TWM453851U - Block cleaner and prober device - Google Patents

Block cleaner and prober device Download PDF

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Publication number
TWM453851U
TWM453851U TW102200878U TW102200878U TWM453851U TW M453851 U TWM453851 U TW M453851U TW 102200878 U TW102200878 U TW 102200878U TW 102200878 U TW102200878 U TW 102200878U TW M453851 U TWM453851 U TW M453851U
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Taiwan
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probe
cleaning
cleaning block
platform
block
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TW102200878U
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Chinese (zh)
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Duen-Tsai Liau
Chien-Yu Chen
Yong-Yung Liau
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Mpi Corp
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Priority to TW102200878U priority Critical patent/TWM453851U/en
Publication of TWM453851U publication Critical patent/TWM453851U/en

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Abstract

A prober device includes a detecting moving stage, at least one probe stage, a cleaning stage, and a block cleaner. The detecting moving stage is for loading a sample. The probe stage is disposed on a platform, and the probe stage includes at least one probe. The block cleaner is disposed on the cleaning stage. The thickness of the block cleaner is about 3 mm~6 mm. Therefore, the probe can insert to the block cleaner and a plurality of attachments on the probe can be stuck by the block cleaner and be removed from the probe.

Description

清潔塊與點測裝置Cleaning block and spotting device

本創作是有關於一種點測裝置。This creation is about a spotting device.

一般點測裝置的探針於使用過一段時間後,探針會因長期接觸待測物而沾附一些附著物,這些附著物可能會影響點測的結果。例如於點測待測物的電性時,施加於探針上的電流會被附著物所干擾;又或者在點測待測物的光性時,探針上的附著物可能會對待測物所發出的光產生遮光的不良效果。因此操作者必須定期清潔探針,以避免上述情形發生。After the probe of the general spotting device is used for a period of time, the probe may adhere to some objects due to long-term contact with the object to be tested, and these attachments may affect the result of the spot test. For example, when measuring the electrical properties of the test object, the current applied to the probe may be disturbed by the deposit; or when the light property of the test object is spotted, the deposit on the probe may be the object to be tested. The emitted light produces an adverse effect of shading. Therefore, the operator must clean the probe regularly to avoid this.

然而市面上所售的清潔片,其在清潔時,操作者以磨擦探針針尖而達到去除附著物的目的。但是,磨擦後的針尖可能會有磨損的可能,如此一來清潔後的探針便無法再度被使用於一些極度要求探針完整的點測檢驗中。另一方面,清潔片僅能清潔探針針尖,無法全方位清除探針針側的附著物,為其不便之處。However, in the cleaning sheet sold on the market, when cleaning, the operator rubs the probe tip to achieve the purpose of removing the deposit. However, the sharpened tip may be subject to wear and tear, so that the cleaned probe can no longer be used in some point-of-care tests where the probe is extremely required. On the other hand, the cleaning sheet can only clean the probe tip, and it is impossible to remove the attachment on the probe needle side in all directions, which is inconvenient.

本創作之一態樣為提供一種清潔塊,用於清除至少一探針所附著之複數個附著物。清潔塊包含主體。主體的厚度為約3 mm~6 mm,使得探針能夠插入主體,並進而讓主體能夠以沾黏的方式清除探針所附著之附著物。One aspect of the present invention is to provide a cleaning block for removing a plurality of attachments to which at least one probe is attached. The cleaning block contains the body. The body has a thickness of about 3 mm to 6 mm, allowing the probe to be inserted into the body and thereby allowing the body to adhere to the attachment to which the probe is attached.

在一或多個實施方式中,主體的蕭氏硬度為約0 A~20 A。In one or more embodiments, the body has a Shore hardness of from about 0 A to 20 A.

在一或多個實施方式中,清潔塊具有一表面,使得清潔塊清潔探針時,表面包覆探針之部分針尖。In one or more embodiments, the cleaning block has a surface such that when the cleaning block cleans the probe, the surface covers a portion of the tip of the probe.

在一或多個實施方式中,表面所包覆之部分針尖的深度為約1 mm~4 mm。In one or more embodiments, a portion of the tip of the surface covered by the surface has a depth of between about 1 mm and 4 mm.

本創作之另一態樣為提供一種點測裝置,包含檢測移動平台、至少一探針座、清潔平台與清潔塊。檢測移動平台用以承載一待測物。探針座設置在一承載平台上,且探針座包含至少一探針。清潔塊置於清潔平台上。清潔塊的厚度為約3 mm~6 mm,使得探針能夠插入清潔塊,並進而讓清潔塊能夠以沾黏的方式清除探針所附著之複數個附著物。其中,在點測裝置處於一檢測模式時,檢測移動平台將移進一檢測區域,檢測移動平台使待測物對探針相對移動以進行點測;在點測裝置處於一清潔模式時,檢測移動平台將移出檢測區域,而清潔平台將移進檢測區域,清潔平台使清潔塊對探針相對移動以進行清潔。Another aspect of the present invention is to provide a spotting device comprising a detection moving platform, at least one probe holder, a cleaning platform and a cleaning block. The mobile platform is detected to carry a test object. The probe holder is disposed on a carrier platform, and the probe holder includes at least one probe. The cleaning block is placed on the cleaning platform. The thickness of the cleaning block is about 3 mm to 6 mm, allowing the probe to be inserted into the cleaning block, which in turn allows the cleaning block to adhere to the plurality of attachments to which the probe is attached. Wherein, when the spotting device is in a detecting mode, the detecting moving platform will move into a detecting area, detecting the moving platform to move the object to be tested relative to the probe for spotting; and detecting the moving when the spotting device is in a cleaning mode The platform will move out of the inspection area, and the cleaning platform will move into the detection area, which cleans the cleaning block against the probe for cleaning.

