TWM455016U - Gas release device for film coating process - Google Patents

Description

Gas release device for coating process

This creation is related to the coating process, in particular to a gas release device for the coating process.

Briefly, the so-called vacuum coating is to put a material to be plated (for example, a substrate) into a vacuum chamber, and then heat a vapor deposition source (for example, selenium) to a state of vaporization and sublimation, so that the vapor deposition source gas adheres to A film is formed on the surface of the object to be plated.

However, in the current coating process, only the gas of the evaporation source can be self-adhered to the surface of the object to be plated, and in addition to being quite time consuming, the thickness of the film formed on the surface of the object to be plated is also likely to be uneven. The condition, in turn, affects the quality of the coating to be plated.

The main purpose of the present invention is to provide a gas release device for a coating process which can improve the uniformity of the film thickness to improve the quality of the coating process.

In order to achieve the above object, the gas release device of the present invention comprises a lower plate, a second intermediate plate, a first intermediate plate, and an upper plate. The second intermediate plate is stacked on the top surface of the lower plate, the first intermediate plate is stacked on the top surface of the second intermediate plate, and the upper plate is stacked on the top surface of the first intermediate plate, wherein: the upper plate has a through hole through the top and bottom sides and a connection a distribution groove at a bottom end of the air hole; the first intermediate plate has a first top surface groove, the first top surface groove is engaged with the distribution groove of the upper plate and is connected with at least two first distribution holes penetrating the top and bottom sides Each of the first distribution holes is connected to a first bottom surface groove; the second intermediate plate has at least two second top surface grooves, and each of the second top surface grooves is coupled to the first bottom surface of the first intermediate plate. a second distribution hole extending through the top and bottom surfaces, each of the second distribution holes being connected to a second bottom surface groove; the lower plate having at least four receiving grooves, each of the receiving grooves engaging the second intermediate plate One of the third bottom surface grooves is connected to a plurality of vent holes penetrating the top and bottom surfaces. Thereby, the inlet hole of the upper plate has the same path length to each of the exhaust holes of the lower plate, so that the gas of the vapor deposition source is released from the exhaust hole after entering the air inlet hole. The amount of gas is approximately equal to increase the uniformity of the thickness of the film, thereby achieving the purpose of improving the quality of the coating process.

The following preferred embodiments are listed in conjunction with the drawings to illustrate the structure and function of the present invention.

Please refer to the first to third figures. The gas release device 10 provided in the preferred embodiment of the present invention is used in the vacuum coating process in the present embodiment, and can of course be used in any gas environment according to actual needs. The coating process for operation. The gas release device 10 of the present invention comprises an upper plate 20, a first intermediate plate 30, a second intermediate plate 40, and a lower plate 50, each of which is made of a material resistant to high temperature and corrosion. The rectangular body structure.

Referring to the fourth figure, the upper plate 20 has a distribution slot 22 and an air inlet hole 24. The air inlet hole 24 extends through the top and bottom surfaces of the upper plate 20. The distribution slot 22 is located on the bottom surface of the upper plate 20 and is connected to the air inlet hole. The bottom of 24. The cross-sectional shape of the distribution groove 22 is preferably a semicircular shape, and may of course be a rectangular shape or other geometric shape. The cross-sectional shape of the air inlet hole 24 is preferably a circular shape, and may of course be A rectangle or other geometric shape.

The first intermediate plate 30 has a first top surface groove 32, and the first top surface groove 32 is connected with four first distribution holes 36 symmetrically distributed, and each of the first distribution holes 36 penetrates through the first intermediate plate 30. The top and bottom sides are connected to a first bottom surface groove 34. The cross-sectional shape of the first top surface groove 32 and the first bottom surface groove 34 is preferably a semicircular shape, and may of course be a rectangular or other geometric shape. The cross-sectional shape of the first distribution hole 36 is round. In a preferred embodiment, it may of course be rectangular or other geometric shape. In addition, the groove diameter of the first top surface groove 32 is equal to the groove diameter of the distribution groove 22 of the upper plate 20 and larger than the first bottom surface groove 34. The diameter of each of the first distribution holes 36 is smaller than the diameter of the intake holes 24 of the upper plate 20.

