area, and the peripheral area is covered by the black matrix pattern, and the touch area is not covered by the black matrix pattern.

Based on the above, the present invention uses nano silver as the material of the second conductive layer. Because nano silver is relatively easy to obtain in materials, and the price is relatively low. Therefore, the touch panel of the present invention can have a relatively low process cost.

In order to make the above features and advantages of this creation more obvious, the following The embodiments are described in detail with reference to the accompanying drawings.

1A to FIG. 1C are schematic cross-sectional views showing a manufacturing process of a touch panel according to an embodiment of the present invention. Referring to FIG. 1A, a substrate 110 is provided. The material of the substrate 110 is, for example, a transparent material. Here, a transparent material generally refers to a material that generally has a high transmittance, and is not a material that defines a transmittance of 100%.

In addition, the substrate 110 may be a rigid substrate or a flexible substrate. In detail, the material of the substrate 110 may be glass, quartz, organic polymer, polymer material or other suitable material. The polymer material is, for example, polyethylene, polypropylene, polystyrene, polymethyl methacrylate, polyvinyl chloride, nylon, polycarbonate, polyurethane, polytetrafluoroethylene, polyethylene terephthalate or the like. The touch panel formed by applying the flexible substrate can have flexibility and is therefore suitable for application on a flexural surface or any flexible object that requires a touch function, such as a display panel.

A first conductive layer 120 is formed on the substrate 110. In this embodiment, the method of forming the first conductive layer 120 is, for example, forming a first conductive material (ie, a material of the first conductive layer 120) on the substrate 110, and patterning the first conductive material to form a first conductive layer. 120.

The material of the first conductive layer 120 is, for example, a transparent conductive material. In detail, the first conductive material 120a may be a metal oxide, a nano silver, a carbon nanotube, or a graphite or a conductive polymer. The metal oxide is, for example, tin gallium oxide, zinc oxide, zinc gallium oxide, indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, indium antimony zinc oxide, or selected from One of the group of metal oxides composed of titanium, zinc, zirconium, hafnium, indium, tin, aluminum, and antimony, or a stacked layer of at least two of the above.

In this embodiment, the material of the first conductive layer 120 is, for example, but not limited to, nano silver. Further, the method of forming nano silver on the substrate 110 may be direct coating or sputtering, evaporation, or the like. In other embodiments, the material of the first conductive layer 120 may also be a conductive material having high transmittance such as a metal oxide, a carbon nanotube or a polymer conductive material. The metal oxide is, for example, indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, indium antimony zinc oxide, or selected from the group consisting of titanium, zinc, zirconium, hafnium, indium, tin, aluminum, and antimony. One of the group of metal oxides formed by or the like, or a stacked layer of at least two of the above. Methods of forming the above materials on a substrate are known to those of ordinary skill in the art and will not be described again. In addition, the method of patterning the first conductive material includes, for example, a lithography process and an etching process, wherein the etching process may be a dry etching process, a wet etching process, or other processes suitable for patterning the first conductive material.

Referring to FIG. 1B , a first insulating layer 130 is formed on the first conductive layer 120 , wherein the first conductive layer 120 is located between the first insulating layer 130 and the substrate 110 . In this embodiment, the material of the first insulating layer 130 may be an inorganic material, an organic material, or a combination thereof. The inorganic material is, for example, ruthenium oxide, tantalum nitride, ruthenium oxynitride, ruthenium aluminum oxide or a stacked layer of at least two of the above materials. Of course, any material that can provide insulating properties can be selectively applied to the present embodiment to fabricate the first insulating layer 130.

Referring to FIG. 1C, a second conductive layer 140 is formed on the first insulating layer 130, wherein the first insulating layer 130 is located on the second conductive layer 140 and the first conductive layer. Between the layers 120, the two are electrically insulated. The method of forming the second conductive layer 140 is, for example, forming a second conductive material (ie, a material of the second conductive layer 140) on the first insulating layer 130, and patterning the second conductive material to form the second conductive layer 140.

In this embodiment, the material of the second conductive layer 140 is nano silver. In addition, the method of forming nano silver on the first insulating layer 130 may be direct coating or sputtering, evaporation, or the like. In addition, the method of patterning the second conductive material includes, for example, a lithography process and an etching process, wherein the etching process may be a dry etching process, a wet etching process, or other processes suitable for patterning the first conductive material. After the second conductive layer 140 is formed, the touch panel 100 of the present embodiment is initially completed.