在一或多個實施方式中,清潔塊的蕭氏硬度為約0 A~20 A。In one or more embodiments, the cleaning block has a Shore hardness of from about 0 A to 20 A.

在一或多個實施方式中,點測裝置處於清潔模式時,檢測移動平台與清潔平台可同步進行位移。In one or more embodiments, when the spotting device is in the cleaning mode, the detecting mobile platform and the cleaning platform can be displaced in synchronization.

在一或多個實施方式中,清潔塊具有一表面,使得清潔塊清潔探針時,表面包覆探針之部分針尖。In one or more embodiments, the cleaning block has a surface such that when the cleaning block cleans the probe, the surface covers a portion of the tip of the probe.

在一或多個實施方式中,表面所包覆之部分針尖的深度為約1 mm~4 mm。In one or more embodiments, a portion of the tip of the surface covered by the surface has a depth of between about 1 mm and 4 mm.

在一或多個實施方式中,點測裝置更包含收光裝置。收光裝置可以是積分球、顯微鏡、太陽能板或電荷耦合元件。In one or more embodiments, the spotting device further includes a light collecting device. The light collecting means can be an integrating sphere, a microscope, a solar panel or a charge coupled component.

以下將以圖式揭露本創作的複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本創作。也就是說,在本創作部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。In the following, a plurality of embodiments of the present invention will be disclosed in the drawings, and for the sake of clarity, many practical details will be described in the following description. However, it should be understood that these practical details are not applied to limit the creation. That is to say, in the implementation part of this creation, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

第1圖繪示依照本創作一實施方式之清潔塊100與探針410的示意圖。如第1圖所示,清潔塊100用於清除至少一探針410所附著之複數個附著物412。清潔塊100包含主體110。主體110的厚度H1為約3 mm~6 mm,使得探針410能夠插入主體110,並進而讓主體110以沾黏的方式清除探針410所附著之附著物412。FIG. 1 is a schematic diagram of a cleaning block 100 and a probe 410 according to an embodiment of the present invention. As shown in FIG. 1, the cleaning block 100 is used to remove a plurality of attachments 412 to which at least one probe 410 is attached. The cleaning block 100 includes a body 110. The thickness H1 of the body 110 is about 3 mm to 6 mm, so that the probe 410 can be inserted into the body 110, and the body 110 is thereby visibly removed from the attachment 412 to which the probe 410 is attached.

上述的探針410主要使用於點測裝置中,接觸待測物,以測量待測物的電性或光性。然而探針410多次接觸待測物的結果,可能會使待測物上的一些物質沾附至探針410上,而成為探針410上的附著物412。這些附著物412會使探針410增加不同的變因,因而影響點測裝置所量測出來的電性或光性,因此探針410需要時常清潔,以確保探針410量測的可靠度。然而一般市售的清潔片多只能夠清除位於探針410針尖部分的附著物412,無法清除位於 探針410針側的附著物412,因此大大影響清潔的效果。有鑑於此,本實施方式之清潔塊100的厚度H1達約3 mm~6 mm,使得探針410能夠充分插入清潔塊100中。如此一來,清潔塊100不只能夠清潔探針410針尖部分的附著物412,也可以進一步清除探針410靠近針尖之部分針側的附著物412,因此比起市售的清潔片具有較好的清潔效果。另一方面,市售的清潔片大多以磨擦針尖的方式來去除附著物412,在磨擦的同時,探針410較易受損。相對而言,本實施方式的清潔塊100是以沾黏的方式清除探針410的附著物412,因此探針410不容易因清潔而造成損壞,其使用壽命可大幅延長。The probe 410 described above is mainly used in a spotting device to contact the object to be tested to measure the electrical or optical properties of the object to be tested. However, the result of the probe 410 being in contact with the object to be tested multiple times may cause some substances on the object to be tested to adhere to the probe 410 to become the attachment 412 on the probe 410. These attachments 412 can cause different variations in the probe 410, thereby affecting the electrical or optical properties measured by the pointing device, so the probe 410 needs to be cleaned from time to time to ensure the reliability of the probe 410 measurement. However, most of the commercially available cleaning sheets can only remove the attachment 412 located at the tip end portion of the probe 410, and cannot be removed. The attachment 412 on the needle side of the probe 410 greatly affects the cleaning effect. In view of this, the thickness H1 of the cleaning block 100 of the present embodiment is about 3 mm to 6 mm, so that the probe 410 can be sufficiently inserted into the cleaning block 100. In this way, the cleaning block 100 can not only clean the attachment 412 of the tip portion of the probe 410, but also further remove the attachment 412 of the probe 410 near the needle side of the needle tip, and thus has better performance than the commercially available cleaning sheet. Cleaning effect. On the other hand, commercially available cleaning sheets mostly remove the attached matter 412 by rubbing the tip of the needle, and the probe 410 is more susceptible to damage while being rubbed. In contrast, the cleaning block 100 of the present embodiment removes the attachment 412 of the probe 410 in a viscous manner, so that the probe 410 is not easily damaged by cleaning, and its service life can be greatly extended.

