KR20150046583A - LED lighting module with heat pumping panel - Google Patents

Abstract

The present invention relates to an LED illuminator, comprising: a perforation hole penetratingly formed from a back surface of a substrate on which LEDs are arrayed to a center of an LED element; And a heat sink for filling the perforation hole with a metal to conduct the heat of the LED device to the back surface of the substrate and a heat dissipation layer for dissipating the conducted heat, the heat dissipation plate being formed by metal printing so as not to contact the neighboring heat dissipation layer. And a light emitting diode (LED) illuminator.
According to the present invention, there is provided an element-integrated heat dissipation type LED illuminator capable of concentrating and emitting the heat emitted from the LED element within a limited area of the heat dissipation plate to be diverted to the outside.

Description

[0001] The present invention relates to an LED lighting module,

The present invention relates to an LED illuminator, comprising: a perforation hole penetratingly formed from a back surface of a substrate on which LEDs are arrayed to a center of an LED element; And a heat sink for filling the perforation hole with a metal to conduct the heat of the LED device to the back surface of the substrate and a heat dissipation layer for dissipating the conducted heat, the heat dissipation plate being formed by metal printing so as not to contact the neighboring heat dissipation layer. And a light emitting diode (LED) illuminator.

In general, a large amount of heat is generated at the time of use of the LED, which may cause heat accumulation in the surrounding components of the LED. When the ambient temperature of the LED rises due to heat accumulation, the current flowing through the LED decreases, There is a problem.

In recent years, the development of an illumination device using an LED has been concentrated. The heat generation of such an LED is focused on the back surface of the substrate on which the LED is arrayed by printing a metal having a high thermal conductivity to form a heat sink, .

10-1105006, and 10-1054652, and 10-0840131, which are filed for the purpose of solving the heat of these LEDs.

However, in the above-described conventional method, there is a PVC substrate between the LED element and the heat sink, so heat generated under the LED substrate is transmitted to the heat sink through the substrate, thereby limiting heat dissipation.

Also, in the case where a plurality of LEDs are arranged in the heat sink, the heat is concentrated at the boundary between the neighboring LEDs and the heat dissipation effect is limited.

Therefore, the heat dissipation effect of the heat dissipation plate is limited by the area of the heat dissipation plate itself, and is limited by interference between the substrate and the heat generated by the neighboring LEDs, so that the designer can not achieve a desired level of heat dissipation.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an element-integrated heat dissipation type LED illuminator capable of concentrating and discharging the discharge heat of an LED element within a limited area of a heat dissipation plate, thereby emitting the emitted heat.

According to an aspect of the present invention, there is provided an LED illuminator, comprising: a perforation hole penetrating from a back surface of a substrate on which LEDs are arranged to a center of an LED element; A thermally conductive film formed by plating a metal having a high thermal conductivity on the perforation hole; A heat dissipation plate for filling the perforation hole with a metal by a print printing technique to form a heat conduction path for conducting heat of the LED device to the back surface of the substrate, and forming a heat dissipation layer for dissipating the conducted heat; And the thermal conductivity is increased from the back surface of the substrate to the back surface of the substrate.

Here, it is preferable that the heat conductive film is formed by plating gold, silver or copper with high thermal conductivity.

Preferably, the heat dissipation layer is formed independently from the heat dissipation layer of the neighboring LED, and the irregular cooling fin is formed at the interface.

According to the present invention, there is provided an element-integrated heat-radiating type LED illuminator capable of concentrating and discharging the exhaust heat of the LED elements within a limited area of the heat radiating plate to be diverted to the outside.

Fig. 1 is a side view of the present invention
2 is a plan view of the unit heat sink of the present invention
Fig. 3 is a plan view
Figure 4 is a schematic diagram illustrating heat distribution in an LED substrate in a prior art system;
FIG. 5 is a graph showing the experimental graph

Hereinafter, the present invention will be described with reference to the drawings. In the following description of the present invention, a detailed description of related arts or configurations will be omitted when it is determined that the gist of the present invention may be unnecessarily obscured will be.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to be exemplary, self-explanatory, allowing for equivalent explanations of the present invention.

2 is a plan view of a unit heat sink according to the present invention, FIG. 3 is an explanatory plan view of the present invention, and FIG. 4 is a view showing heat distribution in a LED substrate in the prior art Fig. 5 is an experimental graph of the present invention. Fig.

As shown in the drawings, the present invention comprises an LED substrate 10, an LED element 1, a perforation hole 20, and a heat sink plate 100.

The main problem that arises when using LEDs as lighting is the heat generated by LEDs. As heat is affected over time, the heat generated by LEDs must be relieved.

Generally, the heat of the LED light is printed on the rear surface of the substrate on which the LEDs are arranged, and the heat sink is formed by emitting a metal having a high thermal conductivity.