The second intermediate plate 40 has four second top surface grooves 42, each of which is connected with two second distribution holes 46 symmetrically distributed, each of the second distribution holes 46 extending through the second intermediate portion The top and bottom sides of the plate 40 are connected to a second bottom surface groove 44. The cross-sectional shape of the second top surface groove 42 and the second bottom surface groove 44 is preferably a semicircular shape, and may of course be a rectangular or other geometric shape. The cross-sectional shape of the second distribution hole 46 is round. In a preferred embodiment, it may of course be rectangular or other geometric shape. In addition, the groove diameter of the second top surface groove 42 is equal to the first bottom of the first intermediate plate 30. The groove diameter of the surface groove 34 is larger than the groove diameter of the second bottom surface groove 44, and the diameter of each of the second distribution holes 46 is smaller than the diameter of the first distribution hole 36 of the first intermediate plate 30.

The lower plate 50 has eight receiving slots 52, and each receiving slot 52 is connected with six venting holes 54 symmetrically distributed. The venting holes 54 extend through the top and bottom surfaces of the lower plate 50, as shown in the second and fourth figures. Show. The cross-sectional shape of the receiving groove 52 is preferably a semicircular shape, and may of course be a rectangular shape or other geometric shape. The cross-sectional shape of the vent hole 54 is preferably a circular shape, and may of course be Rectangular or other geometric shape, in addition, the groove diameter of the receiving groove 52 is equal to the groove diameter of the second bottom surface groove 44 of the second intermediate plate 40, and the diameter of each of the exhaust holes 54 is smaller than the second distribution hole 46 of the second intermediate plate 40. The aperture.

When assembled, as shown in the third and fourth figures, the second intermediate plate 40 is stacked on the top surface of the lower plate 50, so that the second bottom surface grooves 44 of the second intermediate plate 40 and the receiving grooves of the lower plate 50 are respectively received. 52 is joined to each other to form a third passage 64, and then the first intermediate plate 30 is stacked on the top surface of the second intermediate plate 40 such that the first bottom surface grooves 34 of the first intermediate plate 30 and the second intermediate plate 40 Each of the second top surface grooves 42 is joined to each other to form a second passage 62. Finally, the upper plate 20 is stacked on the top surface of the first intermediate plate 30, so that the distribution groove 22 of the upper plate 20 and the first intermediate plate 30 are A top surface recess 32 is joined to each other to form a first passage 60, thus completing the assembly of the present invention.

Through the above structure, when the gas of the vapor deposition source enters the distribution groove 22 of the upper plate 20 and the first top surface groove 32 of the first intermediate plate 30 via the air inlet hole 24 of the upper plate 20, the first passage 60 formed by the first top surface groove 32 of the first intermediate plate 30 At the same time, firstly distributed to the first intermediate plate 30 via the first distribution holes 36 of the first intermediate plate 30. The second bottom surface 62 formed by each of the first bottom surface grooves 34 and the second top surface grooves 42 of the second intermediate plate 40 is then evenly distributed to each of the second distribution holes 46 of the second intermediate plate 40. The second bottom surface groove 44 of the second intermediate plate 40 and the third passage 64 formed by each receiving groove 52 of the lower plate 50 are finally released together from the respective vent holes 54 of the lower plate 50 to a material to be plated. The surface.

Throughout the process, the first passage 60 formed between the upper plate 20 and the first intermediate plate 30, the second passage 62 formed between the first intermediate plate 30 and the second intermediate plate 40, and the second intermediate portion The third passage 64 formed between the plate 40 and the lower plate 50 is multiplied and symmetrically distributed, and is coupled with the intake hole 24 of the upper plate 20, the first distribution hole 36 of the first intermediate plate 30, and the second intermediate portion. The second distribution holes 46 of the plate 40 and the vent holes 54 of the lower plate 50 are also multiplied and symmetrically distributed such that the air inlet holes 24 of the upper plate 20 to the respective vent holes 54 of the lower plate 50 are Have the same path length. In this way, the amount of gas released from the vapor deposition source gas from the respective vent holes 54 of the lower plate 50 is substantially equal, so that a film having a uniform thickness is formed on the surface of the object to be plated to improve the coating process quality. And the purpose of efficiency.

