TW201423344A - Heat sink - Google Patents

Abstract

A heat sink comprises a body, a plurality of cooling fins, at least one bulkhead, and at least one conduction plate, the bulkhead is strung the cooling fins and connected to the body through the conduction plate, such that the heat sink is capable of transmitting heat via the bulkhead and the conduction plate to the cooling fins by way of emission, for enhancing performances of thermal conduction and dissipation.

Description

heat sink

The present invention relates to a heat sink, and more particularly to a heat sink.

With the rapid development of the electronics industry, the power of electronic components such as a central processing unit (CPU) or a graphics processing unit (GPU) used in an electronic device is greatly increased, but these are relatively caused. The amount of heat generated by an electronic component during operation is greatly increased, often resulting in an increase in temperature inside the electronic component itself and its configured system. At the same time, with the rapid accumulation of heat, the running performance of electronic components is degraded, and it is easy to cause the system to crash.

To ensure that the electronic components can operate within their normal temperature range, a heat sink is typically placed on the electronic components to dissipate the heat generated by them. A common heat sink may be a single heat sink or a combination of a heat sink and a fan, wherein the heat sink includes a rectangular base for contacting the electronic components and a plurality of vertical heat sink fins extending from the surface of the rectangular base. The fan is disposed on the plurality of heat dissipation fins to generate airflow to carry away the heat accumulated on the heat dissipation fins. However, such a heat sink has a great limitation on the heat dissipation performance of the heat sink due to the heat conduction area of the rectangular base and the number of heat dissipation fins and the limited surface area.

In view of this, a circular heat sink has been developed, which mainly includes a cylindrical body and a plurality of heat dissipation fins, and a plurality of heat dissipation fins are radially arranged in parallel on the surface of the body, thereby increasing the overall heat dissipation of the heat sink. Surface area, and the heat from the electronic components is transmitted to the heat dissipation fins through the cylinder, so that the heat dissipation performance is obtained Have to improve.

However, this radial heat transfer and heat dissipation method has a larger attenuation rate of heat transfer efficiency as the distance of the fins is longer than the length of the heat sink fin. Moreover, when the airflow generated by the fan is blown toward the heat sink, since the wind pressure around the heat sink is low, the airflow will flow toward the tail end of the heat-dissipating fin with a lower wind pressure (ie, the end away from the cylinder), thereby causing the airflow. The effective contact rate with the heat sink fins is greatly reduced, which in turn limits the heat dissipation performance of the heat sink.

In view of the above problems, the present invention provides a heat sink for solving the problem that the heat transfer fin of the conventional heat sink is farther from the body, the heat transfer efficiency is lower, and the effective contact rate between the tail end of the heat sink fin and the air flow is low, thereby affecting the overall heat dissipation performance. problem.

The heat sink of the present invention comprises a body, a plurality of heat dissipation fins, at least one retaining wall and at least one heat conducting plate. A plurality of heat dissipation fins are disposed on the body, and a channel is formed between the adjacent two heat dissipation fins. A retaining wall is connected between the fins and blocks the passage. The heat conducting plate is disposed between the plurality of heat radiating fins, and connects the body and the retaining wall, and the thickness of the heat conducting plate is greater than the thickness of each of the heat radiating fins.

The utility model has the advantages that the plurality of heat dissipation fins are connected through the retaining wall, and the channels between the adjacent heat dissipation fins are blocked into a plurality of independent spaces, so that the retaining wall can not only transfer heat between the plurality of heat dissipation fins. In addition, the airflow generated by the fan can be guided to flow in each independent space, so that the contact ratio of the heat dissipation fin to the airflow at one end close to the body or one end away from the body tends to be uniform, thereby improving heat dissipation efficiency. In addition, the cross-sectional area of the heat-conducting plate is greater than the cross-sectional area of the heat-dissipating fin, so that the thermal energy on the body can be quickly transmitted to the retaining wall via the heat-conducting plate, and then The wall is passed to each fin. Since the heat is transferred in a radial (or dendritic) manner, the heat transfer and heat dissipation performance of the heat sink can be greatly improved.

