KR20150046578A - LED lighting module with heat pumping panel - Google Patents

Abstract

The present invention relates to an LED illuminator, comprising: a perforation hole penetratingly formed from a back surface of a substrate on which LEDs are arrayed to a center of an LED element; And a heat sink for filling the perforation hole with a metal to conduct the heat of the LED device to the back surface of the substrate and a heat dissipation layer for dissipating the conducted heat, the heat dissipation plate being formed by metal printing so as not to contact the neighboring heat dissipation layer. And a light emitting diode (LED) illuminator.
According to the present invention, there is provided an element-integrated heat dissipation type LED illuminator capable of concentrating and emitting the heat emitted from the LED element within a limited area of the heat dissipation plate to be diverted to the outside.

Description

[0001] The present invention relates to an LED lighting module,

The present invention relates to an LED illuminator, comprising: a perforation hole penetratingly formed from a back surface of a substrate on which LEDs are arrayed to a center of an LED element; And a heat sink for filling the perforation hole with a metal to conduct the heat of the LED device to the back surface of the substrate and a heat dissipation layer for dissipating the conducted heat, the heat dissipation plate being formed by metal printing so as not to contact the neighboring heat dissipation layer. And a light emitting diode (LED) illuminator.

In general, a large amount of heat is generated at the time of use of the LED, which may cause heat accumulation in the surrounding components of the LED. When the ambient temperature of the LED rises due to heat accumulation, the current flowing through the LED decreases, There is a problem.

In recent years, the development of an illumination device using an LED has been concentrated. The heat generation of such an LED is focused on the back surface of the substrate on which the LED is arrayed by printing a metal having a high thermal conductivity to form a heat sink, .

10-1105006, and 10-1054652, and 10-0840131, which are filed for the purpose of solving the heat of these LEDs.

However, in the above-described conventional method, there is a PVC substrate between the LED element and the heat sink, so heat generated under the LED substrate is transmitted to the heat sink through the substrate, thereby limiting heat dissipation.

Also, in the case where a plurality of LEDs are arranged in the heat sink, the heat is concentrated at the boundary between the neighboring LEDs and the heat dissipation effect is limited.

Therefore, the heat dissipation effect of the heat dissipation plate is limited by the area of the heat dissipation plate itself, and is limited by interference between the substrate and the heat generated by the neighboring LEDs, so that the designer can not achieve a desired level of heat dissipation.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an element-integrated heat dissipation type LED illuminator capable of concentrating and discharging the discharge heat of an LED element within a limited area of a heat dissipation plate, thereby emitting the emitted heat.

According to an aspect of the present invention, there is provided an LED illuminator, comprising: a perforation hole penetrating from a back surface of a substrate on which LEDs are arranged to a center of an LED element; A heat dissipation plate having a heat dissipation layer formed on the back surface of the substrate while filling a hole with the metal by a printing and printing technique to form a heat conduction path for conducting the heat of the LED device to the back surface of the substrate; The present invention relates to an element-integrated heat dissipation type LED illuminator.

According to the present invention, there is provided an element-integrated heat-radiating type LED illuminator capable of concentrating and discharging the exhaust heat of the LED elements within a limited area of the heat radiating plate to be diverted to the outside.

Fig. 1 is a side view of the present invention
FIG. 2 is a graph showing the thermal comparison graph

Hereinafter, the present invention will be described with reference to the drawings. In the following description of the present invention, a detailed description of related arts or configurations will be omitted when it is determined that the gist of the present invention may be unnecessarily obscured will be.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to be exemplary, self-explanatory, allowing for equivalent explanations of the present invention.

FIG. 1 is a side structural view of the present invention, and FIG. 2 is a heat comparative graph of the present invention and a conventional method.

As shown in the drawings, the present invention comprises an LED substrate 10, an LED element 1, a perforation hole 20, and a heat sink plate 100.

The main problem that arises when using LEDs as lighting is the heat generated by LEDs. As heat is affected over time, the heat generated by LEDs must be relieved.

Generally, the heat of the LED light is printed on the rear surface of the substrate on which the LEDs are arranged, and the heat sink is formed by emitting a metal having a high thermal conductivity.

However, since there is a PVC substrate between the LED device and the heat sink, heat generated under the LED device is transferred to the heat sink through the substrate, thereby limiting the heat radiation effect.

Also, in the case where a plurality of LEDs are arranged in the heat sink, the heat is concentrated at the boundary between the neighboring LEDs and the heat dissipation effect is limited.

Therefore, the heat dissipation effect of the heat dissipation plate is limited by the area of the heat dissipation plate itself, and is limited by the interference between the substrate and the heat generated by the adjacent LEDs, so that the designer can not achieve a desired level of heat dissipation.

The perforation hole 20 of the present invention is formed to penetrate through the center of the LED element 1 from the back surface of the substrate 10 on which the LED elements 1 are arranged as shown in FIG.

Generally, the heat of the LED element 1 is concentrated in a portion in contact with the substrate 10, and the LED element 1 is communicated from the LED element 1 to the back surface of the substrate 10 by the perforation hole 20, An environment is created in which heat can be transferred to the backside of the substrate 10 without interfering with the substrate 10.

The LED light is generally formed by arranging a plurality of LED elements 1 so that the perforation hole 20 is arranged in the substrate 10 according to the position of the LED element 1.

In the present invention, the heat conduction path 110 is formed by filling metal in the perforation hole 20 in order to concentrate heat of the LED element 1 through the perforation hole 20.

In addition, the heat dissipation layer 120 is formed independently for each LED element so as not to overlap with the heat dissipation layer 120 of the adjacent LED device 1 around the perforation hole 20.

When the heat dissipation layer 120 is formed on the rear surface of the substrate having the perforation hole 20 formed therein by printing and printing technique, the metal is inserted into the perforation hole 20, and the heat conduction path 110 is formed with the heat dissipation layer 120 There is an advantage of being formed.

Although the heat conduction path 110 and the heat dissipation layer 120 have been described for the purpose of describing the present invention, in practice, when the back surface of the substrate 10 is metal-printed after the perforation hole 20 is formed, The heat generating layer 110 and the heat dissipating layer 120 are simultaneously formed.

The heat generated from the LED device 1 toward the substrate 10 is dissipated to the heat dissipation layer 120 through the heat conduction path 110 to form a heat conduction plate for concentrating the heat of the LED device 1. [

The effect of the present invention will be described with reference to FIG.

FIG. 2 is a graph showing a time-dependent measurement of heat emitted from an LED substrate (centralized heat sink) according to the present invention and an LED substrate according to the related art.

As shown in the graph, the temperature of the present invention (concentrated heat sink) is generally low.

The temperature of the LED substrate (centralized heat sink) according to the present invention is low until 60 minutes before the steady state at normal temperature at the front surface of the LED substrate, and after 60 minutes from the back surface of the LED substrate, Appear lower.

This means that after 60 minutes, the front heat is effectively transferred to the backside to cool the substrate.

It will be apparent to those skilled in the art that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined by the appended claims. It is to be understood that the technical spirit of the present invention is to the extent possible.

1: LED element 10: LED substrate
20: Perforation hole
100: Heat sink 110: Heat conduction path
120: heat radiating layer

Claims (1)

In the LED illuminator,
A perforation hole penetratingly formed in the center of the LED device from the rear surface of the substrate on which the LEDs are arranged;
A heat dissipation plate having a heat dissipation layer formed on the back surface of the substrate while filling a hole with the metal by a printing and printing technique to form a heat conduction path for conducting the heat of the LED device to the back surface of the substrate;
Wherein the light is emitted from the light source.

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