詳細而言,請參照第2圖,其繪示第1圖之清潔塊100於清潔探針410時的側面示意圖。清潔塊100具有一表面120。當使用清潔塊100清潔探針410時,探針410插入清潔塊100中,使得表面120能夠包覆探針410之部分針尖,探針410上的附著物412因此可被清潔塊100沾黏而離開探針410,以達到清潔的效果。In detail, please refer to FIG. 2 , which illustrates a side view of the cleaning block 100 of FIG. 1 when the probe 410 is cleaned. The cleaning block 100 has a surface 120. When the probe 410 is cleaned using the cleaning block 100, the probe 410 is inserted into the cleaning block 100 such that the surface 120 can cover a portion of the tip of the probe 410, and the attachment 412 on the probe 410 can thus be adhered by the cleaning block 100. Leave the probe 410 to achieve a cleansing effect.

其中,上述的表面120所包覆之部分針尖的深度H2為約1 mm~4 mm,因此清潔塊100能夠盡可能包覆探針410較易沾附附著物412的區域。然而上述的深度H2僅為例示,實際上表面120所包覆之部分針尖的深度H2可隨著探針410種類或探針410上之附著物412的所在區域而改變,本創作不以此為限。Wherein, the depth H2 of the part of the needle tip covered by the surface 120 is about 1 mm to 4 mm, so that the cleaning block 100 can cover the area where the probe 410 is more likely to adhere to the attachment 412 as much as possible. However, the depth H2 described above is merely an example. In fact, the depth H2 of a portion of the tip of the surface covered by the surface 120 may vary depending on the type of the probe 410 or the area of the attachment 412 on the probe 410. limit.

當探針410插入清潔塊100時,探針410可能會因清潔塊100的材質不同而有斷裂的可能,而且探針410越深 入清潔塊100,斷裂的機率便越大。因此可適當選擇清潔塊100之主體110的蕭氏硬度,使得清潔塊100在清潔探針410時,能夠盡量抵消探針410插入清潔塊100所承受的力量。在一或多個實施方式中,清潔塊100之主體110的蕭氏硬度可選擇為約0 A~20 A。應了解到,以上所舉的蕭氏硬度之值僅為例示,並非用以限制本創作,本創作所屬技術領域中具有通常知識者,應視實際需要,彈性選擇主體110的蕭氏硬度。When the probe 410 is inserted into the cleaning block 100, the probe 410 may be broken due to the material of the cleaning block 100, and the deeper the probe 410 When entering the cleaning block 100, the probability of breaking is greater. Therefore, the Shore hardness of the body 110 of the cleaning block 100 can be appropriately selected so that the cleaning block 100 can offset the force that the probe 410 is inserted into the cleaning block 100 when cleaning the probe 410. In one or more embodiments, the Charpy hardness of the body 110 of the cleaning block 100 can be selected from about 0 A to 20 A. It should be understood that the values of the above-mentioned Xiao hardness are merely illustrative and are not intended to limit the creation. Those skilled in the art to which the present invention pertains should flexibly select the Xiao hardness of the main body 110 according to actual needs.

在一或多個實施方式中,清潔塊100的材質可選擇為軟膠,如熱塑性橡膠(ThermoPlastic Rubber;TPR),以符合上述之蕭氏硬度的要求。熱塑性橡膠為無毒的軟膠,其具有可塑性與沾黏性,在清針時能夠包覆探針410針尖並清除其附著物412。再加上熱塑性橡膠並沒有回沾的問題,因此在清針完畢後並不會影響探針410原本的性質。另一方面,熱塑性橡膠可直接黏貼於一清潔平台上,具有安裝方便的優點。然而本創作並不以此種材質為限。In one or more embodiments, the material of the cleaning block 100 may be selected as a soft rubber such as ThermoPlastic Rubber (TPR) to meet the aforementioned Shore hardness requirements. The thermoplastic rubber is a non-toxic soft rubber which has plasticity and stickiness and can cover the tip of the probe 410 and remove the adhering substance 412 during needle cleaning. In addition, the thermoplastic rubber does not have the problem of back-staining, so the original properties of the probe 410 are not affected after the cleaning is completed. On the other hand, thermoplastic rubber can be directly adhered to a cleaning platform, which has the advantage of convenient installation. However, this creation is not limited to this material.