The features, implementations, and utilities of the present invention are described in detail below with reference to the drawings.

Please refer to FIG. 1 and FIG. 2 , which are respectively a perspective view and a top view of the first embodiment of the present invention. The heat sink 100 disclosed in the first embodiment of the present invention includes a body 110, a plurality of heat dissipation fins 120, two retaining walls 130, 140, and a plurality of heat conducting plates 150. The body 110 can be, but is not limited to, a cylindrical structure or a cubic structure. A plurality of heat dissipation fins 120 are arranged around the outer circumference of the body 110 on the surface of the body 110. One end of each of the heat dissipation fins 120 is connected to the body 110. The other end extends toward the outside of the body 110, so that the plurality of heat dissipation fins 120 are radially arranged on the body 110, and a channel 122 is formed between the adjacent two heat dissipation fins 120 for air circulation.

The second retaining walls 130, 140 surround the body 110 and are spaced apart from each other between the retaining wall 130 and the body 110 and between the retaining wall 130 and the retaining wall 140. The second retaining walls 130, 140 are respectively connected between the plurality of heat radiating fins 120 and are blocked in the channel 122, so that each channel 122 is divided into a plurality of flow guiding regions 1222, 1224 and a pair of flow regions 1226, wherein the flow guiding The area 1222 is between the body 110 and one of the retaining walls 130, the other flow guiding area 1224 is between the two retaining walls 130, 140, and the convection area 1226 corresponds to the tail end of each of the heat radiating fins 120, that is, The heat dissipation fin 120 is toward one end of the body 110.

A plurality of heat conducting plates 150 are spaced apart from the body 110 and connected to the second gear The heat dissipation plate 150 is located in the channel 122 between the adjacent two heat dissipation fins 120 of the plurality of heat dissipation fins 120, and the thickness of the heat conduction plate 150 is greater than the thickness of the heat dissipation fins 120, so the heat conduction is performed. The opposite sides of the plate 150 may be separated from the surface of the two heat dissipation fins by a gap; or partially or completely connected to the surface of the two heat dissipation fins 120. In this embodiment, the opposite sides of the heat conducting plate 150 are completely connected to the surface of the two heat dissipating fins 120 in the flow guiding regions 1222 and 1224 of the channel 122, that is, the heat conducting plate 150 is cooled in the adjacent two. The channel 122 of the fin 120 completely fills the flow guiding regions 1222 and 1224, and the heat conducting plate 150 and the two heat dissipating fins 120 are integrated as an example, but not limited thereto.

Based on the above structure, the heat sink 100 disclosed in the first embodiment of the present invention is connected with a heat conducting sheet 150 having a certain thickness between the body 110 and the second retaining walls 130 and 140, so that the body 110 can be absorbed by the heat conducting sheet 150. The heat energy is sequentially transmitted to the second retaining walls 130 and 140, and then transmitted to each of the heat radiating fins 120 via the second retaining walls 130 and 140, respectively. Therefore, when the heat sink 100 is disposed in an electronic device (not shown) for dissipating heat from a heat generating component such as a central processing unit (CPU) or a graphics processing unit (GPU), the heat sink The 100 is mainly in contact with a heating element on one side of the body 110 for absorbing thermal energy generated by the heating element. Thereafter, thermal energy is transferred to the heat dissipation fins 120 and the heat conduction plate 150 via the body 110. In this process, since the thickness of the heat conducting plate 150 is thicker than that of the heat dissipating fins 120, a large cross-sectional area is available for heat transfer, so that thermal energy is quickly transmitted to the second retaining walls 130, 140 via the heat conducting plate 150, and then And passing through the second retaining walls 130, 140 to the opposite sides of the energy guiding plate 150 to the respective heat radiating fins 120, so as to exchange heat with the outside air by the high total surface area of the plurality of heat radiating fins 120. Use to dissipate heat to the outside environment. Moreover, since the thermal energy can be quickly transmitted to the end of each of the heat dissipation fins 120 away from the body 110 via the heat conducting plate 150 and the retaining walls 130, 140, the heat transfer efficiency of the heat sink fins 120 is further reduced. The big problem further improves the heat transfer and heat dissipation performance of the heat sink 100.

