TW202218073A - Heat dissipation device - Google Patents

Abstract

A heat dissipation device includes a heat dissipation member and a fan. The heat dissipation member includes a first heat dissipation fin group and a second heat dissipation fin group stacked on the first heat dissipation fin group, wherein the first heat dissipation fin group includes a plurality of first heat dissipation fins and the second heat dissipation fin group includes a plurality of second heat dissipation fins. The fan is stacked on the second heat dissipation fin group, wherein the fan is configured to rotate around an axis, and the first heat dissipation fins and the second heat dissipation fins are arranged around the axis. A gap between any two of the second heat dissipation fins adjacent to each other is greater than a gap between any two of the first heat dissipation fins adjacent to each other.

Description

heat sink

The present invention relates to a heat dissipation device, and in particular, to a heat dissipation device using a double-layer heat dissipation fin set.

As the computing performance of electronic components (eg, chips, processors, or controllers) increases, the heat generated when the electronic components (eg, chips, processors, or controllers) operate also increases. Once the heat cannot be quickly dissipated to the outside world, the computing performance of electronic components (such as chips, processors or controllers) will decrease or become disabled due to overheating. Therefore, relevant manufacturers are actively investing in the development and improvement of various forms of heat dissipation devices to improve heat dissipation efficiency.

A common heat dissipation device includes a fan and a set of heat dissipation fins, and the fan is stacked on the set of heat dissipation fins. A common heat dissipation fin set adopts a single-layer design, that is, a plurality of heat dissipation fins in the heat dissipation fin set are arranged at the same height. Specifically, the airflow caused by the fan running will flow through these cooling fins for heat exchange. The number and arrangement of these cooling fins will affect the heat dissipation area and flow resistance, and even cause excessive noise when the fan is running. .

The present invention provides a heat dissipation device with good heat dissipation efficiency.

The present invention provides a heat dissipation device, which includes a heat dissipation body and a fan. The heat sink includes a first heat dissipation fin group and a second heat dissipation fin group stacked on the first heat dissipation fin group, wherein the first heat dissipation fin group includes a plurality of first heat dissipation fins, and the second heat dissipation fins The set includes a plurality of second heat dissipation fins. The fan is stacked on the second heat dissipation fin group, wherein the fan is used to rotate around an axis, and the first heat dissipation fins and the second heat dissipation fins are arranged around the axis. The spacing between any two adjacent second heat dissipation fins is greater than the spacing between any two adjacent first heat dissipation fins.

Based on the above, the heat dissipation device of the present invention adopts a double-layer heat dissipation fin group, wherein the second heat dissipation fin group is closer to the fan than the first heat dissipation fin group, and the plurality of second heat dissipation fins in the second heat dissipation fin group are The arrangement is sparser than the arrangement of the plurality of first heat dissipation fins in the first heat dissipation fin group. Therefore, the airflow caused by the operation of the fan can quickly flow through the second set of heat dissipation fins and toward the first set of heat dissipation fins, and the first set of heat dissipation fins can provide a larger heat dissipation area. Therefore, the heat dissipation device of the present invention has good flow efficiency and heat dissipation efficiency.

In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the following embodiments are given and described in detail with the accompanying drawings as follows.

FIG. 1 is a schematic diagram of a heat dissipation device according to an embodiment of the present invention. Referring to FIG. 1 , in this embodiment, the heat dissipation device 100 can be installed in an electronic product to quickly dissipate the heat generated when an electronic component (eg, a chip, a processor or a controller) in the electronic product operates to the outside. In detail, the heat dissipation device 100 adopts a double-layer heat dissipation fin set, wherein the heat dissipation device 100 includes a heat dissipation body 110 and a fan 120 , and the heat dissipation body 110 includes a first heat dissipation fin set 111 and a first heat dissipation fin set 111 stacked on the first heat dissipation fin set 111 . on the second heat dissipation fin group 112 . The fan 120 is stacked on the second heat dissipation fin group 112 , and the second heat dissipation fin group 112 is located between the fan 120 and the first heat dissipation fin group 111 . That is, the second heat dissipation fin group 112 is closer to the fan 120 than the first heat dissipation fin group 111 .

2A and 2B are schematic views of the heat sink of FIG. 1 from two different viewing angles. FIG. 2C is an enlarged schematic view of the region R1 of FIG. 2A . FIG. 2D is an enlarged schematic view of the region R2 of FIG. 2B . Please refer to FIG. 1 , FIG. 2A and FIG. 2B , the first heat dissipation fin group 111 and the second heat dissipation fin group 112 can be a two-stage aluminum extrusion structure, so they have high design flexibility, low manufacturing cost, light weight and strength Advanced features. The fan 120 can be an axial flow fan, and is used to rotate around the axis AX. The airflow caused by the operation of the fan 120 will first flow through the second heat dissipation fin group 112 , and then flow toward the first heat dissipation fin group 111 .