因此,上述之清潔塊100可應用於具至少一探針410的點測裝置上。應注意的是,在下面的說明中,已在上述實施方式提過之清潔塊100的細節將不再贅述,僅就下列實施方式的變化處加以詳述。Therefore, the cleaning block 100 described above can be applied to a spotting device having at least one probe 410. It should be noted that in the following description, the details of the cleaning block 100 which has been mentioned in the above embodiments will not be described again, but only the changes of the following embodiments will be described in detail.

第3圖繪示本創作一實施方式之點測裝置於清潔模式下的示意圖。點測裝置包含清潔塊100、檢測移動平台300、探針座400、探針410、清潔平台500與承載平台800。檢測移動平台300用以承載一待測物310,探針座400設置在承載平台800上,至少包含一探針410,清潔塊100 置於清潔平台500上。清潔塊100的厚度H1(如第1圖所示)為約3 mm~6 mm,使得探針410能夠插入清潔塊100,並進而讓清潔塊100以沾黏的方式清除探針410所附著之附著物412(如第1圖所示)。詳細而言,請同時參照第3圖與第4圖。第4圖繪示本創作一實施方式之點測裝置於檢測模式下的示意圖。請先參照第4圖,實際操作當點測裝置處於檢測模式時,檢測移動平台300將移進入檢測區域810,之後,檢測移動平台300進行上下移動,故可使待測物310對探針410相對移動以進行點測。接著請參照第3圖,在當點測裝置處於清潔模式時,檢測移動平台300將移出檢測區域810,而清潔平台500將移進檢測區域810,且清潔平台500將進行上下移動,故可使清潔塊100對探針410相對移動以進行清潔動作,清潔動作即是使得探針410能夠插入清潔塊100,並進而讓清潔塊100能夠以沾黏的方式清除探針410所附著之複數個附著物412。要特別說明的是,在點測裝置處於清潔模式時,檢測移動平台300與清潔平台500可同步進行位移,即檢測移動平台300移出檢測區域810時可同步使得清潔平台500移進檢測區域810為較佳。當然亦可分階段進行位移,可以使檢測移動平台300先移出檢測區域810,之後,再使得清潔平台500移進檢測區域810,可視實際需求而定。檢測移動平台300可使得檢測移動平台300本身以及清潔平台500進行水平、上下移動的功能。FIG. 3 is a schematic diagram of the spotting device of the present embodiment in a cleaning mode. The spotting device includes a cleaning block 100, a detection mobile platform 300, a probe holder 400, a probe 410, a cleaning platform 500, and a carrier platform 800. The detecting mobile platform 300 is configured to carry a DST 310. The probe base 400 is disposed on the carrying platform 800 and includes at least one probe 410. The cleaning block 100 Placed on the cleaning platform 500. The thickness H1 of the cleaning block 100 (as shown in FIG. 1) is about 3 mm to 6 mm, so that the probe 410 can be inserted into the cleaning block 100, and then the cleaning block 100 is adhered to the probe 410 in a sticky manner. Attachment 412 (as shown in Figure 1). For details, please refer to Figures 3 and 4 at the same time. FIG. 4 is a schematic diagram showing the pointing device of the present embodiment in a detection mode. Please refer to FIG. 4 first. Actual operation When the spotting device is in the detecting mode, the detecting moving platform 300 will move into the detecting area 810, and then the moving platform 300 is detected to move up and down, so that the object to be tested 310 can be probed 410. Relative movement for spot testing. Referring to FIG. 3, when the spotting device is in the cleaning mode, the detecting moving platform 300 will move out of the detecting area 810, and the cleaning platform 500 will move into the detecting area 810, and the cleaning platform 500 will move up and down, so that The cleaning block 100 moves relative to the probe 410 to perform a cleaning action, which enables the probe 410 to be inserted into the cleaning block 100, and thereby allows the cleaning block 100 to remove the plurality of attachments to which the probe 410 is attached in a sticky manner. Object 412. It should be particularly noted that when the spotting device is in the cleaning mode, the detecting mobile platform 300 and the cleaning platform 500 can be synchronously displaced, that is, when the moving platform 300 is detected to move out of the detecting region 810, the cleaning platform 500 can be synchronized to move into the detecting region 810. Preferably. Of course, the displacement can also be performed in stages, so that the detection mobile platform 300 can be moved out of the detection area 810 first, and then the cleaning platform 500 can be moved into the detection area 810, depending on actual needs. Detecting the mobile platform 300 can enable the detection of the mobile platform 300 itself and the cleaning platform 500 to perform horizontal, up and down movement functions.

