TWI726825B - Heat dissipation device - Google Patents

Abstract

A heat dissipation device includes a heat dissipation member and a fan. The heat dissipation member includes a first heat dissipation fin group and a second heat dissipation fin group stacked on the first heat dissipation fin group, wherein the first heat dissipation fin group includes a plurality of first heat dissipation fins and the second heat dissipation fin group includes a plurality of second heat dissipation fins. The fan is stacked on the second heat dissipation fin group, wherein the fan is configured to rotate around an axis, and the first heat dissipation fins and the second heat dissipation fins are arranged around the axis. A gap between any two of the second heat dissipation fins adjacent to each other is greater than a gap between any two of the first heat dissipation fins adjacent to each other.

Description

Heat sink

The present invention relates to a heat dissipation device, and particularly relates to a heat dissipation device using a double-layer heat dissipation fin set.

As the computing performance of electronic components (such as chips, processors, or controllers) increases, the amount of heat generated during operation of electronic components (such as chips, processors, or controllers) is also increasing. Once the heat cannot quickly escape to the outside world, it will cause the computing performance of electronic components (such as chips, processors, or controllers) to decline or become disabled due to overheating. Therefore, relevant manufacturers have actively invested in the development and improvement of various forms of heat dissipation devices to improve heat dissipation efficiency.

A common heat dissipation device includes a fan and a heat dissipation fin group, and the fan is stacked on the heat dissipation fin group. A common heat dissipation fin group adopts a single-layer design, that is, multiple heat dissipation fins in the heat dissipation fin group are arranged at the same height. Specifically, the airflow caused by the operation of the fan will flow through these heat dissipation fins for heat exchange. The number and dense arrangement of these heat dissipation fins will affect the heat dissipation area and flow resistance, and even cause excessive noise when the fan is running. .

The present invention provides a heat dissipation device, which has good heat dissipation efficiency.

The present invention provides a heat sink, which includes a heat sink and a fan. The heat dissipation body includes a first heat dissipation fin group and a second heat dissipation fin group stacked on the first heat dissipation fin group, wherein the first heat dissipation fin group includes a plurality of first heat dissipation fins, and the second heat dissipation fin group The group includes a plurality of second heat dissipation fins. The fan is stacked on the second heat dissipation fin group, wherein the fan is used to rotate around an axis, and the first heat dissipation fins and the second heat dissipation fins are arranged around the axis. The distance between any two adjacent second heat dissipation fins is greater than the distance between any two adjacent first heat dissipation fins.

Based on the above, the heat dissipation device of the present invention adopts a double-layer heat dissipation fin group, wherein the second heat dissipation fin group is closer to the fan than the first heat dissipation fin group, and the plurality of second heat dissipation fins in the second heat dissipation fin group are The arrangement is sparser than the arrangement of the first heat dissipation fins in the first heat dissipation fin group. Therefore, the airflow caused by the operation of the fan can quickly flow through the second heat dissipation fin group and flow to the first heat dissipation fin group, and the first heat dissipation fin group can provide a larger heat dissipation area. Therefore, the heat dissipation device of the present invention has good flow efficiency and heat dissipation efficiency.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

Fig. 1 is a schematic diagram of a heat dissipation device according to an embodiment of the present invention. Please refer to FIG. 1, in this embodiment, the heat dissipation device 100 can be installed in an electronic product to quickly dissipate heat generated by the electronic components (such as a chip, a processor, or a controller) in the electronic product to the outside during operation. In detail, the heat dissipation device 100 adopts a double-layer heat dissipation fin group, wherein the heat dissipation device 100 includes a heat dissipation body 110 and a fan 120, and the heat dissipation body 110 includes a first heat dissipation fin group 111 and is stacked on the first heat dissipation fin group 111 On the second heat dissipation fin group 112. The fan 120 is stacked on the second heat dissipation fin group 112, and the second heat dissipation fin group 112 is located between the fan 120 and the first heat dissipation fin group 111. In other words, the second heat dissipation fin group 112 is closer to the fan 120 than the first heat dissipation fin group 111 is.

2A and 2B are schematic diagrams of the heat sink of FIG. 1 from two different viewing angles. FIG. 2C is an enlarged schematic diagram of the region R1 in FIG. 2A. FIG. 2D is an enlarged schematic diagram of the area R2 in FIG. 2B. Please refer to Figure 1, Figure 2A and Figure 2B, the first heat dissipation fin group 111 and the second heat dissipation fin group 112 can be a two-stage aluminum extrusion structure, so it has high design flexibility, low manufacturing cost, light weight and strength Higher characteristics. The fan 120 may be an axial fan, and is used to rotate around the axis AX. The airflow caused by the operation of the fan 120 flows through the second heat dissipation fin group 112 first, and then flows to the first heat dissipation fin group 111.