Compared to indium, nanosilver is relatively easy to obtain in materials and relatively inexpensive. Therefore, the touch panel 100 of the present embodiment can have a relatively low process cost by replacing the indium tin oxide with nano silver as the material of the second conductive layer 140 and/or the first conductive layer 120 of the present embodiment. In addition, the touch sensing structure formed by using the nano silver can improve the problem of poor coverage during the indium tin oxide sputtering process, and thus the yield of the touch panel 100 can be improved.

2A-2B are schematic cross-sectional views showing a manufacturing process of a touch panel according to another embodiment of the present invention. Referring to FIG. 2A and FIG. 2B , the touch panel 200 of the present embodiment has a similar structure and process steps as the touch panel 100 of FIG. 1C . The difference between the two is mainly in the method in which the first insulating layer and the second conductive layer are formed on the first conductive layer. In the embodiment, the first insulating layer 210 of the touch panel 200 is an insulating film. For example, the first insulating layer 210 may be made of polyethylene, polypropylene, polystyrene, polymethacrylic acid. A film formed of an insulating material such as methyl ester, polyvinyl chloride, nylon, polycarbonate, polyurethane, polytetrafluoroethylene or polyethylene terephthalate.

In addition, in order to form the insulating film (the first insulating layer 210) on the first conductive layer 120, the touch panel 200 of the present embodiment may further include the first adhesive layer 220 located on the first insulating layer 210 and the first conductive layer. Between layers 120. In detail, the manufacturing method of the touch panel 200 of the present embodiment includes, for example, the steps shown in FIGS. 1A, 2A, and 2B.

Referring to FIG. 1A, a first conductive layer 120 is formed on the substrate 110. For details, refer to the description of FIG. 1A, and details are not described herein again.

Referring to FIG. 2A, a second conductive layer 140 is formed on the first insulating layer 210 (insulating film), and a first adhesive layer 220 is formed on the surface of the first insulating layer 210 opposite to the second conductive layer 140. That is, the first adhesive layer 220 and the second conductive layer 140 are respectively located on opposite surfaces of the first insulating layer 210. In addition, the first adhesive layer 220 may be an Optical Clear Adhesive (OCA), a Pressure Sensitive Adhesive, or a Liquid Optically Clear Adhesive (LOCA). In the embodiment, the first adhesive layer 220 is, for example, an optical adhesive, and the first adhesive layer 220 is, for example, uniformly coated on the first insulating layer 210.

Referring to FIG. 2B , the first insulating layer 210 is fixed on the first conductive layer 140 through the first adhesive layer 220 . Thus, the touch panel 200 of the present embodiment is initially completed.

It should be noted that this embodiment does not limit the fabrication sequence of FIGS. 1A and 2A. In other embodiments, the order of fabrication of FIG. 1A and FIG. 2A may be The adjustment, or the steps of Figures 1A and 2A, can be performed simultaneously in different process chambers.

In this embodiment, indium tin oxide is replaced by nano silver as the material of the second conductive layer 140 and/or the first conductive layer 120. Therefore, the touch panel 200 of the present embodiment can have a relatively low process cost, and can improve the problem of poor coverage during the indium tin oxide sputtering process, and improve the yield of the touch panel 200.

3A-3B are schematic cross-sectional views showing a manufacturing process of a touch panel according to still another embodiment of the present invention. Referring to FIG. 3A and FIG. 3B , the touch panel 300 of the present embodiment has a similar structure and process steps as the touch panel 200 of FIG. 2B . The difference between the two is mainly in the method in which the first conductive layer is formed on the substrate. In addition, the touch panel 300 of the embodiment further includes a second insulating layer 310 and a second adhesive layer 320. The second insulating layer 310 is located between the first conductive layer 120 and the substrate 110. The second adhesive layer 320 is located between the second insulating layer 310 and the substrate 110.