如此一來,因清潔平台500即位於檢測移動平台300的一側,因此探針410在量測完檢測移動平台300上的待 測物310後,不需讓點測裝置停機,即可在同一點測裝置進行清針程序,可大幅縮減清針的步驟與時間。另一方面,本實施方式的清潔塊100因本身具有黏性,因此直接置於清潔平台500上即可固定,不需要額外的安裝步驟。另外應注意的是,雖然於本敘述所搭配的所有附圖中,探針410的形狀皆為彎針,但此並不限制本創作。本創作所屬技術領域中具有通常知識者,應視實際需要,彈性選擇探針410的形狀。In this way, since the cleaning platform 500 is located on the side of the detecting mobile platform 300, the probe 410 is measured on the detecting mobile platform 300. After the object 310 is tested, the needle cleaning device can be performed at the same measuring device without stopping the measuring device, which can greatly reduce the steps and time for clearing the needle. On the other hand, the cleaning block 100 of the present embodiment is self-adhesive, so it can be fixed directly on the cleaning platform 500, and no additional installation steps are required. It should also be noted that although the shape of the probe 410 is a curved needle in all of the drawings to which the present description is incorporated, this does not limit the creation. Those of ordinary skill in the art to which the present invention pertains should flexibly select the shape of the probe 410 as needed.

上述之探針410的數量可為複數個,例如4支,以便於在點測裝置中處理多工程序。本實施方式的清潔塊100因其具有一定的厚度H1(如第1圖所示),可便於一次清潔複數支探針410。詳細而言,因探針410需插入清潔塊100來達到清潔的目的,因此清潔塊100的厚度H1與同時可清潔的探針410數量有關。然而因探針410插入清潔塊100之深度H2(如第2圖所示)有限,例如在本實施方式中深度H2為約1 mm~4 mm,若清潔塊100過厚,對於清針效果並無實質幫助,且清潔塊100可能會因此無法放入點測裝置內。因此在一或多個實施方式中,清潔塊100的厚度H1可選擇約3 mm~6 mm,用以較有效地同時清潔多支探針410。The number of the probes 410 described above may be plural, for example, four, to facilitate processing of the multiplex program in the spotting device. The cleaning block 100 of the present embodiment can facilitate cleaning of the plurality of probes 410 at a time because it has a certain thickness H1 (as shown in FIG. 1). In detail, since the probe 410 needs to be inserted into the cleaning block 100 for cleaning purposes, the thickness H1 of the cleaning block 100 is related to the number of simultaneously cleanable probes 410. However, since the depth H2 of the probe 410 inserted into the cleaning block 100 (as shown in FIG. 2) is limited, for example, in the present embodiment, the depth H2 is about 1 mm to 4 mm, and if the cleaning block 100 is too thick, the cleaning effect is There is no substantial help, and the cleaning block 100 may therefore not fit into the spotting device. Therefore, in one or more embodiments, the thickness H1 of the cleaning block 100 can be selected to be about 3 mm to 6 mm for more effectively cleaning the plurality of probes 410 at the same time.

接著請參照第4圖。當點測裝置處於檢測模式時,探針410可用來量測待測物310的電性或光性。於電性檢測的模式下,待測物310例如可為一晶粒。至少二探針410可先分別接觸待測物310,接著點測裝置自其中一探針410提供一測試電流至待測物310,以量測二探針410之間的 電壓差值。因此若其中任一探針410上具有附著物412(如第1圖所示),因附著物412本身也會帶有一電阻值,所量測出來的電壓差值就不再準確。更甚者,若使用市售清潔片以磨擦的方式清除探針410之附著物412,則探針410的表面積也可能因此改變,使得探針410的電阻值也跟著改變。而本創作一實施方式的清潔塊100因以沾黏的方式清針,可避免上述情形發生。Please refer to Figure 4 below. The probe 410 can be used to measure the electrical or optical properties of the object to be tested 310 when the spotting device is in the detection mode. In the mode of electrical detection, the object to be tested 310 can be, for example, a die. At least two probes 410 may first contact the object to be tested 310, and then the spotting device provides a test current from one of the probes 410 to the object to be tested 310 to measure the difference between the two probes 410. Voltage difference. Therefore, if any of the probes 410 has an attachment 412 (as shown in FIG. 1), since the attachment 412 itself also has a resistance value, the measured voltage difference is no longer accurate. What is more, if the attachment 412 of the probe 410 is removed by friction using a commercially available cleaning sheet, the surface area of the probe 410 may also change, so that the resistance value of the probe 410 also changes. However, the cleaning block 100 of the present embodiment can avoid the above-mentioned situation by clearing the needle in a sticky manner.