In this embodiment, the first heat dissipation fin group 111 includes a plurality of first heat dissipation fins 111a, and the second heat dissipation fin group 112 includes a plurality of second heat dissipation fins 112a. The first heat dissipation fins 111a and the second heat dissipation fins 112a are arranged around the axis AX. In a direction parallel to the axis AX, the fan 120 overlaps the second heat dissipation fins 112a and the first heat dissipation fins 111a to It is ensured that the airflow caused by the operation of the fan 120 can flow through the second heat dissipation fins 112a and the first heat dissipation fins 111a one after another for heat exchange.

Furthermore, the first heat dissipation fins 111a are arranged equidistantly around the axis AX, and the second heat dissipation fins 112a are arranged equidistantly around the axis AX. More specifically, the gap G1 between any two adjacent second heat dissipation fins 112a is greater than the gap G2 between any two adjacent first heat dissipation fins 111a, as shown in FIGS. 2C and 2D. In other words, the arrangement of the second heat dissipation fins 112 a in the second heat dissipation fin group 112 is sparser than the arrangement of the first heat dissipation fins 111 a in the first heat dissipation fin group 111.

Because the arrangement of the second heat dissipation fins 112a in the second heat dissipation fin group 112 is sparser than the arrangement of the first heat dissipation fins 111a in the first heat dissipation fin group 111, compared with the first heat dissipation fin group 111 In terms of 111, the flow resistance of the second heat dissipation fin group 112 to the airflow caused by the operation of the fan 120 is relatively low. Therefore, the airflow caused by the operation of the fan 120 can quickly flow through the second heat dissipation fin set 112 and flow to the first heat dissipation fin set 111, so that the heat dissipation device 100 has good flow efficiency and reduces the noise generated by the operation of the fan 120 .

Please refer to FIGS. 1, 2A, and 2B. When the airflow caused by the operation of the fan 120 flows to the first heat dissipation fin group 111, the arrangement of the first heat dissipation fins 111a in the first heat dissipation fin group 111 is relatively high. The second heat dissipation fins 112a in the second heat dissipation fin group 112 are arranged densely, and the first heat dissipation fin group 111 can provide a larger heat dissipation area, so that the heat dissipation device 100 has good heat dissipation efficiency.

2A to 2D, in this embodiment, the first heat dissipation fin set 111 further includes a first base 111b, and the second heat dissipation fin set 112 further includes a first base 111b stacked on the first base. There are two bases 112b, and the axis AX passes through the second base 112b and the first base 111b. In detail, the first heat dissipation fins 111a are connected to the first base 111b, and are arranged on the outer wall surface of the first base 111b around the axis AX. On the other hand, the second heat dissipation fins 112a are connected to the second base 112b, and are arranged on the outer wall surface of the second base 112b around the axis AX.

The first base 111b is farther away from the fan 120 than the second base 112b, and the first base 111b is closer to the heat source than the second base 112b. The size (for example, volume) of the first base 111b is larger than the size (for example, volume) of the second base 112b, so the specific heat capacity of the first base 111b is greater than the specific heat capacity of the second base 112b. In other words, the first base 111b has strong heat absorption and heat dissipation capabilities, which helps to improve the heat dissipation efficiency.

In a direction parallel to the axis AX, a part of the second heat dissipation fins 112a overlaps a part of the first heat dissipation fins 111a, and any one of the second heat dissipation fins 112a and any one of the first heat dissipation fins that overlap 111a touch each other. In other embodiments, any overlapped second heat dissipation fin and any first heat dissipation fin keep a distance in a direction parallel to the axis, and the two are not in contact.

In this embodiment, each first heat dissipation fin 111a includes two heat dissipation branches 111a1, and in a direction parallel to the axis AX, a heat dissipation branch 111a1 is provided between any two adjacent second heat dissipation fins 112a. In other words, the second heat dissipation fins 112a and a part of the heat dissipation branches 111a1 adopt a staggered arrangement of upper and lower layers, so as to improve the heat dissipation efficiency. Further, the size (for example, volume) of the first base 111b is greater than the size (for example, volume) of the second base 112b, and the number of the heat dissipation branches 111a1 in the first heat dissipation fin group 111 is greater than that of the second heat dissipation fins Because of the number of the second heat dissipation fins 112a in the group 112, the specific heat capacity of the first heat dissipation fin group 111 is greater than the specific heat capacity of the second heat dissipation fin group 112. In other words, the first heat dissipation fin group 111 has strong heat absorption and heat dissipation capabilities, which helps to improve the heat dissipation efficiency.

In the direction parallel to the axis AX, a part of the second heat dissipation fins 112a overlaps a part of the heat dissipation branches 111a1, and any overlapped second heat dissipation fin 112a and any heat dissipation branch 111a1 are in contact with each other to improve Heat transfer effect.