In addition, referring to FIG. 1 to FIG. 3, when the heat sink 100 of the present invention is used with the fan 200, the channel 122 between the adjacent two heat dissipation fins 120 is divided into two layers by the second retaining walls 130 and 140. Zones 1222, 1224 and convection zone 1226, therefore, the airflow generated by fan 200 will be forcedly directed into these diversion zones 1222, 1224 and convection zone 1226, thus avoiding direct escape of airflow after blowing toward radiator 100. To the external environment, and to ensure that the airflow is in full or as much as possible in contact with the body 110, the heat dissipation fins 120, the retaining walls 130, 140, and the heat conducting plate 150 in the flow guiding regions 1222, 1224 and the convection region 1226 to improve heat. The exchange efficiency improves the overall heat dissipation performance of the heat sink 100.

Please refer to FIG. 4, which is a perspective view of a second embodiment of the present invention. The second embodiment of the present invention is substantially identical in structure to the first embodiment. The difference between the two is that only one heat conducting plate 150 is disposed on the heat sink 100, and a groove 112 is formed on one side of the body 110. And a plurality of heat dissipation fins 120 are arranged around the surface of the body 110 around the groove 112. In this embodiment, the heat sink 100 can be used as a heat sink for a heat generating component such as a CPU or a GPU, and a light emitting diode (LED) can be disposed in the recess 112 of the body 110 to serve as a heat sink diode (LED). One of the components of the illuminating device, which can also transmit heat through the retaining walls 130, 140 and the heat conducting plate 150, so that the heat generated by the illuminating diode can be quickly transmitted to the respective fins 120 and then through the fins. 120 and the outside world The air undergoes heat exchange to achieve the purpose of cooling the light-emitting diode.

Please refer to FIG. 5 , which is a top plan view of a third embodiment of the present invention. The heat sink 100 disclosed in the third embodiment of the present invention includes a body 110, a plurality of heat dissipation fins 120, two retaining walls 130, 140, and a plurality of heat conducting plates 150. The body 110 is a cylindrical structure, and a plurality of heat dissipation fins 120 are arranged around the outer circumference of the body 110 on the surface of the body 110, and one end of each of the heat dissipation fins 120 is connected to the body 110, and the other end extends outwardly of the body 110. The plurality of heat dissipation fins 120 are radially arranged on the body 110, and a channel 122 is formed between the adjacent two heat dissipation fins 120.

The second retaining walls 130, 140 surround the body 110 and are respectively connected between the plurality of heat radiating fins 120. At the same time, the second retaining walls 130, 140 are blocked in each of the channels 122, and the channel 122 is divided into a plurality of diversion regions 1222, 1224 and a pair of flow regions 1226, wherein the diversion region 1222 is interposed between the body 110 and one of the retaining walls Between 130, another flow guiding area 1224 is between the two retaining walls 130, 140, and the convection area 1226 corresponds to one end of each heat radiating fin 120 away from the body 110.

A plurality of heat conducting plates 150 are disposed on the body 110 and connected to the second retaining walls 130 and 140. Each of the heat conducting plates 150 is located in the channel 122 between the adjacent two heat radiating fins 120 of the plurality of heat radiating fins 120. The thickness of the heat conducting plate 150 is gradually increased toward the body 110, so that the opposite sides of the heat conducting plate 150 are partially or completely connected to the surfaces of the two heat dissipating fins 120 in the flow guiding regions 1222 and 1224. In this embodiment, the opposite sides of the heat conducting plate 150 are mainly connected to the surfaces of the two heat dissipating fins 120 in the flow guiding region 1222 between the body 110 and the retaining wall 130, so that the heat conducting plate 150 is connected to the body 110. One end is integrated with the two heat dissipation fins 120 as a whole.