請持續參照第4圖。在一或多個實施方式中,點測裝置也可用來量測待測物310的光性,即待測物310可為一發光元件。點測裝置可更包含收光裝置700。收光裝置700置於發光元件的上方,用以偵測發光元件所發出之光。詳細而言,當點測裝置於光性檢測的模式下,探針410位於收光裝置700與發光元件之間,用以提供一電壓至發光元件,使發光元件發光。因此必須確保探針410不會影響收光裝置700的收光,即探針410不會將發光元件所發出的光遮住。然而若探針410沾黏了附著物412(如第1圖所示),尤其是沾附於探針410針側的附著物412,此部分的附著物412則較容易遮住發光元件所發出的光。而以本實施方式之清潔塊100清潔探針410,不但可易於清除於探針410針側的附著物412,且不會有異物回沾的問題,因此對於使用於光性量測的探針410而言,使用清潔塊100清潔為較好的選擇。另外,因收光裝置700的收光強度與其收光距離(在此實施方式中,為發光元件與收光裝置700之間的距離)有關,因此在光性量測作業下,收光距離必須保持相同,以利於後續數據的光強度之統一補償。如此一 來,探針410於光性量測時的高度必須維持相同(例如在本實施方式中為3 mm),即探針410的針尖不容許磨損,而使用清潔塊100即可避免上述情形發生。Please continue to refer to Figure 4. In one or more embodiments, the spotting device can also be used to measure the lightness of the object to be tested 310, that is, the object to be tested 310 can be a light emitting element. The spotting device may further include a light collecting device 700. The light collecting device 700 is disposed above the light emitting element for detecting light emitted by the light emitting element. In detail, when the spotting device is in the mode of photodetection, the probe 410 is located between the light collecting device 700 and the light emitting element for providing a voltage to the light emitting element to cause the light emitting element to emit light. It is therefore necessary to ensure that the probe 410 does not affect the light collection by the light-receiving device 700, i.e., the probe 410 does not obscure the light emitted by the light-emitting elements. However, if the probe 410 is adhered to the attachment 412 (as shown in FIG. 1), especially the attachment 412 attached to the needle side of the probe 410, the attachment 412 of this portion is more likely to cover the light-emitting element. Light. The cleaning of the probe 410 by the cleaning block 100 of the present embodiment can not only easily remove the attachment 412 on the needle side of the probe 410, but also has no problem of foreign matter smearing, so the probe for use in optical measurement is used. For 410, cleaning with cleaning block 100 is a better choice. In addition, since the light-receiving intensity of the light-receiving device 700 and its light-receiving distance (in this embodiment, the distance between the light-emitting element and the light-receiving device 700), the light-receiving distance must be Keep the same to facilitate uniform compensation of the light intensity of subsequent data. Such a The height of the probe 410 at the time of photometric measurement must be maintained the same (for example, 3 mm in the present embodiment), that is, the tip of the probe 410 is not allowed to wear, and the cleaning block 100 can be used to avoid the above situation.

在一或多個實施方式中,上述的收光裝置700可以是積分球、顯微鏡、太陽能板或電符耦合元件(Charge-Coupled Device;CCD)或上述之任意組合。另一方面,發光元件可為發光二極體,本創作不以此為限。In one or more embodiments, the light collecting device 700 may be an integrating sphere, a microscope, a solar panel, or a Charge-Coupled Device (CCD) or any combination thereof. On the other hand, the light-emitting element can be a light-emitting diode, and the present invention is not limited thereto.

接下來將以實驗數據說明本創作一實施方式之清潔塊於實際使用上的功效。實驗1為檢視清潔塊之回沾情況,即檢視以清潔塊清潔的探針,其針體上是否會沾附清潔塊的異物。實驗過程如下:首先使用全新的探針以點測一晶粒。其中針尖之直徑為6.5 μm,清潔塊的厚度為6 mm,而探針插入清潔塊的深度為1.5 mm~2 mm。在完成點測120次後即做一次清針,且每次清針皆將探針插入清潔塊5下,此定義為一回。本實驗1一共重覆10回,以檢視使用清潔塊清潔探針的效果。表一為於每次清針後,以清潔過後的探針點測各3次的電壓數據,其測試電流為20 mA。Next, the effect of the cleaning block of one embodiment of the present invention on actual use will be described with experimental data. Experiment 1 is to examine the back-staining condition of the cleaning block, that is, to inspect the probe cleaned with the cleaning block, and whether the foreign matter of the cleaning block is adhered to the needle body. The experimental procedure is as follows: First, a new probe is used to spot a grain. The diameter of the tip is 6.5 μm, the thickness of the cleaning block is 6 mm, and the depth of the probe inserted into the cleaning block is 1.5 mm to 2 mm. After completing the spot test 120 times, the needle is cleaned once, and each time the needle is inserted into the cleaning block 5, this is defined as one time. This experiment 1 was repeated 10 times in total to examine the effect of cleaning the probe using a cleaning block. Table 1 shows the voltage data of each of the three times after cleaning the probe after each cleaning, and the test current is 20 mA.

由表一的數據可知,在每次清針之後,探針的電性仍大致維持相同,因此可推斷探針無回沾的情形發生。更進一步的,在經過10回的點測與清針後,探針仍然維持其電性的可靠度,即表示即使使用清潔塊清潔探針10次,清潔塊仍不致於損壞探針,因此可推斷使用清潔塊可使探針有較長的使用壽命。It can be seen from the data in Table 1 that the electrical properties of the probe remain substantially the same after each needle cleaning, so it can be inferred that the probe has no back-staining. Furthermore, after 10 points of spotting and needle cleaning, the probe still maintains its electrical reliability, which means that even if the probe is cleaned 10 times using a cleaning block, the cleaning block will not damage the probe. It is inferred that the use of a cleaning block allows the probe to have a long service life.