In other embodiments, the second heat dissipation fins and the heat dissipation branches that overlap in a direction parallel to the axis maintain a gap (that is, the second heat dissipation fins are not in contact with the heat dissipation branches) to destroy the airflow boundary layer. In other words, the gap between the second heat dissipation fin and the heat dissipation branch forms a turbulence design to improve the heat transfer effect.

In particular, the gap G1 between any two adjacent second heat dissipation fins 112a is greater than the gap G2 between any two adjacent first heat dissipation fins 111a, and the gap G2 may be the same first heat dissipation fin The distance between the two heat dissipation branches 111a1 in the sheet 111a, or the distance between the two adjacent heat dissipation branches 111a1 attributable to two different first heat dissipation fins 111a, as shown in FIG. 2C and FIG. 2D Show.

In other embodiments, the first heat dissipation fin adopts a branchless design, that is, the first heat dissipation fin is a single heat dissipation fin body, and the number of the first heat dissipation fins is greater than the number of the second heat dissipation fins.

In summary, the heat dissipation device of the present invention adopts a double-layer heat dissipation fin group, wherein the second heat dissipation fin group is closer to the fan than the first heat dissipation fin group, and a plurality of second heat dissipation fins in the second heat dissipation fin group The arrangement of the fins is sparser than the arrangement of the first heat dissipation fins in the first heat dissipation fin group. Therefore, the airflow caused by the operation of the fan can quickly flow through the second heat dissipation fin group and flow to the first heat dissipation fin group, and the first heat dissipation fin group can provide a larger heat dissipation area. Therefore, the heat dissipation device of the present invention has good flow efficiency and heat dissipation efficiency.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be determined by the scope of the attached patent application.

100: heat sink 110: radiator 111: First cooling fin set 111a: The first heat sink fin 111a1: cooling branch 111b: first base 112: Second cooling fin set 112a: second heat sink fin 112b: second base 120: Fan AX: axis G1, G2: spacing R1, R2: area

Fig. 1 is a schematic diagram of a heat dissipation device according to an embodiment of the present invention. 2A and 2B are schematic diagrams of the heat sink of FIG. 1 from two different viewing angles. FIG. 2C is an enlarged schematic diagram of the region R1 in FIG. 2A. FIG. 2D is an enlarged schematic diagram of the area R2 in FIG. 2B.

100: heat sink

110: radiator

111: First cooling fin set

111a: The first heat sink fin

112: Second cooling fin set

112a: second heat sink fin

120: Fan

AX: axis

Claims (11)

A heat dissipation device includes: The heat dissipation body includes a first heat dissipation fin group and a second heat dissipation fin group stacked on the first heat dissipation fin group, wherein the first heat dissipation fin group includes a plurality of first heat dissipation fins, and the first heat dissipation fin group The second heat dissipation fin group includes a plurality of second heat dissipation fins; and A fan is stacked on the second heat dissipation fin set, wherein the fan is used to rotate around an axis, and the first heat dissipation fins and the second heat dissipation fins are arranged around the axis, any two adjacent The distance between the second heat dissipation fins is greater than the distance between any two adjacent first heat dissipation fins. The heat dissipation device according to claim 1, wherein the first heat dissipation fin set further includes a first base, and the second heat dissipation fin set further includes a second base stacked on the first base, The axis passes through the second base and the first base. The heat dissipation device according to claim 2, wherein the first heat dissipation fins are connected to the first base, and the second heat dissipation fins are connected to the second base. The heat dissipation device according to claim 3, wherein the size of the first base is larger than the size of the second base. The heat dissipating device according to claim 1, wherein each of the first heat dissipating fins includes two heat dissipating branches, and in a direction parallel to the axis, a second heat dissipating fin is provided between any two adjacent ones of the heat dissipating fins. The cooling branch. The heat dissipation device according to claim 5, wherein in a direction parallel to the axis, a part of the second heat dissipation fins overlaps a part of the heat dissipation branches. The heat dissipation device according to claim 5, wherein in a direction parallel to the axis, a part of the second heat dissipation fins contacts a part of the heat dissipation branches. The heat dissipation device according to claim 1, wherein in a direction parallel to the axis, a part of the second heat dissipation fins overlaps a part of the first heat dissipation fins. The heat dissipation device according to claim 1, wherein in a direction parallel to the axis, a part of the second heat dissipation fins contacts a part of the first heat dissipation fins. The heat dissipation device according to claim 1, wherein the first heat dissipation fins are arranged equidistantly around the axis, and the second heat dissipation fins are arranged equidistantly around the axis. The heat dissipation device according to claim 1, wherein the first heat dissipation fin group and the second heat dissipation fin group are a two-section aluminum extrusion structure.

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