In this embodiment, the first heat dissipation fin group 111 includes a plurality of first heat dissipation fins 111a, and the second heat dissipation fin group 112 includes a plurality of second heat dissipation fins 112a. The first heat dissipation fins 111a and the second heat dissipation fins 112a are arranged around the axis AX. In the direction parallel to the axis AX, the fan 120 overlaps the second heat dissipation fins 112a and the first heat dissipation fins 111a, so as to It is ensured that the airflow caused by the operation of the fan 120 can flow through the second heat dissipation fins 112a and the first heat dissipation fins 111a successively for heat exchange.

Further, the first heat dissipation fins 111a are equally spaced around the axis AX, and the second heat dissipation fins 112a are equally spaced around the axis AX. More specifically, the distance G1 between any two adjacent second heat dissipation fins 112a is greater than the distance G2 between any two adjacent first heat dissipation fins 111a, as shown in FIG. 2C and FIG. 2D . That is to say, the arrangement of the second heat dissipation fins 112 a in the second heat dissipation fin group 112 is sparser than the arrangement of the first heat dissipation fins 111 a in the first heat dissipation fin group 111 .

Because the arrangement of the second heat dissipation fins 112a in the second heat dissipation fin group 112 is sparser than the arrangement of the first heat dissipation fins 111a in the first heat dissipation fin group 111, compared with the first heat dissipation fin group As far as 111 is concerned, the flow resistance of the second heat dissipation fin group 112 to the airflow caused by the operation of the fan 120 is relatively low. Therefore, the air flow caused by the operation of the fan 120 can quickly flow through the second heat dissipation fin group 112 and toward the first heat dissipation fin group 111 , so that the heat dissipation device 100 has good flow efficiency and reduces the noise generated by the fan 120 during operation. .

Please refer to FIG. 1 , FIG. 2A and FIG. 2B , when the air flow caused by the operation of the fan 120 flows to the first heat dissipation fin group 111 , the arrangement of the first heat dissipation fins 111 a in the first heat dissipation fin group 111 is relatively high. The second heat dissipation fins 112a in the second heat dissipation fin group 112 are densely arranged, and the first heat dissipation fin group 111 can provide a larger heat dissipation area, so that the heat dissipation device 100 has good heat dissipation efficiency.

Referring to FIGS. 2A to 2D , in this embodiment, the first heat dissipation fin set 111 further includes a first base 111b, and the second heat dissipation fin set 112 further includes a first base 111b stacked on the first base 111b. Two bases 112b, and the axis AX passes through the second base 112b and the first base 111b. Specifically, the first heat dissipation fins 111a are connected to the first base 111b, and are arranged on the outer wall surface of the first base 111b around the axis AX. On the other hand, the second heat dissipation fins 112a are connected to the second base 112b, and are arranged on the outer wall surface of the second base 112b around the axis AX.

The first base 111b is farther from the fan 120 than the second base 112b, and the first base 111b is closer to the heat source than the second base 112b. The size (eg volume) of the first base 111b is larger than that of the second base 112b, so the specific heat capacity of the first base 111b is greater than that of the second base 112b. That is to say, the first base 111b has strong heat absorption and heat dissipation capabilities, which helps to improve the heat dissipation efficiency.

In a direction parallel to the axis AX, a part of the second heat dissipation fins 112a overlaps with a part of the first heat dissipation fins 111a, and any one of the overlapping second heat dissipation fins 112a and any one of the first heat dissipation fins 111a are in contact with each other. In other embodiments, any one of the overlapping second heat dissipation fins keeps a distance from any one of the first heat dissipation fins in a direction parallel to the axis, and the two are not in contact.

In this embodiment, each of the first heat dissipation fins 111a includes two heat dissipation branches 111a1, and in a direction parallel to the axis AX, a heat dissipation branch 111a1 is disposed between any two adjacent second heat dissipation fins 112a. That is to say, the second heat dissipation fins 112a and a part of the heat dissipation branches 111a1 are designed in a staggered arrangement of upper and lower layers, so as to improve the heat dissipation efficiency. Further, the size (eg volume) of the first base 111b is larger than the size (eg volume) of the second base 112b, and the number of the heat dissipation branches 111a1 in the first heat dissipation fin group 111 is greater than that of the second heat dissipation fins Due to the number of the second heat dissipation fins 112 a in the group 112 , the specific heat capacity of the first heat dissipation fin group 111 is greater than the specific heat capacity of the second heat dissipation fin group 112 . That is to say, the first heat dissipation fin group 111 has relatively strong heat absorption and heat dissipation capabilities, which helps to improve the heat dissipation efficiency.

In the direction parallel to the axis AX, a part of the second heat dissipation fins 112a overlaps with a part of the heat dissipation branches 111a1, and any one of the overlapping second heat dissipation fins 112a and any one of the heat dissipation branches 111a1 are in contact with each other, so as to improve the heat transfer effect.