實驗2為清潔塊之清潔功效的檢視,即檢視以清潔塊清潔的探針,其針體上之附著物是否能被完全清除。請同時參照第5圖與第6圖,其中第5圖為完成點測後之探針針尖與針側的顯微鏡照片,而第6圖為完成清針後之探針針尖與針側的顯微鏡照片。實驗過程如下:首先使用探針以點測一晶粒。其中針尖之直徑為6.5 μm,清潔塊的厚度為6 mm,而探針插入清潔塊的深度為1.5 mm~2 mm。在完成點測2000次後即做一次清針,且每次清針皆將探針插入清潔塊5下,此定義為一回。本實施例一共重覆1800回,以檢視使用清潔塊清潔探針的效果。其中點測時之電流為30 mA。Experiment 2 is a review of the cleaning efficacy of the cleaning block, that is, the probe cleaned with the cleaning block, and whether the attachment on the needle body can be completely removed. Please refer to Fig. 5 and Fig. 6, at the same time, Fig. 5 is a micrograph of the probe tip and the needle side after the spot measurement is completed, and Fig. 6 is a micrograph of the probe tip and the needle side after the needle is completed. . The experimental procedure is as follows: First, a probe is used to spot a grain. The diameter of the tip is 6.5 μm, the thickness of the cleaning block is 6 mm, and the depth of the probe inserted into the cleaning block is 1.5 mm to 2 mm. After completing the spot test 2000 times, the needle is cleaned once, and each time the needle is inserted into the cleaning block 5, this is defined as one time. This embodiment was repeated a total of 1800 times to examine the effect of cleaning the probe using the cleaning block. The current during the spot test is 30 mA.

如第5圖所示,在點測之後,探針針尖與針側的部分 皆沾黏了一些附著物。然而在清針過後,第6圖中之探針針尖與針側部分的附著物皆不再存在。更甚者,在第6圖中也不見異物回沾,由此可證明清潔塊對於探針具有良好的清潔功效。As shown in Figure 5, after the spot test, the probe tip and the needle side portion They all stick to some attachments. However, after the needle is removed, the attachment of the probe tip and the needle side portion in Fig. 6 no longer exists. What is more, no foreign matter is peeled back in Fig. 6, and it can be proved that the cleaning block has a good cleaning effect on the probe.

雖然本創作已以實施方式揭露如上,然其並非用以限定本創作,任何熟習此技藝者,在不脫離本創作之精神和範圍內,當可作各種之更動與潤飾,因此本創作之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any person skilled in the art can make various changes and refinements without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

100‧‧‧清潔塊100‧‧‧cleaning block

110‧‧‧主體110‧‧‧ Subject

120‧‧‧表面120‧‧‧ surface

410‧‧‧探針410‧‧‧Probe

412‧‧‧附著物412‧‧‧ Attachments

300‧‧‧檢測移動平台300‧‧‧Detecting mobile platforms

310‧‧‧待測物310‧‧‧Test object

400‧‧‧探針座400‧‧‧ probe holder

500‧‧‧清潔平台500‧‧‧cleaning platform

700‧‧‧收光裝置700‧‧‧Lighting device

800‧‧‧承載平台800‧‧‧bearing platform

810‧‧‧檢測區域810‧‧‧Detection area

H1‧‧‧厚度H1‧‧‧ thickness

H2‧‧‧深度H2‧‧ depth

第1圖繪示依照本創作一實施方式之清潔塊與探針的示意圖。FIG. 1 is a schematic view of a cleaning block and a probe according to an embodiment of the present invention.

第2圖繪示第1圖之清潔塊於清潔探針時的側面示意圖。Figure 2 is a side elevational view of the cleaning block of Figure 1 when cleaning the probe.

第3圖繪示本創作一實施方式之點測裝置於清潔模式下的示意圖。FIG. 3 is a schematic diagram of the spotting device of the present embodiment in a cleaning mode.

第4圖繪示本創作一實施方式之點測裝置於檢測模式下的示意圖。FIG. 4 is a schematic diagram showing the pointing device of the present embodiment in a detection mode.

第5圖為完成點測後之探針針尖與針側的顯微鏡照片。Figure 5 is a photomicrograph of the probe tip and the needle side after the spot test is completed.

第6圖為完成清針後之探針針尖與針側的顯微鏡照片。Figure 6 is a photomicrograph of the probe tip and the needle side after the needle is removed.