In detail, the manufacturing method of the touch panel 300 of the present embodiment includes, for example, the steps shown in FIGS. 3A, 2A, and 3B. Referring to FIG. 3A, a first conductive layer 120 is formed on the second insulating layer 310. The second insulating layer 310 may be made of polyethylene, polypropylene, polystyrene, polymethyl methacrylate, polyvinyl chloride, nylon, polycarbonate, polyurethane, polytetrafluoroethylene or polyethylene terephthalate. A film formed by an insulating material. Further, a second adhesive layer 320 is formed on the second insulating layer 310 with respect to the surface of the first conductive layer 120. That is, the second adhesive layer 320 and the first conductive layer 120 are respectively located on opposite surfaces of the second insulating layer 310. In addition, the second adhesive layer 320 It can be optical glue, pressure sensitive glue or UV water glue. In the present embodiment, the second adhesive layer 320 is, for example, an optical adhesive, and the second adhesive layer 320 is, for example, uniformly coated on the second insulating layer 310, so that the first conductive layer 120 is transmitted through the second adhesive layer 320. It is fixed on the substrate 110.

Referring to FIG. 2A, a first adhesive layer 220 and a second conductive layer 140 are formed on opposite surfaces of the first insulating layer 210. The specific content can be referred to the corresponding description of FIG. 2A, and details are not described herein again.

Referring to FIG. 3A, the second conductive layer 140 is fixed to the first conductive layer 120 through the first adhesive layer 220. Thus, the touch panel 300 of the present embodiment is initially completed.

It should be noted that this embodiment does not limit the production sequence of FIG. 3A and FIG. 2A. In other embodiments, the fabrication sequence of Figures 3A and 2A can be reversed, or the steps of Figures 3A and 2A can be performed simultaneously in different process chambers.

In this embodiment, indium tin oxide is replaced by nano silver as the material of the second conductive layer 140 and/or the first conductive layer 120. Therefore, the touch panel 300 of the present embodiment can have a relatively low process cost, and can improve the problem of poor coverage during the indium tin oxide sputtering process, and improve the yield of the touch panel 300.

4 is a schematic top view of another embodiment of the present invention. For convenience of illustration, FIG. 4 omits a portion of the film layer (eg, an insulating layer) of the touch panel. Figure 5 is a cross-sectional view taken along line A-A' of Figure 4; Referring to FIG. 4 and FIG. 5 , the touch panel 400 of the present embodiment may adopt a stacked structure of the touch panels 100 , 200 , and 300 . In addition, the touch panel 400 of the embodiment may also include The black matrix pattern BM, the plurality of metal traces 410, and the plurality of pads 420 are included.

In detail, the substrate 110 has a touch area A1 and a peripheral area A2 adjacent to the touch area A1, and the peripheral area A2 is covered by the black matrix pattern BM, and the touch area A1 is not covered by the black matrix pattern BM. The material of the black matrix pattern BM may include a resin, a metal, a metal oxide, or other suitable material having a good light-shielding effect and low reflection characteristics.

The first conductive layer 120 includes a plurality of first touch structures S1 located in the touch area A1, and the second conductive layer 140 includes a plurality of second touch structures S2 located in the touch area A1. In this embodiment, the first touch structures S1 extend, for example, in the direction X and are arranged in a direction Y perpendicular to the direction X, and the second touch structures S2 extend, for example, along the direction Y, and along the direction X. arrangement. The present invention does not need to define the shape or arrangement of the first touch structure S1 and the second touch structure S2. For example, the first touch structure S1 and the second touch structure S2 may be staggered with strip electrodes or a sensing structure as shown in FIG. 4 .

Further, the first touch structure S1 of the embodiment includes a plurality of diamond-shaped sensing pads 122 and a plurality of connecting portions 124, wherein the connecting portion 124 connects the adjacent two sensing pads 122, and each of the first touches The control structure S1 includes a connection portion 124 extending from the touch area A1 to the peripheral area A2. The second touch structure S2 includes a plurality of diamond-shaped sensing pads 142 and a plurality of connecting portions 144, wherein the connecting portion 144 is connected to the two adjacent sensing pads 142, and each of the second touch structures S2 includes a touch The area A1 extends to the connection portion 144 of the peripheral area A2. The connecting portion 124 and the connecting portion 144 are staggered with each other and electrically insulated from each other by the first insulating layer (not shown). In other words, before The first insulating layer (for example, the first insulating layer 130) is located at least between the connecting portion 124 and the connecting portion 144.