However, since there is a PVC substrate between the LED device and the heat sink, heat generated under the LED device is transferred to the heat sink through the substrate, thereby limiting the heat radiation effect.

Also, in the case where a plurality of LEDs are arranged in the heat sink as well, as shown in FIG. 5, the heat is concentrated at the boundary between the neighboring LEDs and the heat dissipation effect is limited.

Therefore, the heat dissipation effect of the heat dissipation plate is limited by the area of the heat dissipation plate itself, and is limited by the interference between the substrate and the heat generated by the adjacent LEDs, so that the designer can not achieve a desired level of heat dissipation.

The perforation hole 20 of the present invention is formed to penetrate through the center of the LED element 1 from the back surface of the substrate 10 on which the LED elements 1 are arranged as shown in FIG.

Generally, the heat of the LED element 1 is concentrated in a portion in contact with the substrate 10, and the LED element 1 is communicated from the LED element 1 to the back surface of the substrate 10 by the perforation hole 20, An environment is created in which heat can be transferred to the backside of the substrate 10 without interfering with the substrate 10.

The LED light is generally formed by arranging a plurality of LED elements 1 so that the perforation hole 20 is arranged in the substrate 10 according to the position of the LED element 1.

In the present invention, the heat conduction path 110 is formed by filling metal in the perforation hole 20 in order to concentrate heat of the LED element 1 through the perforation hole 20.

In addition, the heat dissipation layer 120 is formed independently for each LED element so as not to overlap with the heat dissipation layer 120 of the adjacent LED device 1 around the perforation hole 20.

The heat dissipation layer 120 is formed on the back surface of the substrate 10 in a conventional manner so that the heat discharged from the neighboring LED elements 1 is concentrated at the interface as shown in FIG. When the heat dissipation layer 120 is formed separately for each of the LED elements 1, heat is radiated from the sides of the respective heat dissipation layers 120 and is not affected by the heat of the neighboring ID elements 1, The heat accumulation does not occur in the heat accumulation layer 120.

In the present invention, the heat sink 100 is formed of the heat conduction path 110 and the heat dissipation layer 120, and the heat dissipation plate 100 is simultaneously formed by a metal printing technique.

Although the heat conduction path 110 and the heat dissipation layer 120 have been described for the purpose of describing the present invention, in practice, when the back surface of the substrate 10 is metal-printed after the perforation hole 20 is formed, The heat generating layer 110 and the heat dissipating layer 120 are simultaneously formed.

The heat generated from the LED device 1 toward the substrate 10 is dissipated to the heat dissipation layer 120 through the heat conduction path 110 to form a heat conduction plate for concentrating the heat of the LED device 1. [

In order to realize a faster heat transfer in the heat conduction path 110, the present invention further includes plating the thermally conductive film 140 with a metal having a high thermal conductivity, as shown in FIG. 1, in the perforation hole 20 .

The metal having a high thermal conductivity is metal such as gold, silver and copper. When the thermal conductive film 140 is plated using these metals, the heat of the LED element 1 can be more effectively spread toward the heat dissipation layer 120 .

Fig. 5 is a graph according to the present invention showing the heat pumping effect by the thermally conductive film.

In FIG. 5, it can be seen that the cooling effect of the metal coated type increases with time from the back surface of the substrate.

As shown in FIG. 2, each side of the heat dissipation layer 120 of the heat dissipation plate 100 according to the present invention is formed of a cooling fin 130 having a continuous concave-convex structure to improve the cooling efficiency.

4, the heat dissipation plate 100 and the heat dissipation plate 100 of the neighboring LED device 1 are formed as shown in FIG. 4 because of the continuous convex-concave structure. There is an effect that the length of each side of the heat sink 100 can be extended without overlapping.

It will be apparent to those skilled in the art that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined by the appended claims. It is to be understood that the technical spirit of the present invention is to the extent possible.

1: LED element 10: LED substrate
20: Perforation hole
100: Heat sink 110: Heat conduction path
120: heat radiating layer 130: cooling pin
140: Thermal film

Claims (3)

In the LED illuminator,
A perforation hole penetratingly formed in the center of the LED device from the rear surface of the substrate on which the LEDs are arranged;
A thermally conductive film formed by plating a metal having a high thermal conductivity on the perforation hole;
A heat dissipation plate for filling the perforation hole with a metal by a print printing technique to form a heat conduction path for conducting heat of the LED device to the back surface of the substrate, and forming a heat dissipation layer for dissipating the conducted heat;
Composed
And the thermal conductivity is increased to the back surface of the substrate.
The heat sink according to claim 1, wherein the heat conductive film
Characterized in that the device is formed by plating with gold, silver or copper having a high thermal conductivity.
The heat sink according to claim 1,
And an irregular cooling fin is formed on the interface between the heat dissipation layer and the heat dissipation layer of the neighboring LED.

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