100‧‧‧清潔塊100‧‧‧cleaning block

110‧‧‧主體110‧‧‧ Subject

120‧‧‧表面120‧‧‧ surface

410‧‧‧探針410‧‧‧Probe

412‧‧‧附著物412‧‧‧ Attachments

H2‧‧‧深度H2‧‧ depth

Claims (10)

一種清潔塊,用於清除至少一探針所附著之複數個附著物,該清潔塊包含:一主體,該主體的厚度為約3 mm~6 mm,使得該探針能夠插入該主體,並進而讓該主體能夠以沾黏的方式清除該探針所附著之該些附著物。A cleaning block for removing a plurality of attachments attached to at least one probe, the cleaning block comprising: a body having a thickness of about 3 mm to 6 mm, so that the probe can be inserted into the body, and further Allowing the body to remove the attachments to which the probe is attached in a sticky manner. 如請求項1所述之清潔塊,其中該主體的蕭氏硬度為約0 A~20 A。The cleaning block of claim 1, wherein the body has a Shore hardness of about 0 A to 20 A. 如請求項1所述的清潔塊,其中該清潔塊具有一表面,使得該清潔塊清潔該探針時,該表面包覆該探針之一部分針尖。A cleaning block according to claim 1, wherein the cleaning block has a surface such that when the cleaning block cleans the probe, the surface covers a portion of the tip of the probe. 如請求項3所述的清潔塊,其中該表面所包覆之該部分針尖的深度為約1 mm~4 mm。The cleaning block of claim 3, wherein the portion of the tip covered by the surface has a depth of about 1 mm to 4 mm. 一種點測裝置,包含:一檢測移動平台,用以承載一待測物;至少一探針座,設置在一承載平台上,包含至少一探針;一清潔平台;一清潔塊,置於該清潔平台上,該清潔塊的厚度為約3 mm~6 mm,使得該探針能夠插入該清潔塊,並進而讓該 清潔塊能夠以沾黏的方式清除該探針所附著之複數個附著物;以及其中,在該點測裝置處於一檢測模式時,該檢測移動平台將移進一檢測區域,該檢測移動平台使該待測物對該探針相對移動以進行點測;在該點測裝置處於一清潔模式時,該檢測移動平台將移出該檢測區域,該清潔平台將移進該檢測區域,該清潔平台使該清潔塊對該探針相對移動以進行清潔。A spot measuring device comprising: a detecting mobile platform for carrying a test object; at least one probe holder disposed on a carrying platform, comprising at least one probe; a cleaning platform; and a cleaning block disposed thereon On the cleaning platform, the cleaning block has a thickness of about 3 mm to 6 mm, so that the probe can be inserted into the cleaning block, and then the The cleaning block can remove a plurality of attachments attached to the probe in a sticky manner; and wherein, when the pointing device is in a detection mode, the detection mobile platform moves into a detection area, the detection mobile platform enables the The test object moves relative to the probe for spotting; when the spotting device is in a cleaning mode, the detecting moving platform will move out of the detecting area, and the cleaning platform will move into the detecting area, and the cleaning platform makes the The cleaning block moves relative to the probe for cleaning. 如請求項5所述之點測裝置,其中該清潔塊的蕭氏硬度為約0 A~20 A。The spotting device of claim 5, wherein the cleaning block has a Shore hardness of about 0 A to 20 A. 如請求項5所述之點測裝置,該點測裝置處於該清潔模式時,該檢測移動平台與該清潔平台可同步進行位移。The spotting device of claim 5, wherein the detecting mobile platform and the cleaning platform are simultaneously displaceable when the pointing device is in the cleaning mode. 如請求項5所述的點測裝置,其中該清潔塊具有一表面,使得該清潔塊清潔該探針時,該表面包覆該探針之一部分針尖。The spotting device of claim 5, wherein the cleaning block has a surface such that when the cleaning block cleans the probe, the surface covers a portion of the tip of the probe. 如請求項8所述的點測裝置,其中該表面所包覆之該部分針尖的深度為約1 mm~4 mm。The spotting device of claim 8, wherein the portion of the tip covered by the surface has a depth of about 1 mm to 4 mm. 如請求項5所述之點測裝置,更包含一收光裝置,其中該收光裝置係選自於由積分球、顯微鏡、太陽能板與電荷耦合元件所構成之群組。The spotting device of claim 5, further comprising a light collecting device, wherein the light collecting device is selected from the group consisting of an integrating sphere, a microscope, a solar panel, and a charge coupled device.
TW102200878U 2013-01-15 2013-01-15 Block cleaner and prober device TWM453851U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105789076A (en) * 2014-12-22 2016-07-20 旺矽科技股份有限公司 Fault judgement method for prober
TWI631346B (en) * 2017-03-10 2018-08-01 穩懋半導體股份有限公司 Prober and method for positioning probe tip and obtaining probe and polishing sheet contact data

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105789076A (en) * 2014-12-22 2016-07-20 旺矽科技股份有限公司 Fault judgement method for prober
CN105789076B (en) * 2014-12-22 2018-09-07 旺矽科技股份有限公司 Point measurement machine fault distinguishing method
TWI631346B (en) * 2017-03-10 2018-08-01 穩懋半導體股份有限公司 Prober and method for positioning probe tip and obtaining probe and polishing sheet contact data

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