In this embodiment, the pad 420 is fabricated at the same time as the first touch structure S1 or the second touch structure S2. That is, the pad 420 may be the same as the first touch structure S1, and thus the pad 420 may be when the first conductive material (ie, the material of the first conductive layer 120) is patterned. A touch structure S1 is simultaneously fabricated. Alternatively, the pad 420 may belong to the second conductive layer 140 as the second touch structure S2. Thus, the pad 420 may be when the second conductive material (ie, the material of the second conductive layer 140) is patterned. The two touch structures S2 are simultaneously fabricated.

The metal trace 410 is formed, for example, after the second conductive layer 140 is formed. In addition, the metal traces 410 may be formed by sputtering and etching, or the metal traces 410 may be formed by screen printing.

One end of each metal trace 410 extends from the black matrix pattern BM to one of the pads 420, and the other end of each metal trace 410 extends from the black matrix pattern BM to one of the connections 124 extending to the peripheral area A2 or extending. To the connection portion 144 of the peripheral area A2, wherein the end portion of the connection portion 124 extending to the peripheral area A2 (or the end portion of the connection portion 144 extending to the peripheral area A2) is located at the corresponding metal trace 410 and the black matrix pattern Between BM (as shown in Figure 5). In other words, a portion of the metal traces 410 electrically connect the first touch structure S1 and the pads 420, and a portion of the metal traces 410 electrically connect the second touch structure S2 to the pads 420. Therefore, a flexible circuit board or a chip (not shown) soldered to the pad 420 can be transferred or connected. The signals from the first touch structure S1 and the second touch structure S2 are received, and the position of the touched by the user is determined by determining the position of the changed capacitance value. In the present embodiment, these metal traces 410 are disposed in the peripheral region A2. Therefore, the black matrix pattern BM can shield the opaque metal traces 410, and the user can directly see the lines in the peripheral area A2, thereby increasing the aesthetics of the touch panel 400.

In the present embodiment, the black matrix pattern BM is formed, for example, in front of the first conductive layer 120. That is to say, before the first conductive layer 120 is formed on the substrate 110, the black matrix pattern BM is further formed on the substrate 110.

In other embodiments, as shown in FIG. 6A to FIG. 6C , the touch panel may further include a cover plate 150 and a third adhesive layer 160 , wherein the black matrix pattern BM is located between the cover plate 150 and the substrate 110 . In the embodiment of FIG. 6A to FIG. 6C, the substrate 110 is located between the second conductive layer 140 and the cover 150, that is, the touch element (including the first conductive layer 120 and the second conductive layer 140) and the black matrix pattern. The BM is located on opposite sides of the substrate 110, but the present creation is not limited thereto. In other embodiments not shown, the touch elements (including the first conductive layer 120 and the second conductive layer 140) and the black matrix pattern BM may also be located on the same side of the substrate 110.

The material of the cover plate 150 may be glass, quartz, a polymer material or other suitable material. The polymer material is, for example, polyethylene, polypropylene, polystyrene, polymethyl methacrylate, polyvinyl chloride, nylon, polycarbonate, polyurethane, polytetrafluoroethylene, polyethylene terephthalate, polyfluorene. Materials such as imine or acrylic resin. When the cover 150 and the substrate 110 are applied to the flexible substrate, the formed touch panel can have flexibility, because It is suitable for use on flexible surfaces or any flexible object that requires touch function. The third adhesive layer 160 may be an optical glue, a pressure sensitive adhesive or an ultraviolet water gel.

In detail, the black matrix pattern BM may be formed on the cap plate 150, and the cap plate on which the black matrix pattern BM is formed through the third adhesive layer 160 and the first conductive layer 120 and the second conductive layer 140 are formed. The substrate 110 is bonded. In this way, it is avoided that the black matrix pattern is destroyed by the fluorine-based plasma during the etching process, particularly in the dry etching process, and is corroded or surface-embedded. Therefore, the touch panel of the embodiment of FIG. 6A to FIG. 6C can select a more environmentally friendly dry etching process to pattern the first conductive material and the second conductive material. In this way, the waste liquid processing problem after the wet etching process can be solved while maintaining the integrity of the black matrix pattern BM.