In the meantime, the constituent elements disclosed in the foregoing embodiments are merely illustrative and are not intended to limit the scope of the present invention. The alternatives or variations of other equivalent elements are also covered by the scope of the patent application.

10‧‧‧ gas release device

20‧‧‧Upper board

22‧‧‧Distribution slot

24‧‧‧Air intake

30‧‧‧First Intermediate Board

32‧‧‧First top groove

34‧‧‧First bottom groove

36‧‧‧First distribution hole

40‧‧‧Second intermediate board

42‧‧‧Second top groove

44‧‧‧Second bottom groove

46‧‧‧Second distribution hole

50‧‧‧ Lower board

52‧‧‧ socket

54‧‧‧ venting holes

60‧‧‧First Passage

62‧‧‧second channel

64‧‧‧ third channel

The first figure is a perspective view of a preferred embodiment of the present invention, mainly showing the air inlet holes of the upper plate.

The second figure is another perspective view of a preferred embodiment of the present invention, mainly showing the venting holes of the lower plate.

The third figure is an exploded perspective view of a preferred embodiment of the present invention.

Figure 4 is a cross-sectional view of a combination of a preferred embodiment of the present invention.

10‧‧‧ gas release device

20‧‧‧Upper board

24‧‧‧Air intake

30‧‧‧First Intermediate Board

32‧‧‧First top groove

36‧‧‧First distribution hole

40‧‧‧Second intermediate board

42‧‧‧Second top groove

46‧‧‧Second distribution hole

50‧‧‧ Lower board

52‧‧‧ socket

54‧‧‧ venting holes

Claims (7)

A gas release device for a coating process, comprising: a lower plate; a second intermediate plate stacked on a top surface of the lower plate; a first intermediate plate stacked on a top surface of the second intermediate plate; An upper plate is stacked on a top surface of the first intermediate plate; wherein the upper plate has an air inlet hole extending through the top and bottom surfaces, and a distribution slot connecting the bottom end of the air inlet hole, the first intermediate plate has a first top surface groove, the first top surface groove is engaged with the distribution groove of the upper plate and is connected with at least two first distribution holes penetrating the top and bottom surfaces, and each of the first distribution holes is connected to a first bottom surface concave a groove, the second intermediate plate has at least two second top surface grooves, each of the second top surface grooves engaging one of the first bottom plate grooves and connecting two sides of the top and bottom sides a second distribution hole, each of the second distribution holes is connected to a second bottom surface groove, the lower plate has at least four receiving grooves, each of the receiving grooves engaging one of the second bottom plates and the second bottom groove is connected with a plurality of Vent holes through the top and bottom sides. The gas release device for coating process according to claim 1, wherein a cross-sectional shape of the gas inlet hole, a sectional shape of each of the first distribution holes, a sectional shape of each of the second distribution holes, and each The cross-sectional shape of the vent hole is circular. The gas release device for coating process according to claim 2, wherein a diameter of the air inlet hole is larger than an aperture of each of the first distribution holes, and a diameter of each of the first distribution holes is larger than that of each of the second distribution holes The aperture, the aperture of each of the second distribution holes is larger than the aperture of each of the vent holes. The gas release device for coating process according to claim 1, wherein the distribution groove, the first top surface groove, the first bottom surface groove, each of the second top surface grooves, and the second portion The bottom surface groove and each of the receiving grooves have a semicircular shape. The gas release device for coating process according to claim 4, wherein a groove diameter of the distribution groove is equal to a groove diameter of the first top surface groove, and a groove diameter of the first top surface groove is larger than the first a groove diameter of the bottom surface groove, a groove diameter of the first bottom surface groove is equal to a groove diameter of the second top surface groove, and a groove diameter of the second top surface groove is larger than a groove diameter of the second bottom surface groove, The groove diameter of the second bottom groove is equal to the groove diameter of the receiving groove. The gas release device for coating process according to claim 1, wherein the number of the first distribution holes, the number of the first bottom surface grooves, and the number of the second top surface grooves are four, the first The number of the two distribution holes, the number of the second bottom surface grooves, and the number of the receiving grooves are all eight. The gas release device for coating process according to claim 6, wherein each of the receiving grooves is connected with six of the vent holes.