TWM451490U - Heat dissipation device - Google Patents

Description

Heat sink

This creation relates to a heat sink, especially a heat sink applied to a heat source such as a light-emitting diode lamp.

LEDs (Light Emitting Diodes) are widely used due to their power saving advantages. However, high-power LEDs generate a large amount of waste heat when they emit light. If the waste heat cannot be effectively removed, the light-emitting diodes will be eliminated. The temperature of the wafer in the polar body is too high, and the luminous efficiency of the light-emitting diode is greatly reduced, and the service life thereof is shortened. In particular, the concentrated light-emitting diode lamp needs to densely arrange a large number of high-power light-emitting diodes on one substrate. In addition, the waste heat accumulated in it is more difficult to exclude, and it affects the overall lighting performance of the light-emitting diode.

At present, the heat dissipation of the LED is mainly divided into active heat dissipation and passive heat dissipation. Among them, the active heat dissipation uses the operation of the fan to forcibly take away the waste heat generated by the light-emitting diode. Although the heat dissipation method has a certain heat dissipation performance, the fan noise and the fan service life need to be considered in use. Once the fan fails to run, it will cause the LED to overheat and burn out quickly. Moreover, the passive heat dissipation is a mechanism that uses natural convection to dissipate heat. Although this heat dissipation method has no noise problem and limited service life, it must be matched with a large area. The fins are sufficient to dissipate heat from a large amount of waste heat, so that the cold air outside is not easy to enter the middle area of the fins, that is, the cold air cannot enter the fins to exchange heat and take away waste heat. It is still unable to effectively dissipate heat in the form of natural convection.

Therefore, how to create a heat sink to improve the heat dissipation efficiency of a heat source such as a light-emitting diode lamp will be actively exposed by the author.

One of the aims of the present invention is to provide a heat dissipating device capable of simultaneously improving the natural convection of the air and the heat conduction performance of the fins, so as to improve the heat dissipation efficiency when a heat source such as a light-emitting diode lamp is mounted on the heat dissipating device.

To achieve the above object, the present invention provides a heat dissipating device comprising a plate body and a plurality of fins. The plate body includes a heat source setting area, a plurality of through holes, a first surface and a second surface opposite to the first surface, the heat source setting area is located at a center of the first surface, and the through holes are provided a plate body outside the heat source setting region; and the fins are spaced apart from the second surface of the plate body.

In one embodiment, the fins are plate fins, pin fins, or a combination thereof.

In one embodiment, the fins are spaced apart from the first side and the second side of the board body, and the fins are located on the board body outside the heat source setting area.

In one embodiment, the through holes comprise a plurality of first through holes that are parallel to the fins and located between any two adjacent fins.

In one embodiment, the through holes comprise a plurality of second through holes that are perpendicular to the fins.

In an embodiment, the plate body and the fins are integrally formed or assembled. fit.

In an embodiment, the shape of the through holes is an elongated shape, a rectangle, a trapezoid, a circle, an ellipse or the like.

In an embodiment, the shape of the plate body is a geometric shape such as a rectangle, a trapezoid, a circle, or an ellipse.

Therefore, the heat dissipating device of the present invention can be provided with a heat source such as a light-emitting diode lamp in a heat source setting area of the heat dissipating device, and the waste heat generated by the heat source is transmitted to the plural by using a region where the plate body is not provided with a through hole. The fins are convected through a plurality of through holes provided in the body of the plate, so that cold air can enter the gap between the fins, thereby improving the efficiency of heat dissipation.

In order to fully understand the purpose, features and effects of this creation, the following specific examples, together with the attached drawings, provide a detailed description of the creation, as explained below: please refer to Figure 1 and Figure 2 This is a perspective view of the back and front of the heat sink of a specific embodiment. The heat sink 100 includes a board body 10 and a plurality of fins 20 .

The board body 10 includes a heat source setting area 12 , a plurality of through holes 14 , a first surface 16 and a second surface 18 opposite to the first surface 16 . The heat source setting area 12 is located at the center of the first surface 16 . And the through holes 14 are disposed in the plate body 10 except the heat source setting region 12; and the fins 20 are spaced apart from the second surface 18 of the plate body 10 so as to have between any two adjacent fins 20 A gap 22.

The heat source setting area 12 is provided with a heat source (not shown) and the heat sink 100. The heat source may be, for example, a light-emitting diode lamp that generates heat when the light is emitted, by mounting the heat source to the heat source. The region 12 is disposed, and the waste heat generated by the heat source is thermally conducted to the fins 20 of the heat sink 100 for heat dissipation.

In the present embodiment, the fins 20 are plate fins extending from the second surface 18 of the board body 10 and perpendicular to the board body 10 . The shape of the fins 20 is not limited to the embodiment and the drawings, and may be a combination of a pin fin, a plate fin and a pin fin or other forms.

In this embodiment, the through holes 14 include a plurality of first through holes 142 parallel to the fins 20 and located between any two adjacent fins 20, that is, any two adjacent fins 20 The first through holes 142 are formed in the plate body 10, and the first through holes 142 are elongated. The first through holes 142 allow cold air on the same side of the heat source setting region 12 to pass through the first through holes 142 into the gap 22 between the fins 20 to enhance the cold air and the like. The contact of the fins 20 achieves heat exchange, and the waste air is taken away by the flowing cold air, thereby improving the heat dissipation performance of the natural convection. The board body 10 connected to the fins 20 serves as a heat conduction path, and the waste heat generated by the heat source is conducted to the fins 20 located on the second surface 18 via the first surface 16 of the board body 10, and then The waste air is separated from the heat sink 100 by the cold air entering between the fins 20, thereby achieving the efficiency of heat dissipation.