In addition, by using a relatively thin substrate 110 or a relatively thin cover 150, such as a substrate 110 or a cover 150 having a thickness of less than 0.33, and preferably about 0.125 mm, the touch panel can be relatively thin. thickness. In addition, the substrate 110 and the cover plate 150 can be made of a flexible material, so that the flexibility of the touch panel can be improved, and the touch panel can be applied to a flexible surface or any touch function. Flex the object.

In summary, the creation uses nano silver as the material of the second conductive layer. Because nano silver is relatively easy to obtain in materials, and the price is relatively low. Therefore, this creation can produce a touch panel with a relatively low process cost.

Although the present disclosure has been disclosed in the above embodiments, it is not intended to limit the present creation, and any person having ordinary knowledge in the technical field does not take off. Within the spirit and scope of this creation, when some changes and refinements can be made, the scope of protection of this creation shall be subject to the definition of the scope of the patent application attached.

100, 200, 300, 400‧‧‧ touch panels

110‧‧‧Substrate

120‧‧‧First conductive layer

122, 142‧‧‧ Sense pads

124, 144‧‧‧ Connections

130, 210‧‧‧ first insulation

140‧‧‧Second conductive layer

150‧‧‧ cover

160‧‧‧ third adhesive layer

220‧‧‧First adhesive layer

310‧‧‧Second insulation

320‧‧‧Second Adhesive Layer

410‧‧‧Metal routing

420‧‧‧ pads

BM‧‧‧Black Matrix Pattern

A1‧‧‧ touch area

A2‧‧‧ surrounding area

S1‧‧‧ first touch structure

S2‧‧‧ second touch structure

X, Y‧‧ direction

A-A’‧‧‧ cut line

1A to FIG. 1C are schematic cross-sectional views showing a manufacturing process of a touch panel according to an embodiment of the present invention.

2A-2B are schematic cross-sectional views showing a manufacturing process of a touch panel according to another embodiment of the present invention.

3A-3B are schematic cross-sectional views showing a manufacturing process of a touch panel according to still another embodiment of the present invention.

4 is a top plan view of still another embodiment of the present invention.

Figure 5 is a cross-sectional view taken along line A-A' of Figure 4;

6A-6C are schematic cross-sectional views of other embodiments of the present invention.

100‧‧‧ touch panel

110‧‧‧Substrate

120‧‧‧First conductive layer

130‧‧‧First insulation

140‧‧‧Second conductive layer

Claims (10)

A touch panel includes: a substrate; a first conductive layer disposed on the substrate; a first insulating layer disposed on the first conductive layer, wherein the first conductive layer is located on the first insulating layer Between the substrates; and a second conductive layer disposed on the first insulating layer, and the first insulating layer is located between the second conductive layer and the first conductive layer, wherein a material of the second conductive layer For nano silver. The touch panel of claim 1, wherein the material of the first conductive layer is a metal oxide, a nano silver, a carbon nanotube, a graphene or a polymer conductive material. The touch panel of claim 1, wherein the material of the first insulating layer is an inorganic material, an organic material or a combination thereof. The touch panel of claim 1, wherein the first insulating layer is made of polyethylene, polypropylene, polystyrene, polymethyl methacrylate, polyvinyl chloride, nylon, polycarbonate, Polyurethane, polytetrafluoroethylene or polyethylene terephthalate. The touch panel of claim 4, further comprising: a first adhesive layer between the first insulating layer and the first conductive layer. The touch panel of claim 5, further comprising: a second insulating layer between the first conductive layer and the substrate; A second adhesive layer is between the second insulating layer and the substrate. The touch panel of claim 1, wherein the material of the substrate is glass, quartz, organic polymer or polymer material. The touch panel of claim 1, further comprising: a black matrix pattern disposed on the substrate, the substrate having a touch area and a peripheral area adjacent to the touch area, and the peripheral area Covered by the black matrix pattern, the touch area is not covered by the black matrix pattern, and a portion of the black matrix pattern adjacent to one side of the touch area is located between the first conductive layer and the substrate . The touch panel of claim 8, further comprising: a plurality of metal traces on the black matrix pattern and electrically connected to the first conductive layer or the second conductive layer. The touch panel of claim 1, further comprising: a cover plate disposed opposite to the substrate; and a black matrix pattern between the cover plate and the substrate, the substrate having a touch a control area and a peripheral area adjacent to the touch area, and the peripheral area is covered by the black matrix pattern, and the touch area is not covered by the black matrix pattern.