In other embodiments, the overlapping second heat dissipation fins and the heat dissipation branches in the direction parallel to the axis maintain a gap (ie, the second heat dissipation fins do not contact the heat dissipation branches), so as to destroy the airflow boundary layer. That is to say, the gap between the second heat dissipation fin and the heat dissipation branch forms a turbulent flow design, so as to improve the heat transfer effect.

In particular, the distance G1 between any two adjacent second heat dissipation fins 112a is greater than the distance G2 between any two adjacent first heat dissipation fins 111a, and the distance G2 may be the same first heat dissipation fin The distance between the two heat dissipation branches 111a1 in the fin 111a, or the distance between two adjacent heat dissipation branches 111a1 belonging to different two first heat dissipation fins 111a, as shown in FIG. 2C and FIG. 2D Show.

In other embodiments, the first heat dissipation fin adopts a branchless design, that is, the first heat dissipation fin is a single heat dissipation fin body, and the number of the first heat dissipation fin is greater than the number of the second heat dissipation fin.

To sum up, the heat dissipation device of the present invention adopts a double-layer heat dissipation fin group, wherein the second heat dissipation fin group is closer to the fan than the first heat dissipation fin group, and a plurality of second heat dissipation fins in the second heat dissipation fin group The arrangement of the fins is sparser than the arrangement of the plurality of first heat dissipation fins in the first heat dissipation fin group. Therefore, the airflow caused by the operation of the fan can quickly flow through the second set of heat dissipation fins and toward the first set of heat dissipation fins, and the first set of heat dissipation fins can provide a larger heat dissipation area. Therefore, the heat dissipation device of the present invention has good flow efficiency and heat dissipation efficiency.

Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be determined by the scope of the appended patent application.

100: cooling device 110: heat sink 111: The first heat dissipation fin group 111a: the first cooling fin 111a1: Thermal branch 111b: First base 112: The second cooling fin group 112a: Second cooling fin 112b: Second base 120: Fan AX: axis G1, G2: Spacing R1, R2: area

FIG. 1 is a schematic diagram of a heat dissipation device according to an embodiment of the present invention. 2A and 2B are schematic views of the heat sink of FIG. 1 from two different viewing angles. FIG. 2C is an enlarged schematic view of the region R1 of FIG. 2A . FIG. 2D is an enlarged schematic view of the region R2 of FIG. 2B .

100: cooling device

110: heat sink

111: The first heat dissipation fin group

111a: the first cooling fin

112: The second cooling fin group

112a: Second cooling fin

120: Fan

AX: axis

Claims (11)

A heat dissipation device, comprising: A heat sink includes a first heat dissipation fin group and a second heat dissipation fin group stacked on the first heat dissipation fin group, wherein the first heat dissipation fin group includes a plurality of first heat dissipation fins, and the first heat dissipation fin group The two heat dissipation fin sets include a plurality of second heat dissipation fins; and The fan is stacked on the second heat dissipation fin group, wherein the fan is used to rotate around an axis, and the first heat dissipation fins and the second heat dissipation fins are arranged around the axis, and any two adjacent The spacing between the second heat dissipation fins is greater than the spacing between any two adjacent first heat dissipation fins. The heat dissipation device of claim 1, wherein the first heat dissipation fin set further includes a first base, and the second heat dissipation fin set further includes a second base stacked on the first base, The axis passes through the second base and the first base. The heat dissipation device of claim 2, wherein the first heat dissipation fins are connected to the first base, and the second heat dissipation fins are connected to the second base. The heat dissipation device of claim 3, wherein the size of the first base is larger than that of the second base. The heat dissipation device according to claim 1, wherein each of the first heat dissipation fins includes two heat dissipation branches, and in a direction parallel to the axis, between any two adjacent ones of the second heat dissipation fins, there is a the cooling branch. The heat dissipation device of claim 5, wherein in a direction parallel to the axis, a part of the second heat dissipation fins overlaps a part of the heat dissipation branches. The heat dissipation device of claim 5, wherein in a direction parallel to the axis, a part of the second heat dissipation fins contacts a part of the heat dissipation branches. The heat dissipation device of claim 1, wherein in a direction parallel to the axis, a part of the second heat dissipation fins overlaps a part of the first heat dissipation fins. The heat dissipation device of claim 1, wherein in a direction parallel to the axis, a part of the second heat dissipation fins contacts a part of the first heat dissipation fins. The heat dissipation device of claim 1, wherein the first heat dissipation fins are arranged at equal distances around the axis, and the second heat dissipation fins are arranged at equal distances around the axis. The heat dissipation device as claimed in claim 1, wherein the first heat dissipation fin group and the second heat dissipation fin group are a two-section aluminum extrusion structure.

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