In this embodiment, the through holes 14 further include a plurality of second through holes 144 perpendicular to the fins 20 to increase the amount of cold air entering the gaps 22 to improve heat dissipation efficiency.

The first through holes 142 and the second through holes 144 are arranged with the heat source setting region 12 of the plate body 10 as a center of symmetry, but the first through holes 142 and the second through holes 144 are aligned. The arrangement direction and position are not limited to the embodiment and the drawings, but the through holes 14 must be disposed between the fins 20 to achieve the purpose of allowing cold air to enter the gaps 22.

Moreover, the area occupied by the first through holes 142, the area occupied by the second through holes 144, and the area occupied by the plate body 10 not provided with the first through holes 142 and the second through holes 144 It is not limited to the embodiment and the figure, and the optimized configuration can be performed according to the use requirement, for example, according to the amount of heat generated by the heat source, thereby improving the overall heat dissipation efficiency.

In addition, in the embodiment, the board body 10 and the fins 20 are integrally formed, but the board body 10 and the fins 20 may also be in a combined form, and the board body 10 and The material of the fins 20 is a metal, alloy or composite material having thermal conductivity properties.

Moreover, the shape of the through holes 14 may be a rectangle, a trapezoid, a circle, an ellipse or other geometric shapes, and the cross-sectional shape of the plate body 10 may be a rectangle, a trapezoid, a circle, an ellipse or the like, which may be based on actual conditions. Demand changes.

Please refer to FIG. 3, which is a perspective view of a heat sink according to another embodiment of the present invention. As shown, the heat sink 100' includes the board body 10 and a plurality of fins 20.

Different from the foregoing embodiments, the fins 20 are disposed at intervals on the first surface 16 and the second surface 18 of the board body 10, and the fins 20 are located outside the heat source setting area 12 The waste heat generated by the heat source (not shown) can be conducted to the position via the first face 16 of the plate body 10. The fins 20 on the first surface 16 are conducted to the fins 20 located on the second surface 18 via the second surface 18 of the board body 10, and enter the fins 20 through the through holes 14. The cold air between the waste air and the heat sink 100' further enhances the heat dissipation efficiency.

Furthermore, the size and shape of the heat source setting area 12 are not limited to those shown in the embodiment and the drawings, and may be changed according to the size and shape of the actual heat source for bonding the heat source to the heat sink 100'.

In summary, the heat sink of the present invention can be provided with a heat source such as a light-emitting diode lamp in a heat source setting area of the heat sink, and the waste heat generated by the heat source is transmitted by using a region of the board body not provided with a through hole. The plurality of fins are convected through a plurality of through holes provided in the body of the plate, so that cold air can enter the gap between the fins, thereby improving the efficiency of heat dissipation.

The present invention has been disclosed in the above preferred embodiments, and it should be understood by those skilled in the art that this embodiment is only used to depict the present invention and should not be construed as limiting the scope of the present invention. Equivalent changes and substitutions should be made to cover the scope of this creation. Therefore, the scope of protection of this creation is subject to the definition of the scope of patent application.

10‧‧‧ board ontology

12‧‧‧Heat source setting area

14‧‧‧through holes

142‧‧‧ first through hole

144‧‧‧second through hole

16‧‧‧ first side

18‧‧‧ second side

20‧‧‧Fins

22‧‧‧ gap

100,100’‧‧‧ Heat sink

1 is a perspective view of the back side of a heat sink according to a specific embodiment of the present invention.

2 is a front perspective view of a heat sink according to a specific embodiment of the present invention.

Figure 3 is a perspective view of a heat sink of another embodiment of the present invention. schematic diagram.

10‧‧‧ board ontology

12‧‧‧Heat source setting area

14‧‧‧through holes

142‧‧‧ first through hole

144‧‧‧second through hole

16‧‧‧ first side

18‧‧‧ second side

20‧‧‧Fins

22‧‧‧ gap

100‧‧‧heating device

Claims (8)

A heat dissipating device comprising: a plate body, comprising a heat source setting area, a plurality of through holes, a first surface and a second surface opposite to the first surface, wherein the heat source setting area is located at a center of the first surface And the through holes are disposed on the plate body outside the heat source setting region; and the plurality of fins are spaced apart from the second surface of the plate body. The heat sink of claim 1, wherein the fins are plate fins, pin fins or a combination thereof. The heat dissipating device of claim 1, wherein the through holes comprise a plurality of first through holes parallel to the fins and located between any two adjacent fins. The heat sink of claim 3, wherein the through holes comprise a plurality of second through holes that are perpendicular to the fins. The heat dissipating device of any one of claims 1 to 4, wherein the fins are more spaced apart from the first side and the second side of the board body, and the fins are located at the heat source. On the board body outside the area. The heat dissipating device according to any one of claims 1 to 4, wherein the plate body and the fins are integrally formed or combined. The heat dissipating device according to any one of claims 1 to 4, wherein the shape of the through holes is an elongated shape, a rectangle, a trapezoid, a circle, an ellipse or the like. The heat dissipation device according to any one of claims 1 to 4, wherein the shape of the plate body is a rectangle, a trapezoid, a circle, an ellipse or the like.