Therefore, in the third embodiment of the present invention, the thickness of the heat conducting plate 150 is gradually increased toward the body 110, except that the heat conducting plate 150 has a large cross-sectional area in the two flow guiding regions 1222 and 1224. In addition to the heat transfer, the heat conducting plate 150 has a large surface area in the flow guiding zone 1224 and the convection zone 1226 for heat exchange between the heat and the outside air. Therefore, the heat conducting plate 150 has better heat transfer efficiency between the second retaining walls 130, 140 and the body 110, and has good heat dissipation efficiency at the end away from the body 110.

Please refer to FIG. 6 , which is a top plan view of a fourth embodiment of the present invention. The heat sink 100 disclosed in the fourth embodiment includes a body 110, a plurality of heat dissipation fins 120, a retaining wall 130, and a plurality of heat conducting plates 150. The body 110 can be, but is not limited to, a cylinder or a cube, and a plurality of heat conducting plates 150 are disposed on the body 110 at intervals in a symmetrical manner. A plurality of heat dissipation fins 120 are arranged on the surface of the body 110 along the outer circumference of the body 110, and one end of the heat dissipation fins 120 is connected to the body 110, and the other end extends outwardly of the body 110, so that the plurality of heat dissipation fins 120 are on the body 110. A channel 122 is formed between the two adjacent heat dissipation fins 120, and a plurality of heat dissipation fins 120 are respectively disposed on opposite sides of each of the heat conduction plates 150, and a part of the heat dissipation fins 120 are disposed. Connected to opposite sides of the heat conducting plate 150. In addition, the thickness of each of the heat conducting plates 150 is greater than the thickness of each of the heat radiating fins 120. For example, the thickness of the heat conducting plate 150 may be, but is not limited to, equal to or greater than the distance between the adjacent two heat radiating fins 120 plus two heat dissipation. The sum of the thicknesses of the fins 120; or the sum of the thicknesses of a certain number of heat dissipation fins 120, such as the sum of the thicknesses of three, five, or ten heat dissipation fins 120, and the like.

The retaining wall 130 surrounds the body 110 and is respectively connected to a plurality of heat dissipating fins Between the sheet 120 and the plurality of heat conducting plates 150. At the same time, the retaining wall 130 is disposed between each of the channels 122 and between the heat conducting plate 150 and the adjacent heat radiating fins 120, so that the heat conducting plate 150 is connected to the heat radiating fins 120 through the retaining wall 130, and the retaining wall 130 and the body 110 are disposed. In addition to being connected by the heat dissipation fins 120, the heat conduction fins 150 are connected to each other to have a better heat conduction path.

Therefore, in application, when the heat sink 100 is in contact with the heat generating component (not shown) by the body 110, the heat energy generated by the heat generating component can be transmitted to the plurality of heat radiating fins 120 and the plurality of heat conducting plates 150 via the body 110, and The heat transfer rate through the heat conducting plate 150 is greater than the heat transfer rate of the heat sink fins 120, so that the heat energy is quickly conducted to the retaining ring 130. Then, it is transmitted to the end of each of the heat dissipation fins 120 away from the body 110 via the retaining ring 130, thereby accelerating the conduction rate of the thermal energy in the heat sink 100, thereby improving the overall heat dissipation performance of the heat sink 100, and achieving rapid heating elements. The purpose of cooling.

In addition, in the present embodiment, the retaining wall 130 also divides most of the passages 122 into a flow guiding area 1222 and a pair of flow areas 1226, wherein the flow guiding area 1222 is interposed between the body 110 and the retaining wall 130, and the convection area 1226 corresponds to Each of the heat dissipation fins 120 is away from one end of the body 110. Therefore, when the heat sink 100 is used in combination with the fan, the airflow generated by the fan can be restricted from the flow guiding area 1222 and the convection area 1226 to the external environment, thereby increasing the airflow and the body 110, the heat dissipation fins 120, the retaining wall 130, and the heat conduction. The probability of contact between the plates 150, in this way, can further improve the heat dissipation efficiency of the heat sink 100.

The heat sink of the present invention may be, but is not limited to, an integrally formed aluminum extruded heat sink, and the heat conducting plate and the retaining wall are disposed through the heat conducting plate and the retaining wall. The junction forms a junction on the heat sink to provide heat transfer or diffusion, and forms a dendritic heat transfer path between the heat conducting plate, the retaining wall and the heat dissipating fin, so that the heat can be quickly dispersed from the body to the heat sink fin. To speed up heat dissipation. In addition, the heat sink of the present invention can also divide the channel into the guiding region and the convection region by the retaining wall, thereby increasing the contact rate between the airflow generated by the fan and the heat sink, thereby further improving the heat dissipation performance. Therefore, the heat sink of the present invention not only greatly improves the heat transfer efficiency, but also promotes the improvement of the heat dissipation performance.

Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the number of modifications may be made, and the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to the specification.

100‧‧‧heatsink

110‧‧‧ body

112‧‧‧ Groove

120‧‧‧Heat fins

122‧‧‧ channel

1222‧‧‧ diversion area

1224‧‧ ‧ diversion area

1226‧‧‧ Convection area

130‧‧‧Retaining wall

140‧‧ ‧ retaining wall

150‧‧‧heat conducting plate

200‧‧‧fan

Figure 1 is a perspective view of a first embodiment of the present invention.

Figure 2 is a top plan view of a first embodiment of the present invention.

Fig. 3 is a schematic view showing the state of use of the first embodiment of the present invention.

Figure 4 is a top plan view of a second embodiment of the present invention.

Figure 5 is a top plan view of a third embodiment of the present invention.

Figure 6 is a top plan view of a fourth embodiment of the present invention.

100‧‧‧heatsink

110‧‧‧ body

120‧‧‧Heat fins

122‧‧‧ channel

130‧‧‧Retaining wall

140‧‧ ‧ retaining wall

150‧‧‧heat conducting plate

Claims (10)

A heat sink includes: a body; a plurality of heat dissipation fins disposed on the body, and a channel formed between the adjacent two of the heat dissipation fins; at least one retaining wall connected to the heat dissipation fins And blocking the channel; and at least one heat conducting plate disposed between the heat dissipating fins and connecting the body and the retaining wall, and the thickness of the heat conducting plate is greater than the thickness of each of the heat dissipating fins. The heat sink of claim 1, wherein the heat conducting plate is disposed in one of the channels, and the opposite sides of the heat conducting plate are respectively connected to the surfaces of the adjacent two of the heat dissipating fins. The heat sink of claim 2, wherein the channel defines a flow guiding region between the body and the retaining wall, and the opposite sides of the heat conducting plate are connected to the heat dissipating fins in the flow guiding region. surface. The heat sink of claim 3, wherein the opposite sides of the heat conducting plate are connected to the surface of the heat dissipating fins at one end of the heat conducting plate, and are integrated with the heat dissipating fins. The heat sink of claim 3, wherein the opposite sides of the heat conducting plate are combined with the surfaces of the heat dissipating fins as a whole. The heat sink according to claim 3, comprising two retaining walls, wherein the retaining walls are spaced apart, and the passage is blocked to form two guiding regions. The heat sink of claim 1, wherein the heat dissipation fins surround the body, One end of each of the heat dissipation fins is connected to the body, and the other end extends toward the outside of the body. The heat sink of claim 7, wherein the body is further formed with a groove, and the heat dissipation fins surround the groove. The heat sink of claim 1, comprising a plurality of the heat conducting plates, the heat conducting plates being spaced apart from the body. The heat sink of claim 1, wherein the thickness of the heat conducting plate is increasing toward the body.